With Means To Deform Work, Filler, Or Flux Portion Before Fusion Patents (Class 228/15.1)
  • Patent number: 10418172
    Abstract: A method of forming a coil for an inductive component includes bending a conductor into a figure 8 configuration. The figure 8 configuration has opposite first and second ends, a first substantially rounded portion, and a second substantially rounded portion. Each of the first and second substantially rounded portions terminates at one of the first and second ends. The method further includes folding the figure 8 configuration so the first substantially rounded portion overlies the second substantially rounded portion. Other example methods of forming coils for inductive components and other example coils are also disclosed.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: September 17, 2019
    Assignee: Astec International Limited
    Inventors: Alfredo Grueso, Joven Abella, Roger Mendoza
  • Patent number: 10315264
    Abstract: A joining process and a joined article are disclosed. The joining process includes positioning an article having a base material, and friction joining a pre-sintered preform to the base material. The pre-sintered preform forms a feature on the article. The joined article includes a feature joined to a base material by friction joining of a pre-sintered preform.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: June 11, 2019
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, Brian Lee Tollison, Dechao Lin, David Edward Schick
  • Patent number: 9687897
    Abstract: An apparatus has a corrugating device through which a pipe is moved producing corrugation in the circumferential direction of the pipe by rotation. The corrugating device has a corrugator head which is rotatable about its axis, and a hollow shaft on which the corrugator head is firmly fitted and via which the corrugator head is driveable in rotation. A vibration measuring means is connected mechanically to the corrugating device for automatically detecting mechanical vibrations of the rotating corrugating device. The vibration measuring means simultaneously detects measured values for vibrations of the hollow shaft which are characteristic of the state of the hollow shaft bearings and measured values for vibrations of the corrugator head which are characteristic of the balancing thereof. A display apparatus displays the measured values detected thereby and/or evaluation results based on the measured values is furthermore provided.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: June 27, 2017
    Assignee: NEXANS
    Inventors: Volker Zummach, Thomas Krause, Anatoli Schmidt, Adrian Harms
  • Patent number: 9425162
    Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: August 23, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Matthew B. Wasserman, Michael P. Schmidt-Lange
  • Patent number: 9426898
    Abstract: A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Guy Frick, Thomas J. Colosimo, Jr., Horst Clauberg
  • Patent number: 9102003
    Abstract: A method for joining at least two components by inductive high-frequency pressure welding is disclosed. The first component has a first material structure with a first hardness and the second component has a second material structure with a second hardness which is smaller than the first hardness. Both components are inductively heated in the region of the joining surfaces and are subsequently pressed together by a compressive force. The joining surface of the first component with the first hardness, which is greater than the second hardness of the second component, is pre-contoured in a spherical, conical or convex manner prior to joining the two components.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: August 11, 2015
    Assignee: MTU Aero Engines GmbH
    Inventors: Joachim Bamberg, Alexander Gindorf, Herbert Hanrieder
  • Publication number: 20150076215
    Abstract: A method and apparatus manufactures a closed structure part without flange having a curvature and welded edges along a longitudinal direction of the part and further having a varying cross-sectional shape, from two metal plates. Each of two metal plates provided with a curvature along the longitudinal direction of the plate and provided with both ends in a width direction of the plate, are press-formed such that a folding line is formed at positions corresponding to a non-welded bent edge in a cross section of the part, and stacked on each other vertically such that their bulging sides face outward. Their left ends and right ends in the width direction are mutually welded along the longitudinal direction to form welded edges.
    Type: Application
    Filed: April 13, 2012
    Publication date: March 19, 2015
    Applicant: JFE STEEL CORPORATION
    Inventors: Kazuhiko Higai, Yuji Yamasaki, Toyohisa Shinmiya
  • Publication number: 20150060530
    Abstract: A shear bonding device and a shear bonding method of metal plates are disclosed.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventor: In Tai JIN
  • Publication number: 20150056754
    Abstract: Disclosed herein is a substrate processing system, including: a feeding apparatus which feeds a substrate including a plurality of unit substrates into the substrate processing system; a vacuum molding apparatus which molds the substrate fed by the feeding apparatus; a paste printing apparatus which prints a solder paste on the substrate molded by the vacuum molding apparatus; a mounting apparatus which mounts an electronic device on the substrate on which the solder paste is printed; and a reflow apparatus which performs a reflow on the substrate on which the electronic device is mounted, wherein the vacuum molding apparatus includes a substrate molding control unit which controls the molding of the substrate. Therefore, the warpage (CAW) of the substrate is limitedly formed to improve the warpage (CAW) dispersion of the substrate, thereby improving bonding reliability and a mounting yield between the chip die and the bump of the substrate.
    Type: Application
    Filed: February 4, 2014
    Publication date: February 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Seock Hyun Park
  • Publication number: 20140374151
    Abstract: A wire bonded electrical interconnection includes a first electrical contact, a second electrical contact, and a bond wire having a first end bonded to the first electrical contact, a second end bonded to the second electrical contact, and a central portion connecting the first and second ends. The central portion includes notches formed during a wire bonding process, with each notch having at least two corners.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Jia Lin Yap, Poh Leng Eu, Ahmad Termizi Suhaimi
  • Publication number: 20140361006
    Abstract: A device for solid state joining of light metals like aluminum is described. The device utilizes the principle of continuous extrusion to add a string of filler metal into a groove separating the components to be joined, and shear deformation for surface oxide removal in the groove. The device comprises a rotating drive spindle (13) terminated in a drive spindle head (14). A groove with the shape of a circular arc constituting an extrusion chamber (16) is machined in the outer surface (15) of the drive spindle head (14), the extrusion chamber (16) being limited radially outwards by a stationary annular metal shoe (17) surrounding the drive spindle head (14), the extrusion chamber (16) being terminated by an integrated (fixed) or replaceable abutment member (18) for diverting aluminum from its circular movement in the extrusion chamber (16) through a die orifice (19).
    Type: Application
    Filed: December 21, 2012
    Publication date: December 11, 2014
    Inventors: Ulf Roar Aakenes, Öystein Grong, Tor Austigard
  • Patent number: 8872060
    Abstract: An apparatus forms a sheet into a beam having four exterior walls and a common center leg extending between an opposing two of the walls. The apparatus includes a roll former forming the sheet into the beam cross section, a welding station with top and bottom laser welders, and a weld box fixture having inwardly-biased external mandrels (biased by actuators) and outwardly-biased internal split mandrels (biased by springs) that interact to hold a desired shape of the beam in the weld fixture, and also includes a sweeping unit and cutoff device. By this arrangement, the internal and external mandrels, in combination with a bias of the actuators and springs, control a shape of the beam by flexure and movement of material of the sheet when in the weld box fixture during a welding process of the welder.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: October 28, 2014
    Assignee: Shape Corp.
    Inventors: Thomas Johnson, Doug Witte, Daniel Gatti, Brian Oxley, Brian Malkowski
  • Publication number: 20140299654
    Abstract: A setup for assembling, by brazing, a composite panel including at least two parts separated by a filler material and joined together by brazing. The setup includes a furnace to achieve a brazing temperature for brazing the panel, and an assembly device which has a form having a shape similar to the final shape of the panel to be brazed. In particular, the assembly device further includes a pressing device to apply mechanical pressure to at least part of the surface of the panel in a direction allowing the panel to be permanently deformed into a shape which matches that of the form. The pressing device is moved under the action of a spring, and the forces applied by the spring being determined so that, at the brazing temperature, the spring applies the force necessary for deforming the panel against the form.
    Type: Application
    Filed: May 12, 2014
    Publication date: October 9, 2014
    Applicants: AIRCELLE, SNECMA PROPULSION SOLIDE
    Inventors: Hélène MALOT, Philippe Bienvenu, Frédéric Guichard, Olivier Drevet
  • Publication number: 20140259597
    Abstract: A pipe processing tool that is configured to deform the end of a pipe so that the circumferential shape of the end of the pipe generally matches the circumferential shape of an adjacent pipe end. Matching the circumferential shapes of the pipe ends is advantageous during a pipe attachment process. The pipe processing tool can include a deformation ring with a plurality of pipe deformation members. Each pipe deformation member faces radially inward and is actuatable in a radial direction toward and away from the center of the deformation ring in order to permit engagement with the pipe. Each pipe deformation member is individually and separately actuatable from the other pipe deformation members so that the circumferential shapes of the pipes can be altered by controlling suitable ones of the pipe deformation members.
    Type: Application
    Filed: April 17, 2014
    Publication date: September 18, 2014
    Applicant: LAVALLEY INDUSTRIES, LLC
    Inventors: Jason LAVALLEY, Daniel LARSON, Jesse KILDE
  • Patent number: 8832933
    Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 16, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsin Kuo, Wensen Hung, Po-Shi Yao
  • Publication number: 20140117069
    Abstract: An apparatus for producing a tailored sheet metal strip, comprising at least one welding station, by means of which at least two sheet metal strips can be welded to one another along their longitudinal edges, and at least two strip feeding devices for respectively feeding one of the sheet metal strips into the at least one welding station, wherein the at least two strip feeding devices and the at least one welding station define a production line. A further-processing station for further processing is integrated in the production line downstream of the at least one welding station in the strip running direction and is equipped with tools for applying reinforcing material, to local points of at least one of the sheet metal strips which are connected to one another, for punching holes and/or for forming at least one of the sheet metal strips which are connected to one another.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 1, 2014
    Applicant: WISCO LASERTECHNIK GMBH
    Inventors: Gerhard ALBER, Martin RETZBACH
  • Publication number: 20130140345
    Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.
    Type: Application
    Filed: October 9, 2012
    Publication date: June 6, 2013
    Applicant: WEATHERFORD / LAMB, INC.
    Inventor: WEATHERFORD / LAMB, INC.
  • Patent number: 8371495
    Abstract: When rounding metal sheet sections for forming can bodies by means of a rounding machine, a pre-rounding element is used, whose lower part is deflectable with respect to the upper part by means of an actuating element. Thereby, the joint between the upper and the lower part is executed as a solid body joint whose section modulus in bending during the deflection is different along the joint. Thereby, a uniform impact on the metal sheet may be reached. Furthermore, the separating gap between the upper and the lower part is arranged obliquely, thus reducing the bending of the lower part.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: February 12, 2013
    Assignee: Soudronic AG
    Inventors: Peter Hug, Guy Boissin, Oliver Schulthess
  • Publication number: 20120312794
    Abstract: A welding device for a stretch bender is disclosed. The welding device for the stretch bender may include: an operating unit adapted to move forward toward or rearward from a bending die for shaping a shaped beam and mounted in front of the bending die; and a welding unit mounted at the operating unit and welding flange portions of the shaped beam that is completely formed by the bending die so as to prevent the flange portions from being overlapped with each other when extracting the shaped beam, the welding unit being movable forward or rearward against the operating unit.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 13, 2012
    Applicant: SUNGWOO HITECH CO., LTD.
    Inventors: Mun Yong LEE, Kuk-Rae CHO
  • Patent number: 8283593
    Abstract: A wire cleaning guide for guiding a wire in a feed direction and to clean the wire, including a gas supply nozzle for supplying plasma generating gas, a plasma generating chamber with plasma generating gas supplied from the gas supply nozzle thereto for transforming the plasma generating gas into plasma by energizing a bonding wire that passes there through to clean the wire by means of the plasma gas, and wire-feeder-side and bonding-tool-side guide holes for guiding the wire in the feed direction, the diameter of the wire-feeder-side guide hole is greater than that of the bonding-tool-side guide hole so that the outflow rate of gas after wire cleaning flowing between the wire-feeder-side guide hole and the wire is greater than that of gas after wire cleaning flowing between the bonding-tool-side guide hole and the wire.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: October 9, 2012
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Masayuki Horino, Kazuo Fujita
  • Publication number: 20120244666
    Abstract: Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Inventors: Noriaki MUKAI, Masaru Mitsumoto, Makoto Homma
  • Patent number: 8267303
    Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: September 18, 2012
    Assignee: National Semiconductor Corporation
    Inventor: Ken Pham
  • Patent number: 8157494
    Abstract: When rounding metal sheet sections for forming can bodies by means of a rounding machine, a pre-rounding element is used, whose lower part is deflectable with respect to the upper part by means of an actuating element. Thereby, the joint between the upper and the lower part is executed as a solid body joint whose section modulus in bending during the deflection is different along the joint. Thereby, a uniform impact on the metal sheet may be reached. Furthermore, the separating gap between the upper and the lower part is arranged obliquely, thus reducing the bending of the lower part.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: April 17, 2012
    Assignee: Soudronic AG
    Inventors: Peter Hug, Guy Boissin, Oliver Schulthess
  • Publication number: 20120031955
    Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
    Type: Application
    Filed: February 10, 2011
    Publication date: February 9, 2012
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventor: Ken Pham
  • Publication number: 20110259859
    Abstract: The invention relates to a method for producing a metal sheet (7) with a welded-on tube (6) which has at least partially curved sections, wherein the tube (6) is guided by at least one guide element (2) onto the metal sheet (7), is pressed thereon with at least one pressure element (3) and is welded thereto at least at some points and wherein the tube (6) is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided according to the invention that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube (6) is bent with the at least one guide element (2) around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device (1) for carrying out the method.
    Type: Application
    Filed: April 26, 2011
    Publication date: October 27, 2011
    Applicant: DTEC GMBH
    Inventors: Michael DIETL, Arnold Teufel
  • Publication number: 20110258832
    Abstract: A method and apparatus for retaining an ornament, for example, an ornamental crystal, on a frame or plate is provided. The method includes providing a pin having a first end and a second end, opposite the first end, the second end comprising a projection, for example, a head; inserting the first end of the pin through an aperture in the ornament and through a hole in the frame wherein the projection obstructs the aperture in the ornament; deforming, for example, twisting, the second end of the pin to provide a deformation of the second end that obstructs passage of the second end through the hole in the frame; and retaining the ornament on the frame by the projection of the first end of the pin and the deformation of the second end of the pin. Aspects of the invention facilitate the mounting of ornaments to ornamental fixtures, for example, chandeliers.
    Type: Application
    Filed: April 26, 2010
    Publication date: October 27, 2011
    Applicant: SCHONBEK WORLDWIDE LIGHTING INC.
    Inventors: Tho LY, Andrew SCHUYLER
  • Publication number: 20110180590
    Abstract: A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is positioned during second bonding on a lead 74 to a point “p”, and then moved horizontally by a first distance of L1 toward a pad 73, and lowered to a point “r”; a second folding step in which the tip end of the capillary is raised from the point “r” to a height of H2 and then moved horizontally toward the lead 74 by a second distance of L2; and a third bonding step in which the center of the capillary is aligned with and then lowered to a point 87a on the lead 74 adjacent to the point 86a.
    Type: Application
    Filed: January 26, 2011
    Publication date: July 28, 2011
    Applicant: Shinkawa Ltd.
    Inventors: Shinichi Akiyama, Hiroaki Yoshino, Shinsuke Tei
  • Publication number: 20110170946
    Abstract: A metal sheet composite comprising an outer metal sheet having a flange which is folded over around a flanging edge; an inner metal sheet which forms a joint with the flange; and a welding or soldering seam which is produced on or in the joint and fixedly connects the metal sheets to each other. A method for joining metal sheets and a device for flanging and welding or soldering are also disclosed. The device includes: a tool head; a flanging member, arranged on the tool head, for roll-flanging or slide-flanging; and a welding or soldering tool arranged on the tool head, wherein the flanging member and the welding or soldering tool are arranged such that the flanging member forms a pressing means for a welding or soldering process which can be performed using the welding or soldering tool.
    Type: Application
    Filed: January 14, 2008
    Publication date: July 14, 2011
    Applicant: EDAG GmbH & Co. KGaA
    Inventors: Jochen Schneegans, Martin Kraft
  • Publication number: 20110155792
    Abstract: The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces.
    Type: Application
    Filed: March 31, 2010
    Publication date: June 30, 2011
    Inventor: James V. Russell
  • Patent number: 7918378
    Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: April 5, 2011
    Assignee: National Semiconductor Corporation
    Inventor: Ken Pham
  • Publication number: 20100311234
    Abstract: A method of manufacturing a semiconductor device is provided. A first bond of a first wire loop is formed. A wire is bonded through a ball to a lead or a chip electrode of a semiconductor chip to form a second bond of the first wire loop and a first bond of a second wire loop. A second bond of the second wire loop is formed. The ball provides a large bonding area, and thus, provides a strong bonding strength.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 9, 2010
    Inventor: Yukinori Tabira
  • Publication number: 20100140322
    Abstract: When rounding metal sheet sections for forming can bodies by means of a rounding machine, a pre-rounding element is used, whose lower part is deflectable with respect to the upper part by means of an actuating element. Thereby, the joint between the upper and the lower part is executed as a solid body joint whose section modulus in bending during the deflection is different along the joint. Thereby, a uniform impact on the metal sheet may be reached. Furthermore, the separating gap between the upper and the lower part is arranged obliquely, thus reducing the bending of the lower part.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 10, 2010
    Applicant: Soudronic AG
    Inventors: Peter Hug, Guy Boissin, Oliver Schulthess
  • Publication number: 20100062278
    Abstract: A composite of sheet metal parts on or for a vehicle comprises a first sheet metal part forming a first outer shell region and comprising a first joining region which projects from the first outer shell region via a bent transition towards an inner side of the composite. The composite further comprises a second sheet metal part forming a second outer shell region and comprising a second joining region which projects from the second outer shell region towards the inner side of the composite, the second joining region facing the first joining region. The composite also comprises a welding or soldering seam along which the sheet metal parts are connected, wherein the seam runs along or alongside a flange edge formed in the first joining region at a distance from the first outer shell region, a flange deviating from the first joining region along the flange edge.
    Type: Application
    Filed: January 17, 2008
    Publication date: March 11, 2010
    Applicants: TOYOTA MOTOR CORPORATION, EDAG GMBH & CO.
    Inventors: Ewald Quell, Jochen Schneegans, Jean Heussner, Volker Stark, Yoshihiro Fujikawa, Takayuki Oidemizu
  • Publication number: 20090206145
    Abstract: A reflow system in which a reflow furnace is sequentially divided into a plurality of zones along a conveying path of a heat target which is conveyed and by controlling temperatures of the plurality of zones, the heat target which is conveyed is reflowed has: a cooling and flux collecting apparatus circulating and cooling atmosphere gases in furnace bodies of a part or all of the plurality of zones and collecting a flux; and a flow rate control unit which is inserted into a circulating path of the atmosphere gas of each of the zones and can control a flow rate. When the temperature of the zone is reduced, by controlling the flow rate control unit, the flow rate is set to be higher than that upon collecting the flux.
    Type: Application
    Filed: February 12, 2009
    Publication date: August 20, 2009
    Applicants: Tamura Corporation, Tamura FA System Corporation
    Inventors: Nobuaki Tamori, Fumihiro Yamashita
  • Patent number: 6814274
    Abstract: When viewed in a first direction, a cross section of a pressing surface of the bonding tool for pressing the inner leads is flat and extends uniformly over a range longer than the interval between every two electrode pads. When viewed in a second direction orthogonal to the first direction, and when the inner leads are pressed to the electrode pads by virtue of a predetermined pressing force, the length of a pressing area having a pressing force acting between the inner leads and the electrode pads is shorter than the length of each electrode pad.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: November 9, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Yoichiro Kurita, Teruji Inomata
  • Patent number: 6715418
    Abstract: Apparatus includes a housing, a feed table outside the housing for receiving a plate-like blank, a round shaping device in the housing for shaping the blank into a sleeve-like printing form, a welding system, and a transport device for fixing, transporting and depositing the blank aligned level on the shaping device. The transport device includes a plate suction frame penetrated by suction elements which make contact with the blank placed on the feed table. After contact has been made, the blank is fixed by activating the suction elements on the plate suction frame so as to be aligned level, and transported in a stable position to the round shaping device. The raw form is deposited on the round shaping device so as to be aligned level and fixed in-register.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: April 6, 2004
    Assignee: MAN Roland Druckmaschinen AG
    Inventors: Eduard Hoffmann, Johann Winterholler, Alfons Grieser, Katrin Bilzer
  • Patent number: 6708864
    Abstract: A weld wire for storage on a spool of weld wire. The weld wire has a substantially linear cast in the form of an undulating curve that generally lies in a single plane. The undulating curve is a succession of generally semi-circular sections having a generally fixed radius of curvature. The linear cast is formed on the weld wire prior to the weld wire being wound on the spool of weld wire. The linear cast is at least partially retained on the weld wire after the weld wire is unwound from the spool and during the feeding of the weld wire through a welding machine.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: March 23, 2004
    Assignee: Lincoln Global, Inc.
    Inventors: Otto Ferguson, III, Dennis K. Hartman
  • Publication number: 20030132269
    Abstract: A method for fabricating an Invar tool includes the step of superplastically forming an Invar facesheet for the tool. A tool header is provided, and the Invar facesheet is then formed with an SPF diaphragm driver to match the predetermined contour of the tool header. The Invar facesheet is then welded to the tool header. Forming the Invar facesheet is achieved by positioning the Invar facesheet between a superplastically formable diaphragm and a die having the predetermined contour. The diaphragm is heated to a predetermined superplastic temperature, and a predetermined pressure is applied to the diaphragm. Application of the predetermined pressure allows the diaphragm to cause the Invar facesheet to form against the predetermined contour of the die. Superplastically forming the Invar facesheet results in a negligible amount of excess scrap, reduces material costs, and reduces labor costs.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 17, 2003
    Inventors: Phillip E. Kenney, Jeffrey D. Fletcher, Dennis R. Malone, Lawrence B. Wilson
  • Patent number: 6454153
    Abstract: The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: September 24, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Michael Bettinger, Ronald W. Ellis, Tracy Reynolds
  • Patent number: 6405919
    Abstract: In a process for the continuous production of longitudinally seam-welded and corrugated metal tubes (46), a metal band drawn off from a supply reel is formed into an open-seam tube, welded at its longitudinal edges, and the welded smooth tube (45) corrugated. A withdrawal apparatus driven by an electric motor engages the smooth tube. The smooth tube (45) is corrugated by means of a corrugation plate (43) located in a corrugation head (42) which can be driven rotationally. The corrugation head (42) is driven directly by a hollow shaft motor (37, 38).
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: June 18, 2002
    Assignee: Nexans
    Inventors: Christian Frohne, Ernst Hoffmann, Wolfram Klebl, Dieter Muller
  • Publication number: 20010032870
    Abstract: The clamping band manufacturing machine is capable of full-automatically manufacturing the clamping bands and highly increasing the manufacturing efficiency. The machine comprises a main machine part and parts feeding mechanisms. In the main machine part, a band shaping stage welds a clasp on a band section, bends the band section in an arc, and overlaps both end portions of the band section. A lever welding stage welds a lever and the overlapped portion of the band section. An examination stage measures a length of an overlapped portion of the band section and the lever material. An arc shaping stage bends the lever in an arc. A circular shaping stage expands the bent portion of the band section. A conveying mechanism synchronously conveying the band section to each of the sages, which are serially arranged. The feeding mechanisms feed the parts, e.g., the clasp, to the main machine part.
    Type: Application
    Filed: April 12, 2001
    Publication date: October 25, 2001
    Applicant: Kabushiki Kaisha Mihama
    Inventor: Takeshi Nakamura