Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.

Abstract: A filter part for fluid lines, preferably high-pressure lines with pressures in the range of 150 to 900 bar, preferably in the range of 200 to 350 bar, more preferably in the range of 700 to 875 bar, for use especially in filling nipples, non-return valves, pressure regulators, cylinder valves, filling couplings, switching valves, break-off safety devices, quick couplings and also as a separate filter part. The filter part comprises a base body and at least one fluid passage opening, wherein the base body and the fluid passage opening are covered by at least one filter element. The invention further relates to a method for producing a filter part with a base body and a filter element, especially in form of a screen filter which is also known as a filter mesh.

Abstract: A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.

Abstract: There is provided a capacitor, including: a first substrate: a first capacitance generation part formed on the first substrate; a protective layer formed on the first capacitance generation part; a second capacitance generation part formed on the protective layer; and a second substrate formed on the second capacitance generation part.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: Embodiments of a method and apparatus are disclosed for providing improved backside metal contacts to silicon carbide. Embodiments include depositing a barrier layer on the bottom surface of a silicon carbide wafer. The barrier layer is located between the silicon carbide wafer and a silicon layer. The silicon carbide wafer is separated into individual silicon carbide die. Embodiments further include mechanically scrubbing each silicon carbide die on the top surface of a package, forming a gold-silicon eutectic solder that bonds the silicon carbide die to the package. The barrier layer reduces or eliminates diffusion of species into the gold-silicon eutectic solder to reduce or eliminate voids in the gold-silicon eutectic solder.

Abstract: A target assembly comprising—a support body having a carrying surface;—a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface,—wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

Abstract: A composite substrate manufacturing method including the steps of grinding a sapphire substrate to uniform the thickness of the sapphire substrate, next forming an optical device layer on the front side of the sapphire substrate, next bonding the front side of a heat sink substrate through a bonding metal layer to the front side of the optical device layer formed on the front side of the sapphire substrate to thereby form a composite substrate, next grinding the back side of the heat sink substrate of the composite substrate to uniform the thickness of the composite substrate, and finally grinding the back side of the sapphire substrate of the composite substrate to reduce the thickness of the sapphire substrate to a predetermined thickness.

Abstract: A method is provided for producing an engine wall structure that includes an inner wall, to which hot gas is admitted during engine operation, an outer wall, which is colder than the inner wall during engine operation, and at least two webs that connect the inner wall with the outer wall and delimit a cooling duct between the walls. The engine wall structure is produced by wire-electro discharge machining the duct out of a solid sheet forming the entire engine wall structure including the inner wall, the outer wall and the webs.

Abstract: A fluidic device for providing fluidic connections is described. The fluidic device comprises a fluid conduit and a planar coupling member with a fluid port, the fluid port being fluidically connected with the fluid conduit. A contour of the planar coupling member is in a predefined relationship with the fluid port's position.

Abstract: A cutter wheel is disclosed, which comprises a cutter wheel body, a cutting unit, and a solder layer. The cutter wheel body consists of the first substrate and the second substrate, wherein each substrate has an inner surface and an outer surface. The inner surface of the first substrate is treated with surface modification. The cutting unit can be formed on a rough surface. The solder layer is formed between the cutting unit and the second substrate. The present invention also provides a method for manufacturing the cutter wheel as mentioned above.

Abstract: A method and apparatus for producing a sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed core includes a plurality of cells comprising alternating front and rear projections extending outwardly in front of and behind a median plane, with each projection having a bonding surface area or land configured to be bonded with corresponding external sheets on both sides of the formed core. A plurality of micro-abrasions or indentations are formed on the bonding lands, allowing stronger bonding joints to be formed between the core and the external sheets by facilitating improved capillary action by the core during the bonding process.

Abstract: A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair temperature of from about 60 to about 98 percent of the solidus temperature of the base material in a chamber containing a protective gas that inhibits oxidation of the base material. The defect is filled with a filler metal while maintaining the article at the repair temperature. The filling is accomplished by providing a source of the filler metal of substantially the same composition as the base material of the directionally solidified article, and melting the filler metal into the defect progressively while moving the source of the filler metal relative to the article in a direction parallel to the solidification direction.

Abstract: A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to be bonded, (B) mechanically abrading portions of the respective bonding faces contacting the bonding material to be bonded to each other, (C) setting the respective objects fixed in a predetermined position relative to each other while maintaining the respective objects in contact with the bonding material in the fluid state thereof, and (D) solidifying the bonding material to bond the respective objects to each other. In the respective steps (A)-(D), the bonding material is present at the bonding portions to be bonded to each other of the respective objects constantly and without discontinuities.

Abstract: This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing plate, the recess having top and side bonding surfaces. The method of forming the bonded assembly includes treating the bonding surfaces of either the sputter target or backing plate recess by roughening at least a portion of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro-inches. The method further includes orienting the sputter target within the backing plate recess to form one assembly having a parallel interface defined by the top and bottom bonding surfaces and a side interface defined by the side bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A plurality of workpieces are assembled into a stack. Two of the workpieces are machined on one surface at predetermined positions from the edges of the workpieces. The workpieces are stacked so that the machined surfaces of the workpieces face away from each other. Two workpieces are provided with a stop off material on one of their surfaces to prevent diffusion bonding at predetermined positions. The edges of the workpieces are welded together and a pipe is welded to the stack to interconnect with the stop off material to form a sealed assembly. The workpieces are diffusion bonded together. The integral structure formed is heated and opposite ends of the integral structure are twisted relatively to contour the integral structure to a predetermined shape. The integral structure is heated and the machined portions on the workpieces are isothermally forged and then the twisted integral structure is internally pressurised to superplastically form one workpiece to produce an article, eg a fan blade.

Abstract: A process for producing non-corrosive double-wall tubing in which an unbrazed, unsealed continuous double-wall tube of a given circumference is formed from a metal sheet composed of a first non-ferritic metal having a first defined region of exposed non-ferritic metal and a second region of a second metal in overlying relationship thereto, said exposed region having a width essentially equal to the circumference of the finished tube.

Abstract: A method for forming a shaft of filament reinforced matrix metal is provided. The hollow shaft structure is made up of a number of layers of monotape which are assembled together and then HIPed to form a consolidated composite tubular shaft structure. The monotapes employed in forming the individual layers are prepared by plasma spray deposition of matrix metal onto and around an aligned set of reinforcing filaments. Following the plasma spray deposition of the matrix metal, the upper portion of the metal is removed by grinding or machining to increase the density of the monotape by removing the lens dense upper layer. The monotapes are assembled into the hollow shaft configuration by wrapping onto a shaft shaped mandrel in successive layers wound at a pitch to the axis of the mandrel. Consolidation of the multilayer wound structure is accomplished by HIPing at at least 900.degree. C. and at least 15 ksi for a period of more than 1 hour.

Abstract: A method of joining ceramics and metals to themselves and to one another at about 800.degree. C. is described using a brazing filler metal consisting essentially of 35 to 50 at. % copper, 40 to 50 at. % silver, 1 to 15 at. % titanium, and 2 to 8 at. % tin. This method produces strong joints that can withstand high service temperatures and oxidizing environments.

Abstract: Diffusion bonding of surface layers of an alloy, such as an aluminum alloy, having surface oxides of low solubility in the alloy includes treating the surface layers to be bonded to remove existing surface oxide coatings, and diffusion bonding the surface layers to one another by placing the alloy to be bonded under sufficient pressure to cause disruption of the oxide coatings by localized surface deformation of the alloy, enhanced by a superplastic microstructure, without substantial deformation of the alloy, i.e., macroscopic deformation approaching zero percent, while heating the alloy in a non-oxidizing atmosphere for a time sufficient for diffusion bonding to occur. The alloy may be treated so that at least the surface layers thereof have a fine grain structure of the type associated with superplastic forming properties. Components may be formed by diffusion bonding and superplastic forming.

Abstract: Improved apparatus and method for continuously producing high sensitivity magnetochemical particles consisting of joined pairs of pre-oriented magnetic metallic spheres which have been heat treated, magnetically annealed, then plated with color forming metals and overcoated with a chemically resistant coating. These spheres are vibratorially and frictionally seated in surface dimples impressed on the opposed surfaces of a film formed in a mobius loop. The dimples are formed in back-to-back registry by passing the film material through mirror image half-tone screen carrying impressing cylinders. A resin coating applied to the surface of the film loop encases and binds the spheres into mirror image groups; and while the resin coating is still fluid, a directional magnetic field is applied to rotate and orient the encased spheres so that their preferred directions for magnetic field propagation are parallel to the surface of the film loop.

Abstract: A tube joint including a male end which has a rounded inner edge having its original surface finish and a female end which is expanded to receive the male end. The male end is formed by chamfering the end outer diameter and flaring the end inner diameter until the end inner diameter is substantially rounded. The female end is expanded so its inner diameter is only slightly greater than the outer diameter of the male end.

Abstract: A pipeline consisting of lengths of steel pipe welded together in end-to-end relation is made by first weld-plating the internal surface of the end portions of each individual pipe length with a corrosion-resistant material. A protective layer is then applied to the internal surface of each pipe length between the weld-plated end portions, the latter having first been smoothed down by machining to the desired finished thickness of the protective layer. The pipe lengths are then welded together in end-to-end relation. The welding operation consists of first depositing a root bead encircling the pipe at the junction of the ends of the weld-plated material. Weld material is then deposited in and fills out the gap between bevelled edges of the pipe ends to substantially the outside diameter of the pipe.

Abstract: The method of mounting a particle on a support member comprises mounting a mass of material from which the particle is derived on a carrier element and then shaping the mass of material to form an assembly of the particle on the element. The assembly is located in a predetermined attitude relatively to a body of liquid substance which is solidified around the particle. Next, most if not all of the material exterior to the solidified substance is removed and a support member then attached to the remaining part of the assembly. Finally, the solidified liquid substance is removed from the assembly.

Abstract: A method of manufacturing a suction pipette of sinterable material for receiving substantially rectangular, semiconductor crystal plates. The pipette is formed with a rectangular recess and has walls defining the recess which narrow towards the floor of the recess; an evacuation channel communicates with the floor. The method includes the steps of inserting a binder into the material to be sintered, and fabricating first and second parts for assembly of the pipette, the first part being formed with an open channel and having sidewalls defining the channel. The second part is insertable into the first part and has cam-shaped end projections formed with respective inner walls, and outer walls for making contact with the sidewalls upon insertion of the second part into the first part.