Combined Patents (Class 228/18)
  • Patent number: 10916801
    Abstract: A method of manufacturing an electrode body includes a charging step, a first laminating step, and a second laminating step to manufacture the electrode body by laminating positive and negative electrode plates by interposing a separator therebetween. In the charging step, one of the positive and negative electrode plates is a first electrode plate and an other one is a second electrode plate, and one of the first electrode plate and the separator is charged to a potential enough to generate an attraction force between the first electrode plate and the separator. The first laminating step includes bringing the first electrode plate and the separator, at least one of which is charged, into direct contact to attach each other to form a laminated body. In the second charging step, the second electrode plate is laminated on the laminated body to form the electrode body.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: February 9, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Natsumi Hiramoto, Akihiro Ochiai
  • Patent number: 10583522
    Abstract: A tool assembly for performing operations in confined spaces, the tool assembly includes a telescoping pole having a proximal end and a distal end. The telescoping pole is capable of extending between a retracted position and an extended position. A working tool is connected to the distal end of the telescoping pole, and a control unit is connected to the proximal end of the telescoping pole. A flexible cable extending through the telescoping pole electrically connects the working tool to the control unit.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: March 10, 2020
    Assignee: HUBBELL INCORPORATED
    Inventors: Mamoon Tawfiq Abedraboh, Richard Wallace Ceass, Louis Webster Ruffin, Adam Britton Polcha
  • Patent number: 10033023
    Abstract: Methods, stacks and electrochemical cells are provided, in which the cell separator is surface-treated prior to attachment to the electrode(s) to form binding sites on the cell separator and enhance binding thereof to the electrode(s), e.g., electrostatically. The cell separator(s) may be attached to the electrode(s) by cold press lamination, wherein the created binding sites are configured to stabilize the cold press lamination electrostatically—forming flexible and durable electrode stacks. Electrode slurry may be deposited on a sacrificial film and then attached to current collector films, avoiding unwanted interactions between materials and in particular solvents involved in the respective slurries. Dried electrode slurry layers may be pressed or calendared against each other to yield thinner, smother and more controllably porous electrodes, as well as higher throughput. The produced stacks may be used in electrochemical cells and in any other type of energy storage device.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 24, 2018
    Assignee: StoreDot Ltd.
    Inventors: Ekaterina Gotlib Vainshtein, Daniel Aronov
  • Patent number: 10003060
    Abstract: Methods, stacks and electrochemical cells are provided, in which the cell separator is surface-treated prior to attachment to the electrode(s) to form binding sites on the cell separator and enhance binding thereof to the electrode(s), e.g., electrostatically. The cell separator(s) may be attached to the electrode(s) by cold press lamination, wherein the created binding sites are configured to stabilize the cold press lamination electrostatically—forming flexible and durable electrode stacks. Electrode slurry may be deposited on a sacrificial film and then attached to current collector films, avoiding unwanted interactions between materials and in particular solvents involved in the respective slurries. Dried electrode slurry layers may be pressed or calendared against each other to yield thinner, smother and more controllably porous electrodes, as well as higher throughput. The produced stacks may be used in electrochemical cells and in any other type of energy storage device.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: June 19, 2018
    Assignee: StoreDot Ltd.
    Inventors: Ekaterina Gotlib Vainshtein, Daniel Aronov
  • Publication number: 20150090771
    Abstract: A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding.
    Type: Application
    Filed: September 23, 2014
    Publication date: April 2, 2015
    Inventors: Domenico Furfari, Marco Pacchione, Valentin Richter-Trummer
  • Publication number: 20150072473
    Abstract: A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.
    Type: Application
    Filed: December 27, 2013
    Publication date: March 12, 2015
    Inventors: Kui Kam LAM, Pingliang TU, Zhao YANG, Jun QI, Chun Hung Samuel IP
  • Publication number: 20150069109
    Abstract: A lamination device 30 includes a first charger 40 for emitting charged particles toward an uppermost surface of a battery stack 10 of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that are stacked on a stacking stage 32. As a result of the emission of charged particles, the battery stack 10 and one of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that is to be stacked on the stack 10 are electrostatically attracted to each other.
    Type: Application
    Filed: June 14, 2013
    Publication date: March 12, 2015
    Applicant: Nikkiso Co., Ltd.
    Inventors: Takahiro Mori, Tomoyo Sawada
  • Publication number: 20150048523
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 19, 2015
    Applicant: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20150034702
    Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one process chamber or a plurality of process chambers having a treating space in which a reflow process with respect to the substrate is performed, a cleaning unit cleaning the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and the cleaning unit.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 5, 2015
    Applicant: Semigear Inc
    Inventor: Jian Zhang
  • Publication number: 20140342504
    Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.
    Type: Application
    Filed: August 6, 2014
    Publication date: November 20, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Taiji SAKAI, Nobuhiro IMAIZUMI
  • Publication number: 20140263586
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: May 7, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Publication number: 20140191019
    Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
    Type: Application
    Filed: December 13, 2012
    Publication date: July 10, 2014
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Tianniu Chen, Michael B. Korzenski, Ping Jiang
  • Patent number: 8766140
    Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: July 1, 2014
    Assignee: Lincoln Global, Inc.
    Inventor: Paul Edward Denney
  • Publication number: 20140048183
    Abstract: A system and method are detailed for aluminizing surfaces of metallic substrates, parts, and components with a protective alumina layer in-situ. Aluminum (Al) foil sandwiched between the metallic components and a refractory material when heated in an oxidizing gas under a compression load at a selected temperature forms the protective alumina coating on the surface of the metallic components. The alumina coating minimizes evaporation of volatile metals from the metallic substrates, parts, and components in assembled devices during operation at high temperature that can degrade performance.
    Type: Application
    Filed: August 13, 2013
    Publication date: February 20, 2014
    Applicant: BATTELLE MEMORIAL INSTITUTE
    Inventors: Yeong-Shyung Chou, Jeffry W. Stevenson
  • Publication number: 20130187293
    Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.
    Type: Application
    Filed: November 8, 2012
    Publication date: July 25, 2013
    Applicant: FUJITSU LIMITED
    Inventor: FUJITSU LIMITED
  • Publication number: 20130181040
    Abstract: Provided is a semiconductor device manufacturing system according to the present disclosure which manufactures a semiconductor device using a chip stack. The system includes a chip reducing apparatus and a chip bonding apparatus, the chip reducing apparatus includes a reduction chamber, an oxide film of the surface of the terminal of each chip is reduced in the reduction chamber, the chip bonding apparatus includes a reflow chamber isolated from the reduction chamber, a solder ball is bonded to the terminal of each chip in the reflow chamber, and the chip bonding apparatus is installed separately from the chip reducing apparatus.
    Type: Application
    Filed: December 21, 2012
    Publication date: July 18, 2013
    Applicant: Tokyo Electron Limited
    Inventor: Tokyo Electron Limited
  • Publication number: 20130105046
    Abstract: A method of generating a welded assembly includes providing a work-hardened steel component. The method also includes annealing a region on the work-hardened steel component to impart a local temper to the region such that formability of the region is increased. The method additionally includes forming a projection on the annealed region. Furthermore, the method includes clamping a panel against the projection and joining the panel and the work-hardened steel component at the projection via a welding apparatus to generate the welded assembly. A system for generating a welded assembly employing the disclosed method and a method of generating a reinforced assembly are also disclosed.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 2, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Blair E. Carlson, Mark T. Hall
  • Publication number: 20130075455
    Abstract: This invention is to prevent tin from being adhered to a surface of part of an object to be soldered, a solder bump being formed in the part thereof. A reflow pretreatment apparatus includes a hydrogen radical generator and a filter for capturing suspended solids. The hydrogen radical generator radiates hydrogen radicals onto solder arranged in an object to be soldered. The filter for capturing suspended solids is arranged such that the hydrogen radicals are radiated onto the solder after passing through the filter for capturing suspended solids.
    Type: Application
    Filed: July 20, 2012
    Publication date: March 28, 2013
    Applicant: Renesas Electronics Corporation
    Inventor: Yuji SHIMIZU
  • Publication number: 20130048614
    Abstract: Sealing disks (44) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel (54) is fastened on a main plate (53) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.
    Type: Application
    Filed: January 25, 2011
    Publication date: February 28, 2013
    Applicant: Soudronic AG
    Inventors: Francois Chevalley, Jürg Lanz, Marcel Oberholzer
  • Publication number: 20120305630
    Abstract: A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell (1), pillar buses (2), an anode bus (3), a balance bus (4), a inter-cell standby bus (5), a door-shaped pillar clamp (6), an arcuate clamp (7) of anode buses, a current conversion switch (8, a mechanical switching device (9) for the short-circuit port, a voltage sensor and wires thereof (10), a temperature sensor and wires thereof (11), a system (12) for data acquiring, displaying, analyzing and alarming, an A-side welding area (13), a B-side welding area (14) and compression-joint points (15) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell (1) and pillar buses (2) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses (2), other
    Type: Application
    Filed: November 17, 2010
    Publication date: December 6, 2012
    Inventors: Tao Yang, Bin Cao
  • Publication number: 20120205424
    Abstract: A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 16, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Julien Sylvestre
  • Publication number: 20120111925
    Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.
    Type: Application
    Filed: September 13, 2011
    Publication date: May 10, 2012
    Applicant: Raytheon Company
    Inventors: Buu Diep, Thomas A. Kocian, Roland W. Gooch
  • Publication number: 20120055979
    Abstract: A weld ignition system includes a wireless receiver that wirelessly receives a weld ignition activation signal. The weld ignition system further includes igniter that ignites a weld ignition material in response to the wireless receiver wirelessly receiving the weld ignition activation signal. The ignited weld ignition material initiates exothermic based welding of a weld material.
    Type: Application
    Filed: April 23, 2010
    Publication date: March 8, 2012
    Inventor: Fady Ameer Alghusain
  • Patent number: 8074864
    Abstract: An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has an opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited by the electronic thermal igniter assembly. The igniter plug rests on top of the lid and the ignition body is retained in a recess within the igniter plug.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 13, 2011
    Assignee: Continental Industries, Inc.
    Inventors: David Lewis Lofton, James Quintus
  • Publication number: 20110296952
    Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.
    Type: Application
    Filed: August 15, 2011
    Publication date: December 8, 2011
    Inventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
  • Publication number: 20110272453
    Abstract: A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 10, 2011
    Inventors: Hilmar Von Campe, Stefan Meyer, Stefan Huber
  • Publication number: 20110272450
    Abstract: A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps.
    Type: Application
    Filed: July 20, 2011
    Publication date: November 10, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Peter A. Gruber, Jae-woong Nah
  • Publication number: 20110132966
    Abstract: An alternative ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has a opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited either by the electronic thermal igniter assembly or may be ignited by a spark.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 9, 2011
    Applicant: CONTINENTAL INDUSTRIES, INC.
    Inventor: David Lewis Lofton
  • Publication number: 20110127311
    Abstract: A system and method for friction stir welding of small diameter tubing, wherein the small diameter tubing is held in a correct position with a grasp sufficient to perform FSW when the tubing is comprised of high melting temperature materials, wherein the small diameter tubing can be rotated by the positioning and holding system while a FSW tool is held stationary, or vice versa, wherein internal mandrels are also described which can fit inside the smaller dimensions of the small diameter tubing and expand to provide a counter force to prevent deformation of the tubing when forces are applied by the FSW tool, wherein new FSW tool geometries are also described which enable the FSW tool to direct more heat on a tool/workpiece interface to counteract a lack of contact between the FSW shoulder and the workpiece because of tube curvature, and wherein the FSW tool is positioned on a small diameter tube by trailing the joint to provide desirable heating at the joint/workpiece interface and surface finishing.
    Type: Application
    Filed: November 2, 2010
    Publication date: June 2, 2011
    Inventors: Jeremy Peterson, John Hall, Russell J. Steel, Jonathan Babb, Matt Collier, Scott M. Packer
  • Patent number: 7946466
    Abstract: An alternative ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has a opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited either by the electronic thermal igniter assembly or may be ignited by a spark.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: May 24, 2011
    Assignee: Continental Industries, Inc.
    Inventor: David Lewis Lofton
  • Publication number: 20110030852
    Abstract: The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the surface is carried out.
    Type: Application
    Filed: October 20, 2010
    Publication date: February 10, 2011
    Inventors: Snjezana Boger, Peter Englert, Mathias Pfitzer, Ingo Trautwein, Sabine Sedlmeir
  • Publication number: 20100308103
    Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 9, 2010
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: GEORGE JYH-SHANN CHOU, ROBERT DANIEL HILTY
  • Publication number: 20100301103
    Abstract: Two pipes are arranged end to end, the pipes being shaped such that a groove is defined between the ends of the pipe. A plurality of welding torches are used to weld in the groove, such that at least some of the welding torches perform a first welding pass, the welding characteristics of the torches are adjusted and at least some of the welding torches are used to perform a second welding pass. At least one torch welds in a first sector in the first welding pass and a second sector in the second welding pass, the second sector being different to the first. The sectors might overlap or might not overlap.
    Type: Application
    Filed: January 19, 2009
    Publication date: December 2, 2010
    Applicant: SAIPEM S.P.A.
    Inventor: Renato Bonelli
  • Publication number: 20100264131
    Abstract: The present application relates to an apparatus for and a method of forge welding elongate articles (1, 2), such as tubes, together. In addition to electrode (12, 13) assemblies (9) for heating the article (1, 2) ends with high frequency resistive heating, the apparatus includes a coil (3) for induction heating the articles (1, 2) before or after welding, as well as means for cooling the welding seam.
    Type: Application
    Filed: November 10, 2008
    Publication date: October 21, 2010
    Inventors: Per Thomas Moe, Bjorn Halmrast
  • Publication number: 20100230469
    Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
    Type: Application
    Filed: March 9, 2010
    Publication date: September 16, 2010
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kiyoaki IIDA, Kazuo TANAKA, Norio KONDO, Hideaki SAKAGUCHI, Mitsutoshi HIGASHI
  • Publication number: 20100213243
    Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.
    Type: Application
    Filed: April 17, 2008
    Publication date: August 26, 2010
    Applicants: Pac Tech- Packaging Technologies GmbH, Smart Pac GmbH Technology Services
    Inventors: Ghassem Azdasht, Siavash Tabrizi
  • Publication number: 20100194356
    Abstract: A system and method are provided for controlling an internal combustion engine driving a generator/welder or a stand-alone generator. The engine and/or the generator is controlled based upon settings for welding. Controlling the engine may include altering the engine speed based upon a detected demand on the generator and/or operating parameters of a welder.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 5, 2010
    Applicant: Illinois Tool Works, Inc.
    Inventors: Daniel C. Fosbinder, Richard Beeson, Michael J. Trinkner
  • Publication number: 20100170939
    Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.
    Type: Application
    Filed: December 21, 2009
    Publication date: July 8, 2010
    Applicant: FUJITSU LIMITED
    Inventor: Tetsuji ISHIKAWA
  • Publication number: 20100170937
    Abstract: Systems and methods are disclosed for joining two or more parts together via cold spraying. In one embodiment, a first part and second part may be aligned together to create a joint. The parts are joined by cold spraying a material on the first metal part and the second metal part to create a bond at the joint.
    Type: Application
    Filed: January 7, 2009
    Publication date: July 8, 2010
    Applicant: General Electric Company
    Inventor: Eklavya Calla
  • Publication number: 20100102106
    Abstract: A weld enclosure (15) and welding apparatus (10) including a weld enclosure (15). Also a method of welding. The apparatus (10) has first (12) and second (14) opposed tooling faces adapted to receive and hold respective first (16) and second (18) weld elements. The weld enclosure (15) comprises a housing (22, 24a, 24b) that allows relative movement between the weld elements (16, 18) and a change in a physical dimension of at least one of the weld elements (16, 18). The weld enclosure (15) also comprises locating means for locating the housing (22, 24a, 24b) relative to the welding apparatus and includes heating means (20).
    Type: Application
    Filed: May 23, 2008
    Publication date: April 29, 2010
    Applicant: ROLLS-ROYCE PLC
    Inventors: Simon E. Bray, Tony J. Sweeting
  • Publication number: 20100078464
    Abstract: A wire bonding apparatus including a capillary having a through-hole through which a wire is inserted; an inert gas feed section for feeding inert gas containing reducing gas to a region on the tip end side of the bonding tool; and a gas blowing nozzle for blowing out inert gas containing reducing gas along a base end surface of the capillary including an opening of the through-hole. The pressure in the through-hole is made lower than the ambient pressure by the gas blown out of the gas blowing nozzle toward the opening of the base end of the capillary, so that the inert gas containing reducing gas blown out of the inert gas feed section flows through the tip end into the through-hole, thus preventing oxidation of the part of the wire inside the through-hole of the capillary.
    Type: Application
    Filed: October 1, 2008
    Publication date: April 1, 2010
    Inventor: Shinichi Nishiura
  • Publication number: 20100065614
    Abstract: A method of joining pipes (3) to produce underwater pipelines (2), wherein the facing free ends (15) of two adjacent pipes (3), aligned along an axis (A), are welded to define a cutback (18); a protective sheet (22) of plastic material is extruded close to the cutback (18); and the protective sheet (22) is wound about the cutback (18).
    Type: Application
    Filed: December 13, 2007
    Publication date: March 18, 2010
    Applicant: Saipem S.p.A.
    Inventor: Serafino Cittadini Bellini
  • Publication number: 20100055848
    Abstract: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
    Type: Application
    Filed: October 9, 2009
    Publication date: March 4, 2010
    Inventors: Keng Sang Cha, Tek Seng Tan, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir
  • Publication number: 20100037625
    Abstract: Article for magnetic heat exchange and method of manufacturing the same Article for magnetic heat exchange comprising a mantle enveloping at least one core, wherein the core comprises a plurality of grains comprising a magnetocalorically active material or a plurality of particles comprising precursor of a magnetocalorically active material.
    Type: Application
    Filed: February 12, 2007
    Publication date: February 18, 2010
    Applicant: Vacuumschmelze GmbH & Co. KG
    Inventor: Matthias Katter
  • Patent number: 7644852
    Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: January 12, 2010
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Shinichi Nishiura, Fumio Miyano, Masayuki Horino
  • Publication number: 20090301653
    Abstract: An apparatus for processing a document core sheet to produce a document core inlay may include a plurality of processing stations, each for executing at least one step in producing the document core inlay, and at least one supporting table for supporting the core sheet and for transporting the core sheet to each processing station for processing. The processing stations may be positioned surrounding a center such that a closed-loop path is defined. The table may travel along the closed-loop path among the processing stations.
    Type: Application
    Filed: January 25, 2006
    Publication date: December 10, 2009
    Applicant: On Track Innovations Ltd.
    Inventor: Chi Keung Lee
  • Publication number: 20090288762
    Abstract: The invention relates to a method for welding a conductor to a conductive film, which is preferably intended for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.
    Type: Application
    Filed: January 24, 2006
    Publication date: November 26, 2009
    Inventor: Markus Wolfel
  • Publication number: 20090282973
    Abstract: In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.
    Type: Application
    Filed: February 6, 2006
    Publication date: November 19, 2009
    Inventors: Hideki Nakamura, Tsutomu Hiyama, Toshihiko Mutsuji
  • Publication number: 20090184152
    Abstract: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.
    Type: Application
    Filed: December 26, 2006
    Publication date: July 23, 2009
    Inventor: Masahiko Kimbara
  • Publication number: 20090108052
    Abstract: A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventor: Xiangyang FENG