Abstract: A method of manufacturing an electrode body includes a charging step, a first laminating step, and a second laminating step to manufacture the electrode body by laminating positive and negative electrode plates by interposing a separator therebetween. In the charging step, one of the positive and negative electrode plates is a first electrode plate and an other one is a second electrode plate, and one of the first electrode plate and the separator is charged to a potential enough to generate an attraction force between the first electrode plate and the separator. The first laminating step includes bringing the first electrode plate and the separator, at least one of which is charged, into direct contact to attach each other to form a laminated body. In the second charging step, the second electrode plate is laminated on the laminated body to form the electrode body.

Abstract: A tool assembly for performing operations in confined spaces, the tool assembly includes a telescoping pole having a proximal end and a distal end. The telescoping pole is capable of extending between a retracted position and an extended position. A working tool is connected to the distal end of the telescoping pole, and a control unit is connected to the proximal end of the telescoping pole. A flexible cable extending through the telescoping pole electrically connects the working tool to the control unit.

Abstract: Methods, stacks and electrochemical cells are provided, in which the cell separator is surface-treated prior to attachment to the electrode(s) to form binding sites on the cell separator and enhance binding thereof to the electrode(s), e.g., electrostatically. The cell separator(s) may be attached to the electrode(s) by cold press lamination, wherein the created binding sites are configured to stabilize the cold press lamination electrostatically—forming flexible and durable electrode stacks. Electrode slurry may be deposited on a sacrificial film and then attached to current collector films, avoiding unwanted interactions between materials and in particular solvents involved in the respective slurries. Dried electrode slurry layers may be pressed or calendared against each other to yield thinner, smother and more controllably porous electrodes, as well as higher throughput. The produced stacks may be used in electrochemical cells and in any other type of energy storage device.

Abstract: Methods, stacks and electrochemical cells are provided, in which the cell separator is surface-treated prior to attachment to the electrode(s) to form binding sites on the cell separator and enhance binding thereof to the electrode(s), e.g., electrostatically. The cell separator(s) may be attached to the electrode(s) by cold press lamination, wherein the created binding sites are configured to stabilize the cold press lamination electrostatically—forming flexible and durable electrode stacks. Electrode slurry may be deposited on a sacrificial film and then attached to current collector films, avoiding unwanted interactions between materials and in particular solvents involved in the respective slurries. Dried electrode slurry layers may be pressed or calendared against each other to yield thinner, smother and more controllably porous electrodes, as well as higher throughput. The produced stacks may be used in electrochemical cells and in any other type of energy storage device.

Abstract: A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding.

Abstract: A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Abstract: A lamination device 30 includes a first charger 40 for emitting charged particles toward an uppermost surface of a battery stack 10 of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that are stacked on a stacking stage 32. As a result of the emission of charged particles, the battery stack 10 and one of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that is to be stacked on the stack 10 are electrostatically attracted to each other.

Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one process chamber or a plurality of process chambers having a treating space in which a reflow process with respect to the substrate is performed, a cleaning unit cleaning the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and the cleaning unit.

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.

Abstract: A system and method are detailed for aluminizing surfaces of metallic substrates, parts, and components with a protective alumina layer in-situ. Aluminum (Al) foil sandwiched between the metallic components and a refractory material when heated in an oxidizing gas under a compression load at a selected temperature forms the protective alumina coating on the surface of the metallic components. The alumina coating minimizes evaporation of volatile metals from the metallic substrates, parts, and components in assembled devices during operation at high temperature that can degrade performance.

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Abstract: Provided is a semiconductor device manufacturing system according to the present disclosure which manufactures a semiconductor device using a chip stack. The system includes a chip reducing apparatus and a chip bonding apparatus, the chip reducing apparatus includes a reduction chamber, an oxide film of the surface of the terminal of each chip is reduced in the reduction chamber, the chip bonding apparatus includes a reflow chamber isolated from the reduction chamber, a solder ball is bonded to the terminal of each chip in the reflow chamber, and the chip bonding apparatus is installed separately from the chip reducing apparatus.

Abstract: A method of generating a welded assembly includes providing a work-hardened steel component. The method also includes annealing a region on the work-hardened steel component to impart a local temper to the region such that formability of the region is increased. The method additionally includes forming a projection on the annealed region. Furthermore, the method includes clamping a panel against the projection and joining the panel and the work-hardened steel component at the projection via a welding apparatus to generate the welded assembly. A system for generating a welded assembly employing the disclosed method and a method of generating a reinforced assembly are also disclosed.

Abstract: This invention is to prevent tin from being adhered to a surface of part of an object to be soldered, a solder bump being formed in the part thereof. A reflow pretreatment apparatus includes a hydrogen radical generator and a filter for capturing suspended solids. The hydrogen radical generator radiates hydrogen radicals onto solder arranged in an object to be soldered. The filter for capturing suspended solids is arranged such that the hydrogen radicals are radiated onto the solder after passing through the filter for capturing suspended solids.

Abstract: Sealing disks (44) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel (54) is fastened on a main plate (53) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.

Abstract: A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell (1), pillar buses (2), an anode bus (3), a balance bus (4), a inter-cell standby bus (5), a door-shaped pillar clamp (6), an arcuate clamp (7) of anode buses, a current conversion switch (8, a mechanical switching device (9) for the short-circuit port, a voltage sensor and wires thereof (10), a temperature sensor and wires thereof (11), a system (12) for data acquiring, displaying, analyzing and alarming, an A-side welding area (13), a B-side welding area (14) and compression-joint points (15) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell (1) and pillar buses (2) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses (2), other

Abstract: A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: A weld ignition system includes a wireless receiver that wirelessly receives a weld ignition activation signal. The weld ignition system further includes igniter that ignites a weld ignition material in response to the wireless receiver wirelessly receiving the weld ignition activation signal. The ignited weld ignition material initiates exothermic based welding of a weld material.

Abstract: An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has an opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited by the electronic thermal igniter assembly. The igniter plug rests on top of the lid and the ignition body is retained in a recess within the igniter plug.

Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

Abstract: A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell.

Abstract: A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps.

Abstract: An alternative ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has a opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited either by the electronic thermal igniter assembly or may be ignited by a spark.

Abstract: A system and method for friction stir welding of small diameter tubing, wherein the small diameter tubing is held in a correct position with a grasp sufficient to perform FSW when the tubing is comprised of high melting temperature materials, wherein the small diameter tubing can be rotated by the positioning and holding system while a FSW tool is held stationary, or vice versa, wherein internal mandrels are also described which can fit inside the smaller dimensions of the small diameter tubing and expand to provide a counter force to prevent deformation of the tubing when forces are applied by the FSW tool, wherein new FSW tool geometries are also described which enable the FSW tool to direct more heat on a tool/workpiece interface to counteract a lack of contact between the FSW shoulder and the workpiece because of tube curvature, and wherein the FSW tool is positioned on a small diameter tube by trailing the joint to provide desirable heating at the joint/workpiece interface and surface finishing.

Abstract: An alternative ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has a opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited either by the electronic thermal igniter assembly or may be ignited by a spark.

Abstract: The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the surface is carried out.

Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.

Abstract: Two pipes are arranged end to end, the pipes being shaped such that a groove is defined between the ends of the pipe. A plurality of welding torches are used to weld in the groove, such that at least some of the welding torches perform a first welding pass, the welding characteristics of the torches are adjusted and at least some of the welding torches are used to perform a second welding pass. At least one torch welds in a first sector in the first welding pass and a second sector in the second welding pass, the second sector being different to the first. The sectors might overlap or might not overlap.

Abstract: The present application relates to an apparatus for and a method of forge welding elongate articles (1, 2), such as tubes, together. In addition to electrode (12, 13) assemblies (9) for heating the article (1, 2) ends with high frequency resistive heating, the apparatus includes a coil (3) for induction heating the articles (1, 2) before or after welding, as well as means for cooling the welding seam.

Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Abstract: A system and method are provided for controlling an internal combustion engine driving a generator/welder or a stand-alone generator. The engine and/or the generator is controlled based upon settings for welding. Controlling the engine may include altering the engine speed based upon a detected demand on the generator and/or operating parameters of a welder.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: Systems and methods are disclosed for joining two or more parts together via cold spraying. In one embodiment, a first part and second part may be aligned together to create a joint. The parts are joined by cold spraying a material on the first metal part and the second metal part to create a bond at the joint.

Abstract: A weld enclosure (15) and welding apparatus (10) including a weld enclosure (15). Also a method of welding. The apparatus (10) has first (12) and second (14) opposed tooling faces adapted to receive and hold respective first (16) and second (18) weld elements. The weld enclosure (15) comprises a housing (22, 24a, 24b) that allows relative movement between the weld elements (16, 18) and a change in a physical dimension of at least one of the weld elements (16, 18). The weld enclosure (15) also comprises locating means for locating the housing (22, 24a, 24b) relative to the welding apparatus and includes heating means (20).

Abstract: A wire bonding apparatus including a capillary having a through-hole through which a wire is inserted; an inert gas feed section for feeding inert gas containing reducing gas to a region on the tip end side of the bonding tool; and a gas blowing nozzle for blowing out inert gas containing reducing gas along a base end surface of the capillary including an opening of the through-hole. The pressure in the through-hole is made lower than the ambient pressure by the gas blown out of the gas blowing nozzle toward the opening of the base end of the capillary, so that the inert gas containing reducing gas blown out of the inert gas feed section flows through the tip end into the through-hole, thus preventing oxidation of the part of the wire inside the through-hole of the capillary.

Abstract: A method of joining pipes (3) to produce underwater pipelines (2), wherein the facing free ends (15) of two adjacent pipes (3), aligned along an axis (A), are welded to define a cutback (18); a protective sheet (22) of plastic material is extruded close to the cutback (18); and the protective sheet (22) is wound about the cutback (18).

Abstract: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.

Abstract: Article for magnetic heat exchange and method of manufacturing the same Article for magnetic heat exchange comprising a mantle enveloping at least one core, wherein the core comprises a plurality of grains comprising a magnetocalorically active material or a plurality of particles comprising precursor of a magnetocalorically active material.

Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.

Abstract: An apparatus for processing a document core sheet to produce a document core inlay may include a plurality of processing stations, each for executing at least one step in producing the document core inlay, and at least one supporting table for supporting the core sheet and for transporting the core sheet to each processing station for processing. The processing stations may be positioned surrounding a center such that a closed-loop path is defined. The table may travel along the closed-loop path among the processing stations.

Abstract: The invention relates to a method for welding a conductor to a conductive film, which is preferably intended for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.

Abstract: In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.

Abstract: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.

Abstract: A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam.