Combined Patents (Class 228/18)
  • Patent number: 4082212
    Abstract: Metallic tubing is manufactured from galvanized steel strip by forming the strip into tubular shape, welding the edges together and replacing the zinc lost in welding by atomization metallizing the weld zone first with an aluminum alloy containing from more than about 0.30 to about 0.95 weight percent iron and then with zinc.
    Type: Grant
    Filed: March 15, 1976
    Date of Patent: April 4, 1978
    Assignee: Southwire Company
    Inventors: J. Charles Headrick, R. Emory Starnes, Robert C. Peel
  • Patent number: 4067039
    Abstract: A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.
    Type: Grant
    Filed: August 16, 1976
    Date of Patent: January 3, 1978
    Assignee: Motorola, Inc.
    Inventor: Stanley Gaicki
  • Patent number: 4002282
    Abstract: A very-fine microcircuit interconnecting wire is passed through a central ifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary tubes are moveably attached to the capillary bonding head in such a way that they can be positioned with their orifices opposing each other on opposite sides of the very fine wire just below the central orifice of the capillary bonding head. An insulating adhesive or enamel is passed through the capillary tubes to blend around the wire and form an insulating layer as the capillary bonding head is moved from one bonding point to the next.
    Type: Grant
    Filed: March 25, 1976
    Date of Patent: January 11, 1977
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Francis J. Murdoch
  • Patent number: 3994428
    Abstract: This invention discloses the structure of, and the method and apparatus for making, improved metal-matrix composites. Each of the composites comprises a strain-hardenable metal matrix, and a plurality of high-strength, high-modulus, elongated reinforcing members arranged in spatial relationship therein. Each of the members is effectively bonded to the surrounding matrix at selected, discrete surface regions along its length so as to locally strain the matrix around the discretely bonded regions upon the composite being suitably stressed. When thus locally strained, the matrix is spatially selectively and differentially strain-hardened and strengthened near the bonded regions. The spheres of influence of the straining and strain-hardening in the matrix near the bonded regions on one member are caused to significantly overlap similar spheres of influence near the neighboring members.
    Type: Grant
    Filed: June 20, 1975
    Date of Patent: November 30, 1976
    Inventor: Chou H. Li
  • Patent number: 3974954
    Abstract: There is disclosed an electrical contact and a method and apparatus for making said electrical contact wherein the contact comprises at least one formed tine portion, a central retaining portion, and a tail portion. Secured to this tine portion is a precious metal contact material comprised of a first layer of a base material and a second layer of a precious metal.
    Type: Grant
    Filed: January 17, 1975
    Date of Patent: August 17, 1976
    Assignee: GTE Sylvania Incorporated
    Inventors: Robert R. Brenan, Gordon L. Johnson
  • Patent number: 3966110
    Abstract: An ultrasonic soldering system is described. Electrical and electronic components are assembled in a circuit board with their leads extending through holes in the board. The components are temporarily held in position in the board by means of a solid, solder-compatible, stabilizer material having a melting point below that of solder, which material couples the board and leads to one another. The component leads are then trimmed to finish length, and after trimming, the components are soldered in place utilizing vibratory energy in a body of molten solder. The vibratory energy in the solder scrubs the board and leads removing oxides and allowing wetting, thus eliminating the need for application of fluxes and surface preparation prior to soldering. The stabilizing material is melted and displaced simultaneously with soldering.
    Type: Grant
    Filed: March 11, 1975
    Date of Patent: June 29, 1976
    Assignee: Hollis Engineering, Inc.
    Inventor: Kenneth G. Boynton
  • Patent number: 3931776
    Abstract: A method of making a double-walled tubular container by winding plastic sheet material into a sleeve on a cylindrical mandrel with a pair of opposed longitudinal edges of the plastic sheet overlapping. A container top having a skirt is inserted into the plastic sleeve and simultaneously the overlapping edges of the plastic sleeve are heat-sealed and the sleeve is heat-sealed to the skirt of the container top. A thin metal sheet is cut and wound over the sleeve and skirt and is heat-sealed thereto. An ejection outlet stopper is fitted to the container top and the tube is then removed from the mandrel.
    Type: Grant
    Filed: July 1, 1974
    Date of Patent: January 13, 1976
    Inventors: Oscar Barberia, Angel Rogelio Testi