Abstract: A sand control screen assembly includes a base pipe having openings through its thickness, and a mesh layer having mesh material sections coupled to safe edges, or connectors, for connecting sections together. The safe edges include areas of thinning to provide flex joints that yield when exposed to high stresses. The mesh layer may be a drainage layer or a filter medium of the sand control screen assembly.

Abstract: An aluminum clad member is produced by: disposing a joining assistance member at a joint interface between an Al core member and an Al skin member, which joining assistance member being formed by crossing Al wires with each other in longitudinal and lateral directions to form a grid, and having a structure in which spot-like thick portions having a thickness of 0.2-3.2 mm are formed at intersections of the Al wires and arranged in the longitudinal and lateral directions so as to be spaced apart from each other by a distance of 0.2-13 mm; and performing a hot rolling operation with respect to the thus obtained stack of the Al core member, the Al skin member and the joining assistance member, by partially fixing together those members at their peripheral portions or without fixing together those members, such that the joint interfaces is communicated with an ambient air.

Abstract: A method is provided for welding together a tubular member of a first metal and a tubular member of a second metal that is dissimilar to the first metal. The method includes making a transition attachment by friction welding together end-to-end a first end of a rod of the first metal with a first end of a rod of the second metal. An arc weld welds together a second end of the rod of the first metal with the tubular member of the first metal. And another arc weld welds together a second end of the rod of the second metal to the tubular member of the second metal.

Abstract: A method of shortening an end of a well car includes removing a plurality of parts that would inhibit the shortening process; cutting a shear plate and a set of side sill angles at a location on the well side of the end assembly; detaching the end assembly from a main body of the well car; on each side of the main body: cutting the top tube at a location above a monument plate that is just beyond a reinforcement plate attached to the monument plate; cutting through a weld between the monument and reinforcement plates and a side sheet; cutting through the side sheet generally at the attachment location of the monument and reinforcement plates; and cutting the shear plate of the main body with a contoured cut such that the remaining shear plate has a contoured pattern substantially matching the cut shear plate under the removed end assembly.

Abstract: A method of manufacturing a semiconductor chip is disclosed. A die having a plurality of die-pads is attached to a substrate in a semiconductor package which includes a plurality of substrate-pads. The method involves forming conductive column bumps of differing volumes extending from the die-pads; attaching each of the column bumps to a corresponding substrate-pad to form a subassembly; and reflowing the subassembly so that the column bumps form robust electrical and mechanical connections between the die pads and the substrate pads.

Abstract: A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.

Abstract: Thermoplastic sealants and methods for forming a joint, such as a weld joint, between one or more structural members using thermoplastic sealants are provided. The thermoplastic sealants have melting temperatures lower than the melting temperature of at least one of the structural members. The thermoplastic sealants may further include fillers, and are disposed between faying surfaces of the structural members. The sealants can fill the spaces between the structural members to prevent the entry of chemicals, moisture, debris and other substances.

Abstract: The invention relates to a method of protecting equipment intended to operate at high temperature in the presence of a fluid containing at least one hydrocarbon and/or carbon monoxide against corrosion by metal dusting, method in which pieces of the equipment are made from an alloy containing nickel, iron, chromium and/or aluminum, and in which said pieces of the equipment are protected from said corrosion by a protective coating. This method is characterized in that said equipment pieces protected in this way are connected to each other by means of joining pieces, said joining pieces being protected beforehand by a protective coating over at least part of their surface intended to be brought into contact with said fluid at high temperature, and in that each of the connections intended to be subjected to said corrosion is produced by external welding of the ends of the joining piece with said pieces of equipment.

Abstract: An apparatus and method for connecting copper tubes are developed to facilitate welding operation in the refrigerating device. The new apparatus will reduce the poor welding rate so that it will effectively prevent clogging of the copper tubes and leaking the refrigerant. It also has merit to easily determine a suitable heating time while the copper tubes are welding. Thus, the rate of poor welding is reduced, as well as a method for connecting copper tubes by using the tube connecting apparatus.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: A method for soldering pipes configures the pipes being soldered such that water running through the pipes is not permitted to pool in the pipes. The method also configures the pipes to facilitate sealing of the pipes after the soldering is completed.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: A metallic fabric for manufacturing a hollow body is welded at two edge areas and according to the present invention a metallic strip is welded on in the vicinity of the welded seam, whereby the width of the welded seam is narrower than the width of the metallic strip. An elastic material which flattens out vibrations of the hollow body and ensures protection of the welded seam is arranged between the metallic strip and the metallic fabric.

Abstract: A fitting/manifold assembly and method are provided for a heat exchanger. The method includes the steps of providing a manifold (22) including a wall (30) having an aperture (32) therethrough; providing a fitting (24) including a body (42), a nipple (44) extending from the body (42) and having an interior surface (50), and an opening (54) extending through the body (42) to allow access to the interior surface (50); inserting the nipple (44) into the aperture (32) from one side of the wall (30) so that the body (42) of the fitting (24) is on the one side of the wall (30) and a portion (48) of the nipple (44) is on the other side of the wall (30); deforming the interior surface (50) of the nipple (44) with a deforming tool (60, 104) inserted through the opening (54) in the body (42) to enlarge the portion (48) to a shape that restricts retraction of the nipple (44) from the aperture (32).

Abstract: To make stress corrosion cracking caused by precipitation of a &bgr; layer (Mg2Al3) in a welding part 5 or in the periphery of the welding part 5 hard to occur.

Abstract: A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without solder paste, between the surfaces to be assembled of the first and second elements.

Abstract: A technique for joining an elongated wound element and a mating connector of a body implantable lead assembly comprises the steps of causing an end portion of the wound element to abut against a first end of a transition component having similar mass and heat transmission characteristics. The wound element is a coil of wire and the transition component is a ring member, both of which have similar inner and outer diameters. Further, the wire has a nominal diameter and the ring member has a similar transverse dimension. A laser beam is targeted generally at the location at which the end portion of the wound element abuts against the first end of the transition component such that the energy delivered thereto is substantially balanced between the wound element and the transition element, thereby thermally fusing the wound element and the transition component. The wound element and the transition component may be fabricated of the same alloy or of dissimilar alloys.

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract: A method for producing depressed center railcars involves a combination of casting and fabrication. Transition members of the railcar can be casted, preferably with interlocking ledges on the ends of the transition members. The center section can be fabricated from, preferably precambered, longitudinal stringers which can then be connected between the casted transition members via the interlocking ledges. Standard steel warehouse plates can be attached to the fabricated framework of longitudinal stringers to form the surface of the center section. The transition members can be cast with integral provision to accept a center plate member. The fabricated framework of stringers can include reinforcement members for added strength. The framework can also be constructed to allow for the placement of the parts of the brake system and other components on the underside of the railcar.

Abstract: A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the connection surfaces of the flexible circuit (101) are tinned. The circuit board (100) and flexible circuit (101) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (100) and flexible circuit (101). The gap between circuit board (100) and flexible circuit (101) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (101). The solder is reflowed by applying heat by vapor phase condensation.

Abstract: A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without solder paste, between the surfaces to be assembled of the first and second elements.

Abstract: A bracket for a machine frame, such as a core molding machine frame, having horizontal and vertical members includes first and second legs adapted for attachment to the machine frame members. The first and second legs are formed from a plate material and extend perpendicular to each other. The bracket is welded around its periphery to the machine frame. A free end of at least one of the first and second legs has a tapered portion, and one or more openings may be provided in the bracket. An outer periphery of the tapered portion and an inner periphery of the openings are welded to the machine frame for further extending the total weld length and reducing stress concentration in the weld joints.

Abstract: A method for making a spacer assembly comprises: forming a plurality of projections along an edge of a portion of sheet metal; roll forming the portion of sheet metal into a tubular configuration; positioning the roll formed portion of sheet metal and a metal base member to which the roll formed portion of sheet metal is to be welded in a discharge welding apparatus having a pair of electrodes so that the projections of the roll formed portion of sheet metal contact a surface of the metal base member; providing a force so that the projections are disposed in forcible engagement with the surface of the metal base member; and supplying an electrical current between the pair of electrodes and through the roll formed portion of sheet metal and the metal base member so that the projections reach a molten metal stage and are subsequently solidified to enable the roll formed portion of sheet metal to be welded to the metal base member.

Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Abstract: Metal and ceramic members are joined together by a braze joint including a member made of bar stock molybdenum, a first ductile member brazed between the molybdenum member and the metal member, and a second ductile member brazed between the molybdenum member and the ceramic member. The braze joint may be used to join a ceramic wheel shaft to a metal shaft in a turbomachine. The braze joint allows torsion to be transmitted between the ceramic wheel shaft and the metal shaft without the use of a metal sleeve.

Abstract: The subject of the invention is an element made of composite material comprising an organic matrix which is reinforced with mineral or organic fibers, as well as at least one assembly with partial superposition of at least two electrically conductive elongate members, which assembly is essentially embedded in the matrix so as to ensure electrical continuity through the element, at least one junction piece, with a conductive coating or made of a conductive metal or alloy, being interposed between superposed portions of said elongate members of each assembly and held in permanent contact with these portions in the composite material by soldering, which links the piece to the elongate members and is preferably carried out during the heat treatment for forming the composite element.

Abstract: A method of manufacturing a stainless steel ventilated brake disc is provided that results in a relatively inexpensive stainless steel ventilated brake disc. In manufacturing the ventilated brake disc a pair of annular plate members are provided that are constructed of stainless steel. Then a spacing member constructed of stainless steel is inserted between the inner axially facing surfaces of the first and second annular plate members. A nickel bonding paste is applied at the points of contact between the spacing member and the inner axially facing surfaces of the first and second annular plate members. Heat is now applied to the spacing member and the annular plate members as a combined unit with the nickel bonding paste applied thereto. This heating of the assembled unit austenitizes the spacing member and the annular plate members and simultaneously bonds the spacing member to the inner axially facing surfaces of the annular plate members.

Abstract: A welding method for two members adapted to be welded and formed of a low-alloy steel for structural purposes causing the weld metal to develop martensite transformation during cooling after welding, so that the weld metal becomes expanded to a greater degree at room temperature than at a temperature at which the martensite transformation initiates.

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

Abstract: A zone of corrosion-resistant material covering a friction stir welded joint surface is provided by applying a layer of corrosion-resistant material over one or both surfaces of the workpieces being joined so that the layer covers at least the weld zone which will be rendered plastic during a friction stir welding operation. The corrosion-resistant material layer is contacted by the friction stir welding tool, and the tool causes shearing and plastic flow of the corrosion-resistant material along the surface of the welded joint. The corrosion-resistant material thus metallurgically bonds with portions of the plasticized metal so as to form a corrosion-resistant zone protecting the welded joint from exposure to corrosive environments.

Abstract: A method of forming lengths of pipe for assembly together to form fluid flow conduits includes the steps of providing a pipe having a first inner diameter and a central longitudinal axis, providing a ferrule which has an annular first end, having an inner diameter equal to the pipe inner diameter and having a second end formed into a flange adapted to form a flange coupling when abutted against and connected to another similar flange. The flanges have end faces countersunk approximately 1.degree. to 5.degree.. The first end of each ferrule is welded to an end of a pipe, whereby the end face of the flange assumes an orientation wherein the end face is substantially normal to the central longitudinal axis.

Abstract: A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion of the bottom layer which carry a plurality of solder pads. The surface mount package is positioned on the printed circuit board for placing the package bottom surface on a top surface of the printed circuit board between the cavities while positioning package contact pads in spaced relation above corresponding preselected solder pads. A solder column extends between each of the plurality of corresponding solder pads and the selected contact pads for providing an electrical connection.

Abstract: A method for repairing and restoring the functionality of equipment subjected to internal corrosion during its operation at high or medium pressure in a plant for the synthesis of urea. The method includes the cleaning of the corroded area, the formation of suitable supporting and/or holding surfaces for the placement of a new metallic lining, the formation of a new anticorrosive sealed off lining, obtained by positioning and welding flat elements and metallic plates which are suitably shaped and placed next to each other to become adapted to the internal profile of the equipment. The spaces and interstices below this new lining all communicate with at least one weep-hole present in the pressure resistant body. The entire repair is carried out through the manhole of the equipment and enables the restoring of its functionality for times similar to the normal duration of corresponding newly constructed equipment.

Abstract: An endoscope contains no adhesives, epoxies, or other organic materials. The endoscope includes a set of lenses held in position by cylindrical spacers. A pair of windows seal the ends of the endoscope, and prevent the lenses and spacers from falling out. The windows are brazed to the endoscope. Due to the use of brazing, no adhesives are needed to hold the lenses or windows in place. Thus, one can sterilize the endoscope in the high temperature environment of an autoclave, without risking damage to the optical components. The brazing produces a hermetic seal which enables the endoscope to function properly in an environment of high temperature or high pressure, or in chemically abusive environments.

Abstract: Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.

Abstract: A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Abstract: A thin-walled steel first part is joined to a steel second part by first juxtaposing a metal plate with the first part, then securing the plate to the first part by soldering or laser welding, juxtaposing the second part with the plate, and fusion welding the second part to the plate.

Abstract: A method of reversibly brazing surfaces together. An interface is affixed to each surface. The interfaces can be affixed by processes such as mechanical joining, welding, or brazing. The two interfaces are then brazed together using a brazing process that does not defeat the surface to interface joint. Interfaces of materials such as Ni-200 can be affixed to metallic surfaces by welding or by brazing with a first braze alloy. The Ni-200 interfaces can then be brazed together using a second braze alloy. The second braze alloy can be chosen so that it minimally alters the properties of the interfaces to allow multiple braze, heat and disassemble, rebraze cycles.

Abstract: A pipe connecting assembly and method for joining two lengths of steel pipe in the field without the need for welding the connection includes a pair of tubular members both having cylindrical exterior and interior surfaces that substantially conform to the exterior and interior surfaces of the two lengths of steel pipe. At one end of one of the tubular members a male connector is formed. The male connector has a plurality of annular flat and tapered ridges and flat annular surfaces formed thereon. At one end of the other tubular member a female connector is formed. The female connector has a plurality of flat annular ridges and tapered and flat surfaces formed thereon. In employing the tubular members in connecting the two lengths of steel pipe, the ends of the members opposite the male and female connectors are first welded to opposed ends of the steel pipe.

Abstract: The present invention relates to a mounting assembly for a pressure sensor in a pressure transmitter. The mounting assembly includes a header having a cavity opening to a first surface. The cavity is defined by an inner endwall and an inner sidewall. A support is joined to the inner endwall within the cavity on a first support end. A pedestal has a first pedestal end supporting the pressure sensor and a second pedestal joined to the second support end. Aligning means align the second pedestal end to the second support end in order that a volume of the mounting assembly is increased to thereby reduce a quantity of fill fluid needed in the sensor cavity.

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a means for releasably securing the electrical component to the PGA socket.

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin.

Abstract: A process for constructing a circular metallic article which includes a hub and a plurality of vanes mounted on the periphery of the hub wherein the vanes are placed in position around the hub, formers are arranged between the blade portions of the vanes, a dimensionally stable belt having a low thermal expansion coefficient is placed circumferentially around the vanes and the formers, and the assembly is subjected to an isostatic compression at the isothermal forging temperature and pressure of the materials of the hub and the vanes such that the vanes are diffusion welded to the hub and the blade portions of the vanes are compressed to shape.

Abstract: Chip capacitors are attached to an integrated circuit package. Strips of synthetic tape are placed between pairs of chip capacitor pads on the integrated circuit package. The strips of synthetic tape each have a height extending above height of the pairs of chip capacitor pads. In the preferred embodiment, the strips of synthetic tape are strips of polyimide tape. The height of the strips of synthetic tape is selected so that the chip capacitors will be installed at a sufficient distance from the integrated circuit package so that solder balls will not be of sufficient diameter to wedge between the integrated circuit package and the chip capacitors. The chip capacitors are installed over the pairs of chip capacitor pads. The chip capacitors rest on the strips of synthetic tape. For example, the chip capacitors are permanently attached to the pairs of chip capacitors using a solder process. A reflow solder process is then performed.

Abstract: The present invention pertains to an apparatus useful in semiconductor processing. The apparatus can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure. The sealing apparatus enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.

Abstract: The present invention pertains to an apparatus and method useful in semiconductor processing. The apparatus and method can be used to provide a seal which enables a first portion of a semiconductor processing chamber to be operated at a first pressure while a second portion of the semiconductor processing chamber is operated at a second, different pressure.The sealing apparatus and method enable processing of a semiconductor substrate under a partial vacuum which renders conductive/convective heat transfer impractical, while at least a portion of the substrate support platform is under a pressure adequate to permit heat transfer using a conductive/convective heat transfer means. The sealing apparatus comprises a thin, metal-comprising layer, typically in the form of a strip or band, brazed to at least two different surfaces within said processing chamber, whereby the first and second portions of the semiconductor processing chamber are pressure isolated from each other.

Abstract: A method for bonding thermally-mismatched elements of a traveling wave tube employs a metallic plate of undulating character. The plate is located at the region of the interface between tube elements formed of materials of materially-differing thermal character such as the ceramic termination piece and an adjacent sever pole piece of copper. Through either a brazing or a sintering process, pluralities of bonds are formed at points of tangency between the plate and the two elements of differing thermal expansion coefficients. As a result, a good heat flow path, accompanied by a more stable r.f. interface, is formed between the materials that is not subject to fracture as are prior art diffusion bonds.

Abstract: A method of joining two aluminum tubular members comprising steps of: inserting a iron ring member into a first aluminum tubular member, with part of the iron ring member extending out of the first aluminum tubular member; put a second aluminum tubular member on to the part of the iron ring member extending out of the aluminum tubular member; heating a pair of molds having a less width than the iron ring member to a temperature of 660 degrees centigrade; and applying the molds on the place where the two aluminum tubular members are joined together so as to melt the two aluminum tubular members together.

Abstract: A method of manufacturing a magnetically split internal magnetic shield (19) which comprises two complementary parts (15) and (16). Two plate-shaped parts (15') and (16') of a ferromagnetic material are arranged next to each other at a distance d and welded together by means of a strip of a non-magnetic metal. Subsequently, an internal magnetic shield is formed from the twin plate by means of drawing, cutting and/or bending.