Plural Joints Patents (Class 228/178)
  • Patent number: 10967430
    Abstract: A method for heat treating a powder part preform including a titanium alloy, includes heat treating the preform in a furnace at a predefined temperature, wherein the preform is on a holder during the heat treatment. The holder includes a titanium alloy having a mass titanium content no lower than 45%, or a zirconium alloy having a mass zirconium content no lower than 95%, wherein the material making up the holder has a melting temperature higher than the predefined heat treatment temperature, and an antidiffusion barrier is arranged between the preform and the holder to prevent the preform from becoming welded to the holder.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: April 6, 2021
    Assignees: SAFRAN AIRCRAFT ENGINES, ALLIANCE
    Inventors: Guillaume Fribourg, Jean-Claude Bihr, Clément Gillot
  • Patent number: 10186549
    Abstract: A method for bonding a matrix of light-emitting elements onto a substrate includes forming conductive material on bond pads of the substrate in a matrix arrangement. Separately, a plurality of light-emitting elements is also picked up and placed onto a temporary carrier in the said matrix arrangement. The temporary carrier containing the plurality of light-emitting elements is then held with a bond head, and is moved by the bond head to establish contact between electrodes on the plurality of light-emitting elements and the conductive material on the substrate. When heat is applied to the light-emitting elements while exerting a compressive force with the bond head against the conductive material, conductive joints are formed between the light-emitting elements and the substrate.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 22, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yiu Ming Cheung, Ming Li, Zetao Ma, Kai Ming Yeung
  • Patent number: 9849532
    Abstract: A composite wear pad includes a substrate that is selected from the group of iron based alloys, steel, nickel based alloys, and cobalt based alloys. A hard particle-matrix alloy layer is bonded at a surface to the substrate. The hard particle-matrix alloy layer has a plurality of hard particles dispersed in a matrix alloy. The hard particle-matrix alloy layer has a thickness ranging between greater than about 13 millimeters and about 20 millimeters.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: December 26, 2017
    Assignee: KENNAMETAL INC.
    Inventors: Qingjun Zheng, Robert J. Vasinko, Yixiong Liu
  • Patent number: 9774024
    Abstract: A method is provided for interconnecting the batteries in a battery pack in a manner that is designed to minimize damage and contamination of the contact surfaces of the interconnect and the battery terminal, thereby minimizing connection resistance and increasing interconnect reliability.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: September 26, 2017
    Assignee: ATIEVA, Inc.
    Inventor: Martin Forest Eberhard
  • Patent number: 9488304
    Abstract: A connector for lined pipelines includes a tube having opposed male interface elements extending inwardly from respective ends of the tube. One or more circumferential permeable chokes project radially from each male interface element. The chokes minimize flow of oxidizing fluid from the bore into the micro-annulus between the liner and the pipe while maximizing flow of fluid from the micro-annulus into the bore in the event of catastrophic pressure drop in the bore. To maintain gaps between the tube ends and the pipe liners for fluid flow, shoulder formations defined by radially-projecting bands extend circumferentially around the tube. The connector may be used in a joint arrangement where each liner includes a body section, an end section of lesser thickness and greater bore than the body section that terminates short of an end of the pipe, an inner step disposed between the body section and the end section, and an outer step disposed between the end section and the pipe.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: November 8, 2016
    Assignee: Subsea 7 Limited
    Inventor: Peter Lockwood Gledhill
  • Patent number: 9470097
    Abstract: A leading edge member for a composite vane of a gas turbine engine. The leading edge member includes a first leg and a second leg. The first leg includes a proximal end joined to a proximal end of the second leg.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 18, 2016
    Assignee: Rolls-Royce Corporation
    Inventors: Benedict N. Hodgson, Jonathan M. Rivers
  • Patent number: 9272923
    Abstract: Methods of converting shaped templates into shaped metal-containing components, allowing for the production of freestanding, porous metal-containing replicas whose shapes and microstructures are derived from a shaped template, and partially or fully converting the shaped templates to produce metal-containing coatings on an underlying shaped template are described herein. Such coatings and replicas can be applied in a variety of fields including, but not limited to, catalysis, energy storage and conversion, and various structural or refractory materials and structural or refractory composite materials.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: March 1, 2016
    Assignee: Georgia Tech Research Corporation
    Inventors: David W. Lipke, Kenneth H. Sandhage
  • Patent number: 9027822
    Abstract: An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: May 12, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Daisuke Sakurai
  • Patent number: 9016551
    Abstract: The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: April 28, 2015
    Assignee: The Boeing Company
    Inventors: Brad L. Kirkwood, Paul S. Gregg, Gerry D. Miller, Jeff D. Will, David W. Evans
  • Patent number: 9010616
    Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: April 21, 2015
    Assignee: Indium Corporation
    Inventors: Jordan Peter Ross, Amanda M. Hartnett
  • Patent number: 9011785
    Abstract: A high-temperature-resistant component for an exhaust-gas treatment unit, an exhaust-gas treatment unit and a method for producing such a unit, include providing the component or the exhaust-gas treatment unit with a surface layer intended to prevent the formation of chromium carbide bridges during a brazing process for producing the exhaust-gas treatment unit.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: April 21, 2015
    Assignee: EMITEC Gesellschaft fuer Emissionstechnologies mbH
    Inventor: Dieter Lutz
  • Patent number: 9004343
    Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyuki Inoue, Tadayoshi Ohtashiro
  • Patent number: 9004342
    Abstract: Hot-rolled high-strength steel elongated structural members and method of making same are disclosed by hot-rolling high-strength steel having a specific chemical composition to provide structural units. The units are then welded together to provide structural members of desired geometrical configuration including a thin web with opposed thicker flanges extending therefrom to increase the load bearing capacity of the members.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: April 14, 2015
    Assignees: Consolidated Metal Products, Inc., Nucor Corporation
    Inventors: Hugh M. Gallagher, Jr., Joseph Bryan Loosle, Jack L. Williams, William W. Wood, Brenda D. Daniels, Cory J. Anthony, David R. Smith
  • Patent number: 8970026
    Abstract: A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consists of a second solder compound. The outer section can be farther away from a center of the one external side of the substrate than the inner section. During a reflow process, the first and second solder compounds are configured to become completely molten when heated and the first solder compound solidifies at a higher temperature during cool down than the second solder compound.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: March 3, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: George R. Leal, Leo M. Higgins, III, Tim V. Pham
  • Patent number: 8957345
    Abstract: A method is provided for connecting a diaphragm to a housing of a pressure or force sensor, wherein a measurement element is attached in the housing and can capture a load acting from the outside onto the diaphragm during the use of the finished sensor. A housing ring surface or the housing is situated opposite a diaphragm ring surface of the diaphragm, which are subjected to compressive loading by the load during use of the sensor. A first connection is produced in an inner region between the housing ring surface and the diaphragm ring surface until they rest against each other radially outside the first connection. Then a second connection connects the housing ring surface and the diaphragm ring surface to one another radially outside the first connection up to a shared outer edge. Here, a defined connection depth of the entire double connection is maintained.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: February 17, 2015
    Assignee: Kistler Holding AG
    Inventors: Dieter Karst, Paul Furter, Stefan Brechbuehl
  • Patent number: 8944309
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: February 3, 2015
    Assignee: The Regents of The University of Michigan
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Patent number: 8939347
    Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: January 27, 2015
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Ravindranath V. Mahajan
  • Publication number: 20150014242
    Abstract: A screen for intake of fluid. The screen includes parallel and spaced rods, filtration material, a fitting, and structural members. The rods may be distributed in a cylindrical configuration. The filtration material, in some embodiments spirally wrapped wire, is disposed around the rods to define an interior volume. The fitting is disposed at an end of the rods and adjacent to the filtration material. Each structural member, which in some embodiments are elongated bars, is interposed between adjacent rods. The structural members are welded to the adjacent rods, and the adjacent rods and the structural members are welded to the fitting to increase the effective weld area, the tensile strength of the connection, and potentially the overall strength of the screen. The screen may be used for a variety of fluids and installations, and is particularly suited to use in water wells.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 15, 2015
    Inventors: Albert Smith, Thomas James Berger
  • Patent number: 8905292
    Abstract: The invention is an end connector for a horizontal scaffold member where the top of the end connector is inserted into the interior of a scaffold pipe. The invention includes a locking latch that includes a rotating latch member and a rotating lock that interferes when the latch is locked.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: December 9, 2014
    Assignee: Excel Modular Scaffold and Leasing Company
    Inventor: Yates W. Hayman
  • Publication number: 20140284313
    Abstract: A method of manufacturing a shaft of a surgical instrument including forming a proximal segment of the shaft to include one or more features for operably engaging the shaft to a first component of the surgical instrument, forming a distal segment of the shaft to include one or more features for operably engaging the shaft to a second component of the surgical instrument and forming an intermediate segment of the shaft. The proximal segment is welded to a proximal end of the intermediate segment; and the distal segment is welded to a distal end of the intermediate segment. The proximal and distal segments are welded to the intermediate segment such that the one or more features thereof are aligned in a pre-determined orientation relative to one another.
    Type: Application
    Filed: June 5, 2014
    Publication date: September 25, 2014
    Inventors: JAMES D. ALLEN, IV, KIM V. BRANDT, MONTE S. FRY, KEIR HART, DANIEL A. JOSEPH, PETER M. MUELLER, JEFFREY R. UNGER
  • Patent number: 8833637
    Abstract: A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell (1), pillar buses (2), an anode bus (3), a balance bus (4), a inter-cell standby bus (5), a door-shaped pillar clamp (6), an arcuate clamp (7) of anode buses, a current conversion switch (8, a mechanical switching device (9) for the short-circuit port, a voltage sensor and wires thereof (10), a temperature sensor and wires thereof (11), a system (12) for data acquiring, displaying, analyzing and alarming, an A-side welding area (13), a B-side welding area (14) and compression-joint points (15) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell (1) and pillar buses (2) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses (2), other
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: September 16, 2014
    Assignee: China Aluminum International Engineering Corporation Limited
    Inventors: Tao Yang, Bin Cao
  • Patent number: 8827140
    Abstract: Coiled tubing with a secured conduit and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected by the welding and heat treatment process or processes. To install the conduit into the coiled tubing, the coiled tubing is unrolled from the reel, the conduit is attached to an end of the slickline and the other end of the slickline pulled to fish the conduit through the coiled tubing, resulting in conduit held within the retainer inside the coiled tubing. In embodiments where a slickline is not used, the conduit can be pumped into the retainer or dropped therein by gravity when the coiled tubing is hung in a wellbore. Alternatively, a heat resistant conduit may be secured within the coiled tubing by attachment directly to the coiled tubing or held therein by a retainer.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: September 9, 2014
    Inventor: Mark Andreychuk
  • Patent number: 8820613
    Abstract: A method of shortening an end of a well car includes removing a plurality of parts that would inhibit the shortening process; cutting a shear plate and a set of side sill angles at a location on the well side of the end assembly; detaching the end assembly from a main body of the well car; on each side of the main body: cutting the top tube at a location above a monument plate that is just beyond a reinforcement plate attached to the monument plate; cutting through a weld between the monument and reinforcement plates and a side sheet; cutting through the side sheet generally at the attachment location of the monument and reinforcement plates; and cutting the shear plate of the main body with a contoured cut such that the remaining shear plate has a contoured pattern substantially matching the cut shear plate under the removed end assembly.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: September 2, 2014
    Assignee: TTX Company
    Inventors: William R. Halliar, Frank F. Stec, Bruce E. Keating
  • Patent number: 8820611
    Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: September 2, 2014
    Assignee: Ekra Automatisierungssysteme GmbH
    Inventor: Torsten Vegelahn
  • Patent number: 8807416
    Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: August 19, 2014
    Assignee: Denso Corporation
    Inventors: Takuji Sukekawa, Hiroyuki Yamada, Noriyasu Inomata
  • Publication number: 20140224791
    Abstract: A reinforced intermodal container has a corrugated steel wall with an outer side and an inner side. In a length direction the corrugations have alternating inboard and outboard flat panels with adjacent panels linked by web portions. A strengthening structure is welded to the container wall which provides flanges extending generally perpendicularly to the general plane of the wall. The flanges extend between plates welded to the inside faces of the outboard panels and flat strengthening plates welded to the inside faces of the inboard panels. The strengthening structure does not alter the outside width of the container in comparison with the outside width of the unreinforced container. The strengthening structure reduces the inside volume of the container by only a small amount compared with the volume of the unreinforced container.
    Type: Application
    Filed: February 9, 2014
    Publication date: August 14, 2014
    Inventors: Jason Downey, Ardjan Muca
  • Publication number: 20140217155
    Abstract: Methods for welding motor vehicle body component subassemblies at a weld stations are disclosed. First and second pallets may be arranged for reciprocal movement between a load/unload station and the weld station and the pallets are alternately moved from a load/unload station to the weld station while the other pallet is moved from the weld station to a load/unload station. Each pallet may have a plurality of substations for receipt of component subassemblies and, while each pallet is at the load/unload station, the component subassembly at each substation is moved to the next successive substation and a further component is added to the moved component.
    Type: Application
    Filed: April 4, 2014
    Publication date: August 7, 2014
    Applicant: COMAU, Inc.
    Inventor: Velibor Kilibarda
  • Patent number: 8794499
    Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: August 5, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasuyuki Sekimoto
  • Patent number: 8794501
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: August 5, 2014
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 8777090
    Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 15, 2014
    Assignee: H.C. Starck Inc.
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmermann
  • Patent number: 8752753
    Abstract: A method of construction of a tungsten carbide/TSP insert for hard facing a wear surface comprises the steps of forming a tungsten carbide body (12) in a mold. After the molding step, a channel section slot (24) or pocket (24?) is created in the body before it has hardened substantially. The body is then heat-treated to harden it. A TSP body (32) is fitted in the slot/pocket (24/24?) so that it is a close sliding fit between the sides (18) of the slot, and is of the same depth as the slot. The TSP is (preferably) brazed into the slot. The insert has pips (30) on its edges (18) to facilitate welding to a substrate prior to a final brazing step.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 17, 2014
    Inventor: Mark Russell
  • Patent number: 8752754
    Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: June 17, 2014
    Assignee: Showa Denko K.K.
    Inventors: Takashi Shoji, Takekazu Sakai
  • Patent number: 8740046
    Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: June 3, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Publication number: 20140135144
    Abstract: Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: January 16, 2014
    Publication date: May 15, 2014
    Applicant: Karsten Manufacturing Corporation
    Inventors: Eric J. Morales, Erik Henrikson
  • Publication number: 20140102210
    Abstract: A pressure sensor includes a metal port member having a first closed end and a second opposing opened end. A metal shell surrounds a portion of the periphery of the port. A first weld connection joins the port to the shell. A metal base has upper and lower surfaces and a second weld connection joins the shell to the lower surface of the base. Sensing structure is associated with the closed end of the port member. The sensing structure is constructed and arranged to sense pressure changes at the closed end of the port member. A connector housing covers the sensing structure.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 17, 2014
    Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
    Inventors: Yanling Kang, David Ivaska, Robert C. Kosberg, Daniel J. Bratek
  • Patent number: 8690041
    Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: April 8, 2014
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8679591
    Abstract: An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu
  • Publication number: 20140041223
    Abstract: Tenons can be installed at the ends of turbine blades by applying a solid state bonding procedure such as a friction welding technique to join the tenons to the turbine blades. The tenons can be employed to assemble the turbine blades to one or more covers for the turbine blades. The tenons can be installed in connection with the restoration of tenons for turbine buckets in steam turbines and in connection with the renovation of rotor assemblies that include turbine blades secured to a common disk, tenons located at one end of respective turbine blades and one or more covers secured to the turbine blades by means of the tenons. In instances in which tenon remnants are present at the ends of the turbine blades, tenon enlargement elements can be joined to the tenon remnants by the solid state bonding procedure. The tenon installations can be carried out in situ.
    Type: Application
    Filed: December 19, 2012
    Publication date: February 13, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Marek Wojciechowski, Marciej Jan Zarnik
  • Publication number: 20130299963
    Abstract: The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 14, 2013
    Inventors: Atsushi OTAKI, Shigeru OYAMA
  • Patent number: 8567657
    Abstract: Coiled tubing with secured wireline and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected by the welding and heat treatment process or processes. To install wireline into the coiled tubing, the coiled tubing is unrolled from the reel, the wireline is attached to and end of the slickline and the other end of the slickline pulled to fish the wireline through the coiled tubing, resulting in wireline held within the retainer inside the coiled tubing. Alternatively, heat resistant wireline may be secured within the coiled tubing by attachment to the coiled tubing or held by a retainer.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: October 29, 2013
    Inventor: Mark Andreychuk
  • Patent number: 8561876
    Abstract: A preferable golf club 2 is provided with a head 4, a shaft 6, a sleeve 8, and a screw 10. The head 4 is provided with a head body 14 and an engaging member 16. The head body 14 is formed by joining a plurality of members. The plurality of members includes a face member 112, a crown member 110, a sole member 114, and a hosel member 116. Preferably, the face member 112, the crown member 110, and the sole member 114 are produced by press processing a rolled material. Preferably, a through hole 130 into which a lower end part of the hosel member 116 can be fitted is formed in the sole member 114. In the golf club 2, the head body 14 and the shaft 6 are detachably mounted to each other without destruction of a bonding agent.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: October 22, 2013
    Assignee: SRI Sports Limited
    Inventor: Akio Yamamoto
  • Publication number: 20130263796
    Abstract: A high-temperature piping product is configured from a plurality of primary pipe members and a welding material. The primary pipe members are each made from an Ni-based forged alloy containing: Ni, Al, and at least one of Mo and W. The total content of the Mo and the W being 3-8 mass %. The Ni-based forged alloy exhibiting a ??-phase dissolution temperature of from 920 to 970° C., and the ?? phase being precipitated in 30 volume % or more in a temperature range of from 700 to 800° C. The welding material is made from an Ni-based cast alloy having a cast structure formed by welding. The Ni-based cast alloy containing: Ni, Al, and at least one of Mo and W, the total content of the Mo and the W being 9-15 mass %, the Ni-based cast alloy exhibiting a ??-phase dissolution temperature of from 850 to 900° C.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 10, 2013
    Applicant: Hitachi, Ltd.
    Inventors: Shinya IMANO, Hiroyuki DOI, Jun SATO
  • Publication number: 20130224010
    Abstract: A static structure of a gas turbine engine includes a multiple of airfoil segments and at least one structural reinforcement ring mounted to the multiple of airfoil segments.
    Type: Application
    Filed: February 23, 2012
    Publication date: August 29, 2013
    Inventors: Jorge I. Farah, Theodore W. Kapustka, Jonathan P. Burt, Jonathan J. Jakiel, Dana P. Stewart
  • Patent number: 8517247
    Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: August 27, 2013
    Assignee: Steel-Invest Ltd
    Inventor: Seppo Hauta-Aho
  • Patent number: 8496160
    Abstract: The invention relates to a method for positioning two components to be joined to each other along a common joint line. According to the invention, the two components are connected to each other by limited-length tack welds firmly connecting the two components, particularly by way of bonding, to each other. In order to obtain reliable and robust positioning of the components for tacking during the joining process, without requiring extensive production apparatuses, such as is required for the high-precision setting of the focal point of the welding laser relative to the joint line, the tack welds are designed such that they cross the joint line.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: July 30, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Michael Kaeferlein, Thomas Kretschmar, Clemens Pletzenuer, Axel Bormann, Hans Miethsam
  • Publication number: 20130187739
    Abstract: A transformer includes an enclosed tank having an interior and an enclosed radiator spaced from the tank and in fluid communication with the interior. The radiator includes two panels joined to define a substantially enclosed space. The panels have opposing faces and bottom ends. The bottom ends of the panels are joined together by a first weld and portions of the opposing faces of the panels are joined together by a plurality of second welds. The first weld and the plurality of second welds are constructed and arranged such that when an over-pressure condition occurs in the tank and thus in the radiator, the second welds will break generally uniformly permitting the panels to balloon generally uniformly, directing a rupture of the radiator to occur at the first weld, without any rupture of the tank occurring.
    Type: Application
    Filed: January 17, 2013
    Publication date: July 25, 2013
    Applicant: ABB TECHNOLOGY AG
    Inventor: ABB TECHNOLOGY AG
  • Patent number: 8485417
    Abstract: A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: July 16, 2013
    Assignee: HRL Laboratories, LLC
    Inventors: David T. Chang, Tsung-Yuan Hsu
  • Patent number: 8485416
    Abstract: A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: July 16, 2013
    Assignee: Silex Microsystems AB
    Inventors: Thorbjorn Ebefors, Edward Kalvesten, Niklas Svedin, Anders Eriksson
  • Publication number: 20130140096
    Abstract: Earth-boring tools comprise a body comprising at least one pocket extending into the body. A first discrete cutting element segment is secured within the at least one pocket. At least another discrete cutting element segment is secured within the at least one pocket. Methods of forming a cutting structure secured to an earth-boring tool comprise disposing at least one discrete cutting element or at least one cutting element segment within a pocket or recess formed in a blade extending longitudinally and radially over a face of a body. At least one discrete wearable element or at least another discrete cutting element segment is disposed within the pocket or recess. The at least one discrete cutting element or at least one discrete cutting element segment and the at least one discrete wearable element or at least another discrete cutting element segment are secured to the blade within the pocket or recess.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 6, 2013
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Christopher J. Cleboski, Juan Miguel Bilen
  • Patent number: 8448841
    Abstract: A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: May 28, 2013
    Assignee: Alstom Technology Ltd
    Inventors: Ralf Rotzinger, Sorin Keller, Jesus Contreras-Espada