Using Intermediate Diffusion Facilitating Material Patents (Class 228/194)
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Patent number: 11059132Abstract: A braze tape (12) useful with superalloy materials. In one embodiment, the tape includes a layer (14) containing superalloy powder (22) in a binder (24), and a layer (16) containing boron and silicon free braze material powder (32) in a binder, joined together by a layer (18) of double-sided adhesive fluorocarbon polymer tape, such as a double-sided adhesive polytetrafluoroethylene or Teflon® tape (46).Type: GrantFiled: September 11, 2015Date of Patent: July 13, 2021Assignee: Siemens Energy, Inc.Inventor: Kazim Ozbaysal
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Patent number: 11040396Abstract: A method for metal powder injection molding includes injecting a first metal powder of a TiAl-based intermetallic compound into a mold, and molding the first metal powder through use of an injection molding machine; injecting a second metal powder of a TiAl-based intermetallic compound having a same constituent as the first metal powder and having a different average particle diameter from the first metal powder into a mold, and molding the second metal powder through use of the injection molding machine; and sintering molded articles obtained by molding the first metal powder and the second metal powder, and producing a mixed sintered compact in which a first sintered compact of the molded article obtained by molding the first metal powder and a second sintered compact of the molded article obtained by molding the second metal powder are integrated.Type: GrantFiled: November 22, 2017Date of Patent: June 22, 2021Assignees: OSAKA YAKIN KOGYO CO., LTD., MITSUBISHI HEAVY INDUSTRIES AERO ENGINES, LTD.Inventors: Tadayuki Hanada, Kenji Suzuki, Shuntaro Terauchi, Hisashi Kitagaki, Kazuki Hanami
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Patent number: 10933489Abstract: A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.Type: GrantFiled: July 9, 2014Date of Patent: March 2, 2021Assignee: RAYTHEON TECHNOLOGIES CORPORATIONInventor: Grant O. Cook, III
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Patent number: 10926347Abstract: In some embodiments, a method may bond titanium to an intermediate alloy. The method may include layering a portion of an intermediate alloy onto a portion of titanium. The method may include focusing a controlled heat source on a spot of the intermediate alloy to form a weld pool in the intermediate alloy at the spot. The method may include superheating the intermediate alloy in the weld pool above the melting point of the intermediate alloy but below the melting point of titanium such that liquid intermediate alloy contacts the surface of the portion of the titanium heating the portion of the titanium. The method may include diffusing the portions of titanium and intermediate alloy together such that upon the intermediate alloy cooling below the melting point of the intermediate alloy the portions of the intermediate alloy and titanium are bonded forming a weldment.Type: GrantFiled: March 25, 2019Date of Patent: February 23, 2021Assignee: Packless IndustriesInventors: Scott Coleman Zifferer, Edward A. Reed
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Patent number: 10737354Abstract: A bearing component including a first metallic material and a second metallic material. The first metallic material provides a first carbon content and the second metallic material presents a second carbon content. The first metallic material and the second metallic material have been joined by a diffusion welding process. The diffusion welding process results in a transition zone with a varying carbon content between the first metallic material and the second metallic material. Varying carbon content in the transition zone is within an interval and the interval end points are defined by the carbon contents of the first metallic material and the second metallic material.Type: GrantFiled: December 13, 2017Date of Patent: August 11, 2020Assignee: AKTIEBOLAGET SKFInventor: Ingemar Strandell
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Patent number: 10661380Abstract: A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.Type: GrantFiled: March 6, 2017Date of Patent: May 26, 2020Assignee: United Technologies CorporationInventors: Grant O. Cook, III, Kevin W. Schlichting, Venkatarama K. Seetharaman
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Patent number: 10642151Abstract: A pellicle support frame is provided with a frame body made of aluminum alloy and has a pellicle film bonded to the upper surface of the frame body and a transparent substrate bonded to the lower surface of the frame body. Within the frame body, a plurality of hollow portions are provided to be lined up in the circumferential direction of the frame body, and a through-hole which leads from the outer peripheral surface to the inner peripheral surface of the frame body is formed between two adjacent hollow portions. This configuration makes it possible to prevent strain from arising in the support frame and the transparent substrate after the support frame is bonded to the transparent substrate.Type: GrantFiled: September 9, 2015Date of Patent: May 5, 2020Assignee: NIPPON LIGHT METAL COMPANY, LTD.Inventor: Nobuyuki Ishito
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Patent number: 10598378Abstract: A combustor wall is provided for a turbine engine. The combustor wall includes a shell, a heat shield and a combustion chamber. The heat shield is connected to the shell by a bonded connection, and defines a portion of the combustion chamber. A cooling cavity is defined between the shell and the heat shield.Type: GrantFiled: October 7, 2014Date of Patent: March 24, 2020Assignee: United Technologies CorporationInventors: Gary D. Roberge, Grant O. Cook, III
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Patent number: 10487384Abstract: There are provided: an Ni-based alloy member including a ?? phase precipitation with 36 to 60 volume % and exhibiting a high durable temperature and good cold workability; a method for producing the member; an Ni-based alloy product to be used as a precursor of the member; and a method for producing the product. The Ni-based alloy product has a two-phase structure composed of a ? phase and a ?? phase being incoherent to the ? phase, the incoherent ?? phase being present at a ratio of 20 volume % or higher. The Ni-based alloy member produced by cold working the Ni-based alloy product and subsequently by conducting heat treatment comprises a ? phase and a ?? phase being coherent to the ? phase, the coherent ?? phase being present at a ratio of 36 to 60 volume %, and has a predetermined shape.Type: GrantFiled: July 17, 2013Date of Patent: November 26, 2019Assignee: Mitsubishi Hitachi Power Systems, Ltd.Inventors: Shinya Imano, Hironori Kamoshida
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Patent number: 10302184Abstract: A bicycle component comprises a base member and a first alumite layer. The base member is made of an aluminum alloy. The first alumite layer is provided on the base member. The first alumite layer has a thickness that is equal to or larger than 1.0 ?m.Type: GrantFiled: April 1, 2016Date of Patent: May 28, 2019Assignee: SHIMANO INC.Inventors: Dai Yokozawa, Wataru Yamauchi
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Patent number: 10024605Abstract: This heat receiving tile formed of CFC is provided with a heat receiving block formed of a carbon fiber composite material and having a through hole, a cooling pipe inserted through the through hole of the heat receiving block, a buffer material provided to an outer periphery of the cooling pipe, a first brazing portion joining an inner surface of the through hole with an outer surface of the buffer material, a second brazing portion joining an inner surface of the buffer material with an outer surface of the cooling pipe, and a material discontinuous portion extending from a heat receiving surface of the heat receiving block up to the outer surface of the cooling pipe over a full length of the heat receiving block in an axis direction of the through hole.Type: GrantFiled: February 5, 2015Date of Patent: July 17, 2018Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Hirokazu Yamada, Kouji Satou, Daigo Tsuru, Shinji Sakurai, Shigetoshi Nakamura
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Patent number: 9879538Abstract: A blank casting for producing a turbine engine rotor blade, with a vane connected by a platform to a root, is provided. The root has an axial machining allowance intended to be removed by machining from each of its axial extremities. At least one of the axial extremities of the root includes at least one transverse channel that extends over the entire transverse width of the root and whose depth is greater than the machining allowance. A process for obtaining the blade by machining this blank casting is also provided.Type: GrantFiled: March 18, 2014Date of Patent: January 30, 2018Assignee: SNECMAInventors: Alexandre Gimel, Arnaud Negri, Denis Gabriel Trahot
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Patent number: 9773711Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.Type: GrantFiled: March 4, 2016Date of Patent: September 26, 2017Assignee: Industrial Technology Research InstituteInventors: Ming-Hsien Wu, Yen-Hsiang Fang
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Patent number: 9761506Abstract: Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor device 1 comprising: a mounting substrate 70; a semiconductor chip 10 disposed on the mounting substrate 70 and a semiconductor substrate 26, a source pad electrode SP and a gate pad electrode GP disposed on a surface of the semiconductor substrate 26, and a drain pad electrode 36 disposed on a back side surface of the semiconductor substrate 26 to be contacted with the mounting substrate 70; and a source connector SC disposed on the source pad electrode SP. The mounting substrate 70 and the drain pad electrode 36 are bonded by using solid phase diffusion bonding.Type: GrantFiled: February 23, 2012Date of Patent: September 12, 2017Assignees: ROHM CO., LTD., CREE FAYETTEVILLE, INC.Inventors: Takukazu Otsuka, Bryon Western, Brandon Passmore, Zach Cole
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Patent number: 9673163Abstract: The semiconductor device having flip chip structure includes: an insulating substrate; a signal wiring electrode disposed on the insulating substrate; a power wiring electrode disposed on the insulating substrate or disposed so as to pass through the insulating substrate; a semiconductor chip disposed in flip chip configuration on the insulating substrate and comprising a semiconductor substrate, a source pad electrode and a gate pad electrode disposed on a surface of the semiconductor substrate, and a drain pad electrode disposed on a back side surface of the semiconductor substrate; agate connector disposed on the gate pad electrode; and a source connector disposed on the source pad electrode. The gate connector, the gate pad electrode and the signal wiring electrode are bonded, and the source connector, the source pad electrode and the power wiring electrode are bonded, by using solid phase diffusion bonding.Type: GrantFiled: October 18, 2011Date of Patent: June 6, 2017Assignee: ROHM CO., LTD.Inventor: Takukazu Otsuka
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Patent number: 9418959Abstract: A system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer. The first substrate may include a bonding surface and the second substrate may include a complementary bonding surface. The composite bonding layer may be positioned between the first substrate and the second substrate. The composite boding layer may include a metal matrix and a plurality of stress-reducing additives disposed in the metal matrix. Each stress-reducing additive may include a three-dimensional shape The stress-reducing additives may include a ratio of length:height of at least about 2:1. An elastic modulus of a material of the stress-reducing additive may be less than an elastic modulus of the material of the metal matrix.Type: GrantFiled: July 8, 2015Date of Patent: August 16, 2016Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Shailesh N. Joshi, Masao Noguchi
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Patent number: 9349804Abstract: A composite wafer includes a substrate and a SiC-based functional layer. The substrate includes a porous carbon substrate core and an encapsulating layer encapsulating the substrate core. The SiC-based functional layer comprises, at an interface region with the encapsulating layer, at least one of: a carbide and a silicide formed by reaction of a portion of the SiC-based functional layer with a carbide-and-silicide-forming metal. An amount of the carbide-and-silicide-forming metal, integrated over the thickness of the functional layer, is 10?4 mg/cm2 to 0.1 mg/cm2.Type: GrantFiled: February 12, 2013Date of Patent: May 24, 2016Assignee: Infineon Technologies AGInventors: Rudolf Berger, Hans-Joachim Schulze, Anton Mauder, Wolfgang Lehnert, Günther Ruhl, Roland Rupp
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Patent number: 9018605Abstract: A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behavior while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.Type: GrantFiled: July 27, 2012Date of Patent: April 28, 2015Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Pierre-Eric Frayssines, Philippe Bucci, Jean-Marc Leibold, Emmanuel Rigal
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Publication number: 20150097643Abstract: Provided is a combined type RFeB-based magnet, including: a first unit magnet; a second unit magnet; and an interface material that bonds the first unit magnet and the second unit magnet, in which the first unit magnet and the second unit magnet are RFeB-based magnets containing a light rare earth element RL that is at least one element selected from the group consisting of Nd and Pr, Fe, and B, in which the interface material contains at least one compound selected from the group consisting of a carbide, a hydroxide, and an oxide of the light rare earth element RL, and in which an amount of a heavy rare earth element RH that is at least one element selected from the group consisting of Dy, Tb and Ho in the second unit magnet is more than that in the first unit magnet.Type: ApplicationFiled: September 30, 2014Publication date: April 9, 2015Applicant: DAIDO STEEL CO., LTD.Inventor: Shinobu TAKAGI
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Publication number: 20150097642Abstract: Provided is a combined type RFeB-based magnet, including: two or more unit magnets; and an interface material that bonds bonding surfaces of the unit magnets adjacent to each other, in which each of the unit magnets is an RFeB-based magnet containing a light rare earth element RL that is at least one element selected from the group consisting of Nd and Pr, Fe, and B, in which the interface material contains at least one compound selected from the group consisting of a carbide, a hydroxide, and an oxide of the light rare earth element RL, and in which the combined type RFeB-based magnet contains at least one element selected from the group consisting of Dy, Ho and Tb, and has a nonplanar surface.Type: ApplicationFiled: September 30, 2014Publication date: April 9, 2015Applicant: DAIDO STEEL CO., LTD.Inventor: Shinobu TAKAGI
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Patent number: 8991683Abstract: A method of forming a pack in a die by superplastic formation and diffusion bonding comprises applying a forming pressure within the pack to expand the pack within the die; and supplying gas between the die and the pack to apply a back pressure around an outside of the pack while the pack is being expanded to counteract the forming pressure to reduce surface mark off.Type: GrantFiled: September 10, 2012Date of Patent: March 31, 2015Assignee: The Boeing CompanyInventors: Daniel G. Sanders, Larry D. Hefti, Gregory L. Ramsey
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Publication number: 20150083369Abstract: Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together.Type: ApplicationFiled: September 25, 2014Publication date: March 26, 2015Inventors: Jack Merrill Fryer, Geoff Campbell, Brian S. Peotter, Lloyd Droppers
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Publication number: 20150050511Abstract: Disclosed is a process for producing a wear-resistant layer, in particular on components of gas turbines or aero engines. The process comprises providing a component with a titanium material on at least part of a surface on which the wear-resistant layer is to be produced, applying a solder formed from a cobalt base material to the titanium material, soldering the solder to the titanium material by applying heat and producing at least one diffusion zone between solder and titanium material which comprises intermetallic phases.Type: ApplicationFiled: August 18, 2014Publication date: February 19, 2015Inventors: André WERNER, Bernd DANIELS, Michael STRASSER
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Patent number: 8955887Abstract: A liquid phase diffusion bonded pipe joint comprised of metal pipes or a metal pipe and a joint pipe joined by liquid phase diffusion bonding, the liquid phase diffusion bonded pipe joint comprised of a metal joint provided with a tapered slanted part press-fit into an end of a metal pipe by a thrust in a pipe axial direction while expanding the metal pipe in inside diameter and tightly engaging with the end and a joining surface part continuing from the tapered slanted part and joined with an end face of the metal pipe by liquid phase diffusion bonding and a metal pipe tightly engaging with the tapered slanted part in the expanded state and with an end face joined with the joining surface part by liquid phase diffusion bonding.Type: GrantFiled: August 19, 2009Date of Patent: February 17, 2015Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Eiji Tsuru, Yasushi Hasegawa, Yasuhiro Shinohara, Yuichi Sato
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Publication number: 20150041059Abstract: A method is provided for providing, e.g. manufacturing, a thrust reverser inner fixed structure. The method includes (a) providing an acoustic inner barrel that includes a first honeycomb core and an annular inner skin radially inward of the first honeycomb core; (b) providing a bifurcation panel that includes a second honeycomb core; and (c) arranging a corner fitting between and attaching the corner fitting to the acoustic inner barrel and the bifurcation panel.Type: ApplicationFiled: October 17, 2013Publication date: February 12, 2015Applicant: Rohr, Inc.Inventors: Timothy Olson, Jay Cobia, Thomas Sommer
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Publication number: 20150001280Abstract: A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.Type: ApplicationFiled: February 25, 2013Publication date: January 1, 2015Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Toshikazu Nanbu
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Patent number: 8905293Abstract: A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.Type: GrantFiled: December 9, 2010Date of Patent: December 9, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao, Chia-Shiung Tsai, Chun-Wen Cheng
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Publication number: 20140356056Abstract: A hybrid diffusion-brazing process and hybrid diffusion-brazed article are disclosed. The hybrid diffusion-brazing process includes providing a component having a temperature-tolerant region and a temperature-sensitive region, brazing a braze material to the temperature-tolerant region during a localized brazing cycle, then heating the component in a furnace during a diffusion cycle. The brazing and the heating diffusion-braze the braze material to the component, and the localized brazing cycle is performed independent of the diffusion cycle in the hybrid diffusion-brazing process. The hybrid diffusion-brazed article includes a component, and a braze material diffusion-brazed to the component with a filler material. The filler material has a melting temperature that is above a tolerance temperature of the component.Type: ApplicationFiled: May 30, 2013Publication date: December 4, 2014Inventors: Liangde XIE, Ronald Lee SOUTHER, Mark Lawrence HUNT, Steven Charles WOODS
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Publication number: 20140346216Abstract: Process for joining by diffusion welding a part made of steel having a high carbon content and low carbide-forming elements content with a part made of steel or of nickel alloy having a low carbon content and a high carbide-forming elements content, each of the parts comprising a surface to be joined in which process an intermediate material is placed between the surfaces to be joined, then diffusion welding is carried out to join the two parts, and the assembly obtained is cooled, characterised in that the intermediate material is an alloy, with a matrix made of nickel and optionally of iron and/or cobalt, having an austenitic micro-structure at the welding temperature, and comprising 2 to 25% by mass of molybdenum. Also disclosed is an assembly obtained by this process.Type: ApplicationFiled: December 14, 2012Publication date: November 27, 2014Applicant: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVESInventors: Emmanuel Rigal, Isabelle Chu
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Patent number: 8840811Abstract: The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.Type: GrantFiled: April 28, 2010Date of Patent: September 23, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Yuusuke Yasuda, Toshiaki Morita, Eiichi Ide, Teiichi Inada
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Publication number: 20140260478Abstract: A method of processing an alloy workpiece to reduce thermal cracking may comprise spraying a metallic coating material onto at least a portion of a surface of the alloy workpiece to form a surface coating metallurgically bonded to the alloy workpiece. The surface coating may be more ductile than the alloy workpiece and reduces heat loss from the alloy workpiece.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: ATI PROPERTIES, INC.Inventors: Robin M. Forbes Jones, Richard L. Kennedy, Wei-Di Cao
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Patent number: 8827141Abstract: The present invention relates to a process and a device for joining precious metal sheets (1,4) to form structural parts, and to the products (1,4) made by the process.Type: GrantFiled: July 20, 2010Date of Patent: September 9, 2014Assignee: Umicore AG & Co. KGInventors: Rudolf Singer, Stefan Zeuner, Bernd Weber, Joerg Kopatz
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Publication number: 20140191142Abstract: A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behaviour while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.Type: ApplicationFiled: July 27, 2012Publication date: July 10, 2014Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Pierre-Eric Frayssines, Philippe Bucci, Jean-Marc Leibold, Emmanuel Rigal
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Publication number: 20140111956Abstract: A joining method using a metal foam, a method of manufacturing a semiconductor device by using the joining method, and a semiconductor device produced by the manufacturing method are disclosed. A metal foam body is sandwiched between members to be joined, which are then brought into contact with each other and subjected to heat treatment. In this heat treatment, films of low-melting-point metal, such as Sn films covering the members to be joined, are melted. An alloy layer—an intermetallic compound—is formed by bringing about solid-liquid diffusion of Cu of a skeleton of open cells of the metal foam body in the molten Sn. At this stage, a Cu skeleton is left in the metal foam body. Highly thermally resistant and highly reliable joining can be realized by joining the members to be joined together by using this alloy layer.Type: ApplicationFiled: September 10, 2013Publication date: April 24, 2014Applicant: FUJI ELECTRIC CO., LTD.Inventor: Katsumi TANIGUCHI
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Patent number: 8695195Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.Type: GrantFiled: July 3, 2009Date of Patent: April 15, 2014Assignee: Messier-Bugatti-DowtyInventors: Patrick Dunleavy, Richard Masson
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Publication number: 20140069990Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.Type: ApplicationFiled: November 13, 2013Publication date: March 13, 2014Applicant: Zimmer, Inc.Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
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Patent number: 8651364Abstract: A strip-shaped or plate-shaped composite metal object and a method for the production thereof. The composite metal object has at least two layers of the same metal. The layers have been brought by a heat pretreatment to a temperature such that a mutual diffusion bond has resulted through subsequent pressing of the layers against one another, while reducing the thickness by 5 to 25% and preferably 8 to 15%. A layer, which on the side thereof facing an adjacent layer has strip-shaped recesses, which are closed by the adjacent layer to form channels when the layers are pressed together, is used as one of the layers. The channels in the composite metal object allow the inclusion of additional elements before processed further to form an implement. The channels remain extensively preserved during the production and further processing of the composite model object.Type: GrantFiled: November 12, 2008Date of Patent: February 18, 2014Assignee: Eisfink Max Maier GmbH & Co. KGInventors: Norbert Hoffstaedter, Markus Spring
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Patent number: 8608049Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.Type: GrantFiled: October 10, 2007Date of Patent: December 17, 2013Assignee: Zimmer, Inc.Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
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Patent number: 8602290Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.Type: GrantFiled: April 22, 2011Date of Patent: December 10, 2013Assignee: Zimmer, Inc.Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen, Joel G. Scrafton, Casey Harmon
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Publication number: 20130230740Abstract: After a microcrystalline layer having a grain size that is finer than that of a base member is formed on the surface of at least one of a first bonding portion and a second bonding portion, the gap between the first bonding portion and the second bonding portion is filled with a solution into which copper oxide can be eluted, so as to deposit copper oxide contained in the surface oxide film into the solution. By applying pressure and by heating at a temperature of at most the copper recrystallization temperature, the components contained in the solution are removed except for copper, so as to elute copper oxide, thereby bonding the first bonding portion and the second bonding portion via the copper thus deposited. Subsequently, the copper is solid-phase diffused into the first bonding portion and the second bonding portion.Type: ApplicationFiled: February 19, 2013Publication date: September 5, 2013Applicant: SANYO ELECTRIC CO., LTD.Inventors: Yasuyuki YANASE, Koichi SAITO
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Patent number: 8523045Abstract: Copper conductor members or other copper-base workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal strip between assembled facing joining surfaces. The members are pressed together against the reactive material and heated. The combined pressure and heat enable the reactive material to react with facing workpiece material, to liquefy and remove oxides or the like that might inhibit the formation of a welded interface. The liquid, containing original reactive metal and byproducts, is squeezed from the interface of the workpieces to enable the formation of a solid-state weld between them without melting of un-reacted workpiece copper material.Type: GrantFiled: February 15, 2012Date of Patent: September 3, 2013Assignee: GM Global Technology Operations LLCInventors: Thomas A. Perry, James G. Schroth, David R. Sigler
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Publication number: 20130203218Abstract: A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a heating element. The two joining partners and the connecting means are arranged in the pressure chamber such that the connecting means is situated between the first joining partner and the second joining partner. A gas-tight region is then produced, in which the connecting means is arranged. Afterward, a gas pressure of at least 20 bar is produced in the pressure chamber outside the gas-tight region. The gas pressure acts on the gas-tight region and presses the first joining partner, the second joining partner and the connecting means together. The joining partners and the connecting means are then heated by means of the heating element to a predefined maximum temperature of at least 210° C. and then cooled.Type: ApplicationFiled: August 10, 2012Publication date: August 8, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Reinhold Bayerer, Olaf Hohlfeld
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Publication number: 20130189025Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.Type: ApplicationFiled: February 26, 2013Publication date: July 25, 2013Applicant: INFINITY IP COMMERCIALIZATION (ISRAEL) LTD.Inventor: INFINITY IP COMMERCIALIZATION (ISRAEL) LTD.
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Publication number: 20130181039Abstract: [Problem] To provide a highly efficient manufacturing method including an RH supply-diffusion process by which the number of magnets processed at a time can be increased without allowing sintered R-T-B based magnets to stick to holding members. [Solution] A method for producing a sintered R-T-B based magnet including the steps of: forming a stack of RH diffusion sources and sintered R-T-B based magnet bodies by stacking the diffusion sources and the magnet bodies alternately with a holding member having openings interposed; and carrying out an RH supply-diffusion process by loading the stack into a process vessel and creating an atmosphere with a pressure of 0.1 Pa to 50 Pa and a temperature of 800° C., to 950° C., within the process vessel.Type: ApplicationFiled: August 5, 2011Publication date: July 18, 2013Applicant: HITACHI METALS, LTD.Inventor: Tohru Obata
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Patent number: 8474684Abstract: A method for bonding a composite multi-layer shell having complex curvature by the delta-alpha high temperature bonding process uses a novel tool. The tool includes a plurality of segments that combine to form a mandrel assembly having a substantially continuous outer surface. The outer surface has a substantially axisymmetric shape including a complex curvature. When the segments are combined to form the mandrel assembly, at least one of the segments is configured to be movable in a substantially inward direction without substantial obstruction by any other segment. The segments are constructed of a first material have a first coefficient of thermal expansion that is greater than a second coefficient of thermal expansion of a second material of a composite multi-layer shell to be bonded together using the tool.Type: GrantFiled: July 13, 2012Date of Patent: July 2, 2013Assignee: Rohr, Inc.Inventors: Thomas Edward Sommer, Mark Alan Ramsey, David Dwain Rishel
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Publication number: 20130126053Abstract: The invention discloses a novel method to prepare the Ni(Sn, Sb)3 skutterudite compound. Skutterudite compounds are thermoelectric materials, which can transform heat into electric energy. Besides, the Ni(Sn, Sb)3 compound is also an anode material of Li ion battery. The solid state diffusion method is used to prepare the Ni(Sn1-x, Sbx)3 compound. Compared to traditional physical or chemical processes, the method disclosed in the invention is simpler and operates at a lower temperature. By the method according to the invention, the composition of the Ni(Sn, Sb)3 compound can be adjusted to fulfill variety requirements for different applications. It is noteworthy that the invention can prepare ternary compounds. In comparison with the frequently used binary compounds such as Ni3Sn4 or Cu6Sn5, the invention can produce materials with better performance.Type: ApplicationFiled: December 23, 2011Publication date: May 23, 2013Applicant: CHUNG YUAN CHRISTIAN UNIVERSITYInventors: Chih-chi Chen, Yue-Ting Chen
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Publication number: 20130112737Abstract: The invention relates to a composite metal powder for diffusion-brazing assembly or resurfacing of parts (1, 2) made of superalloy, the powder being formed by mixing a powder (3) of an Astroloy type base metal with a powder (4) of an NiCrB1055 type diffusion-brazing metal. The composite powder is free of silicon and it comprises in the range 65% to 70% by weight of Astroloy and in the range 30% to 35% by weight of NiCrB1055.Type: ApplicationFiled: July 27, 2011Publication date: May 9, 2013Applicant: SNECMAInventor: Jean-Francois Didier Clement
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Patent number: 8424746Abstract: To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.Type: GrantFiled: November 16, 2009Date of Patent: April 23, 2013Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Kazumasa Adachi, Motoo Takada, Kozo Ono
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Patent number: 8408446Abstract: Embodiments of a method for manufacturing a turbine engine component are provided, as are embodiments of a thermal growth constraint tool for the manufacture of turbine engine components. In one embodiment, the method includes the steps of obtaining a plurality of arched pieces, arranging the plurality of arched pieces in a ring formation, and bonding the plurality of arched pieces together to produce a monolithic ring by heating the ring formation to a predetermined bonding temperature while constraining the outward radial growth thereof.Type: GrantFiled: February 13, 2012Date of Patent: April 2, 2013Assignee: Honeywell International Inc.Inventors: Jason Smoke, David K. Jan, Don Mittendorf
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Publication number: 20130020378Abstract: A method of forming a brazed joint is provided in which a surface portion of a first metal part is placed in contact with a surface portion of a second metal part to form a contact area therebetween, and the first and second metal parts include copper, silver and/or gold as the primary base metal(s) and at least the surface portion of the first metal part is a modified alloy of the primary base metal(s) having 0.5-12 wt. % phosphorus as a modifier. The surface portion of the first metal part is heated to a temperature sufficient to cause the phosphorus to wet the surface portion of the second metal part and to flow a low melting portion of the first metal part into the contact area by capillary attraction to form the brazed joint between the first and second metal parts.Type: ApplicationFiled: July 19, 2012Publication date: January 24, 2013Inventor: Joseph W. Harris