Abstract: The present invention relates to a method of forming a joint bonding together two solid objects and joints made by the method, where the joint is formed by a layer of a binary system which upon heat treatment forms a porous, coherent and continuous single solid-solution phase extending across a bonding layer of the joint.

Abstract: A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method comprising the steps of: (o) optionally removing organic varnish, (p) positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars, and (q) applying heat to melt the solder bumps and to wet the ends of the vias with solder.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: A hydrogen purifier utilizing a hydrogen permeable membrane, and a gas-tight seal, where the seal is uses a low temperature melting point metal, which upon heating above the melting point subsequently forms a seal alloy with adjacent metals, where the alloy has a melting point above the operational temperature of the purifier. The purifier further is constructed such that a degree of isolation exists between the metal that melts to form the seal and the active area of the purifier membrane, so that the active area of the purifier membrane is not corrupted. A method of forming a hydrogen purifier utilizing a hydrogen permeable membrane with a seal of the same type is also disclosed.

Abstract: A fusion welding method is provided for fusion welding at juxtaposed interface surfaces a first member, for example made of a first metal based on at least one of Ru, Rh, Pd, and Pt, with a second member made of a second metal, for example a high temperature alloy based on at least one of Fe, Co, and Ni, including at least one identified element, for example Al, that can form a continuous layer of a brittle intermetallic compound with the first metal that is free of such element. With the interface surfaces disposed in contact, energy is generated at the interface surfaces in a combination of an amount and for a first time selected to be sufficient to heat the interface surfaces to a fusion welding temperature. However, the first time is less than a second time that enables formation at the fusion welding temperature of the continuous layer of the brittle intermetallic compound at the interface surfaces.

Abstract: A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the first alloy layer. A second lead-free alloy layer having a melting point lower than the first alloy layer is formed on surface of the board. The first and second alloy layers are placed in contact with each other and heated to a predetermined temperature.

Abstract: The invention relates to a method of manufacturing a bushing baseplate, and to a bushing baseplate. The bushing baseplate is characterized in that it comprises tips (18) constituted by hollow tubular elements of outside diameter slightly smaller than the inside diameter of holes (16) in the plate (12) forming the bushing baseplate, which tips are subjected to a step of being expanded radially relative to their axes. The method is simpler and less expensive.

Abstract: Two pieces of metal are joined together using an amorphous metallic joining element. In the joining operation, the joining element is placed between the two pieces to be joined. The joining element and adjacent regions of the pieces being joined are given a joining processing sequence of heating to a joining temperature, forcing the two pieces together for a period of time, and cooling. The joining element has a composition that is amorphous after the processing is complete. The joining element composition is also selected such that, after interdiffusion of elements from the pieces being joined into the joining element during processing, the resulting composition is amorphous after cooling.

Abstract: An improved method of brazing of two unclad aluminum shapes, particularly for automotive heat exchangers, which brazing joint does not leave a physically apparent layer of brazing material and which effects a stronger, sounder autogenous joint. A thin film of aluminum eutectic forming material (Si, Al-Si or Al-Zn) is deposited onto a zone of at least one of the shapes to be brazed or joined. The shapes are placed in joining relationship to form an assembly with a joint at the zone. The assembly is heated to a temperature to diffuse the eutectic forming material into the aluminum members to form a sacrificial bond between the shapes at the joining zone. It is desirable that at least one of the unclad aluminum shapes to be joined is extruded tubing having a precise diametrical configuration and said film is deposited as a physically vapor deposited layer in a thickness range of 1-50 microns.

Abstract: A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, preferably by electrodeposition, to a first faying surface (18). Following assembling with a second faying surface (22), the assembly is heated to melt the solder deposit, whereupon tin from the tin plate dissolves into the solder liquid to form a tin-enriched alloy having an increased melting temperature.

Abstract: An improved heating cycle for brazing an assembly of clad aluminum sheet components having a hypoeutectic aluminum-silicon braze alloy cladding comprises a dwell at a temperature slightly above the eutectic melting point and effective to partially melt the cladding. The dwell is accompanied by vaporization of residual magnesium from the clad alloy to getter oxygen from about the assembly and enhanced disruption of oxide film on the cladding surface, which film would otherwise interfere with capillary flow of the braze alloy into joints. The eutectic temperature dwell provides a more uniform flow of braze alloy into seams and thereby produces a strong, leak-free joint in the brazed structure.

Abstract: A continuous process for solid-phase edge bonding a plurality of dissimilar metal strips to form a composite edge-bonded strip. A plurality of elongated metal strips of equal thickness are heated and aligned in a substantially planar, edge-to-edge relationship and pass through a pair of compression bonding rollers. The bonding roller form a rectangular-shaped cavity having a width slightly greater than the combined width of the plurality of strips and a height less than that of the strips, to reduce in thickness and further elongate the metal strips without substantially changing the combined width of the strips and to form a solid-phase bond between adjacent side edges of the strips. The strength of the solid-phase bond is substantially equal to that of the parent metal strips such that the composite strip can be cut or stamped to form detail component parts such as electronic lead frames without bond failure.

Abstract: A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy is deposited onto a surface of the strip to produce the electrical contact terminal.

Abstract: Joined connections between a metallic compact body made by melting metallurgy and a body made by powder metallurgy are prepared by providing a pre-formed, unsintered pressed body having at least one component which forms a liquid phase at the sintering temperature, placing the pre-formed body directly in contact with a metallic compact body without application of external pressure and subjecting the contacted bodies to a temperature sufficient to sinter the pressed body but below the liquidus temperature of the compact body.