Cooling Under Particular Conditions Patents (Class 228/200)
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Patent number: 6648216Abstract: A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.Type: GrantFiled: August 9, 2001Date of Patent: November 18, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Atsushi Yamaguchi, Masato Hirano, Yoshinori Sakai
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Patent number: 6534195Abstract: Sn—Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn—Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved.Type: GrantFiled: June 11, 2001Date of Patent: March 18, 2003Assignees: Honda Giken Kogyo Kabushiki Kaisha, Yachiyo Kogyo Kabushiki KaishaInventors: Kazunori Takikawa, Masayuki Narita
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Patent number: 6533577Abstract: An oven compartment in an oven for subjecting items to a selected heating sequence having a compartment container with a transport opening therein to permit selectively entering such items adjacent to first plenum structure at a perforated surface to allow providing heating fluid thereon. The first plenum structure has a material mass and a specific heat such that a rate of change of temperature of that structure exceeds one degree Centigrade per second for a selected maximum temperature differential between heating fluid and any entered items positioned adjacent to the perforated surface at selected heating fluid pressures at that perforated surface. A method for heating such items with a heating fluid previously heated by a heater, to an extent determined by operating a heater control, directed onto such items is based on obtaining a control representation of a selected set of values for the heater control versus time based on a heating specification for a selected kind of item to be heated.Type: GrantFiled: February 1, 2002Date of Patent: March 18, 2003Assignee: CVD Equipment CorporationInventors: Bradley C. Anderson, Stephen P. Carlson, Travis R. Chezick, John T. Leone, Jean Pierre Menard, Bruce J. Pierson, James A. Rieck
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Patent number: 6510603Abstract: A production method of a rotor in which a lower layer slot insulator is held at a slot insulator holding portion of a combining jig, a lower layer coil bar is inserted into a coil inserting path of the combining jig and is combined integrally with the lower layer slot insulator by being pushed by a first coil inserting arrow and thereafter, set to inside of a coil integrating path of a coil holding member. The coil holding member is attached to a coil inserting device along with an armature core. The lower layer slot insulator and a lower layer coil trunk are integrally inserted into a slot of the armature core by pushing the lower layer coil bar set to inside of the coil integrating path. The upper layer coil trunk and the lower layer coil trunk may be formed integrally with respective coil arms as a single coil bar.Type: GrantFiled: August 30, 2000Date of Patent: January 28, 2003Assignee: Denson CorporationInventors: Jiro Ebihara, Masayuki Takiguchi
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Patent number: 6402011Abstract: For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.Type: GrantFiled: August 4, 2000Date of Patent: June 11, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahiro Taniguchi, Kazumi Ishimoto, Koichi Nagai, Osamu Yamazaki, Tatsuaki Kitagawa, Osamu Matsushima, Kazuhiro Uji, Seizo Nemoto
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Patent number: 6371361Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.Type: GrantFiled: February 19, 1999Date of Patent: April 16, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Atsushi Yamaguchi, Tetsuo Fukushima
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Patent number: 6347734Abstract: The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. Heating the perimeter portion of the module melts solder disposed between contact members of the module and corresponding contact members of the circuit board in order to form solder connections. Bringing the inner portion of the module to temperature that is lower than that of the perimeter portion reduces the likelihood of causing heat-related damage to the module itself. One arrangement of the invention is directed to a module installation system for installing a module on a circuit board. The module has a perimeter portion and an inner portion. The module installation system includes a heating source, a cooling source, and a nozzle coupled to the heating and cooling sources.Type: GrantFiled: March 27, 2000Date of Patent: February 19, 2002Assignee: EMC CorporationInventor: Stuart D. Downes
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Patent number: 6230962Abstract: A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus directly after removal from the vapor phase using the vapor phase soldering liquid. The advantages of the process consist in a greatly increased cooling rate of the soldered object and in an improved quality of the soldered joints.Type: GrantFiled: March 11, 1999Date of Patent: May 15, 2001Inventor: Helmut W. Leicht
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Patent number: 6059177Abstract: A welding method for two members adapted to be welded and formed of a low-alloy steel for structural purposes causing the weld metal to develop martensite transformation during cooling after welding, so that the weld metal becomes expanded to a greater degree at room temperature than at a temperature at which the martensite transformation initiates.Type: GrantFiled: December 23, 1997Date of Patent: May 9, 2000Assignee: Kawasaki Steel CorporationInventors: Osamu Watanabe, Akihiko Ohta, Chiaki Shiga, Satoshi Nishijima
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Patent number: 5918795Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.Type: GrantFiled: January 31, 1997Date of Patent: July 6, 1999Assignee: Matshushita Electric Industrial Co., Ltd.Inventors: Atsushi Yamaguchi, Tetsuo Fukushima
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Patent number: 5911355Abstract: The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.Type: GrantFiled: July 25, 1997Date of Patent: June 15, 1999Assignee: Messer GreishiemInventors: Jens Tauchmann, Tilman Schwinn, Heinz-Olaf Lucht
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Patent number: 5842627Abstract: A printed board, to which cream solders are applied on lands at the position where leads of electronic parts are to be soldered and the leads of the electronic parts are provided to the lands, is fed to a soldering position and, the cream solders of the fed printed board are spot heated and melted to solder the leads of the electronic parts to the lands. The molten solders are solidified by forced cooling to fix the leads of the electronic parts to the lands, and the printed board on which the leads of the electronic parts are fixed to the lands with the solidified solders is discharged from the soldering position.Type: GrantFiled: October 27, 1996Date of Patent: December 1, 1998Assignee: Sony CorporationInventors: Tei Takanashi, Masuru Tan
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Patent number: 5813595Abstract: A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the wave of solder, the printed circuit boards are further artificially cooled at an approximately constant time-temperature gradient of 20 K/sec.Type: GrantFiled: March 7, 1997Date of Patent: September 29, 1998Assignee: Siemens AktiengesellschaftInventors: Hans-Jurgen Albrecht, Gunter-Werner Strick
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Patent number: 5769308Abstract: The composition of a hard-facing welding material to be overlaid onto a cast iron base metal followed by a supercooling treatment for hardening must lie above a line LA in a Schaeffler's structure diagram which is represented by a Cr equivalent and a Ni equivalent. On the other hand, if the base metal is preheated, the carbon precipitation line will be at the Ni equivalent of 34 (LC1), and the Cr equivalent will thus be above 4. However, if the Cr equivalent is above 4, there will occur cracks after welding (examples in which cracks occurred are shown by square marks represented by a in FIG. 1). As a solution, the carbon precipitation line was raised up to the Ni equivalent of 38 without preheating the base metal, and the Cr equivalent of the welding material was made to be 4 or less.Type: GrantFiled: December 23, 1996Date of Patent: June 23, 1998Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Tsuyoshi Kokusho, Keizou Tanaka, Hideaki Ikeda, Masanobu Ishikawa, Hideo Nakamura, Shigeru Ohno, Masami Watanabe
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Patent number: 5745977Abstract: An armature core composed of a plurality of thin plates having a plurality of slots and a center hole is provided. Then, lower coil bars and subsequently upper coil bars are placed in the respective slots with insulators so that a coil end portion of one of the lower coil bars in one of the slots and a coil end portion of one of the upper coil bars in another slot meet together. After the meeting-coil-end portions are welded, a shaft is inserted to the center hole.Type: GrantFiled: February 29, 1996Date of Patent: May 5, 1998Assignee: Nippondenso Co., Ltd.Inventors: Hideki Ichikawa, Ryohei Saji
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Patent number: 5641341Abstract: A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located adjacent a heated zone and/or a cooling zone; conducting the gas/flux mixture to and through a first filter chamber (22), conducting the filtered gas from the filter chamber (22) through a low pressure portion of a blower housing of a cooling zone (16), then subsequently to and through a high pressure portion (44) of the cooling zone that includes a collection tray (38), a mesh filter (48), a heat exchanger (46) and at least one perforated plate (50). The heat exchanger is thermostatically controlled at a preset tempering temperature that minimizes the collection of flux on its exterior surfaces while allowing a solder joint of an article to solidify.Type: GrantFiled: February 14, 1996Date of Patent: June 24, 1997Assignee: Heller IndustriesInventors: David Heller, James Neville, Peter J. Griffin
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Patent number: 5639012Abstract: In a compound panel welding line, the compound panels discharged from a welding machine are cooled by means of a cooling unit. In the cooling unit, the welded seam is treated with a cooling fluid, in particular a rust-preventative oil. This allows the panels to be cooled and oiled within a very short time and over a very short distance, thus substantially reducing the overall length of a welding line, and greatly facilitating the handling of the compound panels.Type: GrantFiled: May 17, 1995Date of Patent: June 17, 1997Assignee: Elpatronic AGInventor: Werner Urech
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Patent number: 5462626Abstract: A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead.Type: GrantFiled: July 29, 1993Date of Patent: October 31, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Kanayama, Akira Kabeshita, Kenichi Nishino, Satoshi Ohnakada, Takahiko Murata, Kazuhiro Kimura, Kazuto Nishida
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Patent number: 5195673Abstract: A convection braze furnace for brazing aluminum heat exchangers in an inert gas rich atmosphere includes entrance and exit vestibules forming atmosphere barriers of suspended stainless steel strips. The interior of the braze furnace is divided into multiple zones for progressively heating the heat exchangers to a brazing temperature and then cooling the heat exchangers in the final zone. An impeller circulates the heated intent gas atmosphere within each zone to accelerate heat transfer. A chain type conveyor supports the heat exchangers as they are moved through the braze furnace. An isolated return tube surrounds the lower return side of the conveyor chain as it passes through the braze furnace. The braze furnace housing is comprised of inner and outer shells having an inert gas pressurized interstitial cavity therebetween. The inner shell includes a plurality of expansion strips having generally ellipsoidal corner expansion joints.Type: GrantFiled: September 25, 1991Date of Patent: March 23, 1993Assignee: General Motors CorporationInventors: Michael J. Irish, Gary A. Halstead, Brian L. Barten
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Patent number: 5188982Abstract: An Au/si die attach method for attaching a die to a package including preheating the package, melting an Au/Si preform in the package cavity, scratching the die onto the package cavity to form a die attach bond, and gradually cooling an Au/Si die bond by reducing heat supplied to the package, so as to cool the package through a monotonically decreasing sequence of temperatures, wherein the package is maintained for a predetermined period of time at each temperature in the sequence.A heating block with segments supplies a decreasing amount of heat to the packages to let the die attached bond gradually cool. The packages are kept on top of the segments of the heating block for a predetermined period of time and each segment is heated to a specific temperature. The gradual cooling of the die attach bond decreases the thermal resistance and prevents the creation of voids in the die attach bond.Type: GrantFiled: December 20, 1991Date of Patent: February 23, 1993Assignee: VLSI Technology, Inc.Inventor: Chin-Ching Huang
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Patent number: 5172847Abstract: A convection braze furnace for brazing aluminum heat exchangers in an inert gas rich atmosphere includes entrance and exit vestibules forming atmosphere barriers of suspended stainless steel strips. The interior of the braze furnace is divided into multiple zones for progressively heating the heat exchangers to a brazing temperature and then cooling the heat exchangers in the final zone. An impeller circulates the heated inert gas atmosphere within each zone to accelerate heat transfer. A chain type conveyor supports the heat exchangers as they are moved through the braze furnace. An isolated return tube surrounds the lower return side of the conveyor chain as it passes through the braze furnace. The braze furnace housing is comprised of inner and outer shells having an inert gas pressurized cavity interstitial therebetween. The inner shell includes a plurality of expansion strips having generally ellipsoidal corner expansion joints.Type: GrantFiled: September 25, 1991Date of Patent: December 22, 1992Assignee: General Motors CorporationInventors: Brian L. Barten, Gary A. Halstead
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Patent number: 5069381Abstract: A process for brazing non-ferritic steel surfaces such as nickel chromium or stainless steel to which a suitable brazing alloy such as copper has been mechanically attached which includes the steps of instantaneously elevating the surface of the stainless steel to a brazing temperature while maintaining the material in a humidified gaseous atmosphere consisting essentially of a non-reactive carrier gas and a reactive gas present in sufficient concentrations to achieve fluxing; maintaining the surface temperature of the steel for an interval sufficient to permit fusion between the selected metal and the non-ferritic steel surface; after metal fusion has been achieved, allowing the resulting fused metal material to cool to a first lowered temperature in a controlled non-oxidative atmosphere at a rate which retards the formation of fine-grained steel crystals in the metal; and after reaching a metallurgical transformation point, rapidly cooling the fused metal in a controlled atmosphere to a temperature below whType: GrantFiled: May 18, 1990Date of Patent: December 3, 1991Assignee: ITT CorporationInventors: Glen A. Gibbs, Arnold T. Johnson
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Patent number: 4995548Abstract: Coextrusion billets of two or more concentric metallic layers are treated by a hot isostatic pressing process and, then, may be succeeded by heating to an elevated temperature followed by quenching in order to form a diffused bondline between the contiguous touching metal layers, which after extruding and reducing into tubing, is relatively free of bondline defects.Type: GrantFiled: April 10, 1989Date of Patent: February 26, 1991Assignee: Teledyne Industries, Inc.Inventors: Chun T. Wang, Robert H. Scanlon
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Patent number: 4949894Abstract: A process and apparatus for fabricating an optical fiber cable core assembly having at least one optical fiber encapsulated with an ultra-small diameter metallic tube are described. The optical fiber cable core assembly is formed by passing a metal or metal alloy strip through at least one die to form the ultra-small diameter tube, inserting at least one optical fiber or fibers into the tube during the tube formation operation and passing the assembly through a sealing station to seal the tube and provide a hermetic core assembly. To reduce the likelihood of breaking the tube and damaging the optical fiber or fibers therein, the deformation energy for forming the strip into the tube is provided by wrapping the assembly about a tensioning device positioned between the tube forming station and the tube sealing station.Type: GrantFiled: June 7, 1984Date of Patent: August 21, 1990Assignee: Olin CorporationInventors: Joseph Winter, Michael J. Pryor
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Patent number: 4840305Abstract: A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.Type: GrantFiled: March 30, 1987Date of Patent: June 20, 1989Assignee: Westinghouse Electric Corp.Inventors: Michael J. Ankrom, Corey H. Bowcutt, John J. Buckley, Jr., James A. Rew
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Patent number: 4838477Abstract: A method for joining together a pair of flanged metal pipe sections at their respective flanges. The sections have heat sensitive material juxtaposed to, in contact with or bonded to the interior thereof. The method includes the step of providing coolant passages, each of the passages being located adjacent to respect of one of the flanges in proximity to the heat sensitive material for heat exchange therewith. The flanges are brought into a welding position and coolant is passed through the passages. The flanges are then welded together and coolant is continuously passed through the passages until the resultant welded flanges have cooled. An apparatus for effecting this method is also provided comprising a coolant passage adjacent to the flange and in heat exchange relationship with the flange. The coolant passage has an inlet for introducing coolant and an outlet for exhausting coolant therefrom.Type: GrantFiled: May 13, 1988Date of Patent: June 13, 1989Assignee: Du Pont Canada Inc.Inventors: Max J. Roach, Jack C. Taylor
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Patent number: 4819858Abstract: A method of cladding a medium or high steel core rod with another metal includes a hot water quench at a temperature of about 160.degree. F. to boiling temperature and preferably about 195.degree. F. to 205.degree. F. with a subsequent quench in water at a temperature below a level of the first temperature and preferably at about ambient temperature. The clad material is found to be substantially devoid of objectionable oxide particles or surface sponge particles and the steel core substantially devoid of acicular transformation products permitting continued processing by deformation processes, such as wire drawing.Type: GrantFiled: June 10, 1983Date of Patent: April 11, 1989Assignee: Copperweld CorporationInventors: William M. Malone, Malcolm J. Fraser
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Patent number: 4757935Abstract: Method for flushing the inside surface of a pipe in the vicinity of a welded seam, where a flushing gas is fed to the pipe with laminar flow, characterized by the feature that the laminar flow in the pipe is transformed into a turbulent flow in front of the welded seam.Type: GrantFiled: October 27, 1986Date of Patent: July 19, 1988Assignee: Kraftwerk Union AGInventor: Siegfried Gugel
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Patent number: 4736884Abstract: A method for manufacturing a high-strength clad steel plate excellent in corrosion resistance, which comprises the steps of: placing a cladding sheet comprising stainless steel onto at least one of the surfaces of a substrate sheet comprising any one of carbon steel and low-alloy steel; welding together the peripheries of the substrate sheet and the cladding sheet to prepare a slab; heating the prepared slab to a temperature of from 1,050.degree. to 1,300.degree. C.; hot-rolling the heated slab at a finishing temperature of at least 800.degree. C. to obtain a clad steel plate comprising the substrate sheet and the cladding sheet; and cooling the obtained clad steel plate at a cooling rate of from 2.degree. to 60.degree. C. per second until the temperature of the clad steel plate is less than 450.degree. C.Type: GrantFiled: June 27, 1986Date of Patent: April 12, 1988Assignee: Nippon Kokan Kabushiki KaishaInventors: Seishi Tsuyama, Kazuaki Matsumoto, Masaharu Honda, Shigeyasu Matsumoto, Akira Tagane, Toru Izawa
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Patent number: 4735354Abstract: A method of soldering a component on a printed circuit board which has the steps of sucking the components supplied in an irregularly aligned disposition by a feeding sucking nozzle tube, then holding the components by a pair of holding arms of a soldering iron from right and left sides to always direct the component in a predetermined direction, placing the components at predetermined positions on a printed circuit board as in this state, melting the preliminary solder placed in advance on the board, air-cooling to solidify the solder to solder a number of components with a short time by always obtaining the desired designating direction so as not to displace the positions and to locally heat the chip components. Thus, this method can delete thermal adverse influence to the component and obviate an unintentional drop of chip components during the step of feeding the components.Type: GrantFiled: November 6, 1986Date of Patent: April 5, 1988Assignee: Toyo Electronics Corp.Inventors: Kinsaku Yagi, Yoshinori Iwata
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Patent number: 4724890Abstract: For the purpose of connecting frogs consisting of austenitic manganese steel casting with rails consisting of carbon steel there is proposed an aluminothermic process in which the carbon content of the aluminothermic welded connection is limited with 0.2 percent by weight. In this case, the procedure is preferably such that the composition of the melt corresponds, as related to the Schaffler-diagram, to a Ni-equivalent of 13 to 35 percent and to a Cr-equivalent of 8 to 25 percent, noting that for a carbon content of .ltoreq.0.15 percent and preferably .ltoreq.0.1 percent, the equivalent value for Ni is 1x%Ni+30x%C+0.5%Mn and the equivalent value for Cr is 1x%Cr+1x%Mo+1.5x%Si.Type: GrantFiled: July 10, 1986Date of Patent: February 16, 1988Assignee: Voest-Alpine AktiengesellschaftInventors: Alfred Moser, Hubert Augustin
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Patent number: 4702406Abstract: A method of forming a stable welded joint between low alloy steels and austenitic stainless alloy steels which is characterized by increased resistance to chemical corrosion and mechanical stress and which has a greatly extended service lifetime. The method comprises forming a deposit of a low alloy steel containing niobium onto a portion of low alloy steel to be welded; heating the deposit to a first temperature at which all carbides present therein have dissolved; quenching the deposit and forming a solid solution of the elements of the dissolved carbides; and reheating the deposit for a time period and at a second temperature sufficient to form niobium carbides therein containing substantially all of the carbon present in the deposit. The austenitic stainless steel portion is welded to the deposit using a substantially nonferrous nickel-based alloy as the weld filler material, thereby joining the low alloy steel portion to the austenitic stainless steel portion.Type: GrantFiled: October 16, 1986Date of Patent: October 27, 1987Assignee: Carolina Power & Light CompanyInventors: Dennis Sullivan, Richard J. Bloch
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Patent number: 4645116Abstract: Indium is used to bond semiconductor lasers to their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding is achieved in a vacuum chamber in reducing ambients of CO or H.sub.2. Low strain bonds are achieved at bonding temperatures of approximately 180.degree.-240.degree. C. in CO and 220.degree.-230.degree. C. in H.sub.2. Void-free bonds are achieved in CO at temperatures as low as about 205.degree. C. The technique is applicable to other microelectronic chips such as LEDs, for example.Type: GrantFiled: September 5, 1984Date of Patent: February 24, 1987Assignee: AT&T Bell LaboratoriesInventors: Gerard E. Henein, Ralph T. Hepplewhite, Bertram Schwartz
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Patent number: 4631099Abstract: A method for the adhesion of oxide type ceramics and copper or a copper alloy is provided by this invention, which method comprises placing the oxide type ceramics and the copper or copper alloy in mutual contact, heating them in an oxidative atmosphere thereby effecting adhesion thereof, and rapidly cooling the resultant composite of adhesion. The adhesive strength of the composite of adhesion so produced is about 40% higher than the adhesive strength of a similar composite of adhesion obtained by the conventional method involving gradual cooling.Type: GrantFiled: January 4, 1985Date of Patent: December 23, 1986Assignee: Agency of Industrial Science & TechnologyInventors: Yoshihiro Ebata, Saburo Kose, Ryozo Hayami
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Patent number: 4605154Abstract: This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.Type: GrantFiled: January 28, 1985Date of Patent: August 12, 1986Assignee: Johnstone Railway Supply Mfg., Co. Inc.Inventor: Wayne A. Rhodes
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Patent number: 4519854Abstract: A process and apparatus for heat treatment of a steel article made of soft steel or the like comprising heating the steel article to a brazing temperature of 1100.degree.-1200.degree. C., then cooling the steel article in a furnace to a temperature of about 570.degree.-720.degree. C., and thereafter rapidly cooling the article. The article is heated to brazing temperature in an oxidation-free atmosphere and is also cooled in an oxidation-free atmosphere. The article can be rapidly cooled by contact with a surface pretreatment solution.Type: GrantFiled: December 29, 1983Date of Patent: May 28, 1985Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Yasuo Nakanishi, Kazunori Sakamoto, Giichi Ando, Teruoki Watanabe
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Patent number: 4506822Abstract: The invention relates to a method and apparatus for brazing two metal members together, at least one of which is nonplanar, in a brazing furnace using a substantially pure brazing material. The method comprises the steps of utilizing a brazing fixture to hold the two metal members in tangential relation to one another along a portion of each member so that a cavity is formed adjacent to the contacting portions. A braze material is then positioned within the cavity. The braze fixture, the metal members, and the braze material are then placed in a brazing furnace. A heat shield is then placed over the braze fixture, the metal members, and the braze material to shield the braze material from direct furnace radiation. The furnace temperature is linearly increased at a rate of about 180.degree. C. per hour until a temperature of 350.degree. C. is achieved. Heat is transferred by conduction from the metal members to the braze material to cause the braze material to melt.Type: GrantFiled: March 18, 1982Date of Patent: March 26, 1985Assignee: The United States of America as represented by the United States Department of EnergyInventors: Fred G. Hammersand, Anthony J. Witkowski
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Patent number: 4504008Abstract: A conveyor 21 rapidly advances a series of workholders to move printed circuit board connectors 10 mounted therein along a short insulating rail section 37 and a second long cooled rail 31. Presoldered leads 13 overlaying contacts pads 14 are heated to temperatures slightly above the melting point of solder during movement along the first rail 28 and are cooled to solidify the solder during movement along the second rail. A belt 44, moving at the same speed as the conveyor, presses the boards to ensure good contact of the leads with the pads during the melting and cooling of the solder.Type: GrantFiled: June 2, 1983Date of Patent: March 12, 1985Assignee: AT&T Technologies, Inc.Inventors: William C. Kent, Charles H. Payne
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Patent number: 4462533Abstract: This invention relates to a combined method of welding and annealing an aluminum-zinc alloy coated ferrous wire, and restoring the corrosion resistant properties to the annealed areas of said wire. The aluminum-zinc coating consists of an alloy overlay and an intermetallic alloy layer, between said alloy overlay and the ferrous wire. The preferred method includes the steps of (1) upset welding two alloy coated steel wires, (2) annealing the weld joint, at a temperature between about 1200.degree. and about 1450.degree. F. whereby during such annealing the weld joint is subjected to brushing to remove said alloy overlay and to prevent the formation of oxides on said intermetallic alloy layer, (3) removing the burr formed during such welding, and (4) cooling. During said cooling, or alternatively by reheating to a maximum temperature where the aluminum-zinc alloy coating on the wire begins to melt, i.e. about 900.degree. F. (482.degree. C.Type: GrantFiled: June 24, 1982Date of Patent: July 31, 1984Assignee: Bethlehem Steel Corp.Inventors: Samuel T. Furr, Robert E. Bauer
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Patent number: 4431862Abstract: An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.Type: GrantFiled: March 15, 1982Date of Patent: February 14, 1984Assignee: The United States of America as represented by the United States Department of EnergyInventors: Thomas Luhman, Carl Klamut
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Patent number: 4426550Abstract: An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.Type: GrantFiled: March 15, 1982Date of Patent: January 17, 1984Assignee: The United States of America as represented by the United States Department of EnergyInventors: Thomas Luhman, Masaki Suenaga
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Patent number: 4334646Abstract: A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder.Type: GrantFiled: April 17, 1980Date of Patent: June 15, 1982Assignee: Harris CorporationInventor: Henry J. Campbell
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Patent number: 4332342Abstract: A method of and a device for soldering components on thick-film substrates according to the reflow method. Successively, the substrates are preheated, followed by heating to the soldering temperature, after which they are cooled. A wave of molten metal of a given temperature is used for preheating, heating and cooling of the substrates.Type: GrantFiled: March 23, 1981Date of Patent: June 1, 1982Assignee: U.S. Philips CorporationInventor: Henricus C. A. van Der Put
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Patent number: 4243169Abstract: Metal/ceramic abradable seals of the type used in jet aircraft are improved by using a substrate which is able to deform during cooling from the brazing temperature and then rendering the substrate rigid after the cool down.Type: GrantFiled: December 27, 1978Date of Patent: January 6, 1981Assignee: Union Carbide CorporationInventor: Raymond V. Sara
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Patent number: 4032033Abstract: Articles are heated in a condensation heat transfer facility to effect soldering thereof by transporting said articles into a body of hot saturated vapor within the facility. The hot saturated vapor condenses on, and gives up latent heat of vaporization to, the articles to effect solder reflow. The articles are subsequently quenched in a liquid prior to the withdrawal of the articles from the facility.Type: GrantFiled: March 18, 1976Date of Patent: June 28, 1977Assignee: Western Electric Company, Inc.Inventors: Tze Yao Chu, Yogesh Jaluria, Peter Frederick Lilienthal, II, George Michael Wenger
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Patent number: 3957194Abstract: A liquid interface diffusion process for bonding titanium or titanium alloys wherein at least one of the titanium type materials to be fayed is sequentially plated with a total weight of from between 1 and 5 gms/ft.sup.2 of honeycomb core of layers of copper and nickel or an alloy made therefrom. The faying surfaces are then held together to maintain position on alignment, placed in a protective atmosphere, the temperature of the materials are then raised at a controlled rate causing sufficient solid state diffusion to occur and a liquid to form continuing to increase the temperature to a predetermined level and holding at this temperature until a solidification occurs and sufficient additional solid state diffusion occurs producing a desirable dilution of bridge material and titanium at the joint, and then reducing the temperature at a controlled rate to a lower temperature to complete the bonding cycle.Type: GrantFiled: June 13, 1975Date of Patent: May 18, 1976Assignee: Rohr Industries, Inc.Inventor: James R. Woodward