With Subsequent Treating Other Than Heating Of Bonded Parts And/or Filler Material Patents (Class 228/199)
  • Patent number: 10857628
    Abstract: An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: December 8, 2020
    Assignee: The Boeing Company
    Inventor: Austin E. Mann
  • Patent number: 10854883
    Abstract: A wire mesh including a warp which includes a first nickel alloy wire having a first peak tensile strength; and a weft which includes a wire including nickel having a second peak tensile strength, wherein the first peak tensile strength is greater than or equal to the second peak tensile strength, is provided. A current collector and a zinc-air battery that includes the wire mesh are also provided.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 1, 2020
    Assignee: ENERGIZER BRANDS, LLC
    Inventor: Erik Mortensen
  • Patent number: 10695873
    Abstract: The construction of vehicle body structure articles by welding sheet metal products to load bearing structural metal components. The sheet metal product is bent at the edges forming hemlines to dissipate heat uniformly in all directions from the welding location. The sheet metal product is welded at the bending knees of the hemlines edgewise to the longitudinal edges of the structural components while holding the outer surface of the metal sheet in alignment with the edges of the structural components.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: June 30, 2020
    Inventor: Tuan Anh Pham
  • Patent number: 10556285
    Abstract: A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: February 11, 2020
    Assignee: Kobe Steel, Ltd.
    Inventors: Tsuyoshi Matsumoto, Yoshihaya Imamura
  • Patent number: 10259073
    Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: April 16, 2019
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Patent number: 9755260
    Abstract: A method for manufacturing a high temperature electrolyzer (HTE) or a high temperature fuel cell is disclosed. According to one aspect, the HTE includes a vertical stack of n elementary planar cells alternating with n+1 interconnection plates. Each of the elementary cells include a planar porous anode and a planar porous cathode each having cutouts formed therein. The anode and cathode are respectively positioned on each of the faces of a planar dense electrolyte. Brazed joints are formed by infiltration of a defined amount of a brazing composition in the electrodes at contact points between the elementary cells and the interconnection plates.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: September 5, 2017
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Thierry Baffie, Julien Cigna
  • Patent number: 9013029
    Abstract: A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: April 21, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Masanori Minamio, Tatsuo Sasaoka
  • Publication number: 20140312100
    Abstract: The present invention relates to a method of joining polymer coated steel pipes comprising the steps of providing polymer coated pipe segments with an uncoated length on both ends of the segments; welding the polymer coated pipe segments together; applying a curable polymer (A) onto the uncoated length of the welded pipe segments to form an first coating layer; and applying a polymer composition (B) onto the first coating layer to form a topcoat layer with a thickness of 0.5 to 10 mm, wherein the polymer composition (B) has a melt flow rate MFR2 of 1.0 to 6.0 g/10 min, determined according to ISO 1133 at a temperature of 190° C. under a load of 2.
    Type: Application
    Filed: June 1, 2012
    Publication date: October 23, 2014
    Applicant: BOREALIS AG
    Inventors: Leif Leiden, Jouni Purmonen
  • Patent number: 8857700
    Abstract: A method for forming a field joints between sections of coated or insulated pipe which are to be welded together and incorporated into an undersea pipeline for carrying single or multi-phase fluids such as oil, gas and water. The method includes the application of a liquid epoxy layer which overlaps a lip of the factory-applied FBE coating protruding beyond a chamfered end of the factory-applied insulation layer, and which may be applied over the entire weld joint area. The liquid epoxy layer is partially cured by application of heat, and a layer of powdered adhesive is applied onto the partially cured liquid epoxy layer. The adhesive is subsequently sintered and activated by application of heat to its outer surface. The outer surfaces of the adhesive layer and the chamfers are then preheated and the thermal joint insulation is injection molded over the entire joint area.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: October 14, 2014
    Assignee: ShawCor Ltd.
    Inventors: Adam Jackson, Geir Melvold Østby, Peter Jackson
  • Patent number: 8790946
    Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: July 29, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng, Chia-Shiung Tsai
  • Publication number: 20140203068
    Abstract: A connecting method of a single core electric wire to a stranded electric wire which can prevent a contact resistance from increasing is provided. The connecting method includes a tube inserting process that a single core wire and a twisted wire are respectively inserted from openings and of a tubular joint terminal having a single core wire inserting part from an end part to a prescribed position in an interior side and a twisted wire inserting part from the other end part to the single core wire inserting part in the interior side, and a metallic bond process that an end face contacts under pressure with an end face and the single core electric wire is rotated in a twisting direction of the twisted wire to metallically bond the end faces.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: YAZAKI CORPORATION
    Inventor: Fumie HINO
  • Patent number: 8777090
    Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 15, 2014
    Assignee: H.C. Starck Inc.
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmermann
  • Patent number: 8679400
    Abstract: An iron-based sintered sliding material includes: a sintered structure which contains 10-50 wt. % copper and 1-15 wt. % carbon and has been formed by sintering a powder mixture obtained by mixing at least one of an Fe—Cu alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and an Fe—Cu—C alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and containing carbon in an amount of 0-5 wt. %, excluding 0 wt. %, with a graphite powder and at least one of a copper powder and a copper alloy powder; and graphite particles dispersed in the sintered sliding material in an amount of 1-14 wt. % or 3-50 vol. %.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: March 25, 2014
    Assignee: Komatsu Ltd
    Inventor: Takemori Takayama
  • Publication number: 20130299963
    Abstract: The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 14, 2013
    Inventors: Atsushi OTAKI, Shigeru OYAMA
  • Publication number: 20130284796
    Abstract: In one implementation, a system in package assembly process includes attaching a cladding to a substrate to keep the substrate flat while components are soldered onto the substrate. The cladding may include a supporting member and a clamping member, and the substrate may be received between the clamping member and the supporting member. The clamping member may have a plurality of openings formed therein, and the components may be positioned on the substrate within at least one of the plurality of openings. A predetermined pressure may be applied to the clamping member and/or supporting to keep the substrate flat.
    Type: Application
    Filed: April 25, 2012
    Publication date: October 31, 2013
    Applicant: Cisco Technology, Inc.
    Inventors: Mohan R. Nagar, Mudasir Ahmad
  • Publication number: 20130221502
    Abstract: First, an aqueous solution (103) containing an oxide film remover is disposed on a junction region of a first metal plate (101). Then, with the aqueous solution (103) remaining on the first metal plate (101), a second metal plate (102) is placed on the first metal plate (101). Thereafter, a load is applied to junction regions of the first metal plate (101) and the second metal plate (102) in the vertical direction, thereby joining the first metal plate (101) and the second metal plate (102) together to form a junction portion (110). In this manner, a joined body is manufactured.
    Type: Application
    Filed: August 8, 2012
    Publication date: August 29, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Masanori Minamio, Tatsuo Sasaoka
  • Publication number: 20130203199
    Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng, Chia-Shiung Tsai
  • Patent number: 8448840
    Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: May 28, 2013
    Assignee: H.C. Starck Inc.
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
  • Patent number: 8434663
    Abstract: A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are sealed flushly with the filler compound; d) then the side contoured in this way is coated with a coating; e) next the carrier element is applied to the coating, preferably by laser powder build-up welding.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: May 7, 2013
    Assignee: MTU Aero Engines GmbH
    Inventor: Reinhold Meier
  • Publication number: 20120186857
    Abstract: A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.
    Type: Application
    Filed: January 19, 2012
    Publication date: July 26, 2012
    Applicant: NGK Spark Plug Co., Inc.
    Inventors: Masahiro INOUE, Hajime SAIKI, Atsuhiko SUGIMOTO
  • Patent number: 8220693
    Abstract: A procedure for incorporating particles to a predetermined depth in a body to develop a composite surface layer using friction stir processing is described. The process comprises; preparing the surface of the body; applying particulate matter to the prepared surface; selecting a friction stir tool with a pin length substantially equal to the desired composite layer thickness; using a friction stir process to frictionally heat, stir and intermix the particulate matter with the matrix of the article; and traversing the friction stir tool across the body.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: July 17, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Paul E. Krajewski, Yen-Lung Chen
  • Publication number: 20120177528
    Abstract: An iron-based sintered sliding material includes: a sintered structure which contains 10-50 wt. % copper and 1-15 wt. % carbon and has been formed by sintering a powder mixture obtained by mixing at least one of an Fe—Cu alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and an Fe—Cu—C alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and containing carbon in an amount of 0-5 wt. %, excluding 0 wt. %, with a graphite powder and at least one of a copper powder and a copper alloy powder; and graphite particles dispersed in the sintered sliding material in an amount of 1-14 wt. % or 3-50 vol. %.
    Type: Application
    Filed: March 6, 2012
    Publication date: July 12, 2012
    Inventor: Takemori TAKAYAMA
  • Publication number: 20120171073
    Abstract: This invention refers to an alloy for the manufacture of ground-installed electrodes, which is primarily composed of aluminum, manganese, copper, zinc, cadmium, titanium, lead, and iron. This novel alloy allows for the manufacture of vertical and horizontal electrodes of different dimensions, which are used for the ground installation of electrical substations, transmission towers, and electrical distribution posts. In addition, the invention also provides a method to connect said electrodes in a more efficient manner.
    Type: Application
    Filed: September 21, 2009
    Publication date: July 5, 2012
    Inventor: Alberto Manuel Ontiveros Balcazar
  • Publication number: 20120085811
    Abstract: The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility.
    Type: Application
    Filed: November 9, 2011
    Publication date: April 12, 2012
    Applicant: BODYCOTE IMT, INC.
    Inventors: Virendra S. Warke, Stephen J. Mashl
  • Publication number: 20120061453
    Abstract: A method for producing tailor-made sheet metal strips, in particular steel strips, in which at least two sheet metal strips of different material quality and/or sheet metal thickness are welded to one another along the longitudinal edge in a continuous process. In order for the sheet metal strips produced by such a method to exhibit a relatively high level of weld seam strength, uncoated sheet metal strips are used in accordance with the invention as sheet metal strips to be welded. The tailor-made sheet metal strip formed of the uncoated sheet metal strips as a result of welding is then coated.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 15, 2012
    Applicant: THYSSENKRUPP TAILORED BLANKS GMBH
    Inventors: Hans-Peter Vogt, Albrecht Krüger-Eppstein
  • Publication number: 20120048913
    Abstract: A welding alignment and spacing article is provided for forming a welding gap between two structures to be welded together. The article includes a body having first and second surfaces that are spaced from each other at a selected spacing distance to define a region of selected body thickness. The body is formed from a non-metallic degradable body material in the region that can be wholly or partially degraded by exposure to a degrading agent to reduce the body thickness. The body is also formed from a non-degradable body material in the region. The degradable body material and the non-degradable body material are sufficiently incompressible to be useable as a spacer that maintains a specified welding gap distance between the two structures to be welded.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 1, 2012
    Inventor: Michael Hacikyan
  • Patent number: 8113413
    Abstract: In various embodiments, a metallic structure includes first and second clad structures each comprising a protective layer disposed over a steel layer, a joint joining the steel layers of first and second clad structures, and, directly connecting the protective layers of the first and second clad structures, a layer of metal powder disposed in contact with (i) the joint, (ii) the protective layers of the first and second clad structures, and (iii) a portion of at least one of the steel layers proximate the joint.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: February 14, 2012
    Assignee: H.C. Starck, Inc.
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
  • Publication number: 20110278264
    Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.
    Type: Application
    Filed: July 21, 2011
    Publication date: November 17, 2011
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Hiraku MURAYAMA, Akihiko Umeno, Jun Iwami, Yutaka Itou, Youki Aimi
  • Patent number: 8056230
    Abstract: A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: November 15, 2011
    Assignee: Curamik Electronics GmbH
    Inventor: Jürgen Schulz-Harder
  • Publication number: 20110248072
    Abstract: Method and apparatus for coating a pipe (2) or a pipe section with a layer of at least one polymer. The method comprises providing a pipe (2) or a pipe section having an outer surface defining the periphery of the pipe or pipe section; applying on the outer surface of the pipe or pipe section a layer of at least one polymer material in melt stage using a nozzle (3), which is mounted on a carriage capable of travelling along the periphery of the pipe (2) or pipe section; and moving the carriage along at least a part of the periphery during the application of the polymer material to form a layer on the surface of the pipe (2) or pipe section. The outer surface of the pipe or pipe section is being locally heated by induction heating before the application of the polymer material onto said surface. The present invention is particularly useful for coating field joints in pipelines.
    Type: Application
    Filed: October 23, 2009
    Publication date: October 13, 2011
    Applicants: BOREALIS AG, OY KWH PIPE AB
    Inventors: Leif Leidén, Sven Sjöberg, Rauno Smått
  • Publication number: 20110210158
    Abstract: A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 1, 2011
    Applicant: EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MGH
    Inventors: HANS-PETER CASPER, HUBERTUS KOTTHOFF, JÖRG GUTOWSKI, DIETMAR CHAUCHET, LUDWIG WIERES
  • Patent number: 8002169
    Abstract: In various embodiments, a method of joining clad structures includes providing first and second clad structures each comprising a protective layer disposed only partially over a steel layer such that an edge region of the steel layer is exposed, joining the first and second clad structures at their respective edge regions, thereby forming a joint, and cold spraying a metal powder over and in contact with (i) the joint, (ii) the edge regions, and (iii) the protective layers of the first and second clad structures, thereby directly connecting the protective layers of the first and second clad structures with a layer of unmelted metal powder.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: August 23, 2011
    Assignee: H.C. Starck, Inc.
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
  • Publication number: 20110193240
    Abstract: A first bonding material layer is formed on a first substrate and a second bonding material layer is formed on a second substrate. The first and second bonding material layers include a metal. Ions are implanted into the first and second bonding material layers to induce structural damages in the in the first and second bonding material layers. The first and second substrates are bonded by forming a physical contact between the first and second bonding material layers. The structural damages in the first and second bonding material layers enhance diffusion of materials across the interface between the first and second bonding material layers to form a bonded material layer in which metal grains are present across the bonding interface, thereby providing a high adhesion strength across the first and second substrates.
    Type: Application
    Filed: February 5, 2010
    Publication date: August 11, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mukta G. Farooq, Zhengwen Li, Zhijiong Luo, Huilong Zhu
  • Publication number: 20110186334
    Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 4, 2011
    Applicant: Semblant Global Limited
    Inventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith
  • Publication number: 20110158572
    Abstract: The invention concerns a method for manufacturing a steel component (6, 11) comprising a first steel part (7) and a second steel part (8), the first (7) and second (8) steel part having a carbon content up to 1.5 weight percent, The method is comprising: Heating (1), at least partly, the first steel part (7), and at least partly, the second steel part (8), to above the alpha/gamma transformation temperature, and joining (2) the first steel part (7) and the second steel part (8) by welding, the welding taking place at a temperature above the alpha/gamma transformation temperature, and cooling (3) such that hardening effects are avoided. The invention further concerns weld seams (9), welded steel components (6, 11), and bearing components (11, 15, 20, 22, 26, 27, 31).
    Type: Application
    Filed: July 10, 2009
    Publication date: June 30, 2011
    Inventors: Patrik Dahlman, John Van De Sanden
  • Publication number: 20110139859
    Abstract: In a method of preparing an aluminum surface, flux is applied to the aluminum surface and the aluminum surface is brazed. Residual flux and metal oxides are removed from the aluminum surface using an aqueous fluid having a pH between about 5 and about 9.
    Type: Application
    Filed: May 1, 2009
    Publication date: June 16, 2011
    Applicant: CARRIER CORPORATION
    Inventors: Mark R. Jaworowski, Jack Leon Esformes, Neal Magdefrau, Michael F. Taras
  • Publication number: 20110120769
    Abstract: A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop. A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure.
    Type: Application
    Filed: April 19, 2010
    Publication date: May 26, 2011
    Inventors: Shigeaki Sakatani, Akio Furusawa, Kenichiro Suetsugu, Taichi Nakamura
  • Publication number: 20110101619
    Abstract: A MCrAlY alloy, methods to produce a MCrAlY layer and a honeycomb seal are provided. The MCrAlY alloy includes chromium, aluminum, yttrium and iron and optionally titanium, hafnium or silicon. The honeycomb seal includes a substrate, honeycomb cells and a protective coating on side walls of the honeycomb cells or a diffusion area inside side walls of the honeycomb cells, the protective coating or the diffusion area including the MCrAlY alloy.
    Type: Application
    Filed: January 23, 2009
    Publication date: May 5, 2011
    Inventors: David Fairbourn, Paul Mathew Walker
  • Publication number: 20110057017
    Abstract: The present invention is directed to a fluid conduit assembly. In accordance with one embodiment of the present invention, the inventive fluid conduit assembly includes a fluid conduit having an inlet, at least one outlet and a fluid flow passageway therebetween configured to allow for fluid to be communicated between said inlet and said at least one outlet. The inventive fluid conduit assembly further includes at least one damper disposed within the passageway of the fluid conduit. The damper includes a sealed vent configured to vent gases captured by the damper during a brazing process performed on the fluid conduit when unsealed.
    Type: Application
    Filed: November 11, 2010
    Publication date: March 10, 2011
    Applicant: Millennium Industries Corporation
    Inventors: MICHAEL J. ZDROIK, ROBERT J. DOHERTY
  • Publication number: 20100288977
    Abstract: A component adapted to an environment exposed to corrosive species such as chlorine, which component has a substrate and a coating on the substrate configured to shield the substrate from erosion and corrosion. The coating is formed and metallurgically bonded to the substrate by nickel vapor depositing and hot isostatic pressing or by surface brazing. The coating is manufactured to form a dense layer consisting of a protective material that substantially reduces corrosion rate under the presence of the corrosive species.
    Type: Application
    Filed: May 15, 2009
    Publication date: November 18, 2010
    Inventors: Mikko Uusitalo, Janne Nurminen
  • Publication number: 20100282823
    Abstract: In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 11, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: John C. Ulicny, Paul E. Krajewski, Mark A. Golden, Keith S. Snavely
  • Publication number: 20100224673
    Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.
    Type: Application
    Filed: March 9, 2009
    Publication date: September 9, 2010
    Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Masumoto
  • Publication number: 20100210468
    Abstract: Provided is a method for joining two strands of second-generation high-temperature superconducting wire, each of which includes a substrate, a buffer layer, a superconducting layer and a stabilizer layer. The method comprises: partially removing each of the stabilizer layers to expose a portion of the superconducting layer; bringing the exposed portions of the superconducting layers into contact with each other and fixing the superconducting layers to each other; heating the strands of superconducting wire to the melting point of the superconducting layers to melt-diffuse the superconducting layers in contact with each other and to join the strands of superconducting wire together; and oxidizing the junction between the strands of superconducting wire in an oxygen atmosphere (‘oxygenation annealing’). The oxygenation annealing restores the superconducting properties of the superconducting wires lost during the melting diffusion.
    Type: Application
    Filed: August 4, 2009
    Publication date: August 19, 2010
    Inventors: Haigun Lee, Jung-bing Song, Hyun Sung Kim, Na-young Kwon
  • Publication number: 20100187239
    Abstract: A threaded weld fitting and a method of welding a threaded weld fitting to the tank wall of a water storage tank are provided. The threaded weld fitting comprises a body defining an aperture and having a facing surface configured to be positioned facing the tank wall. A female thread is formed along the aperture. A first beveled surface portion of the facing surface extends from an edge of the body. A landing surface portion of the facing surface extends from the first beveled surface portion toward a longitudinal axis of the aperture. A second beveled surface portion of the facing surface extends from the landing surface and to the female thread. The landing surface portion and the second beveled surface portion together define an open annular area positioned to receive a portion of a weld formed by welding the threaded weld fitting to the tank wall.
    Type: Application
    Filed: January 23, 2009
    Publication date: July 29, 2010
    Applicant: Bradford White Corporation
    Inventors: Harold Hoover, Richard Freiberg, Michael McLellen, Joe Beach
  • Publication number: 20100170669
    Abstract: An aluminum braze alloy suitable for use in brazing aluminum alloy components for heat exchanger's which includes lesser amounts of silicon, and further including at least one of magnesium, calcium, a lanthanide series metal and mixtures thereof in a concentration sufficient to form a passivating film under corrosive conditions.
    Type: Application
    Filed: June 26, 2007
    Publication date: July 8, 2010
    Applicant: Carrier Corporation
    Inventor: Mark R. Jaworowski
  • Publication number: 20100102429
    Abstract: A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate.
    Type: Application
    Filed: January 23, 2009
    Publication date: April 29, 2010
    Applicant: GREAT TEAM BACKEND FOUNDRY, INC.
    Inventor: CHUNG HSING TZU
  • Publication number: 20100090334
    Abstract: The objective of this invention is to prevent the generation of defects pertaining to placement of solder balls on the terminal placement parts of the electronic part main body. The solder ball 1 has spherical core 2 and coating layer 3 that covers core 2. The coating layer 3 contains a resin. The diameter of core 2 is in the range of 30-500 ?m. The thickness of coating layer 3 is in the range of 5-100 ?m. The coating layer 3 is melted at temperature in a range of 20° C. between 150 to 300° C., and the viscosity of coating layer 3 is in the range of 0.01-50 Pa-s. After solder balls 1 are set on terminal placement parts 13a in the main body of the electronic part, reflow is performed for solder balls 1. As a result, coating layer 3 is melted first, and core 2 descends under its own weight to come into contact with the terminal placement part. Core 2 is then melted, and core 2 and terminal placement part 13a are soldered and joined to each other.
    Type: Application
    Filed: December 14, 2009
    Publication date: April 15, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Mutsumi MASUMOTO
  • Publication number: 20100089980
    Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump.
    Type: Application
    Filed: February 26, 2008
    Publication date: April 15, 2010
    Applicant: SHINKAWA LTD.
    Inventor: Toru Maeda
  • Patent number: 7601295
    Abstract: A filter is formed by a sintered non-woven metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together with the surface layer of the metal fibers.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: October 13, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshiaki Tomari, Katsunori Heishi, Setsuo Fukuda
  • Publication number: 20090130478
    Abstract: The invention relates to a method of producing and joining superalloy balls by means of brazing and to objects produced with such joints. According to the invention, an alloy powder covered with a brazing solder is bonded to a spherical core and subsequently transformed into a continuous alloy layer by means of brazing.
    Type: Application
    Filed: July 7, 2006
    Publication date: May 21, 2009
    Inventors: Myriam Douin, Marie-Pierre Bacos, Alexandra Boyer, Aurelie Gregoire, Pierre Josso, Sebastien Mercier, Ariel Moriel, Jason Nadler, Serge Naveos, Catherine Rio