With Subsequent Treating Other Than Heating Of Bonded Parts And/or Filler Material Patents (Class 228/199)
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Patent number: 12202964Abstract: The present invention relates to a polymer composition comprising (A) from 60 to 90 wt % of a non-elastomeric polyethylene; (B) from 9.0 to 38 wt % of an elastomer; wherein onto component (A) or components (A) and (B) an acid grafting agent (C) has been grafted in an amount of from 0.01 to 3.0 wt %, all based on the total weight of the polymer composition, and wherein the polymer composition has two distinct peaks and a valley between said peaks in the GPC curve and a Z value, determined from the areas below the two peaks of the GPC curve, of at least ?0.3, wherein the Z-value is determined according to formula (I) Z=s/Abs(B?A) (I) wherein Abs(B?A) is the absolute value of (B?A); A=the area, between the tangent parallel to the MW axis going through log M (Min) and the LS15 signal, from log M of 5.1 to log M value where the LS signal is minimum log M (Min), in the log M range between 5.Type: GrantFiled: January 27, 2020Date of Patent: January 21, 2025Assignee: BOREALIS AGInventors: John Jamieson, Jari-Jussi Ruskeeniemi, Floran Prades, Noureddine Ajellal, Tua Sundholm, Jouni Purmonen, Angelica Maëlle Delphine Legras, Katja Klimke, Andreas Albrecht
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Patent number: 12148680Abstract: A semiconductor device includes: a wiring substrate; a semiconductor chip mounted on the wiring substrate; a heat release sheet arranged on the semiconductor chip to cover the entire semiconductor chip and having a larger area than an area of the semiconductor chip; and a cover member which covers the semiconductor chip and the heat release sheet and to which the heat release sheet is fixed. The cover member has a first portion facing the semiconductor chip, a flange portion arranged in a periphery of the first portion and bonded and fixed onto the wiring substrate, and a second portion arranged between the first portion and the flange portion. In a plan view of the cover member viewed from the heat release sheet, the heat release sheet is bonded/fixed to the cover member through a bonding member partially arranged between the heat release sheet and the cover member.Type: GrantFiled: November 3, 2021Date of Patent: November 19, 2024Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Toshihiko Akiba, Yusuke Tanuma
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Patent number: 11731206Abstract: A method may include removing a portion of a base component adjacent to a damaged portion of the base component to define a repair portion of the base component. The base component may include a cobalt- or nickel-based superalloy, and the repair portion of the base component may include a through-hole extending from a first surface of the base component to a second surface of the base component. The method also may include forming a braze sintered preform to substantially reproduce a shape of the through-hole. The braze sintered preform may include a Ni- or Co-based alloy. The method additionally may include placing the braze sintered preform in the through-hole and heating at least the braze sintered preform to cause the braze sintered preform to join to the repair portion of the base component and change a microstructure of the braze sintered preform to a brazed and diffused microstructure.Type: GrantFiled: April 15, 2022Date of Patent: August 22, 2023Assignee: Rolls-Royce CorporationInventors: Raymond Ruiwen Xu, Scott Nelson, Joseph Peter Henderkott
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Patent number: 11688555Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.Type: GrantFiled: December 30, 2020Date of Patent: June 27, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yukihiro Fujita, Shogo Kanbe, Kosuke Nakano, Hideki Otsuka
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Patent number: 11541470Abstract: A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a braze region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the braze region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the solidus temperature of the braze material. A braze precursor material is also provided.Type: GrantFiled: April 2, 2021Date of Patent: January 3, 2023Assignee: General Electric CompanyInventors: Voramon Supatarawanich Dheeradhada, Raghavendra Rao Adharapurapu, Juan Borja, Don Mark Lipkin
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Patent number: 11135682Abstract: The invention concerns a method for the manufacturing of a clad sheet product comprising a core layer (6) and at least one cladding layer, the method comprising rolling an assembly of a core layer and at least one cladding layer and reducing the thickness to a desired gauge, the core layer being made of an aluminium alloy, the at least one cladding layer comprising a centre section (2) and at least two edge sections (4, 5) positioned at opposite sides of the centre section (2) along the edges of the at least one cladding layer, the centre section being made of a material being an aluminium alloy or a composite material comprising a matrix of aluminium or an aluminium alloy, the edge sections along (4, 5) the edges being made of a material different from the material of the centre section, wherein the edge sections (4, 5) are cut off during or after the rolling. The invention further concerns a cladding plate useful in the method.Type: GrantFiled: March 14, 2017Date of Patent: October 5, 2021Assignee: Gränges ABInventor: Torkel Stenqvist
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Patent number: 11072844Abstract: A method of forming and processing a high strength aluminum alloy for the production of a vehicle component includes providing a metal sheet that was rolled from an aluminum alloy. The sheet is heat treated through a first aging step of a set of aging steps that are necessary to achieve a T6 or a T7 temper state. Prior to achieving the T6 or a T7 temper state, the sheet is formed to a desired shape and welded in the desired shape to produce a desired vehicle component. Once formed, the vehicle component is heat treated through a remaining aging step to achieve a T6 or T7 temper state homogeneously throughout the vehicle component.Type: GrantFiled: October 24, 2017Date of Patent: July 27, 2021Assignee: SHAPE CORP.Inventor: Helen Weykamp
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Patent number: 10857628Abstract: An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.Type: GrantFiled: November 6, 2017Date of Patent: December 8, 2020Assignee: The Boeing CompanyInventor: Austin E. Mann
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Patent number: 10854883Abstract: A wire mesh including a warp which includes a first nickel alloy wire having a first peak tensile strength; and a weft which includes a wire including nickel having a second peak tensile strength, wherein the first peak tensile strength is greater than or equal to the second peak tensile strength, is provided. A current collector and a zinc-air battery that includes the wire mesh are also provided.Type: GrantFiled: October 14, 2015Date of Patent: December 1, 2020Assignee: ENERGIZER BRANDS, LLCInventor: Erik Mortensen
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Patent number: 10695873Abstract: The construction of vehicle body structure articles by welding sheet metal products to load bearing structural metal components. The sheet metal product is bent at the edges forming hemlines to dissipate heat uniformly in all directions from the welding location. The sheet metal product is welded at the bending knees of the hemlines edgewise to the longitudinal edges of the structural components while holding the outer surface of the metal sheet in alignment with the edges of the structural components.Type: GrantFiled: October 17, 2017Date of Patent: June 30, 2020Inventor: Tuan Anh Pham
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Patent number: 10556285Abstract: A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.Type: GrantFiled: October 26, 2015Date of Patent: February 11, 2020Assignee: Kobe Steel, Ltd.Inventors: Tsuyoshi Matsumoto, Yoshihaya Imamura
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Patent number: 10259073Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.Type: GrantFiled: March 27, 2015Date of Patent: April 16, 2019Assignee: Toyo Kohan Co., Ltd.Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
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Patent number: 9755260Abstract: A method for manufacturing a high temperature electrolyzer (HTE) or a high temperature fuel cell is disclosed. According to one aspect, the HTE includes a vertical stack of n elementary planar cells alternating with n+1 interconnection plates. Each of the elementary cells include a planar porous anode and a planar porous cathode each having cutouts formed therein. The anode and cathode are respectively positioned on each of the faces of a planar dense electrolyte. Brazed joints are formed by infiltration of a defined amount of a brazing composition in the electrodes at contact points between the elementary cells and the interconnection plates.Type: GrantFiled: January 6, 2010Date of Patent: September 5, 2017Assignee: Commissariat à l'énergie atomique et aux énergies alternativesInventors: Thierry Baffie, Julien Cigna
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Patent number: 9013029Abstract: A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.Type: GrantFiled: August 8, 2012Date of Patent: April 21, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Masanori Minamio, Tatsuo Sasaoka
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Publication number: 20140312100Abstract: The present invention relates to a method of joining polymer coated steel pipes comprising the steps of providing polymer coated pipe segments with an uncoated length on both ends of the segments; welding the polymer coated pipe segments together; applying a curable polymer (A) onto the uncoated length of the welded pipe segments to form an first coating layer; and applying a polymer composition (B) onto the first coating layer to form a topcoat layer with a thickness of 0.5 to 10 mm, wherein the polymer composition (B) has a melt flow rate MFR2 of 1.0 to 6.0 g/10 min, determined according to ISO 1133 at a temperature of 190° C. under a load of 2.Type: ApplicationFiled: June 1, 2012Publication date: October 23, 2014Applicant: BOREALIS AGInventors: Leif Leiden, Jouni Purmonen
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Patent number: 8857700Abstract: A method for forming a field joints between sections of coated or insulated pipe which are to be welded together and incorporated into an undersea pipeline for carrying single or multi-phase fluids such as oil, gas and water. The method includes the application of a liquid epoxy layer which overlaps a lip of the factory-applied FBE coating protruding beyond a chamfered end of the factory-applied insulation layer, and which may be applied over the entire weld joint area. The liquid epoxy layer is partially cured by application of heat, and a layer of powdered adhesive is applied onto the partially cured liquid epoxy layer. The adhesive is subsequently sintered and activated by application of heat to its outer surface. The outer surfaces of the adhesive layer and the chamfers are then preheated and the thermal joint insulation is injection molded over the entire joint area.Type: GrantFiled: June 4, 2010Date of Patent: October 14, 2014Assignee: ShawCor Ltd.Inventors: Adam Jackson, Geir Melvold Østby, Peter Jackson
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Patent number: 8790946Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.Type: GrantFiled: February 2, 2012Date of Patent: July 29, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng, Chia-Shiung Tsai
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Publication number: 20140203068Abstract: A connecting method of a single core electric wire to a stranded electric wire which can prevent a contact resistance from increasing is provided. The connecting method includes a tube inserting process that a single core wire and a twisted wire are respectively inserted from openings and of a tubular joint terminal having a single core wire inserting part from an end part to a prescribed position in an interior side and a twisted wire inserting part from the other end part to the single core wire inserting part in the interior side, and a metallic bond process that an end face contacts under pressure with an end face and the single core electric wire is rotated in a twisting direction of the twisted wire to metallically bond the end faces.Type: ApplicationFiled: March 25, 2014Publication date: July 24, 2014Applicant: YAZAKI CORPORATIONInventor: Fumie HINO
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Patent number: 8777090Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.Type: GrantFiled: March 21, 2013Date of Patent: July 15, 2014Assignee: H.C. Starck Inc.Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmermann
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Patent number: 8679400Abstract: An iron-based sintered sliding material includes: a sintered structure which contains 10-50 wt. % copper and 1-15 wt. % carbon and has been formed by sintering a powder mixture obtained by mixing at least one of an Fe—Cu alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and an Fe—Cu—C alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and containing carbon in an amount of 0-5 wt. %, excluding 0 wt. %, with a graphite powder and at least one of a copper powder and a copper alloy powder; and graphite particles dispersed in the sintered sliding material in an amount of 1-14 wt. % or 3-50 vol. %.Type: GrantFiled: March 6, 2012Date of Patent: March 25, 2014Assignee: Komatsu LtdInventor: Takemori Takayama
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Publication number: 20130299963Abstract: The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing.Type: ApplicationFiled: May 7, 2013Publication date: November 14, 2013Inventors: Atsushi OTAKI, Shigeru OYAMA
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Publication number: 20130284796Abstract: In one implementation, a system in package assembly process includes attaching a cladding to a substrate to keep the substrate flat while components are soldered onto the substrate. The cladding may include a supporting member and a clamping member, and the substrate may be received between the clamping member and the supporting member. The clamping member may have a plurality of openings formed therein, and the components may be positioned on the substrate within at least one of the plurality of openings. A predetermined pressure may be applied to the clamping member and/or supporting to keep the substrate flat.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Applicant: Cisco Technology, Inc.Inventors: Mohan R. Nagar, Mudasir Ahmad
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Publication number: 20130221502Abstract: First, an aqueous solution (103) containing an oxide film remover is disposed on a junction region of a first metal plate (101). Then, with the aqueous solution (103) remaining on the first metal plate (101), a second metal plate (102) is placed on the first metal plate (101). Thereafter, a load is applied to junction regions of the first metal plate (101) and the second metal plate (102) in the vertical direction, thereby joining the first metal plate (101) and the second metal plate (102) together to form a junction portion (110). In this manner, a joined body is manufactured.Type: ApplicationFiled: August 8, 2012Publication date: August 29, 2013Applicant: PANASONIC CORPORATIONInventors: Masanori Minamio, Tatsuo Sasaoka
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Publication number: 20130203199Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.Type: ApplicationFiled: February 2, 2012Publication date: August 8, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng, Chia-Shiung Tsai
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Patent number: 8448840Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.Type: GrantFiled: January 4, 2012Date of Patent: May 28, 2013Assignee: H.C. Starck Inc.Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
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Patent number: 8434663Abstract: A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are sealed flushly with the filler compound; d) then the side contoured in this way is coated with a coating; e) next the carrier element is applied to the coating, preferably by laser powder build-up welding.Type: GrantFiled: March 31, 2005Date of Patent: May 7, 2013Assignee: MTU Aero Engines GmbHInventor: Reinhold Meier
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Publication number: 20120186857Abstract: A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.Type: ApplicationFiled: January 19, 2012Publication date: July 26, 2012Applicant: NGK Spark Plug Co., Inc.Inventors: Masahiro INOUE, Hajime SAIKI, Atsuhiko SUGIMOTO
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Patent number: 8220693Abstract: A procedure for incorporating particles to a predetermined depth in a body to develop a composite surface layer using friction stir processing is described. The process comprises; preparing the surface of the body; applying particulate matter to the prepared surface; selecting a friction stir tool with a pin length substantially equal to the desired composite layer thickness; using a friction stir process to frictionally heat, stir and intermix the particulate matter with the matrix of the article; and traversing the friction stir tool across the body.Type: GrantFiled: November 9, 2009Date of Patent: July 17, 2012Assignee: GM Global Technology Operations LLCInventors: Paul E. Krajewski, Yen-Lung Chen
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Publication number: 20120177528Abstract: An iron-based sintered sliding material includes: a sintered structure which contains 10-50 wt. % copper and 1-15 wt. % carbon and has been formed by sintering a powder mixture obtained by mixing at least one of an Fe—Cu alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and an Fe—Cu—C alloy powder containing copper in an amount which is the solid solubility or larger and is 5-50 wt. %, excluding 50 wt. %, and containing carbon in an amount of 0-5 wt. %, excluding 0 wt. %, with a graphite powder and at least one of a copper powder and a copper alloy powder; and graphite particles dispersed in the sintered sliding material in an amount of 1-14 wt. % or 3-50 vol. %.Type: ApplicationFiled: March 6, 2012Publication date: July 12, 2012Inventor: Takemori TAKAYAMA
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Publication number: 20120171073Abstract: This invention refers to an alloy for the manufacture of ground-installed electrodes, which is primarily composed of aluminum, manganese, copper, zinc, cadmium, titanium, lead, and iron. This novel alloy allows for the manufacture of vertical and horizontal electrodes of different dimensions, which are used for the ground installation of electrical substations, transmission towers, and electrical distribution posts. In addition, the invention also provides a method to connect said electrodes in a more efficient manner.Type: ApplicationFiled: September 21, 2009Publication date: July 5, 2012Inventor: Alberto Manuel Ontiveros Balcazar
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Publication number: 20120085811Abstract: The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility.Type: ApplicationFiled: November 9, 2011Publication date: April 12, 2012Applicant: BODYCOTE IMT, INC.Inventors: Virendra S. Warke, Stephen J. Mashl
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Publication number: 20120061453Abstract: A method for producing tailor-made sheet metal strips, in particular steel strips, in which at least two sheet metal strips of different material quality and/or sheet metal thickness are welded to one another along the longitudinal edge in a continuous process. In order for the sheet metal strips produced by such a method to exhibit a relatively high level of weld seam strength, uncoated sheet metal strips are used in accordance with the invention as sheet metal strips to be welded. The tailor-made sheet metal strip formed of the uncoated sheet metal strips as a result of welding is then coated.Type: ApplicationFiled: November 16, 2009Publication date: March 15, 2012Applicant: THYSSENKRUPP TAILORED BLANKS GMBHInventors: Hans-Peter Vogt, Albrecht Krüger-Eppstein
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Publication number: 20120048913Abstract: A welding alignment and spacing article is provided for forming a welding gap between two structures to be welded together. The article includes a body having first and second surfaces that are spaced from each other at a selected spacing distance to define a region of selected body thickness. The body is formed from a non-metallic degradable body material in the region that can be wholly or partially degraded by exposure to a degrading agent to reduce the body thickness. The body is also formed from a non-degradable body material in the region. The degradable body material and the non-degradable body material are sufficiently incompressible to be useable as a spacer that maintains a specified welding gap distance between the two structures to be welded.Type: ApplicationFiled: August 26, 2010Publication date: March 1, 2012Inventor: Michael Hacikyan
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Patent number: 8113413Abstract: In various embodiments, a metallic structure includes first and second clad structures each comprising a protective layer disposed over a steel layer, a joint joining the steel layers of first and second clad structures, and, directly connecting the protective layers of the first and second clad structures, a layer of metal powder disposed in contact with (i) the joint, (ii) the protective layers of the first and second clad structures, and (iii) a portion of at least one of the steel layers proximate the joint.Type: GrantFiled: July 18, 2011Date of Patent: February 14, 2012Assignee: H.C. Starck, Inc.Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
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Publication number: 20110278264Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.Type: ApplicationFiled: July 21, 2011Publication date: November 17, 2011Applicant: Terumo Kabushiki KaishaInventors: Hiraku MURAYAMA, Akihiko Umeno, Jun Iwami, Yutaka Itou, Youki Aimi
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Patent number: 8056230Abstract: A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.Type: GrantFiled: February 2, 2005Date of Patent: November 15, 2011Assignee: Curamik Electronics GmbHInventor: Jürgen Schulz-Harder
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Publication number: 20110248072Abstract: Method and apparatus for coating a pipe (2) or a pipe section with a layer of at least one polymer. The method comprises providing a pipe (2) or a pipe section having an outer surface defining the periphery of the pipe or pipe section; applying on the outer surface of the pipe or pipe section a layer of at least one polymer material in melt stage using a nozzle (3), which is mounted on a carriage capable of travelling along the periphery of the pipe (2) or pipe section; and moving the carriage along at least a part of the periphery during the application of the polymer material to form a layer on the surface of the pipe (2) or pipe section. The outer surface of the pipe or pipe section is being locally heated by induction heating before the application of the polymer material onto said surface. The present invention is particularly useful for coating field joints in pipelines.Type: ApplicationFiled: October 23, 2009Publication date: October 13, 2011Applicants: BOREALIS AG, OY KWH PIPE ABInventors: Leif Leidén, Sven Sjöberg, Rauno Smått
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Publication number: 20110210158Abstract: A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.Type: ApplicationFiled: March 17, 2011Publication date: September 1, 2011Applicant: EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MGHInventors: HANS-PETER CASPER, HUBERTUS KOTTHOFF, JÖRG GUTOWSKI, DIETMAR CHAUCHET, LUDWIG WIERES
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Patent number: 8002169Abstract: In various embodiments, a method of joining clad structures includes providing first and second clad structures each comprising a protective layer disposed only partially over a steel layer such that an edge region of the steel layer is exposed, joining the first and second clad structures at their respective edge regions, thereby forming a joint, and cold spraying a metal powder over and in contact with (i) the joint, (ii) the edge regions, and (iii) the protective layers of the first and second clad structures, thereby directly connecting the protective layers of the first and second clad structures with a layer of unmelted metal powder.Type: GrantFiled: February 14, 2011Date of Patent: August 23, 2011Assignee: H.C. Starck, Inc.Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmerman
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Publication number: 20110193240Abstract: A first bonding material layer is formed on a first substrate and a second bonding material layer is formed on a second substrate. The first and second bonding material layers include a metal. Ions are implanted into the first and second bonding material layers to induce structural damages in the in the first and second bonding material layers. The first and second substrates are bonded by forming a physical contact between the first and second bonding material layers. The structural damages in the first and second bonding material layers enhance diffusion of materials across the interface between the first and second bonding material layers to form a bonded material layer in which metal grains are present across the bonding interface, thereby providing a high adhesion strength across the first and second substrates.Type: ApplicationFiled: February 5, 2010Publication date: August 11, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mukta G. Farooq, Zhengwen Li, Zhijiong Luo, Huilong Zhu
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Publication number: 20110186334Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.Type: ApplicationFiled: February 18, 2011Publication date: August 4, 2011Applicant: Semblant Global LimitedInventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith
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Publication number: 20110158572Abstract: The invention concerns a method for manufacturing a steel component (6, 11) comprising a first steel part (7) and a second steel part (8), the first (7) and second (8) steel part having a carbon content up to 1.5 weight percent, The method is comprising: Heating (1), at least partly, the first steel part (7), and at least partly, the second steel part (8), to above the alpha/gamma transformation temperature, and joining (2) the first steel part (7) and the second steel part (8) by welding, the welding taking place at a temperature above the alpha/gamma transformation temperature, and cooling (3) such that hardening effects are avoided. The invention further concerns weld seams (9), welded steel components (6, 11), and bearing components (11, 15, 20, 22, 26, 27, 31).Type: ApplicationFiled: July 10, 2009Publication date: June 30, 2011Inventors: Patrik Dahlman, John Van De Sanden
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Publication number: 20110139859Abstract: In a method of preparing an aluminum surface, flux is applied to the aluminum surface and the aluminum surface is brazed. Residual flux and metal oxides are removed from the aluminum surface using an aqueous fluid having a pH between about 5 and about 9.Type: ApplicationFiled: May 1, 2009Publication date: June 16, 2011Applicant: CARRIER CORPORATIONInventors: Mark R. Jaworowski, Jack Leon Esformes, Neal Magdefrau, Michael F. Taras
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Publication number: 20110120769Abstract: A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop. A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure.Type: ApplicationFiled: April 19, 2010Publication date: May 26, 2011Inventors: Shigeaki Sakatani, Akio Furusawa, Kenichiro Suetsugu, Taichi Nakamura
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Publication number: 20110101619Abstract: A MCrAlY alloy, methods to produce a MCrAlY layer and a honeycomb seal are provided. The MCrAlY alloy includes chromium, aluminum, yttrium and iron and optionally titanium, hafnium or silicon. The honeycomb seal includes a substrate, honeycomb cells and a protective coating on side walls of the honeycomb cells or a diffusion area inside side walls of the honeycomb cells, the protective coating or the diffusion area including the MCrAlY alloy.Type: ApplicationFiled: January 23, 2009Publication date: May 5, 2011Inventors: David Fairbourn, Paul Mathew Walker
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Publication number: 20110057017Abstract: The present invention is directed to a fluid conduit assembly. In accordance with one embodiment of the present invention, the inventive fluid conduit assembly includes a fluid conduit having an inlet, at least one outlet and a fluid flow passageway therebetween configured to allow for fluid to be communicated between said inlet and said at least one outlet. The inventive fluid conduit assembly further includes at least one damper disposed within the passageway of the fluid conduit. The damper includes a sealed vent configured to vent gases captured by the damper during a brazing process performed on the fluid conduit when unsealed.Type: ApplicationFiled: November 11, 2010Publication date: March 10, 2011Applicant: Millennium Industries CorporationInventors: MICHAEL J. ZDROIK, ROBERT J. DOHERTY
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Publication number: 20100288977Abstract: A component adapted to an environment exposed to corrosive species such as chlorine, which component has a substrate and a coating on the substrate configured to shield the substrate from erosion and corrosion. The coating is formed and metallurgically bonded to the substrate by nickel vapor depositing and hot isostatic pressing or by surface brazing. The coating is manufactured to form a dense layer consisting of a protective material that substantially reduces corrosion rate under the presence of the corrosive species.Type: ApplicationFiled: May 15, 2009Publication date: November 18, 2010Inventors: Mikko Uusitalo, Janne Nurminen
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Publication number: 20100282823Abstract: In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part.Type: ApplicationFiled: May 7, 2009Publication date: November 11, 2010Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: John C. Ulicny, Paul E. Krajewski, Mark A. Golden, Keith S. Snavely
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Publication number: 20100224673Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.Type: ApplicationFiled: March 9, 2009Publication date: September 9, 2010Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Masumoto
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Publication number: 20100210468Abstract: Provided is a method for joining two strands of second-generation high-temperature superconducting wire, each of which includes a substrate, a buffer layer, a superconducting layer and a stabilizer layer. The method comprises: partially removing each of the stabilizer layers to expose a portion of the superconducting layer; bringing the exposed portions of the superconducting layers into contact with each other and fixing the superconducting layers to each other; heating the strands of superconducting wire to the melting point of the superconducting layers to melt-diffuse the superconducting layers in contact with each other and to join the strands of superconducting wire together; and oxidizing the junction between the strands of superconducting wire in an oxygen atmosphere (‘oxygenation annealing’). The oxygenation annealing restores the superconducting properties of the superconducting wires lost during the melting diffusion.Type: ApplicationFiled: August 4, 2009Publication date: August 19, 2010Inventors: Haigun Lee, Jung-bing Song, Hyun Sung Kim, Na-young Kwon