Abstract: Disclosed is a double side cooled, pressure mounted semiconductor package and a method for the manufacture thereof. The package is formed by directly bonding upper and lower metal contact assemblies to an annular ceramic housing. Assembly is simplified if at least one contact assembly comprises two parts applied sequentially. An annular flange having a central opening approximately the size of the central opening in the annular housing and having an outside diameter larger than the outside diameter of the ceramic housing is direct bonded to one end of the housing simultaneously with a lower semiconductor contact. After a conventional semiconductor pellet is positioned in the housing, the second part, a metal contact disc with an outside diameter approximately equaling the outside diameter of the flange, is positioned thereover. Finally, the flange and the disc are welded around their peripheries.

Abstract: Processes and compositions for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strontium, barium and antimony. The solder may be used with or without flux.

Abstract: A method of repairing an under water pipeline from which a defective or damaged length of pipe has been cut away to form longitudinally spaced-apart, exposed, pipe ends which method includes the steps of:(a) butt-welding to each exposed pipe end a tubular end portion of a hollow, open-ended member having an inner or outer part-spherical mating surface;(b) butt-welding a sleeve to one end of a length of replacement pipe;(c) mounting on the sleeve a tubular end portion of a hollow open-ended member which has a part-spherical mating surface complementary to that of one of the open-ended members butt-welded to the exposed pipe ends and which is adapted to form therewith a ball-and-socket coupling;(d) welding to the other end of the replacement pipe a tubular end portion of a hollow open-ended member which has a part-spherical mating surface complementary to that of the other of the members butt-welded to the exposed pipe ends and which is adapted to form therewith a ball-and-socket coupling;(e) positioning the re

Abstract: A process for producing a thick film circuit with terminal elements on an inorganic substrate. A paste of silver powder, copper oxide powder and organic bonding agent is silk screen printed on an inorganic substrate, dried and sintered. Then over preselected locations along individual conductor paths terminal elements are hard soldered. The conductor paths are strongly adhered to the inorganic substrate and the terminal elements are likewise strongly adhered to the individual conductor paths.

Abstract: An apparatus and method for concentrically and radially aligning and welding together two tubular metal components, such as a metal pipe or tubing, and a tubular flanged member, or two or more metal pipes or tubings.

Abstract: Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.

Abstract: A pair of insulating substrates are maintained at a definite spacing, at least one of the substrates being transparent and provided with transparent electrode, the periphery of the substrates is sealed except a liquid crystal inlet opening to form a cell, a liquid crystal is filled into the cell and the opening is sealed with a molten solder in an inert atmosphere.

Abstract: An automated apparatus for sequentially forming integrally fused battery terminals on a plurality of storage batteries is described wherein a head means having a mold means adjustably mounted thereon is automatically movable with respect to a vertical axis, and has slidably mounted thereon a burning means for automatically producing a variable-intensity flame for melting said battery elements to form said integrally fused battery terminal during a vertical stroke thereof. An automated post burn station is further described having a conveyor means for advancing batteries sequentially to said burning station and for aligning said batteries with respect to said station for the above described fusing process. A plurality of novel sensors incorporated into the automated post burn station facilitates the rapid, automatic processing of batteries, while providing a high degree of safety and reliability.

Abstract: Nickel-chromium-silicon steel electrode for arc welding provides maraging stainless steel weld deposits having desirable strength, toughness and corrosion resistance in age-hardened condition. Electrode arc can be shielded with inert gas or with lime-cryolite-titania flux containing specially controlled proportions of manganese.

Abstract: Copper alloy carrier objects are brazed to silver or copper alloy contact objects by assembling or positioning the carrier object into direct contact with said contact object such that there is defined or presented an exposed position or junction where said carrier object and said contact object come into direct contact, then placing at said position or junction a quantity, such as a pellet or piece, of a brazing alloy and subjecting the resulting assembly to furnace brazing at an elevated temperature for a sufficient period of time in a non-reactive gaseous atmosphere to cause said brazing alloy to melt and to join and braze together said carrier object and said contact object.

Abstract: A thermally and electrically conductive metal lead member is joined to the refractory metal contact member of a semiconductor device using a brazing alloy comprising on a weight basis about 80-89 percent copper, about 5-15 percent silver, and about 4-6 percent phosphorus. The contact member/semiconductor joint may be formed in an inert atmosphere at the same time and at the same temperature as the contact member/lead member joint.