Abstract: The inventive method of manufacturing a cryoprobe uses an assembly pin (25) for receiving a sleeve (20) that is to form a part of the head (13) of the cryoprobe and comprises three abutment surfaces (27, 29, 30) that are axially offset relative to each other, said abutment surfaces ensuring, following the attachment of the sleeve (20) and the nozzle (24) to the tube end (19), the correct axial positioning of the nozzle (24) and the sleeve (20), in particular, relative to the distal end surface (18) of the tube end (19). Consequently, the position of the nozzle (24) in the expansion chamber (23) that formed after the sleeve (20) was closed and thus the function of the cryoprobe are ensured.

Abstract: A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.

Abstract: A solder includes zinc as a main component and the solder contains 6 to 8 mass percent of indium. A solder includes zinc as a main component, wherein the solder contains only indium. In a die-bonding structure in which a semiconductor chip is connected to a bonded member by a solder, the solder made of zinc as a main component and contains indium.

Abstract: A multi-component braze filler alloy comprising 60-70% by weight CM247 superalloy and BRB braze alloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. The substrate/braze interface may be subsequently weld-repaired without de-melting and migrating the braze alloy from the interface. The weld zone and surrounding area are solidification crack resistant. After the alloy composition is brazed to the base substrate the component may be returned to service. Thereafter the component remains repairable by welding or re-brazing, if needed to correct future in-service defects.

Abstract: A multi-component braze filler alloy comprising at least 70% by weight MarM509A superalloy with the remainder MarM509B superalloy is diffusion brazed to a CM247 alloy base substrate, such as a gas turbine blade or vane. It is shown that generally higher braze temperatures lead to improved results including the possibility of re-welding such a brazed component, resulting in a re-repaired brazed component capable of continued commercial service.

Abstract: A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site.

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract: The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.

Abstract: The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.

Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: An aluminum alloy material contains Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mm2 or more to 7×105 pcs/mm2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 ?m are present in a cross-section of the aluminum alloy material, while 100 pcs/mm2 to 7×105 pcs/mm2 of Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 ?m are present in a cross-section of the aluminum alloy material. An aluminum alloy structure is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material to a total mass of the aluminum alloy material is 5% or more and 35% or less.

Abstract: A bonded body made of an aluminum alloy and a copper alloy and obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one bonded member and the other bonded member being bonded to each other through metallic connection, wherein the one bonded member is made of comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and unavoidable inevitable impurities, and satisfying the chemical formula: C+2.4×S?7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition concentration is satisfied, and the other bonded member comprises a copper alloy having a higher solidus temperature than the one bonded member. A bonding method for the bonded body is provided.

Abstract: A downhole tool and method for manufacturing such downhole tool. The downhole tool includes a bit body having a blank and a matrix bonded to and surrounding the blank, a shank having a threaded connection at one end, and a butt joint formed within a gap formed between the blank and the shank and coupling the blank to the shank. The blank includes a first planar surface while the shank includes a second planar surface opposite the one end. The butt joint is formed between the first and second planar surfaces when positioned adjacent to one another, wherein the first planar surface is positioned external to the matrix.

Abstract: A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.

Abstract: A fan blade includes first and second titanium portions that are secured to one another with an aluminum alloy braze. A method of manufacturing a fan blade includes providing first and second titanium portions, applying an aluminum alloy braze to at least one of the first and second titanium portions, and heating the fan blade to melt the aluminum alloy braze and join the first and second portions to one another to provide a fan blade with an airfoil exterior contour.

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Abstract: In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of which is larger than the outer diameter of the backing tube; (c) arranging the sputter target about the backing tube; and (d) bonding the sputter target to the backing tube by providing a solder layer between the backing tube and the sputter target; In accordance with the invention step (d) comprises directionally solidifying the solder layer.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: A method of bonding two members including an aluminum alloy material as one member, and an aluminum alloy material or a pure aluminum material as the other member, the method being characterized in: that the aluminum alloy material for the one member and the aluminum alloy material for the other member are composed of an aluminum alloy containing Mg of not more than 0.5 mass %; and that a bonding process is carried out in a furnace having a non-oxidizing atmosphere at a temperature, at which a ratio of a mass of liquid phases generated in the aluminum alloy material defined as the one member to the total mass of the aluminum alloy material falls within a range from 5% to 35%, on the condition that there is either a coated fluoride-based flux or a coated chloride-based flux between both of the members to be bonded.

Abstract: An electronic device manufacturing apparatus is disclosed. The electronic device manufacturing apparatus includes a vacuum chamber, a support part, a moving part, and a heating part. The support part is located in the vacuum chamber and has a first placement surface on which a first member is to be placed. The moving part is located in the vacuum chamber and has a second placement surface on which a second member is to be placed. The moving part is movable between a first position where the first placement surface and the second placement surface do not face each other when seen in plan view and a second position where the first placement surface and the second placement surface face each other when seen in plan view. The heating part heats the first member and the second member.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.

Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.

Abstract: A brazing process, a braze assembly, and a brazed article are disclosed. The brazing process includes applying a braze material to an article within a vacuum chamber while the vacuum chamber is substantially evacuated. The braze assembly is capable of applying a braze material to an article within a vacuum chamber while the vacuum chamber is substantially evacuated. The brazed article is devoid of re-formed oxides.

Abstract: A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.

Abstract: Laminate armor and methods of manufacturing laminate armor. Specifically, laminate armor plates comprising a commercially pure titanium layer and a titanium alloy layer bonded to the commercially pure titanium outer layer are disclosed, wherein an average thickness of the titanium alloy inner layer is about four times an average thickness of the commercially pure titanium outer layer. In use, the titanium alloy layer is positioned facing an area to be protected. Additionally, roll-bonding methods for manufacturing laminate armor plates are disclosed.

Abstract: A method for repairing a gas turbine engine component includes applying a braze slurry to a first portion of the component, applying a pre-sintered preform to a second portion of the component that is different than the first portion, and brazing the component.

Abstract: A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Abstract: In certain embodiments of the present disclosure, a refrigerator is described. The refrigerator includes an inner liner defining a storage compartment. The refrigerator further includes an outer wall forming a vacuum insulation panel. The outer wall defines a hermetically sealed vacuum compartment wall. The compartment includes filler insulating material and is evacuated of atmospheric gases. The compartment is located between the outer wall and the inner liner.

Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

Abstract: Laminate armor and methods of manufacturing laminate armor are disclosed. Specifically, laminate armor plates comprising a commercially pure titanium layer and a titanium alloy layer bonded to the commercially pure titanium outer layer are disclosed, wherein an average thickness of the titanium alloy inner layer is about four times an average thickness of the commercially pure titanium outer layer. In use, the titanium alloy layer is positioned facing an area to be protected. Additionally, roll-bonding methods for manufacturing laminate armor plates are disclosed.

Abstract: Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.

Abstract: A device for controlling the temperature of an energy store is provided. The device includes a contact element having a contact area for providing a thermal coupling to the energy store, a fluid channel, which is arranged in the contact element, and an insulating apparatus, which is arranged in the contact element.

Abstract: A method of brazing a top loading cutter into a cutter pocket is disclosed, wherein the method includes placing at least one braze disc between an inner wall of the cutter pocket and a portion of the top loading cutter and heating the at least one braze disc to a temperature above the melting temperature of the braze disc.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.

Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.

Abstract: A method of fabrication of a rocket engine nozzle assembly using pressure brazing generally includes initially assembling a rocket engine nozzle liner into a rocket engine nozzle jacket for a rocket engine nozzle assembly. The rocket engine nozzle assembly may then be sealed. Prior to pressure brazing the rocket engine nozzle assembly, pressure brazing parameters may be determined. The pressure brazing may be performed with the determined pressure brazing parameters to complete the fabrication of the rocket engine nozzle. The rocket engine nozzle assembly may include a rocket engine nozzle jacket and a rocket engine nozzle liner having a plurality of channels, with the space between each channel defining a land, and the rocket engine nozzle liner having at least a pair of endlands disposed at each end thereof. The rocket engine nozzle liner is bonded to the rocket engine nozzle jacket by the endlands being bonded to the nozzle jacket and the lands being pressure brazed to the nozzle jacket.

Abstract: The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.

Abstract: A brazed aluminum counter-flow heat exchanger particularly suited for use in Ocean Thermal Energy Conversion is produced by assembling and welding subassemblies of corrugated fins that were previously vacuumed brazed in a stacked group. After the brazing operation, the stacked group of subassemblies are later separated and rearranged to create a subsequent stack of alternating layers of corrugated layers and layers having wide open saltwater passageways. To complete the unit, a friction stir welding process provides final exterior weld seams that penetrate to the internal saltwater passageways in the heat exchanger. The full weld penetration eliminates corrosion-conducive crevices at the welded joints, thus making the aluminum heat exchanger suitable for saltwater use.

Abstract: A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.

Abstract: A brazing sheet material for CAB brazing without applying flux. The brazing sheet material including an aluminum core alloy layer provided with a first brazing clad layer material on one or both sides of the aluminum core layer and at least one second brazing clad layer material positioned between the aluminum core alloy layer and the first braze clad layer material. The second brazing clad layer material is an Al—Si alloy brazing material having 5% to 20% Si and 0.01% to 3% Mg, and the first brazing clad layer material is an Al—Si alloy brazing material having 2% to 14% Si and less than 0.4% Mg. Also disclosed is a brazed assembly manufactured in a brazing operation.

Abstract: Apparatus and method for purging atmospheric air from a chamber with a gas including means for generating a substantially non-turbulent, laminar flow front of the gas into the chamber with minimal turbulence to displace the atmospheric air in the chamber, the chamber having exhaust means associated therewith to permit the displaced atmospheric air to exit the chamber. The chamber is preferably a welding chamber and the gas is preferably argon.

Abstract: An X-ray target assembly includes a substrate, a target supported by the substrate adapted to generate X-rays when impinged by an electron beam, and an enclosure over the target providing a volume for the target. The enclosure is made of a material substantially transparent to electrons. The volume is substantially vacuum or filled with an inert gas.

Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).

Abstract: A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.

Abstract: The invention relates to a coated boron or nitrogen containing superhard abrasive material selected from cBN, boron suboxide and boron carbide comprising: cBN, boron suboxide and/or boron carbide superhard abrasive material substrate; a primary layer of a carbide/nitride/boride forming metal, such metal preferably being Ti and preferably being substantially in the form of the carbide, nitride or boride; a secondary layer of a high melting point metal selected from W, Mo, Cr, Ni, Ta, Au, Pt, Pd and alloys thereof; and an overcoat of Ag, Ni, Cu, Au, Pd, Pt, Rh, Os, Ir, Re, combinations and alloys thereof such as bronze (Cu/Sn), silver/bronze and silver/tin, the metal of the secondary layer being different to the metal of the overcoat. The invention further relates to methods for the manufacture of such material, use of such materials in tools and tools including such material.

Abstract: The invention relates to a coated diamond comprising a diamond substrate; a primary carbided layer of a carbide forming element; a secondary layer of a high melting point metal selected from W, Mo, Cr, Ni, Ta, Au, Pt, Pd or any combination or alloy thereof, the secondary layer being substantially free of carbide forming element from the primary layer; and an overcoat of Ag, Ni, Cu, Au, Pd, Pt, Rh, Os, Tr, Re, any combination or alloy thereof, the metal of the secondary layer being different to the metal of the overcoat. The invention further relates to methods for producing such coated diamonds and abrasive-containing tools including such coated diamonds.