Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: The present invention relates to a brazing material comprising an alloy containing essentially of: 15 to 30 wt % chromium (Cr); 0.1 to 5.0 wt % manganese (Mn); 9 to 20 wt % nickel (Ni); 0 to 4.0 wt % molybdenum (Mo); 0 to 1.0 wt % nitrogen (N); 1.0 to 7.0 wt % silicone (Si); 0 to 0.2 wt % boron (B); 1.0 to 7.0 wt % phosphorus (P); optionally 0.0 to 2.5 wt % of each of one or more of elements selected from the group consisting of vanadium (V), titanium (Ti), tungsten (W), aluminum (Al), niobium (Nb), hafnium (Hf) and tantalum (Ta); the alloy being balanced with Fe, and small inevitable amounts of contaminating elements; and wherein Si and P are in amounts effective to lower melting temperature. The present invention relates further to a method of brazing, a product brazed with the brazing material.

Abstract: The invention relates to a surface of an object, especially a heat exchanger, e.g. a lateral part, a wavy rib, or a tube of a heat exchanger, which is to be soldered by means of a flux layer (2). In order to improve the properties of the surface that is to be soldered, said surface is provided with at least one more layer (3; 13, 16) in addition to the flux layer (2). The at least one more layer (3; 13; 16) contains an additive which modifies the surface to be soldered, said additive being reacted in order to modify the surface when the surface that is to be soldered is soldered.

Abstract: The welding of a tight envelope is performed in two stages (8, 9), with an intermediate sucking up by an appendage with holes (6, 7) to create a vacuum in an envelope and strengthen the insulation offered by the interlining (1). When the second weld (9) has been performed, the appendage having the hole may be withdrawn. An electric resistance seam weld is preferable. One can thereby use welding procedures under atmosphere and weld metallic envelopes.

Abstract: A vacuum insulation tube assembly which is utilized as a component in a cryosurgical probe. The vacuum insulation tube assembly includes an inner tube; and, an outer tube concentrically positioned about the inner tube. The outer tube is securely soldered at end portions of the inner tube and forms a vacuum space between the inner tube and the outer tube. The vacuum tube assemblies may be conveniently mass produced using a special fixture.

Abstract: A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 ?m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 ?m thick, and a second layer of gold, 2.54 ?m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

Abstract: A method for brazing two or more of stainless steel components for use in medical equipment, in which one component is joined to other component using a brazing material containing Au of which amount is 62.5 wt % or higher, the method comprising the steps of: a first step in which the components are subjected to a heat treatment at a temperature of 1,050 to 1,200° C. in a hydrogen containing atmosphere or in a vacuum; a second step in which one of the components is allowed to close to the other component so as to form a gap therebetween; and a third step in which the brazing material in a molten state is supplied into the gap to join the components together to manufacture a metal assembly. The joint portions formed in the metal assembly have excellent chemical resistance and corrosion resistance, and thus the metal assembly is suitably used in an endoscope.

Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Abstract: A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber.

Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.

Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.

Abstract: After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.

Abstract: A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 ?m, and an interlayer of a refractory metal-copper-composite. The refractory metal-copper-composite has a macroscopically uniform copper and refractory-metal concentration progression and a refractory metal concentration of between 10 vol. % and 40 vol. % over its entire thickness.

Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: A vacuum brazing method is disclosed for joining aluminum stock materials to each other. The typical cladding material utilized includes aluminum and a melting point lowering agent such as silicon. In addition, the cladding material typically includes magnesium to provide for enhanced wetting of the cladding material into the joint area. It has been found that adjusting the ratio of magnesium to calcium to a level of equal to or greater than 625 to 1 provides greatly enhanced brazed joint formation and reliability of the vacuum brazing method.

Abstract: A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.

Abstract: A method of fabrication is adapted to weld paired metal plates, particularly fuel cell bipolar plates, using a partial vacuum to hold the paired metal plates together during the welding process. Each bipolar plate has a plurality of contact surfaces for joining the paired metal plates. The contact surfaces of a first plate are co-aligned with contact surfaces of a second plate. An outer perimeter and a plurality of reactant gas channels and ports of each plate pair are sealed to form a sealable interior volume. A partial vacuum is drawn in the interior volume to clamp each plate pair together at the contact surfaces and a weld joint is made between at least a plurality of the contact surfaces. Laser welding is preferably used for its ability to fuse the contact surfaces together without perforating the plates and thereby losing the partial vacuum.

Abstract: A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace for brazing the materials. Heated gas produced in the pre-heat section and the brazing furnace is conveyed along a flowpath to the chamber of the dry-off oven to provide substantially the sole source of heat for the oven. The flowpath for the heated gas is defined by a series of tubes in communication with each component of the brazing system and intermediate manifolds disposed between components. The discharge mouths of the tubes open into the oven chamber at the suction side of recirculation fans operating within the oven. The overall temperature of the oven can be regulated by controllably mixing ambient air with the heated gas in relation to the oven temperature.

Abstract: The aim of the present invention is a process for manufacturing a plated product (1) comprising a support part in steel (2) and an anticorrosion metallic coating (3), characterized in that the anticorrosion coating (3) is fixed on the support part (2) by controlled-atmosphere brazing, in particular by vacuum brazing. The process according to the invention makes it possible to fix solidly an anticorrosion coating with a thickness smaller than 1 mm on a steel plate.

Abstract: A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for closing an end of the cylindrical wall. A workpiece handling system is mounted on the pressure vessel door for supporting a metallic workpiece to be heat treated or brazed. The workpiece handling system includes apparatus for rotating the workpiece during a processing cycle. A vacuum system is connectable to the workpiece for creating a subatmospheric pressure inside the workpiece during a brazing cycle.

Abstract: The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet arranged between the parallel plates and/or sheets, wherein the corrugated aluminium stiffener sheet is an aluminium brazing sheet product made from an aluminium brazing sheet product including a core sheet (1) made of an aluminium alloy having on at least one surface of the core sheet clad, and preferably on both sides, an aluminium clad layer (2), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, preferably 5 to 14%, and a layer (3) comprising nickel on the outer surface of the aluminium clad layer. The invention further relates to a method of manufacturing thereof.

Abstract: A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: A method for producing a laminated metal ribbon comprises the steps of (a) vapor-depositing a third metal layer on at least one welding surface of a first metal ribbon 4 and a second metal ribbon 5 in a vacuum chamber 1, the third metal being the same as or different from a metal or an alloy of the first and second metal ribbons 4, 5; (b) pressure-welding the first metal ribbon 4 to the second metal ribbon 5; and (c) subjecting the resultant laminate 9 to a heat treatment for thermal diffusion.

Abstract: A brazing sheet product having a core sheet (1) made of an aluminium alloy, having one or both of the surfaces of the core sheet clad with an aluminium clad layer (2), and a layer (3) comprising nickel on the outersurface of one or both the aluminium clad layer or layers (2). There is a layer (4) comprising zinc or tin as a bonding layer between the outersurface of the aluminium clad layer or layers (2) and the layer (3) comprising nickel. The aluminium clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0, impurities each up to 0.05, total up to 0.20; and balance aluminium.

Abstract: A brazing sheet product and a method of manufacturing a brazing sheet product in which a layer comprising nickel is plated onto a surface of a clad layer made of an aluminium-silicon alloy containing silicon in the range of 2 to 18 weight %, wherein the surface is pre-treated by application of a bonding layer comprising zinc or tin. The application of the bonding layer may be by a zincate or a stannate treatment. The use of lead to promote wetting during brazing can be reduced or avoided, or other elements such as bismuth can be used.

Abstract: An induction heating system that can be used to braze metals and that overcomes many of the disadvantages of conventional brazing systems. The induction heating system improves quality and lowers production cost for many brazing requirements. The system is designed to quickly, accurately and cost effectively heat individual parts, and to replace flame brazing procedures and batch vacuum furnaces. Because the system can braze parts in an inert atmosphere or in no atmosphere (e.g., in a vacuum), no flux or acid cleaning bath is necessary and oxidation on the part is eliminated. Further, by including a gas quenching feature, the system prevents the annealing of parts and produces high quality brazed parts that meet desired hardness specifications.

Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.

Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.

Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.

Abstract: Fabrication techniques for an integrated sputtering target assembly include pressure assisted bonding of soldered layers of material, in particular, soldering of the target material to its backing plate; pressure assisted curing of structural adhesives used to join a finned cover plate to a backing plate which between them form passages for fluid cooling; and bonding an electrical insulating layer to the back surface of the backing plate. The pressure to assist in bonding is typically applied by an autoclave. The cooling fluid passages disposed between a cover and a finned backing plate can be sealed by using laser welding or electron beam welding rather than closing the cooling passages with structural adhesives.

Abstract: According to the present invention, an insert material is laid between metal beryllium and copper alloy, wherein the insert material has the minimum, solidus temperature of not lower than 870° C. to the metal beryllium and copper alloy, respectively, and a single diffusion bonding process is performed under the condition that the temperature is not lower than 850° C. and less than the minimum solidus temperature, and the pressure is 20 to 30O MPa, so that the metal beryllium, copper alloy and stainless steel can be effectively bonded without deterioration of corrosion resistance for sensitizing of the stainless steel.

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position.

Abstract: A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density core aluminum and aluminum alloy parts can be formed according to the method of the invention. The method of forming low density core metal parts generally comprises the steps of providing a porous, foam metal core and simultaneously pressure bonding first and second solid metal face sheets directly to opposite sides of the core and densifying the core by applying heat and uniaxial forge pressure to the first and second face sheets and to the core for a predetermined period of time. The method of the invention can therefore produce LDC parts having a predetermined shape and density. Furthermore, the LDC parts are less subject to interfacial oxidation and delamination than conventional LDC parts made by brazing.

Abstract: A big scale (500 cc) golf club head fabrication method includes the step of preparing molds for making a top cover panel, a bottom cover panel and a face panel, the step of preparing metal alloy plate materials and then cutting the metal alloy plate materials into the desired sizes and then using the molds thus obtained to forge the metal alloy plate materials into the desired top cover panel, bottom panel and face panel respectively, and the step of welding the obtained top cover panel, bottom panel and face panel in a vacuum tank to form a golf club head and then polishing the golf club head into a finished product.

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract: A vacuum package (20) is fabricated by providing a package base (22) with a device (32) affixed to the interior of the package base (22), and a package lid (42). An activatable getter material (54) is deposited onto a preselected region of either the interior (48) of the package lid (42) or that portion of the package base (22) which does not have the device (32) affixed thereto. The deposited getter material (54) is deposited at a temperature such that it is activated during deposition. The vacuum package lid (42) is sealed to the vacuum package base (22). The steps of depositing and sealing are conducted in an evacuated vacuum chamber without exposing the interior to atmosphere.

Abstract: A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Abstract: A sputtering target assembly is fabricated by diffusion bonding a target material plate to a backing plate. The plates are cleaned in a vacuum environment, and an interlayer is formed on one or more of the plates. The plates are then joined under heat and pressure, before an oxide layer can form on the joining surfaces of the plates. The plates may be sequentially processed through cleaning, interlayer deposition, and bonding chambers, all with vacuum environments, to form the finished part, or, a single chamber may be used to provide the cleaning, interlayer deposition and bonding functions.

Abstract: This invention relates to a method for producing a metallic catalyst carrier used for a catalytic convertor for an automobile, for example, and calcines a metallic catalyst carrier element obtained by alternately winding or laminating metallic plates in vacuum, and in integrally combining the connecting parts of the metallic plates by diffused junction, the metallic catalyst carrier element being calcines at 1200.degree. C. or above and a pressure of 1 Pa to 10 Pa, preferably l.5 Pa to 10 Pa, to obtain a strong metallic catalyst carrier having oxidization resistance.

Abstract: A method for producing a metal structure, in particular a honeycomb body, especially for a catalytic converter, from at least partly structured, wound, intertwined or stacked sheet-metal layers, includes cleaning the structure in a vacuum in a cleaning chamber, transferring the structure to a process chamber, carrying out a connecting process which may be a brazing operation, transferring the structure to a cooling chamber, and cooling the structure to a predetermined temperature in a vacuum in the cooling chamber. The method is preferably carried out in a three-chamber apparatus and enables shorter production cycles, more economical use of energy, and favorable variation of the surface properties of honeycomb bodies, as compared with previous methods.

Abstract: A cryogenic surgical instrument and method of manufacturing the same are described. The instrument is a cryosurgical probe having concentrically arranged cryogenic fluid supply and return tubes extending through a concentric handle portion into a closed end probe shaft wherein the handle portion and a substantial length of the probe shaft are evacuated to provide a layer of thermal insulation between the cryogenic fluid supply and return tubes and the exterior of the instrument. All the parts of the probe structure are joined by vacuum brazing method carried out in an evacuated furnace. The method involves assembling the probe parts into sub-assemblies which are vacuum brazed at a temperature of at least about 1000.degree. F. and a vacuum of at least about 1.times.10.sup.-3 Torr. The sub-assemblies are then assembled into the final probe assembly which is likewise vacuum brazed.

Abstract: An aluminum brazing alloy composite sheet is provided which can be utilized in both the vacuum brazing process and the controlled atmosphere brazing process for the brazing of aluminum parts. The brazing alloy composite sheet consists of an aluminum core alloy of the 3XXX, 5XXX or 6XXX type clad at least on one major surface with a lithium-containing aluminum filler alloy containing from about 0.01% to about 0.30% by weight lithium. The core alloy may contain up to about 2% by weight magnesium and is suitable for producing aluminum alloy heat exchanger assemblies, such as radiators or evaporators.

Abstract: The invention relates to a method for soldering electronic components to printed circuit boards or other elements to be connected by soldering, as well as suitable continuous soldering systems. The use of electronic modules, designed in the form of printed circuit boards populated with pluggable, mountable, or surface-mountable electronic components (Surface Mounted Devices, SMDs), which must be then soldered, is growing steadily. To manufacture these modules, suitably prepared printed circuit boards are populated with the corresponding components, the latter are held in place possibly with an adhesive or soldering paste in preparation for the soldering process, and finally the printed circuit boards and the components are connected together permanently and conductively by a soldering process. This soldering process is performed under low pressure and under the plasma action of a special process gas.

Abstract: Disclosed is a process of preparing a composite wire which comprises sealing one end of a pipe to be employed as a jacket, inserting a bar to be employed as a core into the pipe and conducting a hot processing of the pipe while vacuum-sucking the pipe from the other end thereof. In accordance with the present invention, the strength of the resulting composite wire is sufficient, and the number of operations can be reduced, that is, the wire can be prepared under the excellent workability and productivity.

Abstract: A vacuum furnace for brazing aluminum with brazing metal containing magnesium in which evaporated magnesium in the furnace is oxidized before aluminum members having been brazed are taken out, and/or the temperatures of a movable wall serving to control the communication between a vacuum pump and a heating chamber during heating and of an inner surface of the heating chamber are maintained at above a specified temperature at which evaporated magnesium does not adhere, and/or a heating member which is to be excited electrically and electrodes used for electrically exciting the heating member, which are the constituents of a heater for heating the aluminum members and the brazing metal, are hermetically sealed and insulated from the inside of the heating chamber.

Abstract: A desired environment is entrapped inside a hollow workpiece by placing a meltable filler adjacent a plurality of capillaries in the wall of the workpiece. The workpiece is then placed in the desired controlled environment (e.g. a vacuum). The workpiece is then heated to melt the filler material which then through capillary action flows into and closes all of the capillaries thereby entrapping the controlled environment within the workpiece.

Abstract: An alloy for brazing ceramics has the following composition, in weight percent: 0.5 to 3% titanium; 0.25 to 2% aluminum, silicon or tin; 2 to 6% copper; balance silver.

Abstract: A process is disclosed of explosive bonding two or more components together by forming the components into a stack, placing the stack into an envelope made of a deformable material, sealing the envelope except for an evacuation port, evacuating the interior of the envelope through the said port and subjecting the stack to explosive bonding within the envelope, thereby joining the components together; by conducting the explosive bonding in an evacuated envelope, not only are the components protected from damage during the explosion but the bonding is enhanced due to the reduced pressure of air between the components. After bonding, the stack can be subjected to superplastic forming.