Abstract: The present invention relates to a temperature-control unit for a furnace device for heat treating a plate, in particular a metal plate. The temperature-control unit has a temperature-control body, which is arrangeable in a furnace chamber of the furnace device. The temperature-control body has a plurality of receiving bores. Furthermore, the temperature-control unit has a plurality of temperature-control pins, wherein the temperature-control pins are mounted in the receiving bores movably relative to the temperature-control body. The temperature-control pins are controllable in such a way that a temperature-control group of the temperature-control pins is extendable from the temperature-control body in the direction towards the plate, so that a thermal contact between the temperature-control group of the temperature-control pins and a predetermined temperature-control zone of the plate is generatable.

Abstract: The present invention provides a simple, cost effective and hassle-free method and apparatus for modifying the surface grain structure of the material, thereby providing a material with multi-modal grain structure having high strength and good formability. The present invention uses a single step processing technique known as submerged static friction stir processing for modifying the surface grain structure of the material, thereby generating a multi-modal grain structure. In the present invention since the working material is completely immersed in the coolant, this maintains the working temperature of the system. Further the present invention does not involve long processing steps and do not need any specialized equipments.

Abstract: Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule. By filling a molten bonding material in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling, a cylindrical ceramic sputtering target is manufactured so as to be characterized in that as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less.

Abstract: A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys.

Abstract: A method for producing a shell-shaped component and a production system for producing such a component are disclosed. Thee component is produced by a cold gas stream by cold gas spraying. The particles of the cold gas stream are applied to the edge of the component being produced, wherein simultaneously a supporting body is used, which supports the component only at the point of incidence of the cold gas stream. In this way, the form of the component can be shaped by suitably moving the supporting body and the cold spray nozzle, without having to produce a core that fills the entire volume of the shell-shaped component. Thus, the method may be especially economical for small quantities, because the supporting body can be used universally for components of different geometries.

Abstract: A system and method for radially expanding hollow cylindrical objects, through the use of a tube expansion tooling, affixing a mandrel in place, the tooling rendered operative through the generation of hydraulic pressure, to provide the axial force necessary for pulling of the mandrel into the tool, and the mandrel having concentrically applied thereon various spacers, cams, and curved segments, which when the drawbar of the mandrel is pulled, manual forces are generated through the cams and segments into an expansion capacity to force the expansion of any tube in which the mandrel locates, to be expanded into a tight binding fit within a tube sheet or any other bore hole formed in equipment.

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.

Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.

Abstract: A laser welding system includes a free-spacing beam delivery laser head having a linear array of at least two laser diodes. Each of the diodes generates a laser beam of a predetermined wavelength and spectral width, the laser beams adapted to weld a workpiece having a first component and at least one other component to be welded to the first component, the first component being substantially transmissive to the wavelength, the other component being substantially absorptive of the wavelength. A lens is spaced a predetermined distance from each of the laser diodes, each of the lenses adapted to focus the respective laser beam into a focused laser beam segment, thereby forming a continuous line of laser energy from a substantially serial combination of each focused laser beam segment. The continuous line of laser energy is in a plane containing the workpiece, and is substantially orthogonal to the workpiece translation direction.

Abstract: A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.

Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed.

Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: A method for the subsequent treatment of welded connections is shown and described. The object of providing a method for the subsequent treatment of a weld by which the tensile stresses in the region of the weld are reduced is achieved by applying a top layer to the weld on a workpiece by cold-gas spraying.

Abstract: A method and apparatus for welding a first workpiece to a second workpiece having a first surface to be chrome plated welds a heat sink liner to a second surface of the second workpiece opposite the first surface. The first surface of the second workpiece is them chrome plated. The first workpiece is then welded to the second workpiece at the heat sink, which absorbs a substantial amount of heat generated by the weld before that heat can reach the chrome-plated second surface.

Abstract: A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling apparatus of each tweezer member includes a pair of heat dissipating tubes that travel in an associated tweezer member, with distal ends thereof in fluid communication with an associated soldering head, and with a proximal end of one thereof fluidly communicating with a fluid source. A crossover tube fluidly communicates the proximal end of one tube of one tweezer member with the proximal end of one tube of the other tweezer member.

Abstract: A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Abstract: A non-woven weld blanket for protecting automobile exteriors and interiors and industrial equipment from weld spatter, comprising a needle punched webbing of pre-oxidized, polyacrylonitrile (PAN) fibers. The fabric is assembled using these carbon precursor fibers that have been interlocked by a needle punch process to produce a non-woven and non-plush blanket. The weld blanket is lightweight and is successful at a cost-effective thickness and density. In use, the blanket can be taped to automobile components or industrial equipment to ensure the security and protection of equipment from molten metal spatter near welding locations.

Abstract: A cooling fin structure is constructed by a thermally conductive sheet bent to form a heat radiation part and a welding part. The welding part is formed with a vacant region, which is defined by notches, openings or a slot, and the thermally conductive sheet is welded to a substrate through the welding part.

Abstract: A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.

Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.

Abstract: A heater is secured to a cooling device in a reflow oven by a bracket comprising a first portion attached to a supporting structure, such as the cooling device itself, and a second portion extending over the heater. A member, preferably a screw, extends through the second portion of the bracket, against the heater. The first portion of the bracket is preferably attached to the cooling device by a screw. The bracket is preferably a stiff material such as aluminum. In addition, the duty cycle of a plurality of heaters on a plurality of respective cooling devices is controlled by a thermocouple on the cooling device closest to the exit of the reflow oven.

Abstract: A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the circuit board is cooled or

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: A method and apparatus for friction stir welding that produces a weld of significantly reduced surface roughness at significantly higher welding rates, in materials that are difficult to weld, such as non-extrudable aluminum alloys. The method includes cooling the stir welding tool during the welding process, thereby reducing the tendency of softened metal to adhere to the rotating pin and shoulder of the tool. The apparatus includes a tool with internal spaces or an external jacket, through which coolant can be pumped to remove heat and cool the tool during welding operations. In another embodiment, the apparatus includes a device for spraying a coolant onto exterior surfaces of the distal end of the welding tool to thereby remove heat from the tool, and the surrounding workpiece, during welding.

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be soldered in such a manner as to suppress a hot wind tending to turn around to a part setting surface to diminish the thermal energy loss as well as to prevent the circuit quality from being lowered by the solder.

Abstract: A heat sink made of aluminum having both high strength and heat dissipation performance together is manufactured. In a method of manufacturing a heat sink made of aluminum by brazing a plurality of fins 13 on a heat dissipating substrate 11, the fin 13 comprises an Al—Mg—Si series alloy containing from 0.3 to 0.7% by weight of Mg, from 0.3 to 0.7% by weight of Si and the balance of Al and inevitable impurities, and is put to cooling at a rate of 50° C./min or more in a range from 450-500° C. to 300° C. in the cooling process after heating for brazing and, subsequently, artificial aging is applied at 100 to 250° C.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and thereafter the board is cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

Abstract: A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus directly after removal from the vapor phase using the vapor phase soldering liquid. The advantages of the process consist in a greatly increased cooling rate of the soldered object and in an improved quality of the soldered joints.

Abstract: A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally entails supporting the circuit board on a pallet with pedestals that contact the surface of the circuit board directly opposite surface-mount components on the board. The pallet also includes an access directly opposite leaded components assembled to the board so that their leads are exposed. The pallet and board assembly are then placed on a wave soldering apparatus and wave soldered while applying and maintaining a force to the circuit board that ensures contact between the pedestals and the surface of the board opposite the surface-mount components, so that the leads of the leaded components are soldered to the circuit board.

Abstract: A thermal mass (18) is reflow soldered atop of a multi-layered medium (10) in order to yield minimum thermal resistance between a heat source (22) located on the multi-layered medium (10) and the thermal mass (18) for greater heat dissipation efficiency. Moreover, the thermal mass (18) can be auto-placed onto the multi-layered medium (10) in order to accurately and closely position the thermal mass (18) next to the heat source (22).

Abstract: The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heng and pressing followed by a finish rolling. A region of each metal block is restrained from a clamping position to the end portion thereof in order to prevent a change in level of the metal blocks in heating and pressing the piece. The end portions of the metal blocks can be thus prevented from deformation.

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position.

Abstract: Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.

Abstract: A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.

Abstract: A heat suppressing wrap is provided for suppressing the transfer of thermal energy along a pipe during a thermal joining operation, such as a high temperature, open flame welding, brazing or soldering operation. The heat suppressing wrap is a blended fabric cloth made of at least 50% cotton that is saturated with a liquid solution of a heat, fire and smoke inhibiting agent, and preferably, a fire fighting agent. The fire fighting agent is preferably a fire fighting foam, and most preferably, is PYROCAP B-136.TM. fire fighting foam manufactured by PYROCAP International, Inc. of Woodbridge, Va. Short lengths of the wrap are rolled and placed in a container with the liquid solution so that the cloth wraps remain saturated with the fire fighting agent. The wraps are then positioned, and preferably wrapped, over the pipe adjacent a pipe joint to greatly reduce the transfer of thermal energy along the pipe generated by the thermal joining operation.

Abstract: An article is welded, as in weld repair of a defect, by positioning a weld lift-off block at a location on the surface of the article adjacent to the intended location of the end of the weldment on the surface of the article. The weld lift-off block has a wedge shape including a base contacting the surface of the article, and an upper face angled upwardly from the base from a base leading edge. A weld pool is formed on the surface of the article by directly heating the surface of the article using a heat source. The heat source is moved relative to the surface of the article and onto the upper surface of the weld lift-off block by crossing the leading edge of the wedge, without discontinuing the direct heating of the article by the heat source. The heating of the article with the heat source is discontinued only after the heat source is directly heating the upper face of the weld lift-off block, and not the article.

Abstract: A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of the support structure (12) for the circuit board (10) during the wave soldering operation, or a temporary mask (28) applied directly to a surface of the circuit board (10). In each case, the thermal shield (18, 28) is configured to contact and completely cover a limited surface region of the circuit board (10) directly opposite the SMT component (14). To provide adequate thermal protection, the covered surface region is preferably as large as or larger than the surface area of the component (14). In a preferred embodiment, the perimeter of the thermal shield (18, 28) has a tapered thickness, e.g., a beveled edge, that enables uninterrupted wave soldering of the surface surrounding the thermal shield (18, 28).

Abstract: A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.

Abstract: The present invention provides a method to repair a void in an aluminum alloy, particularly a void resulting from an exit hole left from friction stir welding (FSW). The method includes machining the void to provide a tapered bore (34) through a parent metal, i.e., the aluminum alloy (30), providing grooves and ridges (36) on a sidewall of the tapered bore, inserting into the bore a consumable tapered plug (38) having an included angle less than, or equal to, that of the tapered bore, and rotating the plug inside the bore under an applied load to plasticize both its surface and the ridges on the parent metal tapered bore. The tapered plug is preferably attached at its proximal end to a nonconsumable heat sink (40) to remove excessive heat generated during rotation of the plug. Also, a support bracket is temporarily attached to the aluminum alloy adjacent the tapered bore to receive a distal end of the plug (38) and to react to the applied load.

Abstract: A hardfacing apparatus includes a deposition head including a heat source, a hardfacing material source, and a chill block having a chill block surface. The deposition head is positioned at a location so as to deposit a mass of the hardfacing material onto the workpiece surface. The chill block is positioned remote from the deposition head with the chill block surface in a facing-but-spaced-apart relation to the workpiece surface, separated from the workpiece surface by a gap having a dimension between the chill block and the workpiece surface of a standoff distance D.sub.S. Molten hardfacing material is deposited onto the workpiece surface from the deposition head. Simultaneously, the workpiece surface is moved relative to the hardfacing apparatus so that the molten hardfacing material passes into the gap and is molten as it enters the gap.

Abstract: A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.

Abstract: Improved welding method and padeye processing speeds up the connection of individual joints by peripheral fusion welding while the joint to be added stands vertically atop an existing pipe string also standing vertical in the rig floor. A plurality of welders can operate to speed up completion of the weld by removing heat from the pipe during the welding process. Heat is removed by the use of fluid cuffs near the weld area and, optionally, by using a spool within the pipe string to dispense expansion cooled air against the inner pipe wall in the vicinity of the weld. A special improved padeye is provided for welding near the pipe ends for handling. The padeye has a divided profile, a hole for a lifting shackle, and it will be accepted within the skirt of the lead system of the driving hammer. The upper end of the padeye can be cut from the pipe while the pipe is resting, on rig related structure, on the lower surface of the padeye.

Abstract: An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.

Abstract: An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered to the heatsink using a second solder and then the top surface is soldered to the electronic device using a third solder preferably having the same melting point as the second solder, or having approximately the same melting point as the second solder. Reverse powering of the thermoelectric cooler assists the soldering of the top surface to the electronic device by heating the top surface to a temperature sufficient to melt the third solder while cooling the bottom surface of the thermoelectric cooler to a temperature lower than the melting point of the second solder.

Abstract: A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.