Abstract: A method of heat treating high pressure die cast objects using pressure is disclosed. A high pressure die cast object is obtained and solution heat treated to above 700° F. for at least 2 hours at pressures between 0.5 and 35 KSI or at any pressure or range of pressures therebetween. This method of solution heat treatment with pressure reduces and/or eliminates blistered defects on the high pressure die cast object. The method of heat treating by solution heat treatment with pressure also allows an increase of yield strength and corresponding weight reduction upon redesign or substantially larger safety factors for the cast object.

Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.

Abstract: A wiring board includes a single-layer insulating layer, and a single-layer interconnect layer embedded in the insulating layer, wherein an entirety of a first surface of the interconnect layer is exposed in a recessed position relative to a first surface of the insulating layer, and a second surface of the interconnect layer is partially exposed in a recessed position relative to a second surface of the insulating layer.

Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.

Abstract: A brush intended for ensuring electrical contact between a fixed part and a moving part, said brush comprising a layer composed chiefly of carbon, silver, and of another metal different from silver, for example copper.

Abstract: Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.

Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.

Abstract: A method for joining a first metal part (11) with a second metal part (12), the metal parts (11,12) having a solidus temperature above 1100 QC. The method comprises: applying a melting depressant composition (14) on a surface (15) of the first metal part (11), the melting depressant composition (14) comprising a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part (11); bringing (202) the second metal part (12) into contact with the melting depressant composition (14) at a contact point (16) on said surface (15); heating the first and second metal parts (11,12) to a temperature above 1100 QC; and allowing a melted metal layer (210) of the first metal component (11) to solidify, such that a joint (25) is obtained at the contact point (16). The melting depressant composition and related products are also described.

Abstract: The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.

Abstract: The invention relates to a self-fluxing brazing piece. The piece comprises a composite material comprising at least one inorganic material distributed in a metal or metal alloy matrix, the inorganic material forming a flux during brazing to promote the formation of a thermally induced metallic bond. The matrix may be an aluminum silicon brazing alloy and the inorganic material may be a potassium-fluoro-aluminate flux. The piece is made by spray forming.

Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Abstract: A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste.

Abstract: An intermediary (such as a web reverse proxy), which is located between a web browser and one or more backend applications, manages cookies that are provided by the backend applications and returned to the web browser during a user session. The intermediary decides which cookies should be sent to the browser and which cookies should be stored therein. Preferably, this determination is made in an automated manner by examining the response for any cookie-dependent code (e.g., scripting) included in the response.

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: [Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper. [Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color.

Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; and, wherein R9 is selected from a hydrogen, a C1-30

Abstract: A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 and R8 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R7 and R8, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with a C1-6 alkyl group; wherein R10 and R11 are independently selected from a C1-20 alkyl group, a substituted C1-20 alkyl group, a C6-20 aryl group and a substituted C6-20 aryl group or wherein R10 and R11, together with the carbon to which they are attached, form a C3-20 cycloalkyl ring optionally substituted with

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; wherein R7 comprises at least two tertiary carbons and is selected from an unsubstituted C5-80 alkyl group, a substituted C5-80 alkyl group, an unsubstituted C12-80 arylalkyl group and a substituted C12-80 arylalkyl group; and, wherein the two nitrogens shown in formula I are each separately bound to one of the at least two tertiary carbons of R7; with the proviso that when the polyamine fluxing agent of formula I is represented by formula Ia: then zero to three of R1, R2, R3 and R4 is(are) hydrogen. Also provided is a method of soldering an electrical contact using the polyamine flux composition.

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

Abstract: A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end.

Abstract: An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.

Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

Abstract: A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required, that is sufficiently durable to withstand processing operations and also provides good metallurgical bonds upon brazing.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.

Abstract: A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contact pads during a reflow bonding process. The flux is also configured to cure or polymerize, to form donut shaped polymer support members for the external contacts. In addition, the flux is configured to mask conductive traces in electrical communication with the contact pads, and to electrically insulate the external contacts from the conductive traces. The external contacts can be pre-formed solder balls, or deposited solder bumps. In the case of solder bumps, the flux can include solder particles configured to coalesce into the solder bumps.

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.

Abstract: A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.

Abstract: The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol. When metal pieces between which the metal connecting composition is applied is heated, the hydrocarbon compound is dehydrogenated to form radical, and the radical reduces oxide film on the metal surface to be connected.

Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.