Applying Flux Patents (Class 228/223)
  • Patent number: 10045443
    Abstract: A method of supplying a medium into a cavity of a component carrier or a preform of a component carrier, wherein the method comprises providing the component carrier or the preform of the component carrier with the cavity having a slanted sidewall, providing a medium supply device with a tapering portion and a medium supply opening, and optionally supplying the medium into the cavity while the slanted sidewall and the tapering portion are in alignment with one another.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: August 7, 2018
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Gernot Grober
  • Patent number: 9314881
    Abstract: The present invention provides a flux for brazing aluminum-based materials, the flux being capable of brazing an A5052 alloy or the like containing 1.5 wt % or more of magnesium even when an Al—Si eutectic alloy (Si content: 7 to 12 wt %; A4343 alloy, A4047 alloy; melt starting temperature: about 577 to 615° C.) is used as a brazing material. Specifically, the present invention provides a flux for brazing aluminum-based materials, the flux comprising LiF, AlF3, and CsF, and the composition ratio of the three components being adjusted to within the range enclosed by four lines: line C connecting (30, 0, 70) and (30, 70, 0), line (1) connecting (31, 33.5, 35.5) and (51.5, 22.5, 26), line (2) connecting (32.5, 28.5, 39) and (49, 21.5, 29.5), and line (3) connecting (57.5, 42.5, 0) and (57.5, 0, 42.5), excluding the points on line C, in the triangular coordinates indicating LiF mol %, AlF3 mol %, and CsF mol %.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: April 19, 2016
    Assignee: DAIICHI KIGENSO KAGAKU KOGYO CO., LTD.
    Inventor: Takahiro Nagae
  • Patent number: 9059241
    Abstract: A method for packaging a semiconductor device includes attaching a first array of solder material to a first surface of an interposer; bringing the first array of solder material into physical contact with a laminate; and initially bonding the interposer to the laminate by applying a first temperature and pressure gradient to the first array of solder material such that a melting temperature of the first array of solder material is not exceeded.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: June 16, 2015
    Assignee: International Business Machines Corporation
    Inventors: Mario J. Interrante, Katsuyuki Sakuma
  • Publication number: 20150097024
    Abstract: An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Inventors: Hirokuni KURIHARA, Akio IGARASHI, Ryosuke MIZUTORI, Akinori GOWA, Naoaki HASHIMOTO
  • Publication number: 20150097025
    Abstract: An electrode forming device has a flux application unit that applies flux on a substrate; a plurality of ball filling units that are arranged in series at a downstream side of the flux application unit and fill conductive balls on the substrate applied with the flux to form electrodes; and a first conveying device, a second conveying device, a first bypass conveyor and a second bypass conveyor that convey the substrate to one of the ball filling units and conveys the substrate in such a way as to bypass the other ball filling unit.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Inventors: Hirokuni KURIHARA, Shoichi GUNJI, Takao KAWANO, Tomoyuki YAHAGI, Naoaki HASHIMOTO
  • Patent number: 8978962
    Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 17, 2015
    Assignee: Solvay Fluor GmbH
    Inventors: Placido Garcia-Juan, Hans-Walter Swidersky, Andreas Becker
  • Publication number: 20150061129
    Abstract: A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, lsamu Sato
  • Publication number: 20150034704
    Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Alexandra Mary Mackin, John Pereira, Matthew J. Scherer
  • Publication number: 20150027679
    Abstract: A finned tube assembly for an air cooled condenser and method for forming the same. The finned tube assembly comprises a flow conduit in the form of a bare steel tube and at least one set of fins bonded directly to the tube. In one embodiment, the tube has a non-circular cross section and the fins have a serpentine configuration. An oil based carrier and flux mixture is used in one embodiment to braze the fins onto the bare tubes, A braze filler metal may he introduced proximate to the bonding site by several different delivery mechanism. The braze filler metal may be aluminum or aluminum silicon. The finned tubes assemblies are combined in tube bundles and assembled to form an air cooled condenser which may be used in power generation, station, and other applications.
    Type: Application
    Filed: January 18, 2013
    Publication date: January 29, 2015
    Inventors: Krishna P. Singh, Frank David Sanderlin, William G. Schofield, Dmitiy Yakov Kats, Joseph Paul Mosher, Robert Charles Sloan, Thomas G. Haynes, III
  • Patent number: 8925793
    Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Siddharth Bhopte, Joe Albert Ojeda, Sr.
  • Publication number: 20140374469
    Abstract: Systems and methods for evenly applying a flux coating to any number of different shaped parts with a single machine are described. The systems and methods provide advantages in that the flux coating may be applied accurately within 2% to 4% of desired thickness with 85% to 95% of the total yield of flux being applied, this minimizing waste. Thousands of parts may be batch treated with a single, machine without operator input.
    Type: Application
    Filed: May 30, 2014
    Publication date: December 25, 2014
    Applicant: Lucas-Milhaupt, Inc.
    Inventor: Daniel J. Jossick
  • Patent number: 8833636
    Abstract: A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: September 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah
  • Publication number: 20140246770
    Abstract: A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 4, 2014
    Inventors: Chandra M. Jha, Feras Eid, Johanna M. Swan, Ashish Gupta
  • Publication number: 20140242753
    Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.
    Type: Application
    Filed: December 17, 2013
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyeong Min YEO, Seung Min RYU, Dae Jung KIM, Ji Ho UH, Suk Won LEE
  • Publication number: 20140212678
    Abstract: Provided are a soldering device and method which allow for oldering at low cost with high yield and high reliability.
    Type: Application
    Filed: April 16, 2012
    Publication date: July 31, 2014
    Applicant: TANIGUROGUMI CORPORATION
    Inventor: Katsumori Taniguro
  • Patent number: 8770462
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Raytheon Company
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • Publication number: 20140183249
    Abstract: Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Sik CHOI, Bong Yeol LEE, Min Hee YOON, Seung Chul KIM
  • Publication number: 20140158424
    Abstract: A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
    Type: Application
    Filed: May 29, 2012
    Publication date: June 12, 2014
    Inventors: Andreas Schlarb, Bernhard Reul, Mitja Rateiczak, Lothar Lesmeister
  • Publication number: 20140124925
    Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 8, 2014
    Inventors: Rajen S. Sidhu, Wei Hu, Carl L. Deppisch, Martha A. Dudek
  • Publication number: 20140110462
    Abstract: A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask.
    Type: Application
    Filed: August 30, 2013
    Publication date: April 24, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: PETER A. GRUBER, PAUL A. LAURO, JAE-WOONG NAH
  • Publication number: 20140103098
    Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Yon Ho YOU, Seon Jae MUN, Noriaki MUKAI, Seung Wan KIM, KiJu LEE, Jung In CHOI
  • Patent number: 8680187
    Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: March 25, 2014
    Assignee: Raytheon Company
    Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Masumoto
  • Publication number: 20140076958
    Abstract: A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
    Type: Application
    Filed: February 6, 2012
    Publication date: March 20, 2014
    Applicant: ANDREW LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 8668131
    Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: March 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chien Ling Hwang
  • Publication number: 20140048586
    Abstract: The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 20, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu
  • Publication number: 20140036427
    Abstract: Provided is a method for manufacturing a component having an electrode corrosion preventing layer by performing the low-cost, high-yield and highly reliable soldering, can be provided. The method for manufacturing a component includes: a step of preparing component 10? having electrode 2; a step of contacting first organic fatty acid-containing solution 3a with electrode 2; a step of adhering first molten solder 5a onto electrode 2 by contacting first molten solder 5a with electrode 2; a step of ejecting a gas flow or a liquid flow to adhered first molten solder 5a to remove excess first molten solder 5a in first molten solder 5a adhered onto electrode 2; and a step of cooling electrode 2 from which excess first molten solder 5a has been removed to less than a melting point of first molten solder 5a.
    Type: Application
    Filed: August 2, 2012
    Publication date: February 6, 2014
    Applicant: TANIGUROGUMI CORPORATION
    Inventors: Katsumori Taniguro, Genzo Watanabe
  • Publication number: 20140011318
    Abstract: New and improved ultrasonic spray shaping assemblies, components thereof, and methods for using the assemblies. An ultrasonic spray shaping assembly includes jet block and impact jet components to receive and redirect a single gas stream, whereby to use the single gas stream to shape an ultrasonic spray plume in a desired shape, particularly into a desired width of the plume. Modifications to the components, such as relative positioning, can be used to alter the shape of the spray plume. The present invention can be fabricated in a compact, lightweight design. It has many applications, including but not limited to, the deposition of flux onto a printed circuit board.
    Type: Application
    Filed: April 18, 2013
    Publication date: January 9, 2014
    Inventors: Benjamin Massimi, Joseph Reimer
  • Publication number: 20130341379
    Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.
    Type: Application
    Filed: December 23, 2011
    Publication date: December 26, 2013
    Inventors: Rajen S. Sidhu, Martha A. Dudek, James C. Matayabas, Michelle S. Phen, Wei Tan
  • Publication number: 20130299564
    Abstract: Pre-flux coating for the manufacturing of components by brazing, in particular manufacturing of heat exchangers of aluminium components including one or more fluxes and filler materials. The coating is composed of fluxes in the form of potassium aluminum fluoride K1-3AIF4-6, potassium trifluoro zincate, KZnF3, lithium aluminum fluoride Li3AIF6, filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K2SiF6, and solvent and binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on methacrylate homopolymer or methacrylate copolymer. The potassium aluminium fluoride, K1-3AIF4-6 is a flux including KAIF4, K2AIF5, K3AIF6 or a combination of these fluxes.
    Type: Application
    Filed: August 22, 2011
    Publication date: November 14, 2013
    Inventors: Dagmar Steiner, Jan Halvor Nordlien, Jeffrey L. Insalaco
  • Patent number: 8555502
    Abstract: The invention relates to a method for producing a metal part. Said method comprises the steps of supplying a strand of metal material and applying a coating from a fluxing agent composition to a surface of the strand of material by means of an application device (1), said fluxing agent composition being applied to only a defined portion of the surface of the strand of material by means of the application device (1).
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: October 15, 2013
    Assignee: BEHR GmbH & Co. KG
    Inventors: Peter Englert, Bernd Grünenwald, Matthias Türpe
  • Patent number: 8557055
    Abstract: The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the need for the surface treatment process that is conventionally carried out after the soldering process. To achieve this, nanoparticles are added to a base substance.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: October 15, 2013
    Assignee: BEHR GmbH & Co. KG
    Inventors: Snjezana Boger, Peter Englert, Matthias Pfitzer, Sabine Sedlmeir, Ingo Trautwein
  • Patent number: 8544713
    Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: October 1, 2013
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Issaku Sato, Akira Takaguchi
  • Patent number: 8528802
    Abstract: An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: September 10, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu
  • Patent number: 8499996
    Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: August 6, 2013
    Assignee: Behr GmbH & Co. KG
    Inventors: Oliver Mamber, Hans Koch
  • Publication number: 20130128485
    Abstract: The present invention relates to processing of PCBA, and provides a method for enhancing reliability of a welding spot of a chip, a printed circuit board and an electronic device. The method for enhancing reliability of the welding spot of the chip includes: dipping an epoxy flux on a weld leg of a chip or coating, with epoxy flux, a bonding pad corresponding to the weld leg of the chip, and mounting the chip to the bonding pad; and performing reflow processing on the bonding pad mounted with the chip, and finishing curing the epoxy flux. By applying the present invention, an Underfill process is not required, thereby reducing the cost of the device and improving the manufacturing efficiency.
    Type: Application
    Filed: December 27, 2012
    Publication date: May 23, 2013
    Applicant: Huawei Device Co., Ltd.
    Inventor: Huawei Device Co., Ltd.
  • Patent number: 8434666
    Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 7, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kim S. Ho, Michael K. Gallagher, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
  • Patent number: 8434667
    Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 7, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. Winkle, Avin V. Dhoble, Kim S. Ho, Michael K. Gallagher, Xiang-Qian Liu, David Fleming
  • Patent number: 8430293
    Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 30, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Avin V. Dhoble, Mark R. Winkle, Michael K. Gallagher, Kim S. Ho, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
  • Patent number: 8430295
    Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 30, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Kim S. Ho, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
  • Patent number: 8430294
    Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 30, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kim S. Ho, Mark R. Winkle, Avin V. Dhoble, Michael K. Gallagher, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
  • Publication number: 20130082094
    Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Mark R. Winkle, Avin V. Dhoble, Kim S. Ho, Michael K. Gallagher, Xiang-Qian Liu, David Fleming
  • Publication number: 20130082093
    Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Kim S. Ho, Mark R. Winkle, Avin V. Dhoble, Michael K. Gallagher, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
  • Patent number: 8411455
    Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from ?40 to 150° C. has been suppressed.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenji Kondo, Masahito Hidaka, Koji Kuyama, Yutaka Kamogi
  • Patent number: 8408448
    Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.
    Type: Grant
    Filed: February 11, 2012
    Date of Patent: April 2, 2013
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Peter Alfred Gruber, Mark Harrison McLeod, Jae-Woong Nah
  • Patent number: 8399800
    Abstract: A manufacturing method for a metal mark plates is disclosed. In this manufacturing method, a welding flux layer is firstly disposed onto a metal base plate, and a plurality of metal mark parts are arranged on corresponding regions of the metal base plate on which the welding flux layer is disposed. Thereafter, a laser spot welding step is performed to assemble the metal mark parts with the metal base plate by heating the backside of the metal back plate at a location corresponding to the welding flux layer. This manufacturing method therefore provides a fast and stable welding way for manufacturing the metal mark plate. Besides, this manufacturing method can be applied for automatic production and precise mass production could thereby be accomplished.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: March 19, 2013
    Assignee: Chenming Mold Ind. Corp.
    Inventors: Yu-To Chao, Hsueh-Tsu Chang, Yau-Hung Chiou
  • Publication number: 20130043297
    Abstract: An automatic fluxing machine is provided and includes a dispensing section including a surface having through holes formed therein through which flux material is dispensable toward a braze joint and a plugging section disposed below the braze joint to prevent downward flow of dispensed flux material.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 21, 2013
    Applicant: CARRIER CORPORATION
    Inventors: Timothy Andrecheck, Luis F. Avila, Jeffrey L. Jones
  • Publication number: 20130037172
    Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.
    Type: Application
    Filed: March 8, 2011
    Publication date: February 14, 2013
    Applicant: SOLVAY FLUOR GMBH
    Inventors: Placido Garcia-Juan, Hans-Walter Swidersky, Andreas Becker
  • Patent number: 8371497
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: February 12, 2013
    Assignee: QUALCOMM Incorporated
    Inventor: Christopher James Healy
  • Publication number: 20130001279
    Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 3, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand, Valerie Oberson
  • Patent number: 8342385
    Abstract: A transfer process for bonding a solderable device to a solderable firsl substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: January 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: Bing Dang, Raymond R. Horton, Robert J. Polastre