Abstract: A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.

Abstract: A lifting structure in the form of a release hook configured to conveniently and easily release computer components from their supporting structure by a simple pivoting action in response to lifting of thumbscrews. A typical computer component would be a PCIe card within a GPU tray. The lifting structure does not require the use of tools to release the computer components, and can be used where computer components ordinarily cannot be released by human fingers due to limitations of space. The lifting structure lifts the computer component to a height where the computer component can then be easily grasped by human fingers for removal of the component.

Abstract: The present invention relates to a surface modification method for a polyether-ether-ketone material. The method combines physical and chemical methods, and comprises the steps of performing plasma immersion ion implantation on the surface of the polyether-ether-ketone material with argon as an ion source, and then, soaking the polyether-ether-ketone material treated by plasma immersion ion implantation in a hydrogen peroxide aqueous solution, hydrofluoric acid aqueous solution, or ammonia water to make the surface of the modified polyether-ether-ketone material have nanoparticles, shallow nanoporous structures, and/or ravined nanostructures.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: The present disclosure provides a compound according to the formula: Rf1[CH(—O—CH(3-m)Rf2m)(—O—CF2—CFH—Rf3)]n ??[I] wherein n is 1 or 2, wherein m is 1, 2 or 3, wherein, when n is 1, Rf1 is selected from the group consisting of highly fluorinated alkyl groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein, when n is 2, Rf1 is selected from the group consisting of highly fluorinated alkylene groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein each Rf2 is independently selected from the group consisting of alkyl groups which are linear, branched, cyclic, or a combination thereof, which may optionally be substituted, and which may optionally contain one or more catenated heteroatoms; wherein at least one Rf2 is highly fluorinated; wherein each Rf3 is indep

Abstract: The invention relates to a method for joining objects made of metal, plastic or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles.

Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.

Abstract: The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the apparatus being adapted to heat the items to be soldered to a temperature required for soldering by condensing the vapor. Further the invention relates to a method and an apparatus for flux deposition connected to a soldering machine, which soldering machine comprises a solder heating medium evaporated by heating means forming a vapor that heats elements to be soldered by heat transfer and by condensation, which apparatus comprises means for condensation, of a vapor containing flux where pumping means circulate vapor containing flux through the condensation means, where the condensation means comprises heat exchangers for cooling the vapor for flux condensation.

Abstract: Normally liquid, omega-hydrofluoroalkyl ether compounds (and selected mixtures thereof) have a saturated perfluoroaliphatic chain of carbon atoms interrupted by one or more ether oxygen atoms. The compounds can be prepared, e.g., by decarboxylation of the corresponding fluoroalkyl ether carboxylic acids and are useful, e.g., in cleaning and drying applications.

Abstract: The present invention comprises cost-effectively manufactured, electrically conductive and mechanically compliant micro-leads and a method of utilizing these compliant micro-leads to interconnect area grid array chip scale packages (“CSPs”) to printed wiring boards (“PWBs”). The preferred method includes orienting a plurality of conductive compliant micro-leads, secured to one another in parallel with tie bars and tooling, to align with a corresponding pattern of conductive pads located along the surface of an area grid array CSP. The compliant micro-leads are electrically connected and mechanically secured to the corresponding connecting surfaces of the area grid array CSP. Next, the securing tie bars and the tooling are removed. The opposite ends of the conductive compliant micro-leads are then oriented to align with a corresponding pattern of conductive surface pads on a PWB.

Abstract: The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting the primary liquid into the vapor phase. The system is characterized in that primary liquid or the vapor thereof or both can be introduced by means of a primary-liquid fluid line into a soldering-zone heating module in fluid communication with the soldering zone and into a process-zone heating module in fluid communication with the process zone, the heating capacity of the soldering-zone heating module and of the process-zone heating module being adjustable independently of each other to thereby generate superheated vapor based on the zones. Furthermore, the invention relates to a method for operating a vapor phase reflow system.

Abstract: The invention relates to a process for controlling the heat transfer to a workpiece during vapor phase soldering. According to said process, a workpiece placed in a vapor phase is first rapidly heated to a predetermined temperature, and then the temperature is controlled by changing the vapor volume on the workpiece surface. Preferably, a workpiece in the vapor phase is heated to a temperature lower than the melting point of the solder, and then the workpiece is heated at the boundary between the vapor phase and the vapor-free space more slowly to the melting point of the solder. This invention is advantageous in that it provides a process for rapid vapor phase soldering with no undesirable side effects, such as, e.g., formation of solder pearls.

Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.

Abstract: A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the connection surfaces of the flexible circuit (101) are tinned. The circuit board (100) and flexible circuit (101) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (100) and flexible circuit (101). The gap between circuit board (100) and flexible circuit (101) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (101). The solder is reflowed by applying heat by vapor phase condensation.

Abstract: A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus directly after removal from the vapor phase using the vapor phase soldering liquid. The advantages of the process consist in a greatly increased cooling rate of the soldered object and in an improved quality of the soldered joints.