Abstract: A pressing group for a sintering press to carry out sintering of electronic components on a substrate has a multi-stem cylinder having a front head and a rear head together delimiting a compression chamber. In the front head pressing stems are slidingly supported, parallel and independent from each other, the rear ends of the pressing stems protruding into the compression chamber. In the compression chamber, an actuating flat gasket extends over the rear ends of the pressing stems. The actuating flat gasket is fixed to the front head by an anchoring frame engaging a peripheral portion of the actuating flat gasket, the anchoring frame being completely housed in the compression chamber so that the pressurized fluid also acts on the anchoring frame.

Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.

Abstract: There is provided a functional element that includes a first substrate, a second substrate disposed to face the first substrate, and a buffer layer provided between the first substrate and the second substrate. The buffer layer has, in a layer thereof, a distribution of concentration of a metallic element. The distribution changes in a film thickness direction.

Abstract: A thermocompression bonding method for thermocompression bonding a sheet to a workpiece, where the method includes a stacking step of placing the sheet between a flat plate and the workpiece to form a stack in which the sheet is held between the workpiece and an entire surface of the flat plate and a thermocompression bonding step of thermocompression bonding the sheet to the workpiece while planarizing the sheet with the flat plate by heating the sheet and applying an external force to the stack, after performing the stacking step.

Abstract: A field of thermal treatment of ceramic materials is provided, and relates to a method for thermal treatment of a solid ceramic part in a microwave cavity, the direction of the electrical field E being substantially uniform in an empty cavity, comprising the steps that consist of placing, in the cavity, at least one ceramic part surrounded by at least one first susceptor with dimensions, material and arrangement configured to emit infrared radiation, each first susceptor including at least one first main surface, each first main surface being an adjusted surface in which the cone distances are parallel to the electrical field E, and of emitting the microwaves into the cavity.

Abstract: An electronic assembly, and a method for making the electronic assembly, includes a first electronic component, a second electronic component, and a plurality of interconnects. The plurality of interconnects electrically couple the first electronic component to the second electronic component. Each of the plurality of interconnects comprise one of a plurality of first magnetic components in physical alignment with an associated one of a plurality of second magnetic components, the plurality of second magnetic components being components of one of the second electronic component and the plurality of interconnects.

Abstract: Devices and techniques including process steps make use of recesses in conductive interconnect structures to form reliable low temperature metallic bonds. A fill layer is deposited into the recesses prior to bonding. The fill layer is composed of noble metal (such as copper) and active metal (such as Zn). Then the fill metal layer is turned into a metal alloy after annealing. A dealloying is performed to the metal alloy to remove the active metal from the metal alloy while the noble metal remains to self-assemble into porous (nanoporous) structure metal. First conductive interconnect structures are bonded at ambient temperatures to second metallic interconnect structures using dielectric-to-dielectric direct bonding techniques, with the fill nanoporous metal layer in the recesses in one of the first and second interconnect structures.

Abstract: A process for welding a first molding to a second molding. The process uses an implement including first and second external surfaces. Each external surface further includes a duct. An end of the first molding is heated by a hot gas while the end is at a distance from the duct-entry plane in the range from 3 mm outside the duct to 10 mm inside the duct. A junction area of the second molding is heated by a hot gas while the junction area is at a distance from the duct-entry plane in a range from 3 mm outside the duct to 10 mm inside the duct. The heated end and the heated junction area are then brought into contact with one another and cooled, forming a weld between the first molding and the second molding. Also disclosed is a welded molding obtainable by the process of the invention.

Abstract: A trolley includes a body and a side block coupled to the body via a pivot arm and a spring. An adjustment knob adjusts a position of the side block relative to the body. A first plurality of rollers are coupled to the body and roll along a first roller recess on a first side of a length of a cap channel. A second plurality of rollers are coupled to the side block and roll along a second roller recess on a second side of the length of the cap channel. A first welding torch bracket positions a welding torch at a first interface between the first side of the length of the cap channel and a first deck sheet as the trolley traverses the length of the cap channel.

Abstract: An aerofoil structure with a hollow cavity is manufactured by diffusion bonding and superplastic forming. Outer panels are formed of a first material; a membrane is formed of a second material. Stop-off material is applied to preselected areas on at least one side of the membrane or of one of the panels so as to prevent diffusion bonding between the panels and the membrane at the preselected areas. The panels and the membrane are arranged in a stack and a diffusion bonding process is performed to bond together the first and second panels and the membrane to form an assembly. A superplastic forming process is performed at a forming temperature to expand the assembly to form the aerofoil structure. The forming temperature is selected so that the second material undergoes superplastic deformation at the forming temperature and the first material does not undergo superplastic deformation at the forming temperature.

Abstract: The present disclosure describes a gastric jejunal tube having a gastric lumen and a jejunal lumen that run the length of the tube. The cross-sectional sizes of the lumens change from above to below the most distal gastric port. A method of making the gastric jejunal tube is also described.

Abstract: A semi-flexible laminar silicone foam rubber-base heater for high temperature gas supply and exhaust lines used in microelectronic semiconductor fabrication uses superimposed adhesively bonded layers of an etched foil heater element containing layer, a high-to-low heat thermal transition layer, a thermal fuse laden silicone foam rubber insulation layer and a durable wrapping layer. The system can provide for the combined use of highly controllable etched foil heater elements, clean silicone foam rubber insulation, and inexpensive mechanical thermal fuses safely in a high heat gas supply and exhaust line environment.

Abstract: The invention discloses a machining method of welding an ear plate on a barrel of a central cylinder of a horizontal preheater.

Abstract: A method for non-destructively evaluating a joined component includes inducing vibrations in the joined component within a range of frequencies, acquiring a resonance spectra from the joined component resulting from the induced vibrations, and analyzing the resonance spectra using Acoustic Sensor Testing (AST).

Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.

Abstract: A process and method for welding using an oxygen and propylene gas mixture is disclosed herein. Landing gear components may be welded together using this oxygen and propylene gas fuel source. For instance, an axle beam and/or a post of an aircraft may be welded using oxygen and propylene gas fuel source.

Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.

Abstract: A method for assembling at least two plates using a brazing process, the plates being separated by a filler material situated therebetween, includes placing the two plates, separated by the filler material, in a furnace; compressing the two plates separated by the filler material; controlling the temperature in the furnace according to a brazing cycle. The two plates separated by the filler material are compressed using a plurality of devices that can be pressurized using a fluid, the pressurizable devices being located in the furnace and being distributed over the surface of one of the two plates to which each pressurizable device applies a mechanical pressure that is remote-controlled as a function of the temperature in the furnace.

Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.

Abstract: Methods for joining material to an article comprising one or more passageways include fluidly connecting a temperature controlled fluid source comprising temperature controlled fluid to at least one passageway and passing the temperature controlled fluid through the at least one passageway, wherein the temperature controlled fluid at least partially controls a temperature profile of the article. The methods further include joining material to the article, wherein the temperature profile of the article at least partially controls a resulting joined material characteristic.

Abstract: Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: A visually seamless method of joining a first piece of metal and a second piece of metal is described. The first piece of metal is placed in contact with an edge of the second piece of metal. In some embodiments, the edge includes a sacrificial lip. The first piece of metal forming a junction area with the edge of the second piece of metal, applying a forging force to the first piece of metal, the forging force having an effect of creating an extremely tight fit up between the first and the second pieces of metal, welding the first and the second pieces to form an assembly and forming a cosmetically enhancing protective layer on the surface of the assembly, the protective layer obscuring any visible artifacts on the surface of the assembly, the obscured visible artifacts including any discoloration or discontinuity created by the laser welding.

Abstract: A method for producing an electronic device is disclosed. One embodiment provides two soldering partners to be connected to one another at an envisaged joining location and at least one of which includes an electronic component or is formed as such a component, a soldering apparatus having an inductor, and an intermediate plate The soldering partners, the inductor and the intermediate plate are positioned in such a way that the intermediate plate is arranged between the electronic component and the envisaged joining location, on the one hand, and the inductor. The soldering partners are connected at the envisaged joining location by using a solder that is melted by energy emitted by the inductor.

Abstract: A strip-shaped or plate-shaped composite metal object and a method for the production thereof. The composite metal object has at least two layers of the same metal. The layers have been brought by a heat pretreatment to a temperature such that a mutual diffusion bond has resulted through subsequent pressing of the layers against one another, while reducing the thickness by 5 to 25% and preferably 8 to 15%. A layer, which on the side thereof facing an adjacent layer has strip-shaped recesses, which are closed by the adjacent layer to form channels when the layers are pressed together, is used as one of the layers. The channels in the composite metal object allow the inclusion of additional elements before processed further to form an implement. The channels remain extensively preserved during the production and further processing of the composite model object.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: A method for producing a metallic part including inner reinforcements of ceramic fibers, according to which: at least one recess for an insert is machined in a metallic body having an upper surface; at least one insert of ceramic fibers in a metallic matrix is arranged in the recess; the insert is covered with a cover; the gap around the insert is placed under a vacuum and hermetically sealed; the entire metallic body with the cover is treated by hot isostatic compaction; and the treated assembly is machined to produce the part. The insert is rectilinear, and the recess for the insert in the metallic body forms a rectilinear groove, the cover being dimensioned so as to be able to placed on the insert in the recess after having been shrunk by cooling and to establish a tight fit in the groove by dilation such as to close the space.

Abstract: Embodiments of a method for manufacturing a turbine engine component are provided, as are embodiments of a thermal growth constraint tool for the manufacture of turbine engine components. In one embodiment, the method includes the steps of obtaining a plurality of arched pieces, arranging the plurality of arched pieces in a ring formation, and bonding the plurality of arched pieces together to produce a monolithic ring by heating the ring formation to a predetermined bonding temperature while constraining the outward radial growth thereof.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece (10) and one or more second metal workpieces (15) are brought into proximity to one another such that a first portion (12) of the first workpiece (10) is in general overlying relationship with a second portion (17) of the one or more second workpieces (15). A suitable material (99) is provided between said first portion (12) and said second portion (17), said material (99) being in the form of particles or foil. At least a first part of said first workpiece (10) comprising said first portion (12) is forced toward said a part of the one or more second workpiece (15) comprising said second portion (17) by means of any one of a suitable high pressure joining process (95) and a high speed joining process, such as to cause the said first metal workpiece (10) and said one or more second metal workpieces (15) to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: Methods of connecting solder bumps located on dies to leads located on substrates are disclosed herein. One embodiment includes applying a first compression force between the solder bump and the lead; relieving the first compression force between the solder bump and the lead; and applying a second compression force between the solder bump and the lead.

Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.

Abstract: Maraging steel compositions, methods of forming the same, and articles formed therefrom comprising, by weight, 15.0 to 20.0% Ni, 2.0 to 6.0% Mo, 3.0 to 8.0% Ti, up to 0.5% Al, the balance Fe and residual impurities. The composition may be a first layer of a composite plate, and may have a second layer deposited on the first layer, the second layer having a composition comprising, by weight, 15.0 to 20.0% Ni, 2.0 to 6.0% Mo, 1.0 to 3.0 Ti, up to 0.5% Al, the balance Fe and residual impurities. The first layer may have a hardness value ranging from 58 to 64 RC, and the second layer may have a hardness value ranging from 48 to 54 RC. The first layer may be formed employing powdered metallurgical techniques. Articles formed from the compositions include armored plate.

Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Abstract: A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support.

Abstract: A method for manufacturing a continuous sucker rod coil, wherein the method includes the step of selecting a plurality of input coils, each input coil having the same uniform hardness, and each input coil having two free ends. The method further includes the step of fusing adjacent free ends of adjacent input coils together to form one continuous length of rod, the fusing creating fused areas and a heat-affected zone at each fused area. The method also includes the step of treating each of the heat-affected zones to alleviate irregularities induced during fusing. Additionally, the method includes the step of winding the continuous length of rod into a finished coil.

Abstract: A method of forming a part that includes a first component and a second component and which two components are diffusion bonded together. The first component is configured as a pressure component and includes a first bond land surface. The second component is configured as a suction component and includes a second bond land surface. A mandrel is provided that includes a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component. The first and second components are positioned on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment. The first and second components together with the mandrel are positioned in a die assembly. The die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die.

Abstract: In a reflow soldering apparatus, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the soldering apparatus to issue an alarm at this set time. A control unit thereof calculates a period of time when the alarm issues based on the set warning-issue-time before circuit-board-discharge and the like. After a sensor of entrance side has detected that the circuit board enters into main body of the reflow soldering apparatus, the control unit determines whether or not the starting time of the alarm sound has been elapsed. The control unit controls the information unit to sound the alarm when the control unit determines that the starting time of the warning issue has elapsed.

Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Abstract: In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100) and the predetermined pattern is spaced from the edges of the first surface (106) of the first metal workpiece (100). Stop off material (124) to prevent diffusion bonding is applied in a predetermined position on the first surface (106) of the first metal workpiece (100) and the predetermined position extends from the predetermined pattern of stop of material (122) on the first surface (106) of the first metal workpiece (100) towards one edge of the first surface (106) of the first metal workpiece (100).

Abstract: Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond components of the heat exchanger together. An enhanced boiling layer (EBL) comprising metal particles bonded to each other and to a boiling side of the metal wall provides nucleate boiling pores to improve heat transfer. The EBL has a melting temperature that is higher than the melting temperature of the brazing material. Also disclosed is a process for assembling the heat exchanger.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate.

Abstract: A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

Abstract: A reflow oven chamber assembly that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing disposed within the reflow oven chamber, one or more heating elements disposed in the chamber housing, and one or more compression box assemblies disposed in the chamber housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages.