Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

Abstract: A battery has a cathode, an anode and an electrolyte, with the cathode having a cathode current collector and a cathode material. The cathode material has a cathode active material, which is capable of reversibly intercalating and deintercalating first metal ions. The electrolyte has a solvent capable of dissolving the first metal ions and second metal ions that can be reduced to a metal during a charge cycle and be oxidized from the metal to the dissolved second metal ions during a discharge cycle. The cathode current collector has an electrochemically inert carrier and graphite. The carrier is wrapped by the graphite. The cathode current collector provided has good corrosion resistance and the battery has a long floating charge life and a low cost.

Abstract: A constructing-and-forging method for preparing homogenized forged pieces comprises: preparing preformed billets: cutting off a plurality of continuous casting billets, milling and smoothing surfaces of the billets to be welded, performing vacuum plasma cleaning operation to the surfaces to be welded, stacking the plurality of billets and sealing around the surfaces in a vacuum chamber by electron beam welding; forge-welding and homogenizing the preformed billets: heating the preformed billets to a certain temperature in a heating furnace and taking the heated preformed billets out of the heating furnace, forging the preformed billets by a hydraulic press, then using three-dimensional forging to disperse the welded surfaces such that composition, structure and inclusion of the interface areas are at the same level as those of the bodies of the billets. Cheap continuous casting billets are stacked and forge welded.

Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.

Abstract: A method reinforcing an axisymmetric annular metal part by including a winding of composite material. A metal blank for the part is prepared, a cavity is formed therein that opens out into a coaxial inside face thereof, and that presents a right cross-section of axial extent that decreases from the inside towards the outside, a reinforcing yarn is wound in the cavity, the cavity is closed, the assembly is subjected to a hot isostatic compression process, and the blank is machined to obtain a final part.

Abstract: A method for assembling at least two plates using a brazing process, the plates being separated by a filler material situated therebetween, includes placing the two plates, separated by the filler material, in a furnace; compressing the two plates separated by the filler material; controlling the temperature in the furnace according to a brazing cycle. The two plates separated by the filler material are compressed using a plurality of devices that can be pressurized using a fluid, the pressurizable devices being located in the furnace and being distributed over the surface of one of the two plates to which each pressurizable device applies a mechanical pressure that is remote-controlled as a function of the temperature in the furnace.

Abstract: A method of manufacturing an elongate insert configured to be integrated by CIC in a metal container, including coated yarns bonded together, the coated yarns being formed from metal-coated ceramic fibers. The method includes placing the coated yarns side by side in a bundle and pulling the fiber bundle through a shaping element so as to compact the fiber bundle transversely while forming the fiber bundle so as to have a defined cross section. A metal part incorporating a fibrous insert can be manufactured by the CIC technique.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: A thermal conduction device and a method for fabricating the same are disclosed. Firstly, arrange a plurality of diamond particles on a plane according to a predetermined pattern to form a diamond particle monolayer. Next, apply a forming process on a metal material such that the metal material forms a metal matrix wrapping the diamond particles to form a composite body including the diamond particle monolayer embedded in the metal matrix. Next, stack a plurality of the composite bodies and perform a heating process to join the metal matrixes to each other to form the thermal conduction device. The device is characterized in arranging diamond particles on a plane to form a two-dimensional monolayer structure and manufactured via assembling the two-dimensional monolayer structures to form a three-dimensional multilayer structure. By controlling the arrangement of the diamond particles, the thermal conduction device can have superior thermal conduction performance.

Abstract: A method for manufacturing a one-piece annular metal part having a reinforcing insert of composite material includes forming a blank of the part by superimposing, around a rotating cylindrical mandrel, layers of metal wire and layers of coated fiber, the layers of coated composite fiber being arranged in the blank according to the positioning of the insert in the part; placing the blank in a receiving tool, and applying a hot isostatic pressing treatment to the blank; and extracting the treated blank from the receiving tool and, as required, machining the treated blank to obtain the one-piece annular metal part having a reinforcing insert.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece (10) and one or more second metal workpieces (15) are brought into proximity to one another such that a first portion (12) of the first workpiece (10) is in general overlying relationship with a second portion (17) of the one or more second workpieces (15). A suitable material (99) is provided between said first portion (12) and said second portion (17), said material (99) being in the form of particles or foil. At least a first part of said first workpiece (10) comprising said first portion (12) is forced toward said a part of the one or more second workpiece (15) comprising said second portion (17) by means of any one of a suitable high pressure joining process (95) and a high speed joining process, such as to cause the said first metal workpiece (10) and said one or more second metal workpieces (15) to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

Abstract: An impact beam assembly includes a beam of high-strength steel, and a pair of end brackets constructed of a dissimilar material than the high-strength steel. The brackets are locally deformed onto the beam to thereby surround a portion of the beam. Once deformed, the brackets define a flat section suitable for welding to a vehicle door panel, as well as a section for retaining the beam. The beam can include a surface feature suitable for retaining the beam to the end brackets. A method of reinforcing a vehicle door assembly includes positioning the beam with respect to the end brackets such that the brackets surround a portion of the beam, and then activating a magnetic pulse coil (MPC) to deform an overlapping portion of the brackets onto the beam. The brackets are then attached to a surface of the door assembly to reinforce the door assembly.

Abstract: A press apparatus includes a mounting table and a pressing member. A workpiece formed of a plurality of laminated core sheets is placed on the mounting table, and the pressing member is used for pressing the workpiece on the mounting table from above. The mounting table is supported by a base member so as to be loosely movable in a horizontal plane. When the pressing member is lowered, a positioning member determines the position of the workpiece such that the core sheets of the workpiece are aligned along a single vertical axis.

Abstract: In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100) and the predetermined pattern is spaced from the edges of the first surface (106) of the first metal workpiece (100). Stop off material (124) to prevent diffusion bonding is applied in a predetermined position on the first surface (106) of the first metal workpiece (100) and the predetermined position extends from the predetermined pattern of stop of material (122) on the first surface (106) of the first metal workpiece (100) towards one edge of the first surface (106) of the first metal workpiece (100).

Abstract: An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.

Abstract: This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the method involves weakly bonding a stack of laminates forming internal voids and channels with a first generally low uniaxial pressure and first temperature such that bonding at least between the asperites of opposing laminates occurs and pores are isolated in interfacial contact areas, followed by a second generally higher isostatic pressure and second temperature for final bonding. The method thereby allows fabrication of micro-channel devices such as heat exchangers, recuperators, heat-pumps, chemical separators, chemical reactors, fuel processing units, and combustors without limitation on the fin aspect ratio.

Abstract: In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first heating stage. Subsequently, the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding, while heating the chips directly by the first heating stage. Thereafter, the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then, on the second heating stage, the semiconductor chips are thermocompression-bonded to the matrix substrate, while being heated directly by the second heating stage.

Abstract: A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component, where one of the first and second axle housing components is a metallic component made of a metallic material. A portion of one of the first and second axle housing components is positioned within a portion of the other of the axle housing components in an overlapping manner, thereby forming an overlapping portion. A metallic band may be disposed around the overlapping portion. An inductor is positioned around the overlapping portion. The inductor is energized to generate a magnetic field for collapsing at least one of the overlapping portion and the metallic band, thereby securing the first and second axle housing components together.

Abstract: A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturing process. The green seal plate cap is inserted into the opening in the cast member and the cast member is subjected to iso-static pressing, which bonds the seal plate cap to the cast member and sinters the cap to form a solid seal.

Abstract: A method of joining two vehicle axle housing components made from the same or dissimilar materials includes providing a first axle housing component, and providing a second axle housing component made from a material which is same/dissimilar to the material used to make the first axle housing component, where one of the first and second axle housing components is a metallic component made of a metallic material. A portion of one of the first and second axle housing components is positioned within a portion of the other of the axle housing components in an overlapping manner, thereby forming an overlapping portion. A metallic band may be disposed around the overlapping portion. An inductor is positioned around the overlapping portion.

Abstract: More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not above room temperature.

Abstract: A system and method are disclosed for the manufacture of a hard disk drive arm and the bonding of magnetic head to suspension on the drive arm.

Abstract: The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter target assemblies (5) in accordance with the present invention are preferably comprised of target materials (10) and backing plate materials (15) having dissimilar thermal expansion coefficients and incorporate internal cooling channels (20). In the preferred embodiment, the resulting bond and the formation of the cooling channels (20) are cooperative.

Abstract: A method and an apparatus incorporating the method for making a long, continuous laminate. A plurality of layers of materials are simultaneously wound around a metal hub. Strips of refractory material, perforated metal, metal foil, metal mesh, and random fiber media, are employed in the layers of materials. The hub, once completed, is placed into a furnace for diffusion bonding and later cooled to room temperature. The cooled laminate coil may be cut into various lengths.

Abstract: A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material (13) can be prevented from being broken because the ceramics material (13) is heated while being placed on a holder (14) and is pressure-joined under a pressure of 1 kg/mm2 or lower.

Abstract: The instant invention is directed to a bonded product, such as a manifold, for gas or liquid chromatographs, and a method for making the same. The bonded product is made using the following steps: (i) contacting two or more steel sheets; (ii) heating the contacted sheets to a temperature substantially below the melting temperature of the sheets; (iii) applying pressure to the contacted sheets; and (iv) cooling the contacted sheets. No intermediate foreign material is used to bond the steel sheets, e.g., no welding material or TLP diffusion bonding plate is utilized. Nonetheless, a strong, leak free bond is generated at temperatures as low as 1700° F. (926.6° C.). The bond is molecular in nature, as evidenced by grains that grow from one sheet to another across the interface between the two sheets.

Abstract: An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.

Abstract: A method of repairing a part, such as a rotating disk/drum rotor of a gas turbine engine. The method includes: heating a contact area of a wrought material and a contact area of a wrought part; and pressing the contact area of the material against the contact area of the part to bond the parts. A method of making a rotating part of a gas turbine engine, comprising: heating a contact area of a wrought material and a contact area of a wrought part; and pressing the contact area of the material against the contact area of the part to bond the parts. The methods may include a subsequent heat treatment to provide the desired strength properties to the joint between the material and the part.

Abstract: A method of manufacturing a hermetically sealed chamber, including preparing two aluminum or aluminum alloy material members which face each other, forming a first extending convex portion on a surface to be metal-bonded of one of the two aluminum or aluminum alloy material members, where the first convex portion extends in a manner to make an enclosure, forming a second extending convex portion on a surface to be metal-bonded of the other of the two aluminum or aluminum alloy material members, where the second convex portion extends in a manner to make a corresponding enclosure, and receiving internally packaged parts therebetween, fitting the first extending convex portion and the second extending convex portion, and causing the first extending convex portion and the second extending convex portion to be metal-bonded by press-forging.

Abstract: A method of joining at least a portion of a first substrate with at least a portion of a second substrate. The first substrate includes at least 90 weight percent aluminum and a first set of additives wherein magnesium is the dominant constituent in the additives. The second substrate includes at least 85 weight percent magnesium and a second set of additives wherein aluminum is the dominant constituent of the second set of additives. The first and second substrates are heated to an elevated temperature ranging from about 440° C. to 500° C. Pressure is applied to the first and second substrates at least at one point of contact to bond the first and second substrates together.

Abstract: A wiring layer transfer composite constituted by a laminate composed of a carrier layer, a barrier layer and a wiring-forming layer, the barrier layer being a continuous layer substantially free from defects, can be produced by (a) preparing a first Cu-based metal foil having an average thickness of 50 &mgr;m or less and an average surface roughness Rz of 5 &mgr;m or less in both surfaces for the carrier layer; (b) preparing a second Cu-based metal foil having an average thickness of 20 &mgr;m or less and an average surface roughness Rz of 5 &mgr;m or less in both surfaces for the wiring-forming layer; (c) vapor-depositing a metal having different etchability from that of Cu onto at least one of the first metal foil and the second metal foil to form the barrier layer having an average thickness of 1 &mgr;m or less; and (b) pressure-welding both metal foils via the barrier layer.

Abstract: Its basic means is a monolithically bonded construct prepared by monolithically bonding together a rare-earth magnet 2 and a an alloy material that is a high melting point metal or a high specific-tenacity material through the solid phase diffusion bonding by the hot isostatic pressing treatment, and a monolithically bonded construct with an interposal of a thin layer of the high melting point metal between a rare-earth magnet 2 and an alloy material 3, 4 that is a high specific-tenacity material.

Abstract: The present invention provides a method of diffusion bonding a first article containing a thermally activated expansion agent to a second article. The first article and the second article are placed adjacent to each other at a bonding area. The first article and the second article are constrained such that contact is maintained between the first article and the second article at the bonding area. The constrained articles are then heated at a temperature that causes the first article to expand, creating pressure between the articles at the bonding area.