By Capillary Action Patents (Class 228/258)
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Patent number: 5050790Abstract: A metal-made carrier body is fabricated for an exhaust gas cleaning catalyst. At least one sheet-like metal band and at least one corrugated metal band, each of said bands being made of a thin metal sheet, are superposed one over the other so as to establish contacts therebetween, thereby forming a multi-layered composite body defining a number of network-patterned gas flow passages along the central axis thereof. The composite body is dipped in an electroless plating bath capable of forming a brazing coating layer on the composite body so as to form a brazing coating layer at least in the vicinity of each contact except for the contact itself. The composite body is then subjected to a heat treatment so as to braze the contacts between the sheet-like metal band and corrugated metal band. Before dipping the composite body in the plating bath, it may optionally be enclosed in a cylindrical metal casing. The composite body and cylindrical metal casing are also brazed together at their mutual contacts.Type: GrantFiled: March 19, 1990Date of Patent: September 24, 1991Assignee: Usui Kokusai Sangyo Kabushiki KaishaInventors: Kazunori Takikawa, Yuzo Hitachi
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Patent number: 5026611Abstract: A metal-made carrier body, for carrying thereon an exhaust gas cleaning catalyst, comprises a metal casing, and a multi-layered composite structure or honeycomb core structure composed of a sheet-like metal band and a corrugated metal band and enclosed in the tubular metal casing and joined therewith. The inner wall of the casing is provided with fine recesses for promoting the penetration of a brazing material. Because of the fine recesses, it is possible to join the honeycomb core structure and the casing together with adequate firmness, thus making the carrier body excellently durable.Type: GrantFiled: July 6, 1989Date of Patent: June 25, 1991Assignee: Usui Kokusai Kangyo Kabushiki KaishaInventors: Masayoshi Usui, Haruo Serizawa
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Patent number: 5005757Abstract: A number of rare earth-cobalt permanent magnet segments are temporarily secured together by means of a tool. Before securement the segment surfaces at each interface are pre-tinned. A solder pre-form in the shape of a "wagon wheel" rests on one transverse end of the magnet so that the spokes of the pre-form overlie the interface joints. The magnet is then lowered into a gradually heated glycerine bath until the solder melts and directly flows over each interface. Upon slow cooling of the cylinder, metallurgical bonding is effected between the various segments of the magnet.Type: GrantFiled: May 14, 1990Date of Patent: April 9, 1991Assignee: Grumman Aerospace CorporationInventors: Michael G. Kornely, Jr., Robert G. Micich, John M. Miller
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Patent number: 4972989Abstract: A method of joining surface mount components includes screen printing a single layer of solder paste or other adhesive onto a substrate, positioning a component with a planar lead with a hole through the planar lead over the solder and mounting a second component over the hole in the first lead. The assembly is heated or otherwise processed until the solder or adhesive flows by capillary action through the hole and into the space between the components such that it forms solder joint between the stacked components.Type: GrantFiled: October 30, 1989Date of Patent: November 27, 1990Assignee: Motorola, Inc.Inventors: Brian J. Black, Lisa M. Leding
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Patent number: 4841101Abstract: In the sealed feedthrough construction disclosed herein, a maximally compliant solder joint is provided between the low expansion ferrule of a glass insulted feedthrough connector and a bore in an enclosure bulkhead of a high expansion metal. The desired uniform radial thickness is established by providing a step on either the outer diameter of the ferrule or the inner diameter of the bore.Type: GrantFiled: December 21, 1987Date of Patent: June 20, 1989Inventor: John A. Pollock
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Patent number: 4816621Abstract: A ceramic-metal lead assembly, of the type suitable for use in nerve or heart pacemakers, has a disk of high-purity ceramic with at least one lead extending therethrough, the disk being soldered vacuum-tight to a flange ring via a solder gap. The flange ring consists of a metal which is resistant to body electrolytes, and the coefficients of thermal expansion of the joined materials are matched to each other, but are not identical. For avoiding cracks in the ceramic disk in the region of the solder connection, the solder gap has a width such that the diffusion path of the metal of the flange ring into the solder connection cannot exceed a selected distance in the solder bridge which forms at the soldering temperature. A solder zone which is free of the metal of the flange ring, and thus has a dutility which is not degraded by the flange ring metal, is formed around the ceramic disk.Type: GrantFiled: November 25, 1987Date of Patent: March 28, 1989Assignee: Siemens AktiengesellschaftInventors: Rosa M. Huebner, Ursula Huebner, Klaus G. Huebner
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Patent number: 4527819Abstract: A braided hose which has a frost-free socket joint made by placing a ring of brazing material above the joint and heating the joint below the ring. This way, the brazing material flows into the joint so that its external and exposed edge of the joint is completely filled. If the capillary action of the molten solder is incomplete, any voids in the joint are exposed to the interior of the hose and not to the atmosphere. The socket is very shallow, in the order of one-half to one convolution of the hose.Type: GrantFiled: September 13, 1983Date of Patent: July 9, 1985Assignee: Titeflex CorporationInventors: Norman H. Desilets, Chester T. Gazda, Richard A. Zamachaj
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Patent number: 4493143Abstract: A semiconductor member is attached to a base by placing a wafer of solder material on the base, placing a carrier member having a through capillary hole on the solder wafer, placing the semiconductor member on the carrier member and heating the arrangement whereby the solder material melts to solder the carrier member to the base, the solder material also travelling via the capillary hole to solder the semiconductor member to the carrier member.Type: GrantFiled: October 23, 1981Date of Patent: January 15, 1985Assignee: Telefunken Electronic GmbHInventor: Herbert Maier
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Patent number: 4477012Abstract: A method of brazing the nodes of honeycomb core material and the top and bottom panels to the honeycomb core material to form a sandwich structure. The method comprises the insertion in selected cells of the core, a coil or loop formed of normally flat resilient braze foil ribbon under tension and then releasing the tension to allow the braze foil, coil or loop to be urged against the cell walls under its own resiliency. The top and bottom panels are then installed over the core adjacent to the cell faying edges to form top and bottom surfaces. Pressure is then applied from the panels toward the honeycomb core material. The temperature of the sandwich structure is then elevated until the braze foil is caused to melt. Capillary attraction causes the now liquid braze material to flow into the interstices between the cell nodes and between the faying edges of the honeycomb core cells and the adjacent panels.Type: GrantFiled: December 13, 1982Date of Patent: October 16, 1984Assignee: Rohr Industries, Inc.Inventors: Charles L. Holland, Dale L. Jennings
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Patent number: 4385720Abstract: A T-shape joint includes a slant gap formed between joint faces of a vertical base metal and a horizontal base metal and the slant gap is filled perfectly with a brazing alloy without remaining any defect.The slant gap can be saw tooth shape gaps. The slant gap can be formed in the thickness direction of the vertical base metal.The molten brazing metal penetrates into the slant gap without forming a cavity for a stronger joint.Type: GrantFiled: September 6, 1979Date of Patent: May 31, 1983Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Wataru Shimada, Kazumichi Machida, Masaru Okada
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Patent number: 4373260Abstract: A method of manufacturing an electrical circuit wiring assembly comprises the steps of preparing a first sub-assembly having a metal board chassis and a first circuit element provided with hard stiff leads, preparing a second sub-assembly having a second circuit element provided with soft thin leads and an eyelet terminal for connecting the soft thin lead to the hard lead by means of a soldered junction, and assembling the first and second sub-assemblies by a soldering operation to form a main wiring assembly. In the second sub-assembly the second circuit element and the eyelet terminal are carried temporarily on an unsolderable mounting tool. The first and second sub-assemblies are temporarily coupled to each other during the forming of the main assembly by means of a coupling tool or jig for applying molten solder to an exposed connecting portion of the eyelet terminal and to portions of the hard and soft leads extending from the eyelet terminal.Type: GrantFiled: August 7, 1980Date of Patent: February 15, 1983Assignee: New Nippon Electric Company, Ltd.Inventors: Kazuaki Matsumura, Seiki Nakanishi
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Patent number: 4334646Abstract: A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder.Type: GrantFiled: April 17, 1980Date of Patent: June 15, 1982Assignee: Harris CorporationInventor: Henry J. Campbell
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Patent number: 4161809Abstract: A method of making a solar absorber panel is disclosed in which mild steel sheets are provided with a pattern of recesses such that when the sheets are superimposed, an internal hollow fluid heat transfer passage system is formed thereby including inlet and outlet manifolds joined by connecting passages. A metallic sealing material having a lower melting point than the sheets is placed in the recesses, the sheets are superimposed and the structure is peripherally welded to form a gas-tight envelope. The envelope is purged of air, partially internally evacuated and the edges of the internal passages sealed by heating the assembly above the melting point of the sealant material. The vacuum drawn on the envelope insures a tight seal between all passages as it allows external ambient air pressure to force the sheets together.Type: GrantFiled: September 26, 1977Date of Patent: July 24, 1979Assignee: Honeywell Inc.Inventor: Asbjorn M. Severson
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Patent number: 3977075Abstract: According to one aspect of the disclosure, a planar substrate receives a plurality of conductive posts therein, which posts include an offset medial portion having a laterally projecting notch portion. Certain posts are arranged with their notch portions in coplanar relationship and in latching registration with an interior sidewall portion of a housing received over the posts. Accordingly, the housing provides an insulating receptacle shroud for the posts and is latchingly retained in place without a need for attachment to the substrate. The shroud is also provided with card guides connected thereto by integral hinge portions enabling alignment of, and reducing twisting and warping of, the card guides. The card guides are additionally coupled together with rails further reducing twisting and warping of the guides. The terminals are advantageously mounted in strip form for ease in manufacture and assembly to the substrate.Type: GrantFiled: June 17, 1975Date of Patent: August 31, 1976Assignee: AMP IncorporatedInventors: James Edward Lynch, Kenneth Ronald Parmer, Robert Franklin Cobaugh