Applying Or Distributing Fused Filler Patents (Class 228/256)
  • Patent number: 10994523
    Abstract: A joint between at least one element of metal material and at least one element of plastic material is obtained by pressing these elements in contact against each other, with a simultaneous application of heat. A cladding of metal material and/or of plastic material is applied above the joint by additive manufacturing technology.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 4, 2021
    Assignee: C.R.F. SOCIETA CONSORTILE PER AZIONI
    Inventors: Daniele Pullini, Massimo Cucco, Gabriele Ciaccio, Fabio D'Aiuto, Michele Maria Tedesco
  • Patent number: 10556284
    Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: February 11, 2020
    Assignee: Seagate Technology LLC
    Inventors: Aaron Collins, Paul Davidson, Ralph Smith
  • Patent number: 10462945
    Abstract: A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: October 29, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masayuki Mantani, Takaaki Sakaue
  • Patent number: 10449641
    Abstract: A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 22, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masayuki Mantani, Takaaki Sakaue
  • Patent number: 10440866
    Abstract: System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers the undersupporting device to the transporter, which transports the undersupporting device to a working position. The undersupporting-device is fixed to the undersupporting-device installer. The carry-in side delivering unit delivers the board to the transporter, which transports the board to the working position.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 8, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masayuki Mantani, Takaaki Sakaue
  • Patent number: 9528172
    Abstract: A high-strength steel sheet having improved HIC resistance and fracture resistance even when it is thick has a chemical composition comprising, in mass %, C: 0.02-0.07%, Si: 0.05-0.50%, Mn: 1.10-1.60%, P: at most 0.015%, S: at most 0.0030%, Nb: 0.005-0.030%, Ti: 0.005-0.020%, Al: 0.005-0.060%, Ca: 0.0005-0.0060%, N: 0.0015-0.0070%, at least one of Cu, Ni, Cr, and Mo in a total of greater than 0.1% to less than 1.5%, and a remainder of Fe and impurities and a steel structure composed of at least 10% by area of bainite and a remainder of ferrite and pearlite. The degree of segregation is less than 1.6 for Nb and less than 1.4 for Mn in the central portion of the thickness of the steel sheet.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: December 27, 2016
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Izuru Minato, Nobuaki Takahashi, Akio Yamamoto
  • Patent number: 9329206
    Abstract: A method for manufacturing a probe card is provided wherein probes are held in a holding plate such that the respective probes correspond to through holes with their connecting end portions projected from one surface of the holding plate. A plate-like member including openings having larger diameters than diameters of the through holes and housing the connecting end portions in the openings is arranged by making one surface of the plate-like member abut the one surface of the holding plate. After supplying solder cream in the respective openings from the other surface of the plate-like member, a connection base plate and the holding plate are relatively fixed so that the solder cream, burying the connecting end portions of the respective probes held in the holding plate with the plate-like member removed, may abut the respective corresponding connection pads, and the solder cream is heated to melt the solder cream.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: May 3, 2016
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Tomokazu Saito, Yuki Kasai
  • Publication number: 20150132605
    Abstract: A composite composition that includes an MCrAlX alloy and a nano-oxide ceramic is disclosed. In the formula, M includes nickel, cobalt, iron, or a combination thereof, and X includes yttrium, hafnium, or a combination thereof, from about 0.001 percent to about 2 percent by weight of the alloy. The amount of the nano-oxide ceramic is greater than about 40 percent, by volume of the composition. A protective covering that includes the composite composition is also disclosed. The protective covering can be attached to a tip portion of a blade with a braze material. A method for joining a protective covering to a tip portion of a blade, and a method for repair of a blade, are also provided.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: General Electric Company
    Inventors: Sundeep Kumar, Anand Krishnamurthy, Kivilcim Onal, Pazhayannur Ramanathan Subramanian, Dennis Michael Gray, Padmaja Parakala
  • Publication number: 20150132143
    Abstract: A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38) formed at an angle (A1) of 35-60° relative to the component surface (36), and a second side (40) formed at an angle (A2) of 10-35° relative to the surface. The sides may be extended to intersect (44) without the necessity for a flat bottom surface (20) as is typical for prior art weld joints (10). The inventive weld joint may be formed by moving an end mill tool (60) into and along the surface with its axis of rotation (64) being transverse to the surface.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Inventors: Gerald J. Bruck, Ahmed Kamel
  • Publication number: 20150114727
    Abstract: An earth-boring tool may comprise a body having at least one blade, and at least one cutting element recess may be formed in a surface of the at least one blade. At least one cutting element may be affixed within the at least one cutting element recess. The at least one cutting element may comprise a substantially cylindrical lateral side surface configured to allow the at least one cutting element to rotate about a longitudinal axis within the at least one cutting element recess when the at least one cutting element is partially inserted into the at least one cutting element recess. The at least one cutting element may also comprise a back face comprising alignment features configured to abut complementary alignment features disposed on a back surface of the at least one cutting element recess. Methods of forming earth-boring tool bodies.
    Type: Application
    Filed: October 25, 2013
    Publication date: April 30, 2015
    Applicant: Baker Hughes Incorporated
    Inventor: William H. Heuser
  • Publication number: 20150115452
    Abstract: Semiconductor device packages and methods of manufacturing the semiconductor device packages are provided. A semiconductor device package may include a bonding layer between a substrate and a semiconductor chip, and the bonding layer may include an intermetallic compound. The intermetallic compound may be a compound of metal and solder material. The intermetallic compound may include Ag3Sn. A method of manufacturing the semiconductor device package may include forming a bonding layer, which bonds a semiconductor chip to a substrate, by using a mixed paste including metal particles and a solder material. The bonding layer may be formed by forming an intermetallic compound, which is formed by heating the mixed paste to react the metal particles with the solder material.
    Type: Application
    Filed: June 23, 2014
    Publication date: April 30, 2015
    Inventors: Jeong-Won YOON, Baik-woo LEE, Seong-woon BOOH, Chang-mo JEONG
  • Publication number: 20150098178
    Abstract: Described herein is an apparatus that includes a housing that defines an interior cavity. The housing also includes a feedthrough aperture. The apparatus also includes an electrical connector that is coupled to the housing over the feedthrough aperture. The electrical connector includes a base, a plurality of pins extending through the base, and a skirt positioned about a periphery of the base. The pins extend from a location external to the housing to a location within the interior cavity of the housing. Further, an inner surface of the base is co-planar with an outer end of the feedthrough aperture. The apparatus also includes solder positioned on the housing and against an entire periphery of the skirt to seal the electrical connector to the housing.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: HGST Netherlands B.V.
    Inventors: Noritaka Otake, Hiroshi Matsuda, Katsumasa Nakatsukasa, Kouki Uefune
  • Publication number: 20150090773
    Abstract: A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Edward SCHICK, Srikanth Chandrudu KOTTILINGAM, Benjamin Paul LACY, John Wesley HARRIS, JR., Brian Lee TOLLISON
  • Publication number: 20150090775
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Publication number: 20150086776
    Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.
    Type: Application
    Filed: March 27, 2013
    Publication date: March 26, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20150069999
    Abstract: A method for contacting at least two metal electrodes, wherein the metal electrodes are located in a cavity of a basic body of sintered ceramic and frontal end faces of the metal electrodes. The metal electrodes are arranged essentially planparallel to an outer surface of the basic body. The method includes steps as follows: introducing a solder into at least one hole of the basic body, wherein the hole is so embodied that it leads to a rear portion of the metal electrode away from the frontal end face of the metal electrode wherein the solder can wet the rear portion of the metal electrode, wherein the metal electrodes are in their longitudinal direction shorter than the basic body, especially have only ? of the length of the basic body; introducing a cable into the hole at least until the cable extends into the solder; and heating the basic body with solder and cable above the solidification temperature of the solder.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 12, 2015
    Inventors: Stephan Buschnakowski, Alexander Serfling
  • Publication number: 20150072170
    Abstract: Al—Mg and Al—Mg—Zn weld filler alloy compositions for use with fusion weldable 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy base metals are disclosed. The weld filler alloys may be used for joining a first aluminum base metal segment to a second aluminum base metal segment, where the base metal segments is at least one of 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy. The weld filler alloys, in wire or rod form, may also be used to repair a defective weld.
    Type: Application
    Filed: November 18, 2014
    Publication date: March 12, 2015
    Inventors: Jen C. Lin, Israel Stol, Kyle L. Williams
  • Publication number: 20150061118
    Abstract: A three-dimensional chip stack includes a first chip bonded to a second chip to form a bonded interconnection therebetween. The bonded interconnection includes a first conductive pillar overlying a first substrate of the first chip, a second conductive pillar overlying a second substrate of the second chip, and a joint structure between the first conductive pillar and the second conductive pillar. The joint structure includes a first IMC region adjacent to the first conductive pillar, a second IMC region adjacent to the second conductive pillar, and a metallization layer between the first IMC region and the second IMC region.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang, Kuo-Ching Hsu
  • Publication number: 20150044041
    Abstract: A gas turbine vane containment cap is attached to an inboard surface of the vane inner shroud by penetrating flat weld filler, formed in a root gap between the cap and inner shroud. A semi-circular bead weld filler is formed outboard the penetrating weld filler closer to the vane exterior. Vane containment caps so welded are more resistant to in-service cracking along weldments.
    Type: Application
    Filed: October 24, 2014
    Publication date: February 12, 2015
    Inventors: Mrinal Munshi, Shivashankar Vinay Amatiganahally, Eric L. Roach, Todd F. Young
  • Publication number: 20150041525
    Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 12, 2015
    Applicants: NISSAN MOTOR CO., LTD., Sanken Electric Co., Ltd.
    Inventors: Satoshi Tanimoto, Yusuke Zushi, Yoshinori Murakami, Kohei Matsui, Shinji Sato, Yu Fukushima
  • Publication number: 20150027768
    Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 29, 2015
    Inventors: Yasuhiro TAKASE, Kazuki HANADA, Kazunori KITAMURA
  • Publication number: 20150021379
    Abstract: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.
    Type: Application
    Filed: July 10, 2014
    Publication date: January 22, 2015
    Inventors: Bruce Patrick Albrecht, Christopher Hsu
  • Patent number: 8925789
    Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: January 6, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Publication number: 20140366624
    Abstract: A spacer for a thermal, flow measuring device, wherein the spacer has a planar bearing surface for a thin-film resistance thermometer and an otherwise circularly cylindrical, lateral surface, wherein the bearing surface is inclined relative to a longitudinal axis of the spacer.
    Type: Application
    Filed: November 22, 2012
    Publication date: December 18, 2014
    Inventors: Tobias Baur, Fanos Christodoulou, Martin Barth, Axel Pfau
  • Patent number: 8904914
    Abstract: Methods of forming a structure for treating a vessel include providing a mandrel and braiding a plurality of filaments around the mandrel. The mandrel may include a strand having a longitudinal axis and a plurality of balls coupled to the strand along the longitudinal axis. Pairs of the plurality of balls may be spaced along the longitudinal axis. Braiding the plurality of filaments around the mandrel may include, during braiding, forming a plurality of bulbs around the plurality of balls and forming necks between pairs of the plurality of balls. The methods may include, after braiding the plurality of filaments, heat treating (e.g., shape setting) the plurality of filaments on the mandrel. Portions of the braided plurality of filaments may be secured to the mandrel, for example using bangles, wire, and/or adhesive.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: December 9, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Publication number: 20140352933
    Abstract: A core assembly for a heat exchanger includes a plurality of parting sheets defining a plurality of fluid passages including a plurality of first fluid passages and a plurality of second fluid passages arranged in an alternating arrangement, wherein each of the plurality of parting sheets comprises a thickness of about 0.016?. Also included is a plurality of first fluid passage fins disposed between the plurality of parting sheets within each of the plurality of first fluid passages. Further included is a plurality of second fluid passage fins disposed between the plurality of parting sheets within each of the plurality of second fluid passages. Yet further included is a plurality of closure bars disposed between respective pairs of the plurality of parting sheets.
    Type: Application
    Filed: May 28, 2013
    Publication date: December 4, 2014
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Kurt L. Stephens, Michael Spineti
  • Publication number: 20140345939
    Abstract: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.
    Type: Application
    Filed: August 15, 2014
    Publication date: November 27, 2014
    Inventors: Kosuke Nakano, Hidekiyo Takaoka
  • Publication number: 20140341635
    Abstract: A brazed part includes two or more components that are brazed together and has related method of making. Using a method of locating parts relative to one another, an inter-component gap between the components may be formed. Subsequently, during brazing, flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 20, 2014
    Applicant: GKN SINTER METALS, LLC
    Inventors: Jeffrey W. Lemke, Ian W. Donaldson, John D. Gurosik
  • Patent number: 8887980
    Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: November 18, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Kurata, Daisuke Soma, Hiroshi Okada
  • Patent number: 8851358
    Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: October 7, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Tomokazu Saito, Seito Moriyama
  • Publication number: 20140291006
    Abstract: A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together, includes: filling a solder-filling-hole with cream solder, the solder-filling-hole provided so as to be open in a planar region of the first-land; arranging a solder-drawing-hole so that the solder-drawing-hole and the solder-filling-hole face each other, the solder-drawing-hole being formed so as to be open in a planar region of the second region, having a center position to be superposed on a center position of the solder-filling-hole, and having a solder wettability higher than a solder wettability of the solder-filling-hole; melting the cream solder in the solder-filling-hole by reflow heating and causing at least part of the cream solder to ascend to the solder-drawing-hole facing the solder-filling-hole; and jointing the first-land and the second-land together by solidifying the cream solder interposed between the firs
    Type: Application
    Filed: January 6, 2014
    Publication date: October 2, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Keiichi YAMAMOTO, Takahiro KITAGAWA
  • Publication number: 20140284376
    Abstract: A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.
    Type: Application
    Filed: June 3, 2014
    Publication date: September 25, 2014
    Applicant: Agere Systems LLC
    Inventors: Mark Bachman, John W. Osenbach
  • Publication number: 20140284375
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.
    Type: Application
    Filed: January 27, 2014
    Publication date: September 25, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Warren M. Farnworth, Rickie C. Lake, William M. Hiatt
  • Publication number: 20140241897
    Abstract: A fan blade includes first and second titanium portions that are secured to one another with an aluminum alloy braze. A method of manufacturing a fan blade includes providing first and second titanium portions, applying an aluminum alloy braze to at least one of the first and second titanium portions, and heating the fan blade to melt the aluminum alloy braze and join the first and second portions to one another to provide a fan blade with an airfoil exterior contour.
    Type: Application
    Filed: September 25, 2012
    Publication date: August 28, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventor: UNITED TECHNOLOGIES CORPORATION
  • Publication number: 20140226285
    Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 14, 2014
    Applicant: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Alexander Schmajew
  • Publication number: 20140212208
    Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 31, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Edward SCHICK, Srikanth Chandrudu KOTTILINGAM, Johnie Franklin McCONNAUGHHAY, Brian Lee TOLLISON, Yan CUI
  • Publication number: 20140203069
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.
  • Publication number: 20140197228
    Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
    Type: Application
    Filed: March 18, 2014
    Publication date: July 17, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas E. LOMBARDI, Donald MERTE, Gregg B. MONJEAU, David L. QUESTAD, Son K. TRAN
  • Publication number: 20140199115
    Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 17, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
  • Patent number: 8770462
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Raytheon Company
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • Patent number: 8740040
    Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: June 3, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Won Choi, Yon Ho You, Ki Ju Lee
  • Publication number: 20140144971
    Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.
    Type: Application
    Filed: January 29, 2014
    Publication date: May 29, 2014
    Applicant: Research Triangle Institute
    Inventors: Robert O. Conn, Daniel S. Stevenson
  • Publication number: 20140147075
    Abstract: An apparatus includes a slider structure having a waveguide and a cavity configured to align a laser to the waveguide. The cavity includes a plurality of solder bumps on a bottom of the cavity configured to electrically and thermally couple the laser to the slider. At least one mechanical stopper is disposed in the cavity to facilitate vertical alignment between an output of the laser and an input of the waveguide. At least one solder bump is disposed on the mechanical stopper to facilitate lateral alignment between the output of the laser and the input of the waveguide in response to a reflow of the solder bumps.
    Type: Application
    Filed: November 28, 2012
    Publication date: May 29, 2014
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventor: James Gary Wessel
  • Patent number: 8733618
    Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: May 27, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Publication number: 20140134459
    Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.
    Type: Application
    Filed: April 3, 2013
    Publication date: May 15, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen
  • Publication number: 20140124365
    Abstract: In a method of forming a cylindrical sputter target assembly, comprising the steps of: (a) providing a cylindrical backing tube; (b) providing a cylindrical sputter target, the inner diameter of which is larger than the outer diameter of the backing tube; (c) arranging the sputter target about the backing tube; and (d) bonding the sputter target to the backing tube by providing a solder layer between the backing tube and the sputter target; In accordance with the invention step (d) comprises directionally solidifying the solder layer.
    Type: Application
    Filed: April 29, 2011
    Publication date: May 8, 2014
    Inventors: Dieter Wurczinger, David Daniel
  • Publication number: 20140116331
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Application
    Filed: February 22, 2013
    Publication date: May 1, 2014
    Applicant: The Regents of the University of Michigan
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Publication number: 20140117001
    Abstract: A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 4.7 and 10.9 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.
    Type: Application
    Filed: January 7, 2014
    Publication date: May 1, 2014
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventor: Bruce Edward Anderson
  • Publication number: 20140099499
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: October 10, 2012
    Publication date: April 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: LARRY Alan BIDWELL, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Publication number: 20140097232
    Abstract: A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S?) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.
    Type: Application
    Filed: December 11, 2013
    Publication date: April 10, 2014
    Applicant: FUJIKURA LTD.
    Inventors: Nozomu Toyohara, Akira Sakamoto, Yohei Kasai