By Immersing In Stagnant Pool Patents (Class 228/259)
  • Patent number: 9956634
    Abstract: A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few ?m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: May 1, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Isamu Sato, Koji Watanabe, Kota Kikuchi, Michio Suzuki, Naoto Kameda, Hideki Nakamura
  • Publication number: 20140326490
    Abstract: A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
    Type: Application
    Filed: June 25, 2014
    Publication date: November 6, 2014
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Shunsaku Yoshikawa, Yoshie Yamanaka, Tsukasa Ohnishi, Seiko Ishibashi, Koji Watanabe, Hiroki Ishikawa, Yutaka Chiba
  • Publication number: 20140226285
    Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 14, 2014
    Applicant: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Alexander Schmajew
  • Publication number: 20140183250
    Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.
    Type: Application
    Filed: December 11, 2013
    Publication date: July 3, 2014
    Applicant: International Business Machines Corporation
    Inventors: Stephen M. Hugo, Matthew S. Kelly
  • Patent number: 8479390
    Abstract: A method for producing a connector has first to fifth processes. In the first process, a contact unit having a plurality of contacts and a tying part, is formed with the contacts tied at each axial direction middle part of the contacts by the tying part and with the contacts arranged parallel to each other. In the second process, a plating layer is formed on a part of the contact unit by soaking the contact unit in a plating bath from an axial direction one end side of the contact unit to an axial direction middle part of the tying part. In the third process, the contacts are isolated by cutting the tying part. In the fourth process, a part where the plating layer is formed, of the contact is inserted into a hole of a circuit board. In the fifth process, the contacts are soldered to the circuit board.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: July 9, 2013
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Teruyuki Ohnishi, Shinichi Isobe, Kohtaro Shiino
  • Patent number: 8371497
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: February 12, 2013
    Assignee: QUALCOMM Incorporated
    Inventor: Christopher James Healy
  • Patent number: 8348137
    Abstract: Connections can be made to microwires comprising a conductor of a lower melting point metal (e.g., indium 290) in a sheath of higher melting point polymer (e.g., PETG) by placing a small diameter spring, slightly larger in inside diameter than the outer diameter of the microwire, and of a readily solderable material over the distal end of the microwire. The conductor of the microwire is then soldered to the distal end of the spring in any of several ways that result in a solid member at the distal end of the microwire. The flexible spring provides a flexible support for the microwire, so that as the microwire flexes in use, the spring provides a strain relief; that is, the proximal portion of the spring flexes along with the microwire, so that the microwire bends over some distance rather than at a single point.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: January 8, 2013
    Assignee: Pascale Industries, Inc.
    Inventor: Willorage Rathna Perera
  • Publication number: 20120199393
    Abstract: A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
    Type: Application
    Filed: September 2, 2010
    Publication date: August 9, 2012
    Inventors: Shunsaku Yoshikawa, Yoshie Yamanaka, Tsukasa Ohnishi, Seiko Ishibashi, Koji Watanabe, Hiroki Ishikawa, Yutaka Chiba
  • Patent number: 8188010
    Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: May 29, 2012
    Assignees: The Furukawa Electric Co., Ltd., International Superconductivity Center, The Juridical Foundation
    Inventors: Masashi Yagi, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara
  • Publication number: 20120091188
    Abstract: Solder pot intended for a machine for selective soldering of through-hole electronic components on a printed circuit board, characterized in that it is in the form of a right prism, preferably with a hexagonal base.
    Type: Application
    Filed: June 9, 2010
    Publication date: April 19, 2012
    Applicant: ROBERT BOSCH GMBH
    Inventor: Bassem Elhage
  • Publication number: 20120048912
    Abstract: Embodiments of a method for forming an MCrAlY coating on a gas turbine engine component are provided, as are embodiments of a method for repairing a structurally-damaged region of a gas turbine engine component utilizing an MCrAlY material. In one embodiment, the method includes the step of preparing an MCrAlY slurry containing an MCrAlY powder, a low melting point powder, a binder, and a dilutant. After application over the gas turbine engine component, the MCrAlY slurry is heated to a predetermined temperature that exceeds the melting point of the low melting point powder to form an MCrAlY coating on the gas turbine engine component. The MCrAlY powder may have any one of a number of different compositions.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 1, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Yiping Hu, Richard L. Bye
  • Patent number: 8104661
    Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: January 31, 2012
    Assignee: Tamura Corporation
    Inventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
  • Publication number: 20110139855
    Abstract: Methods and apparatus for improving wave soldering processes by measuring and controlling the amount of residual oxygen present in the soldering tank and thereby avoiding excess dross formation. The methods and apparatus utilize a glass plate with ports to support sensors, e.g. oxygen sensors to both protect the solder bath from contact with air and to measure the oxygen levels associated with the solder bath.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 16, 2011
    Inventor: Tero RISTOLAINEN
  • Patent number: 7861909
    Abstract: Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: January 4, 2011
    Assignee: Nihon Superior Sha Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Publication number: 20100314433
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: June 11, 2009
    Publication date: December 16, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventor: Christopher James Healy
  • Patent number: 7845540
    Abstract: Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: December 7, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Rick C. Lake, Ross S. Dando
  • Publication number: 20100276475
    Abstract: The invention relates to a supply device for feeding a gas to a wave brazing or tinning machine, wherein said machine is capable of generating at least one soldering wave, comprising: a gas inlet channel, a set of N secondary channels immersed in the solder bath of the brazing or tinning machine, and an injection channel supplying at least one injection means for injecting the gas in the vicinity of said at least one wave, each secondary channel having its inlet end connected to the injection channel, characterized in that the number N of secondary channels is equal to or higher than 1, and in that the inner diameter d of the secondary channels and the gas flow rate Q0 in the inlet channel are selected so that the gas flow in the secondary channels is in a turbulent mode.
    Type: Application
    Filed: January 8, 2009
    Publication date: November 4, 2010
    Inventors: Marc Leturmy, Alban Poirier
  • Publication number: 20100065246
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 18, 2010
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
  • Publication number: 20090289102
    Abstract: Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.
    Type: Application
    Filed: July 19, 2006
    Publication date: November 26, 2009
    Applicant: NIHON SUPERIOR SHA CO., LTD.
    Inventor: Tetsuro Nishimura
  • Publication number: 20090233799
    Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi(bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
    Type: Application
    Filed: February 2, 2009
    Publication date: September 17, 2009
    Applicants: THE FURUKAWA ELECTRIC CO., LTD., Int. Superconductivity Tech Ctr the Juridical Fdn.
    Inventors: Masashi YAGI, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara
  • Publication number: 20090008434
    Abstract: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
    Type: Application
    Filed: September 5, 2008
    Publication date: January 8, 2009
    Applicant: METALLIC RESOURCES, INC.
    Inventor: Stanley R. Rothschild
  • Publication number: 20080210743
    Abstract: A process of fabricating a stack capacitor includes the following steps. First of all, multiple energy storage units having respective first electrodes and second electrodes at opposite sides are provided. These energy storage units are then stacked to have the first electrodes contact with each other and the second electrodes contact with each other, wherein the energy storage units are initially positioned by a fastening member. Next, the first electrodes are bonded together via a first conductive layer and the second electrodes are bonded together via a second conductive layer, thereby fabricating the stack component.
    Type: Application
    Filed: September 13, 2007
    Publication date: September 4, 2008
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Ming-Tsung Lee, Chen-Yu Yu, Kai-Hung Huang, Lin-Hsien Hu
  • Patent number: 6948650
    Abstract: When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing the dross from the reservoir includes a skimming plate pivotally attached to a displaceable structure; a stop is provided to restrict the degree to which the skimming plate can pivot so that the skimming plate will not pivot more than 90° from vertical to enable the skimming plate to dig into the dross and collect dross when the displaceable structure is displaced toward on outlet of the reservoir. Further still, the displaceable structure of the skimmer can be controlled via a computer control system storing software code instructions for a motor to extend and retract the displaceable structure such that the skimming plate extends to a position further from the outlet port of the reservoir with each displacement cycle.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: September 27, 2005
    Assignee: Speedline Technologies, Inc.
    Inventors: Keith A. Howell, James M. Morris, David M. McDonald, Eric Wayne Becker, Joseph Wayne Brickell
  • Patent number: 6789720
    Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: September 14, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Uchida, Kazuo Kido, Tomoyuki Nakano, Takeshi Kuribayashi, Yoshihiko Misawa
  • Publication number: 20040129765
    Abstract: A printed circuit board junction box including an outer case and a printed circuit board. The outer case has a top cover and a bottom cover. The printed circuit board has female and male electrical terminals mounted in through-holes that extend from an upper surface to a lower surface of the printed circuit board. One side of the printed circuit board has only male electrical terminals. The printed circuit board is soldered by raising a molten solder container to contact the lower surface of the printed circuit board. The printed circuit board is turned in a heating chamber so that the molten solder flows through the through-holes in the printed circuit board to solder the female and male electrical terminals to the printed circuit board.
    Type: Application
    Filed: January 6, 2003
    Publication date: July 8, 2004
    Inventors: Cheol Seob Lee, Yang Youn Choi, Jong Keun Song
  • Patent number: 6758387
    Abstract: The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An electroplated coating is applied to a portion to be soldered of a difficult to solder material, the difficult to solder material is then passed through molten solder to which ultrasonic waves are applied, and a large amount of solder is adhered only to solder plated portions.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: July 6, 2004
    Assignee: Senju Metal Industry Co., Ltd.
    Inventor: Mitsuo Zen
  • Patent number: 6760396
    Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.
    Type: Grant
    Filed: February 4, 1946
    Date of Patent: July 6, 2004
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Ernest R. Boller, Lowell D. Eubank
  • Publication number: 20040011857
    Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.
    Type: Application
    Filed: July 16, 2002
    Publication date: January 22, 2004
    Inventor: John W. Abouchar
  • Patent number: 6592021
    Abstract: A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the substrate. A bath of conductive bonding material (e.g., a low melting point solder) is made inside a tray-like metal chassis of the assembly. The circuit board is floated on the bath and excessive portion of the conductive material is absorbed. A branch circuit for branching a first path into at least two second paths is provided by mainly using impedance transformers but by using fewest possible stubs. Also, the elements are arranged in symmetry around the axis through the first path. This yields a wide operating frequency band. A waveguide-microstrip line transition that is easy to work and low in transition loss is provided by shaping the wider walls of the ridge waveguide so as to spread out toward the end.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: July 15, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd
    Inventors: Ushio Sangawa, Suguru Fujita
  • Patent number: 6551650
    Abstract: A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52). The composite substrate (20) is then dipped or otherwise immersed into a reservoir of liquid solder (106). Next, the composite substrate (20) is redrawn (116), or otherwise removed, from the liquid solder to form solder bumps (113) on the at least one metal wetting pad (52).
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: April 22, 2003
    Assignee: Corning Incorporated
    Inventors: Alain R. Carre, Jurriaan Gerretsen
  • Patent number: 6523735
    Abstract: A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to be bonded, (B) mechanically abrading portions of the respective bonding faces contacting the bonding material to be bonded to each other, (C) setting the respective objects fixed in a predetermined position relative to each other while maintaining the respective objects in contact with the bonding material in the fluid state thereof, and (D) solidifying the bonding material to bond the respective objects to each other. In the respective steps (A)-(D), the bonding material is present at the bonding portions to be bonded to each other of the respective objects constantly and without discontinuities.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: February 25, 2003
    Assignee: Nippon Sheet Glass Co., Ltd.
    Inventors: Koichi Sakaguchi, Shinjiro Domi, Shigeki Nakagaki, Yoshikazu Toshikiyo
  • Publication number: 20030003011
    Abstract: Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.
    Type: Application
    Filed: June 14, 2002
    Publication date: January 2, 2003
    Inventors: Rikiya Kato, Shinichi Nomoto, Hiroshi Okada
  • Publication number: 20020195479
    Abstract: The invention describes a device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners.
    Type: Application
    Filed: June 18, 2002
    Publication date: December 26, 2002
    Inventors: Bruno Benedetti, Christoph Nagler, Joerg Stengele
  • Publication number: 20020162879
    Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.
    Type: Application
    Filed: April 10, 2002
    Publication date: November 7, 2002
    Applicant: Vitronics Soltec B.V.
    Inventors: Gerrit Schouten, Fransiscus H.C. Benning, Lambertus P.C. Willemen
  • Publication number: 20020096555
    Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.
    Type: Application
    Filed: January 23, 2001
    Publication date: July 25, 2002
    Applicant: ORBOTECH LTD.
    Inventors: Scott Steven Waxler, Dan Zemer
  • Publication number: 20020092899
    Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.
    Type: Application
    Filed: December 12, 2001
    Publication date: July 18, 2002
    Applicant: ShinMaywa Industries, Ltd.
    Inventors: Akira Miyoshi, Masahiro Ikeji, Nobuo Satou, Shigeru Sakaue, Tadashi Taniguchi
  • Publication number: 20020047038
    Abstract: A circuit assembly having a thin and large-area dielectric substrate and an improved earthing condition. To make the assembly, a circuit board comprising the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the substrate. A bath of conductive bonding material (e.g., a low melting point solder) is made inside a tray-like metal chassis of the assembly. The circuit board is floated on the bath and excessive portion of the conductive material is absorbed. A branch circuit for branching a first path into at least two second paths is provided by mainly using impedance transformers but by using fewest possible stub(s). Also, the elements are arranged in symmetry around the axis through the first path. This yields a wide operating frequency band. A waveguide-microstrip line transition that is easy to work and low in transition loss is provided by shaping the wider walls of the ridge waveguide so as to spread out toward the end.
    Type: Application
    Filed: November 15, 2001
    Publication date: April 25, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Ushio Sangawa, Suguru Fujita
  • Patent number: 6250537
    Abstract: A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped into a solder pot to refill the thimble with solder, the support rods abut the bottom of the solder pot, and the thimble continues to slide down the support rods causing the scraper to scrape away dross on the thimble.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: June 26, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Miguel I. Avila, Oscar Vazquez
  • Patent number: 6209776
    Abstract: In a flyback transformer device wherein the leads of diodes or like electronic components are connected between pairs of terminal pieces provided upright at opposite ends of a coil bobbin, the lead ends, of the components are fixedly connected to the respective terminal pieces by electric welding. A coil conductor wound around the bobbin has an end twined around the terminal piece, and the twined portion is soldered by dipping.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: April 3, 2001
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Akio Kurogi, Hiroshi Okamoto, Hideo Onishi, Yasushi Akado
  • Patent number: 6145733
    Abstract: The invention concerns a method for soldering of additional electronic components onto a circuit board having components which have already been soldered and mounted thereto, wherein the additional components are plugged through the circuit board and soldered thereto. In order to be able to subsequently solder the components in a simple and reliable fashion, a template, having a pattern of holes corresponding to the soldering points and locations which are to be subsequently formed on the circuit board, is lowered and pressed onto the surface of a solder bath in such a fashion that the solder displaces into the holes and rises up within same. The circuit board having the previously mounted additional components is placed onto the template in such a fashion that the regions which are to be soldered are disposed within the openings of the template and dipped into the solder located therein.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: November 14, 2000
    Assignee: Herbert Streckfuss GmbH
    Inventors: Herbert Streckfuss, Volker Liedke
  • Patent number: 5934540
    Abstract: A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion chamber has a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber, and for damming and holding the molten solder within the solder immersion chamber. A pair of oil weirs is provided adjacent either side of the upper solder chamber for continuously flowing oil to flood the top surface of the molten solder in the solder immersion chamber. A skimmer skims oil from the top surface of the molten solder, and returns the separated oil to the pair of oil weirs.
    Type: Grant
    Filed: July 31, 1997
    Date of Patent: August 10, 1999
    Assignee: Teledyne Industries, Inc.
    Inventor: Nicholas J. Scheurich
  • Patent number: 5845839
    Abstract: A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the plunger during the soldering operation of the workpiece accomplishes continual flow across the soldered workpiece thereby removing any contaminants which rise to the surface or are introduced by the workpiece.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: December 8, 1998
    Assignee: General Motors Corporation
    Inventors: Thomas Dale Dodge, Ronald Dale Gentry
  • Patent number: 5711473
    Abstract: An inert atmosphere spot soldering process and apparatus uses cups arranged to match the arrangement of the terminals to be soldered. The cups are filled to over flowing with liquid solder and provided with a enveloping flow of hot inert gas. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder. After immersion, the terminals are raised gently non parallel to the solder surface until they are above the solder and then the flow of inert gas is terminated permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: January 27, 1998
    Inventor: William Sund
  • Patent number: 5611480
    Abstract: In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.
    Type: Grant
    Filed: October 3, 1994
    Date of Patent: March 18, 1997
    Assignee: Pillarhouse International Limited
    Inventors: Alexander J. Ciniglio, Michael Tombs, Neil Squire
  • Patent number: 5497936
    Abstract: A method is provided for soldering a coil winding to a terminal pin. A specific quantity of solder is applied onto the terminal pin, the terminal pin having a winding end wrapped therearound. The solder, for example, can be applied by immersing the pin end into a solder bath having a temperature only slightly above the melting point of the solder. Subsequently, the solder is melted with a welding torch under a protective atmosphere only at a power and time required to achieve a soft-soldering temperature. As a result thereof, a soldering free of fluxing agent and without the high thermal stress of a welding is possible. Other embodiments include placing a ring of solder onto the terminal prior to heating. Also, a predetermined length of solder wire can be brought into contact with the terminal pin prior to heating. The invention provides a guide tube device for such a purpose.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: March 12, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventors: Erich Vojta, Horst Hendel
  • Patent number: 5370297
    Abstract: In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft having a hexagonal cross-section. A pivotable lobe couples the shaft to a shaft to lower the component holder and to rotate it (by rotation of shaft). The stepper motors allow for variable speed of vertical movement of the component holder and for selective rotation.
    Type: Grant
    Filed: March 3, 1993
    Date of Patent: December 6, 1994
    Assignee: Pillarhouse International Limited
    Inventors: Alexander J. Ciniglio, Michael Tombs, Neil Squire
  • Patent number: 5335843
    Abstract: A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on the liquid solder in the container establishes a consistent level enabling a mechanized process to dip the junctions the same depth each time. Between dips the container is refilled. The size of the container limits the exposure of other adjacent devices to the heat of the solder and also provides a limited quantity of solder to the junction thus providing a consistent soldered connection.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: August 9, 1994
    Inventor: William Sund
  • Patent number: 5299728
    Abstract: Apparatus and method for forming long lengths of laminated superconducting tape by passing three foils over idler pulleys, through a solder bath and between pinch rollers having a portion which extend above the solder bath to enable cleaning of the pinch rollers during the formation of the superconducting tape with means to adjust the pressure applied by the pinch rollers, and to adjust the laminated tape takeup tension independently from the foil process tension.
    Type: Grant
    Filed: October 28, 1992
    Date of Patent: April 5, 1994
    Assignee: General Electric Company
    Inventors: Christopher G. King, Gerhard S. Kobus, Anthony Mantone, Malvin L. Dennis, Frank D. Shaffer, Richard A. Stephens, Neil G. Fiddes
  • Patent number: 5288009
    Abstract: The method comprises the steps of providing a vessel for containing a solder melt, and a bowl having a horizontal upper rim with an upwardly directed edge extending therealong; immersing the bowl in the solder melt contained in the vessel; lifting the bowl to a position where at least the upper rim is located above the solder melt contained in the vessel, whereby molten solder is drawn by the bowl; dipping conductive elements of a device into the molten solder drawn by the bowl; separating the conductive elements from the molten solder drawn by the bowl; and, immediately after the separation, spinning the device about a substantially vertical axis. The spinning step comprises a first phase of submitting the device to a selected angular acceleration, a second phase, having a selected duration of spinning the device at a selected maximum rotational velocity, and a third phase submitting the device to a selected angular deceleration.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: February 22, 1994
    Assignee: Carrar
    Inventors: Christian Corlay, Jean-Claude Germain, Claude Chevalier
  • Patent number: 5236117
    Abstract: A method and apparatus for tinning and soldering metal parts of electronic components and assemblies, and removing excess solder therefrom. The metal parts of the electronic components and assemblies are heated to a temperature near that of molten solder. A holding fixture, adapted to hold the heated components, slidably connects to an acceleration means which dips the metal parts of the components into the molten solder. Then acceleration energy is applied to the acceleration means, causing it to rapidly remove the components from the molten solder. Rapidly removing the components from the molten solder leaves excess solder behind, whereby all metal parts of the components are thoroughly tinned and soldered together without leaving unwanted solder bridges therebetween. A vibration means may also be used to prevent solder voids and promote solder wetting in densely packed leads and rails being tinned.
    Type: Grant
    Filed: June 22, 1992
    Date of Patent: August 17, 1993
    Assignee: Staktek Corporation
    Inventors: Jerry M. Roane, Carmen D. Burns