Abstract: A method for minimizing voids when soldering a printed circuit board being equipped with components, in particular with electrical and/or electronic components, includes oscillation of the printed circuit board while the solder situated between the components and the printed circuit board is being melted or after it has been melted. In this respect, the frequency of the oscillation changes between a starting frequency and a final frequency. Preferably, the oscillation is introduced in a direction of the printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop.

Abstract: A process for closing an opening in a surface of a component, and components formed thereby. The process entails forming a channel in the component surface so that the channel at least partially surrounds an opening at the component surface. An alloy is then deposited in the channel to form a crack-free deposit in the channel. A step is then machined that intersects the opening and is at least partially formed in the deposit. The step defines a recess that is at least partially surrounded by a peripheral portion of the deposit and has a surface recessed into the component surface. A cap is placed in the recess and welded to the peripheral portion of the deposit to define a weld joint that completely closes the opening. The surface of the weld joint is then machined to form a machined surface that is substantially flush with the component surface.

Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.

Abstract: There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can be operated at temperatures of 600° C. or greater. This invention allows for solder connections to be formed using solder paste or high-temperature.

Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.

Abstract: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.

Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.

Abstract: A process for repairing a turbine component of a turbomachine, as well as a sintered preform used in the process and a high gamma-prime nickel-base superalloy component repaired thereby. The sintered preform contains a sintered mixture of powders of a cobalt-base braze alloy and a cobalt-base wear-resistant alloy. The braze alloy constitutes at least about 10 up to about 35 weight percent of the sintered preform and contains a melting point depressant such as boron. The preform is formed by mixing powders of the braze and wear-resistant alloys to form a powder mixture, and then sintering the powder mixture. To use the preform, a surface portion of the turbine component is removed to expose a subsurface portion, followed by diffusion bonding of the preform to the subsurface portion to form a wear-resistant repair material containing the braze alloy dispersed in a matrix of the wear-resistant alloy.

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract: Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically non-conducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: Spherical balls, notably microballs of welding alloys, are produced by passing a melted material through vibrating orifices of a granulation pot, in order to form droplets which solidify when falling, by gravity, into a cooling tower filled with an inert gas. To improve the surface condition of the balls, the inert gas comprises approximately 15 to 150 ppm of oxygen. Moreover, the melted material is subject to ultrasound stirring just before being fed into the granulation pot. The balls are, preferably, dampened at the outlet of the cooling tower by brushes composed of polyamide wires. Besides, the control of the vibration frequency of the vibrating orifices in relation to the percentage of balls meeting the standards enables to improve the output.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: A method of making a double layer capacitor consists of the steps of: impregnating each of a plurality of carbon preforms with a metal; forming a plurality of current collector foils, each of the plurality of current collector foils having a tab portion and a paddle portion; forming a plurality of electrodes by positioning one of the plurality of carbon preforms against respective paddle portions of each of the plurality of current collector foils, wherein each of the plurality of electrodes comprises one of the plurality of current collector foils and one of the plurality of carbon preforms; stacking each of the plurality of electrodes such that tab portions of adjacent ones of the plurality of current collector foils are offset, thereby forming an electrode stack; interposing respective porous separator portions between each of the plurality of electrodes, wherein the porous separator portions function as electrical insulators between the adjacent ones of the plurality of electrodes preventing electrical sh

Abstract: An apparatus for manufacturing solder balls including a tundish, a vibrator, a cooling liquid tank an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel, and a cooling liquid reservoir. The tundish has orifices at its bottom. The vibrator is immersed in the molten metal of the tundish and generates vibrations. The cooling liquid tank is situated under the tundish and is provided with a cooling liquid heater at its upper and middle outer surface, a cooling liquid cooler at its lower outer surface, and a cooling liquid discharge conduit at its top. The inactive atmospheric chamber is interposed between the bottom of the tundish and the op surface of the cooling liquid. The molten metal receiving tray is seated on a portion of the inactive atmospheric chamber and is horizontally movable.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at a high rate and are highly uniform because of the nature of capillary stream break-up. Applied harmonic disturbances are used to control and generate the satellite and parent droplets. The satellite droplets are electrostatically charged on a droplet-by-droplet basis and are then deflected by, e.g., an electric field to predetermined locations on a substrate. The substrate is moveable, attached to an x-y table, for facilitating the placement of satellite droplets on the substrate. The satellite droplets can be placed in individual locations on the substrate (e.g., for forming a ball grid array) or can be overlapped to form conductive traces. Because the satellite droplets have small diameters, these traces may have correspondingly small widths or pitches.

Abstract: A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

Abstract: A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrations involves the following steps: a semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a suction hole, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and ultrasonic vibrations are applied from the suction tool to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.

Abstract: A liquid dosing device, comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T.sub.1, and a ceramic actuator element which is in intimate contact with a portion of the external surface of the tube. The tube and the element are mutually adhered using a solder having a melting point in excess of T.sub.1. The liquid in the reservoir may be molten solder or glue.

Abstract: A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the workpieces to be joined; mechanically activating the molten solder material, to break oxide films on the solder material, while the solder material contacts the surfaces of the workpieces to be joined; assembling the surfaces of the workpieces to be joined; and applying pressure to the surfaces of the workpieces to be joined both while the solder material is molten and as the solder material cools to a solid.

Abstract: A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.

Abstract: A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.

Abstract: A method of eliminating or substantially eliminating voids formed in the bottom of high aspect ratio holes following the physical vapor deposition of a material over the surface of a substrate. The method includes placing the substrate in an ultrasonic processing chamber filled with a fluid and having an ultrasonic source. The ultrasonic source is used to generate ultrasonic waves at a frequency no higher than is sufficient to cause a flow of the material adjacent the voids into these voids, without significantly affecting the deposited material elsewhere on the substrate.

Abstract: The present invention pertains to a device for the flux-free soldering of printed circuit boards guided over the soldering wave of a wave soldering nozzle, wherein the solder is vibrated by means of at least one ultrasonic electrode (sonotrode), the surface of the sonotrode is directly rinsed by the soldering wave, and the printed circuit boards are guided just above the surface of the sonotrode. It is provided that the surface (12, 28) of the sonotrode (5, 21) forms at least a partial area of the surface of the wave former (11, 13) of the wave soldering nozzle (2, 22).

Abstract: A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than the melting temperature of the solder and while at the elevated temperature, vibrating the parts to align (center) the areas with respect to one another. Accordingly a reflow oven designed to practice this invention includes a conveyor system with three continuous belts leading in series from the entrance to the exit of the oven. The first belt carries the parts through a temperature zone where melting of the binder occurs; the second belt carries the parts through a hotter zone where melting of the solder and vibration to effect centering occurs; the third belt carries the part through the cooling zone. Separation of the belt into three isolated sections prevents disturbance of the parts when they are located in areas where the solder is not molten.

Abstract: A radiation-shielding storage/transport container has a cast-iron vessel having an open end defining an end face, a steel ring engaging the end face and forming at least one annular seat, a weld unitarily bonding the ring to the end face, and a cover secured to the steel ring in the seat thereof. The cast-iron vessel is formed at its open end with an annular seat having a shoulder surface forming the end face. The weld is an aluminothermic weld that extends over the entire surface of the interface between the ring and the vessel. The ring is formed with two such seats and the cover includes an inner plug cover and an outer cover each in a respective one of the seats. The outer cover is of steel and a second peripheral weld connects the outer cover to the respective seat.

Abstract: A joining method of an aluminum member to a dissimilar metal member excluding copper by brazing or soldering through the use of a brazing filler metal or a solder for aluminum member; in which a plating composed of a metal voluntarily selected from copper, aluminum, zinc, lead, silicon, cadmium, tin and an alloy having major component of two or more kinds of them, is previously applied on a surface of joined portion of the dissimilar metal member, the plated joined portion of the dissimilar metal member is dipped in a molten brazing filler metal or a molten solder and ultrasonic vibration is given to the joined portion to stick the brazing filler metal or the solder to the joined portion, and a brazing or a soldering is carried out thereafter.

Abstract: A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Abstract: A tunnel for fluxless soldering, is a straight linear tunnel which contains vibrating means to vibrate a solder wave and a non-explosive gas atmosphere. The gas atmosphere includes a small portion of hydrogen or other gaseous reducing agent, sufficient to achieve a fluxing action. A process for soldering an element comprises the steps of conveying the element through a tunnel containing a non-explosive gas atmosphere substantially excluding oxygen, heating the element in the tunnel, soldering the element, and retaining the element in the gas atmosphere of the tunnel until solder on the element has solidified.

Abstract: Two metallic surfaces are bonded together by coating each of the metallic surfaces with a layer of a first material and a layer of a second and different material contacting the layer of the first material. The first material and second material are chosen so that a eutectic liquid layer will form at the interface between them. The layers of the second material on each of the metallic surfaces are abutted together and then the layers are heated above the eutectic temperatures to form a localized liquid, which upon solidification results in an interconnection between the surfaces.

Abstract: An automatic braze welding apparatus comprises a divisional rotatable index drive for indexing a rotatable plate in increments of 45.degree.. A plurality of clamping devices are used for safely seating a workpiece radiator at the divisional radial positions of the rotable plate. At least one flux supplying head is mounted on a first position of the divided rotatable plate, and at least one first welding manifold provided with a plurality of torches with at least one position changeable means is mounted on the divisional second and fifth positions, respectively. At least one second welding manifold performs second welding work at the upper surface of the divisional third and sixth positions, and at least one product position correcting device corrects any unbalanced state of the product at the fourth and seventh positions, thereby clamping the radiators by means of the product clamping means and removing it therefrom.

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.