Abstract: A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

Abstract: A method and apparatus for circumferential application of materials to an interior surface of a curved pipe includes providing a pipe support with a rotational axis. A curved section of pipe is mounted to the pipe support. An arm supporting an applicator head is positioned within the curved section of pipe. The pipe support is rotated about the rotational axis, while coordinating movement of the arm to maintain the applicator head in a working position within the curved section of pipe.

Abstract: A roller-type solder coating device for applying a coating of liquid solder to a workpiece. The device has a solder bath tank, a coating roller, and a nozzle connected to a pumping chamber provided in the tank to provide a flow of the solder bath to the coating roller. A trough is positioned underneath the coating roller and similarly connected to the nozzle so as to prevent direct re-entry of the solder delivered from the nozzle into the solder bath. The tank may be sealed and inert gas introduced therein to prevent oxidation of the solder contained within the tank. A second coating roller may be provided so as to permit simultaneous coating of opposite sides of a workpiece during its passage between the coating rollers.

Abstract: A method for the discretionary interconnection of plural devices into an array includes the steps of designing bridge sites between the devices, individually testing the devices, inking over the bridge sites to devices which do not meet predetermined parameters, and soldering in a manner to cause the solder to bridge the gap between the acceptable devices and the rest of the array but not to bridge the gap to unacceptable devices. In devices comprised of multiple parallel elements, only sub-elements which fall within predetermined functional requirement ranges are incorporated into the parallel array produced. This method of discretionary interconnection is readily adapted to automated techniques for fabricating semiconductor MOS devices such as MCTs, IGBTs and parallel MOSFET arrays.

Abstract: An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel longitudinally extending rails mounted on the top portion on opposing sides of said central cavity; a flux tank mounted in said central cavity approximate said first end to hold a liquid flux for flux-coating electronic component leads; a heated pot mounted in said central cavity approximate said second end to hold a hot molten solder bath for tinning the electronic component leads; a powered, wheeled electronic-component transport adapted to ride on said rails to carry electronic components from said first end over the flux tank to the second end over said solder pot and back again; two powered cam means mounted in said transport, rotatable to a high transport position and a low processing position, said c

Abstract: A process for soldering circuit boards comprising the steps of:(a) applying a solder flux coating to the solder side of a board;(b) drying the flux on the board and preheating the solder side of the board by sequentially(i) directing a stream of warm gas over the solder side of the board,(ii) positioning the solder side of the board over a hot molten solder bath,(c) soldering the solder junctions on the board by immersing the solder side of the board into the surface of the hot molten solder bath by sequentially(i) immersing a first edge of the board into the surface of the solder bath,(ii) lowering the remainder of the board into the surface of the solder bath,(iii) longitudinally moving the board in the solder bath, and(iv) lifting the board from the surface of the solder bath at an angle to the surface of the solder bath to drain excess hot molten solder from the board.

Abstract: An apparatus for forming pocket welts is disclosed. The upper portion of the external breast pocket of men and women's sport and suit jackets are frequently constructed by making a cut in the breast of the jacket and connecting a pocket to the inward side of the jacket fabric. A pocket welt is joined to the exterior of the breast, just below the cut and along its sides to form a top portion of the completed pocket. The pocket welt is constructed using a precut piece of fabric which is positioned by an operator on a template, which forms a portion of the apparatus. The fabric is secured by a vacuum and is folded by the operator along lines determined by the template. Subsequent to folding, a precut fusing material may be positioned by the operator over the fabric. The apparatus is then actuated by the operator causing the fabric and fusing to be folded and pressed, automatically. If fusing is used, the temperature of the platens may be set sufficiently high so as to cause the fusing to bond to the fabric.

Abstract: A solar liquid-to-liquid heat exchanger, method of making the same, and hot water heating apparatus employing same are provided wherein such heat exchanger is comprised of a first tubular member made of a heat conductive tube material and having a plurality of turns, a second tubular member made of a heat conductive tube material and having a plurality of turns which correspond to and are fixed against the turns of the first member to provide a strong mechanical and thermal connection between immediately adjacent faces of associated member turns. The fixing of the turns of the members and utilization of the heat exchanger in a hot water heating apparatus with flow of a solar fluid used in such apparatus in one direction through the first tubular member and water to be heated through the second tubular member in counterflow to the one direction assures optimum transfer of heat from the solar fluid to the water to be heated.

Abstract: To improve the solderability of the terminals or connections of integrated circuit components (IC-components) with parallel connection rows these must be pre-tin plated. An apparatus is disclosed which immerses the connections or terminals to be pre-tin plated as deeply as possible into the solder bath without exposing the components to impermissible thermal loads. This is obtained in that the components which are to be initially or pre-tin plated are tilted about an axis extending parallel to the terminal or connection row in a manner such that the connections of a row are simultaneously immersed into the solder bath.

Abstract: A fixture is provided for holding a hybrid substrate having a plurality of components already soldered to conductive patterns and/or lands on the front side thereof and having fingers of a lead frame pressed over one edge thereof for dip soldering lead frame fingers to lands. The fixture comprises a flat plate having a plurality of titanium clips or hook elements extending below the bottom edge of the plate, assembled hybrid substrates being loaded into the fixture with the base of the lead frame resting on the hooks. Slots cut in the front of the plate define a rib that extends over the length of the plate near the bottom edge. The rib contacts the backside of a substrate to form an air gap that prevents flux and solder wicking up it. A hinged cover rests against components on a substrate to hold the latter in place. Only the hook ends of the titanium clips, the lead frame, and a portion of the substrate adjacent the one edge are dipped into molten solder to solder lead fingers to associated lands.