Including Means To Apply Flux Or Filler To Work Or Applicator Patents (Class 228/33)
  • Patent number: 11117325
    Abstract: Apparatus and methods are disclosed to provide a guide for sand blasting a fiber-reinforced object. The proposed guide consist of three-dimensional (3D) features that will result in reflective ray-like protrusions that can be detected and displayed by Augmented Reality (AR) hardware including a head mounted display. The AR hardware determines a virtual object to be presented in a field of view, a position in the field of view, and a perspective of the virtual object in the field of view based on position information from the reflective ray-like protrusions. At least a portion of the sand blasting area is observable through the display and lens when the display is presenting the rendered virtual object.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: September 14, 2021
    Assignee: Xerox Corporation
    Inventors: Marc D. Daniels, Wayne A. Buchar
  • Patent number: 11104077
    Abstract: According to aspects of the embodiments, there is provided process and apparatus to analyze imaging problems including but not limited to detecting defects of an imaging substrate useful in a Composite-Based Additive Manufacturing (CBAM) process. Data from the at least one imaging sensor may be used to: compensate for irregularities in a substrate deposited layer; compensate for irregularities in the printed layer, such as missing jet correction; reject a layer, the layer being scrapped and re-printed; pause the print job so that maintenance or service may be performed; or provide traceability data for proof-of-work, forensic, diagnostic, or other purposes. Depending on system architecture and design goals, the imaging sensor may be employed prior to or subsequent to the deposition of a printed layer.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 31, 2021
    Assignee: Xerox Corporation
    Inventors: Marc D. Daniels, Jeffrey W. Drawe
  • Patent number: 10269612
    Abstract: A substrate holding device includes robot arms, wherein the robot arm includes a supporting portion for supporting a substrate; a plurality of substrate holding modules disposed on the robot arm. Each substrate holding module includes a linear guide mechanism, a substrate holding member, and a drive device for driving the substrate holding member to move along the linear guide mechanism between a first position in which the substrate holding member clamps the substrate and a second position in which the substrate holding member releases the substrate.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: April 23, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Liwei Guan
  • Patent number: 9227260
    Abstract: Approaches to a solder ball bonding (SBB) tool and a method for solder ball bonding work pieces. The SBB tool comprises a rotatable feed plate for transporting solder balls from a reservoir to a nozzle, which is a position at which a laser light source can irradiate and melt the solder balls. The melted solder ball is then ejected from the nozzle and onto one or more work pieces, for electrically interconnecting the work pieces. The feed plate is configured with first holes and second holes, the first holes for receiving and transporting solder balls and the second holes for providing an aperture for the laser light to irradiate the solder balls, as the feed plate rotates and the holes are moved to positions in relation to the reservoir and the nozzle.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: January 5, 2016
    Assignee: HGST NETHERLANDS B.V.
    Inventors: Kenichi Murata, Yusuke Matsumoto
  • Publication number: 20150140801
    Abstract: Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 21, 2015
    Inventors: Chin Hock Toh, Aksel Kitowski, Uday Mahajan, Thean Ming Tan
  • Publication number: 20150108206
    Abstract: Some embodiments of the present disclosure relate to an apparatus and method to form a pattern of solder bumps. A solder paste is applied a plate comprising a pattern of holes, where each hole is partially filled by a piston attached to a movable stage. The remainder of the holes are filled by applying a force to the solder paste with a first solder paste application tool. A second solder paste application tool then removes excess paste from the front surface of the plate. The solder paste is then disposed onto a surface of a substrate by moving the movable stage, which fills a larger portion of each hole with a piston, forces the solder paste out of each hole, and forms pattern of solder paste on the surface of the substrate. The pattern of solder paste is then subjected to additional processing to form a pattern of solder bumps.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Li Hsiao, Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20150083785
    Abstract: Disclosed is a purging device for pipe welding, comprising: a pair of sealing tools that are disposed inside a pipe, expand by supplied air and are in contact with an inner wall of the pipe; and a connection pipe that is disposed between the pair of sealing tools, is a cylindrical body, wherein the sealing tools are respectively fixed to either side end of the connection pipe and the connection pipe is provided with a gas nozzle for discharging inert gas supplied from the outside, wherein each of the sealing tools further comprises a blocking layer that is flame retardant and is coupled in such a manner as to surround an outer circumferential surface of each of the sealing tools.
    Type: Application
    Filed: January 23, 2013
    Publication date: March 26, 2015
    Inventor: Jin Woo Park
  • Publication number: 20150069112
    Abstract: An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Mahmoud A. ABOU-NASR, Dimitar Petrov FILEV, Elizabeth Therese HETRICK, William C. MOISION
  • Publication number: 20150041520
    Abstract: The present invention relates to an ignition device for exothermic welding comprising an electrically conductive metal bushing (1) that can house a pellet of a first welding material (4) in electrical contact with the inner wall of an inner chamber (1c) of the bushing (1), provided with an electrically insulating cap (2) and a bottom base (1b) with an opening (1d) through which the first welding material (4) falls in an incandescent state onto a second welding material (4a) arranged in a weld mold (7) when an exothermic reaction has been triggered in the first welding material (4); an electrode (5) that goes through the cap (2) of the metal bushing (1) and comprises a top contact (5a) connectable to a power output (24) of a voltage generator and a bottom contact in the form of a filament (5b) that can be in electrical contact with the pellet of the first welding material (4), the filament (5b) being made of a material having a melting temperature greater than the ignition temperature of the welding material (
    Type: Application
    Filed: March 19, 2013
    Publication date: February 12, 2015
    Inventors: Carlos Pomar Garcia, Veronica Pomar Pedredo
  • Publication number: 20150034698
    Abstract: A robot includes: a stage unit; a rotation base connected to the stage unit in a rotatable manner around a predetermined rotating axis; an arm unit connected to the rotation base and having a base end rotatable around a first rotation axis that is substantially orthogonal to the rotating axis; a balancer connected to both the rotation base and the arm unit; and a cable arranged along the arm unit outside the balancer while supported by that balancer.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 5, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Shingi TAKAHASHI, Tomoyuki SHIRAKI, Masato ITO, Kaori SAKAKI, Takahiko KANAMORI
  • Publication number: 20150021377
    Abstract: A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 22, 2015
    Applicant: TUBEFUSE APPLICATIONS B.V.
    Inventors: Wayne RUDD, Hu Chun YI, Jeremy Joseph ITEN
  • Publication number: 20150021379
    Abstract: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.
    Type: Application
    Filed: July 10, 2014
    Publication date: January 22, 2015
    Inventors: Bruce Patrick Albrecht, Christopher Hsu
  • Publication number: 20140374467
    Abstract: A capillary bonding tool for wire bonding includes a first section, a second section and a bonding section. The first section has a first outer peripheral sidewall, an opposing first inner sidewall that extends generally parallel to the central longitudinal axis, and a first opening surrounded by the first inner sidewall. The second section has a second outer peripheral sidewall, an opposing second inner sidewall that extends at an angle with respect to the central longitudinal axis, and a second tapered opening surrounded by the second inner sidewall. The bonding section has a peripheral ridge extending axially outwardly from the second inner sidewall of the second section. The peripheral ridge has a third outer peripheral sidewall, a third inner tubular sidewall that extends generally parallel to the central longitudinal axis and radially outwardly of the first inner sidewall, and a third opening surrounded by the third inner tubular sidewall.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Jia Lin Yap, Yin Kheng Au, Lai Cheng Law
  • Patent number: 8905290
    Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: December 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Il-Soo Choi, Min Kim, Tae-Ho Moon, Ju-Young Yu, Sung-Bok Hong
  • Publication number: 20140326780
    Abstract: A welding device for a mask frame assembly, includes a chamber maintained in a vacuum state, a mask frame disposed in the chamber, a support frame disposed in the chamber and configured to support the mask frame, a mask disposed in the chamber and configured to be welded to the mask frame, a tensile unit disposed in the chamber, installed on the support frame and configured to apply a tensile force to stretch the mask; and a welding unit disposed in the chamber and configured to weld the mask frame and the mask to each other.
    Type: Application
    Filed: September 24, 2013
    Publication date: November 6, 2014
    Applicant: Samsung Display Co,. Ltd.
    Inventor: Jeong-Won Han
  • Patent number: 8875978
    Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: November 4, 2014
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Peter A. Gruber, Mark H. McLeod, Jae-Woong Nah
  • Patent number: 8844793
    Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: September 30, 2014
    Assignee: Raytheon Company
    Inventors: Buu Diep, Thomas A. Kocian, Roland W. Gooch
  • Publication number: 20140246481
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Inventors: Hideyuki ABE, Kazuaki MAWATARI
  • Publication number: 20140242753
    Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.
    Type: Application
    Filed: December 17, 2013
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyeong Min YEO, Seung Min RYU, Dae Jung KIM, Ji Ho UH, Suk Won LEE
  • Publication number: 20140224860
    Abstract: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.
    Type: Application
    Filed: February 11, 2013
    Publication date: August 14, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber, John P. Karidis, Bouwe W. Leenstra, Phillip W. Palmatier, Kevin M. Prettyman, Christopher L. Tessler, Thomas Weiss
  • Patent number: 8770462
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Raytheon Company
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • Publication number: 20140183249
    Abstract: Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Sik CHOI, Bong Yeol LEE, Min Hee YOON, Seung Chul KIM
  • Publication number: 20140151437
    Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.
    Type: Application
    Filed: November 25, 2013
    Publication date: June 5, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Il-Soo Choi, Min Kim, Tae-Ho Moon, Ju-Young Yu, Sung-Bok Hong
  • Patent number: 8740040
    Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: June 3, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Won Choi, Yon Ho You, Ki Ju Lee
  • Publication number: 20140131339
    Abstract: The invention described herein generally pertains to a system and method for detecting a moisture with a flux used in a welding process. A sensor is employed with a flux source that supplies a welding operation or process in which the sensor detects a moisture level with a flux within the flux source. A monitor component is configured to receive or aggregate data from the sensor, wherein the data relates to the moisture level associated with a flux supply or a portion of flux.
    Type: Application
    Filed: February 25, 2013
    Publication date: May 15, 2014
    Applicant: LINCOLN GLOBAL, INC.
    Inventors: ULRICH M. FISCHER, STEVEN R. SUMNER, PATRICK S. WAHLEN
  • Patent number: 8714432
    Abstract: An apparatus (10) for the production of brazed aluminum products on a continuous flow basis includes, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15,16) and a transportation element (25) for conveying (26) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying (26) and return (27) runs within the tunnel furnace.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: May 6, 2014
    Assignee: AFC-Holcroft
    Inventor: Malcolm Roger McQuirk
  • Publication number: 20140117067
    Abstract: This viscous material feeder includes a nozzle to discharge a viscous material stored in a storage portion storing the viscous material and a feeding mechanism transferring the viscous material from the storage portion to the nozzle and discharging the viscous material from the nozzle. The nozzle has a bent feed route to guide the viscous material from the storage portion to a tip of the nozzle and is configured to be dividable along the bent feed route.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 1, 2014
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Hidetoshi SATO
  • Patent number: 8704137
    Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: April 22, 2014
    Inventor: Ching-Jen Hsu
  • Publication number: 20140091129
    Abstract: A welding tractor is described as well as a process for using the tractor in which a predefined angle of inclination or declination is maintained during a circumferential welding process.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: LINCOLN GLOBAL, INC.
    Inventors: Steven R. Peters, Edward A. Enyedy
  • Publication number: 20140076959
    Abstract: Disclosed herein are a solder paste print squeegee and a method of using the same. The solder paste print squeegee includes: a rotation module driven rotatably; a pair of rods coupled with the rotation module in parallel; a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; and a pair of squeegee blades supported by the squeegee holder.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeo Park, Jae Soo LEE
  • Patent number: 8668131
    Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: March 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chien Ling Hwang
  • Patent number: 8651356
    Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: February 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Noriaki Mukai, Hueng Jae Oh, Dae Young Lee, Jin Won Choi
  • Publication number: 20140042208
    Abstract: A method for manufacturing a vehicle power transmission device having a case and a ring gear fitted to the outer peripheral surface of the case to transmit drive power from a drive source. The method includes: a welding step in which an annular flange is provided on the case or the ring gear and butt welding is performed by lapping a weld bead along the contact portion of one side surface of the annular flange and the case or the ring gear; a measurement step in which the outline of the other side surface of the annular flange placed in close proximity to the one side surface are measured; and an evaluation step in which a weld condition is evaluated based on part of the outline, which is determined in the measurement step, of a portion corresponding to the lapping portion of the weld bead.
    Type: Application
    Filed: April 18, 2011
    Publication date: February 13, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keisuke Uchida, Shingo Iwatani, Katsunori Suzuki
  • Publication number: 20140042211
    Abstract: A system and a method for welding two or more conduits are disclosed. The system includes a root welding tool, a filler welding tool and a support member. The root welding tool root weld a gap to form a root layer configured along end portions, from outer circumferential surfaces side opposite to inner circumferential surfaces side of conduits. The root weld is performed such that spattering of root weld material is prevented. The filler welding tool is utilized to fill the gap. The support member is provided for applying an outward thrust to ensure shrinkage of the filler and root weld materials longitudinally and radially outward, preventing pressing out of the filler and root weld materials along the inner circumferential surfaces side.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 13, 2014
    Applicant: ALSTOM Technology LTd
    Inventors: Ari BECKER, Andreas Bresinski
  • Publication number: 20140034707
    Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
    Type: Application
    Filed: October 30, 2012
    Publication date: February 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Yon Ho You, Ki Ju Lee
  • Publication number: 20140030849
    Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 30, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Publication number: 20140011318
    Abstract: New and improved ultrasonic spray shaping assemblies, components thereof, and methods for using the assemblies. An ultrasonic spray shaping assembly includes jet block and impact jet components to receive and redirect a single gas stream, whereby to use the single gas stream to shape an ultrasonic spray plume in a desired shape, particularly into a desired width of the plume. Modifications to the components, such as relative positioning, can be used to alter the shape of the spray plume. The present invention can be fabricated in a compact, lightweight design. It has many applications, including but not limited to, the deposition of flux onto a printed circuit board.
    Type: Application
    Filed: April 18, 2013
    Publication date: January 9, 2014
    Inventors: Benjamin Massimi, Joseph Reimer
  • Publication number: 20140008420
    Abstract: A substrate treating method including: a coating step in which a coating film of a liquid material comprising a metal and a solvent is formed on a first substrate and a second substrate; and a heating step in which the coating film is heated in a state where the first substrate and the second substrate are held in a manner such that the coating film formed on the first substrate faces the coating film formed on the second substrate.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 9, 2014
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Hidenori Miyamoto
  • Publication number: 20130334290
    Abstract: Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.
    Type: Application
    Filed: August 22, 2012
    Publication date: December 19, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ju LEE, Yun Bog KIM, Seon Young MYOUNG, Suk Jin HAM, Seong Chan PARK, Hyun Jung LEE
  • Patent number: 8608048
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: December 17, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Publication number: 20130327811
    Abstract: Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture.
    Type: Application
    Filed: July 12, 2012
    Publication date: December 12, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bing Dang, Jae-Woong Nah
  • Patent number: 8590765
    Abstract: A solder drawing member (402) is detachably attached on the outer side of a jet nozzle (303) that jets molten solder pumped from a solder tank (102) storing the molten solder. The solder drawing member (402) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle (303). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member (402), thereby reducing bridge phenomena and icicle phenomena.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: November 26, 2013
    Assignee: Panasonic Corporation
    Inventors: Shinji Yoshino, Minoru Yamamoto, Toshinori Mimura
  • Publication number: 20130284794
    Abstract: The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.
    Type: Application
    Filed: February 20, 2013
    Publication date: October 31, 2013
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventor: SANYO Electric Co., Ltd.
  • Publication number: 20130277416
    Abstract: Remote melt joining methods include melting a filler material to produce a molten filler material, wherein melting the filler material occurs at a remote distance away from a target site of a substrate material such that melting the filler material maintains the target site of the substrate material below its solidus temperature, and, delivering the molten filler material to the target site of the substrate material in a continuous stream.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 24, 2013
    Inventor: Arthur Lindemanis
  • Publication number: 20130270327
    Abstract: Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 17, 2013
    Applicant: Toyota Motor Engineering & Manufacturing North America
    Inventor: Sang Won Yoon
  • Patent number: 8544713
    Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: October 1, 2013
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Issaku Sato, Akira Takaguchi
  • Publication number: 20130240610
    Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 19, 2013
    Applicant: RAYTHEON COMPANY
    Inventors: William D. Beair, Michael R. Williams, Eric Gilley
  • Patent number: 8517245
    Abstract: An automatic soldering machine adapted for soldering cables with electronic products includes a main frame module, a man-machine control interface, a sliding tray located in front of the man-machine control interface, a loading tool slidably disposed in the sliding tray, a feeding module close to a bottom of the sliding tray, a removing module located between the man-machine control interface and a reforming module, a container, a loading tool combination module located above the sliding tray, a spraying module located in rear of the sliding tray, and a loading tool reflow module mounted on a rear of the main frame module. The man-machine control interface is connected with and controls the loading tool, the feeding module, the removing module, the reforming module, the loading tool combination module, the spraying module and the loading tool reflow module for realizing an automatic soldering process of the electronic products and the cables.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: August 27, 2013
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ai-Jun Yan, Wei Wang, Wen-Zhi Xia
  • Patent number: 8490857
    Abstract: A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.
    Type: Grant
    Filed: March 31, 2012
    Date of Patent: July 23, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiroyuki Matsui, Hirohisa Matsuki, Koki Otake
  • Patent number: 8453915
    Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: June 4, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Larry Yanaros, Frederick Wagner