Abstract: An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W2 that is greater than the width W1 so surfaces of the channel at the narrowest section defined by width W1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.

Abstract: An electric heating cloth having gaps and a connection structure thereof are disclosed. The electric heating cloth having gaps comprises plural conductive yarns arranged in a first direction and plural textile yarns and plural metal conductive wires arranged in a second direction for interweaving with the plural conductive yarns. The plural metal conductive wires are aligned at external sides of the plural textile yarns to form a first conductive side and a second conductive side respectively, and each of the first conductive side and the second conductive side has plural gaps.

Abstract: Provided is a stacking apparatus for heat exchanger cores that can assemble heat exchanger cores manufactured by a conventional manufacturing apparatus for heat exchanger core into stacked heat exchanger cores. As a solution, the stacking apparatus for heat exchanger cores includes: a core uprightly supporting unit; a first core holder with a J shape that holds a first heat exchanger core in close contact with a second heat exchanger core, a second core holder that holds the first heat exchanger core and the second heat exchanger core in close contact, and a core holding unit that moves the first core holder and the second core holder; a core conveying unit including a bottom supporter, a third core holder with a J shape that holds the first heat exchanger core or the second heat exchanger core held by the bottom supporter in close contact, and a moving mechanism; and an operation control unit that controls an operation of the core holding unit and the core conveying unit.

Abstract: A linear apparatus for forming a can opening, including: a working tabletop, a plurality of necking machining stations are arranged on the working tabletop; each necking machining station is provided with a can body positioning recess for positioning a can body; the can body positioning recess is internally provided with a vacuum suction hole; a vacuum chamber is arranged below the working tabletop; the vacuum chamber is in communication with the vacuum suction hole; a necking machining device is correspondingly arranged on each necking machining station; further: a moving device, and the moving device acts on the can body positioned in the can body positioning recess and is used for moving the can body on the stations onward by one station. The apparatus has the advantages of simple structure, low cost, small occupied space and convenient maintenance, and is the best choice for manufacturers with low production speed requirements.

Abstract: A method for automated circumferential welding of a workpiece by means of at least one welding device, including: (a) determining a further weld path for a further weld to be welded on the workpiece, the further weld extending from a start point, via a downstream part to a stop point, (b) determining first welding parameters associated with the further weld and adapted to weld the further weld on the workpiece, the first welding parameters are adapted to transfer a first level of heat to the workpiece, (c) identifying at least one overlap area in the further weld path between the downstream part and the start point of the further weld or between the further weld and a start or stop point of a previous weld, (d) determining a boost area, the boost area including the at least one overlap area, (e) determining boost welding parameters associated with the boost area and adapted to weld the further weld in the boost area, the boost welding parameters are adapted to transfer a second level of heat to the workpiece,

Abstract: A workpiece is conveyed from a first fixed point to a second fixed point by a conveyor in a chucked state. A phase of the workpiece that is being conveyed by the conveyor is detected by a detector. The workpiece conveyed to the second fixed point by the conveyor is seated on a seating part. A workpiece seating phase of the seating part is adjusted by an adjustor to the phase of the workpiece detected by the detector.

Abstract: A welding power supply having a power take-off shaft is provided. The welding power supply has an engine having an output shaft coupled a generator, where the engine shaft drives the generator to produce an electric current. The engine shaft further extends through the generator and is coupled to the power take-off shaft. One of a plurality of auxiliary attachments may be attached to the power-take off shaft and may be driven by the power-take off shaft.

Abstract: A cartridge assembly for a tool includes a cartridge body or casing that contains a conductor. A conductor is connected to a pulse generator or source of stored charge that is discharged to vaporize the conductor and create an electro-hydraulic or electro-magnetic shockwave that is used to impact or pulse weld two parts together.

Abstract: A process including forming a photovoltaic solar cell on a substrate, the photovoltaic solar cell comprising an anchor positioned between the photovoltaic solar cell and the substrate to suspend the photovoltaic solar cell from the substrate. A surface of the photovoltaic solar cell opposite the substrate is attached to a receiving substrate. The receiving substrate may be bonded to the photovoltaic solar cell using an adhesive force or a metal connecting member. The photovoltaic solar cell is then detached from the substrate by lifting the receiving substrate having the photovoltaic solar cell attached thereto and severing the anchor connecting the photovoltaic solar cell to the substrate. Depending upon the type of receiving substrate used, the photovoltaic solar cell may be removed from the receiving substrate or remain on the receiving substrate for use in the final product.

Abstract: A method of coating a field joint of a pipeline to accelerate the cycle time comprises positioning a mould tool around the field joint to define a mould cavity and injecting plastics material into the mould cavity through a plurality of gates in the mould tool, spaced along the mould cavity. The material is injected through different gates at different times as the mould cavity is filled, specifically through at least one first gate to advance a melt front within the mould cavity, and subsequently through at least one second gate spaced from the first gate, preferably when the melt front passes the second gate. First and second mould tools may be positioned successively around the field joint to create inner and outer coatings on the field joint. An insert may be positioned in the mould cavity to be embedded in the injected plastics material.

Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A roll former for forming a sheet into a continuous multi-tubular reinforcement beam. The roll former includes a first set of rollers that are configured to bend the sheet to form a common center wall in generally perpendicular orientation relative to first and second lateral portions of the sheet that extend in opposing directions from respective first and second radiused ends of the common center wall. The first set of rollers also form radiused edges on the first and second lateral portions. A second set of rollers is configured to form a channel rib longitudinally along each of the first and second lateral portions. A third set of rollers is configured to bend the first and second lateral portions simultaneously and equally to abut the first and second radiused edges with the respective first and second radiused ends of the common center wall to define adjacent tubes of the beam.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: A method for fabricating a filtering member in which overlapping portions of a wire are bonded together in a layered manner through thermal treatment for forming a mesh is disclosed. In accordance with the method, a contact surface pressure between portions of the wire to be bonded together is maintained as equal to or higher than a predetermined level set depending on a thermal treatment condition. In this state, the thermal treatment is conducted such that a bonding portion of the wire has a strength equal to or greater than 4N.

Abstract: The invention relates to a method for welding two welding parts (1, 3) by means of a fillet weld (11), wherein a first welding part (1), with a bearing surface at least in an edge area of an edge that is to be welded by means of a fillet weld, is brought into contact with a bearing surface of a welding part (3) and the welding energy (5) is supplied in an energy supply area during the welding process, exclusive of a surface (7) of the first welding part facing away from the bearing surface, said energy supply area being located at a predetermined distance from the edge of the first welding part. The welding energy is supplied in a direction, whereby the direction component thereof points perpendicular to the course of the fillet weld that is to be produced in the direction of an inner area of the first welding part, forming a welding angle of less than 90° with the contact plane of the bearing surfaces of the first and second welding parts.

Abstract: A system and method of forming a continuous strip from a plurality of strips, each strip having a leading end and a trailing end. Embodiments can include a forming apparatus that chamfers at least one of the leading and trailing ends of each strip. The chamfered trailing ends may then be positioned against chamfered leading ends of successive ones of the plurality of strips. Once a leading end and a trailing end are positioned against one another, a first welding apparatus may weld on a first side, from above, the trailing and leading ends positioned against each other to form weld joints. Once at least two strips have been welded together, the strips can constitute the continuous strip. An inverting apparatus can then invert the continuous strip and weld joints. The inversion of the weld joints can be done so as not to create a reverse bend in the continuous strip. A second welding apparatus can then weld on a second side opposite the first side, from above, the inverted weld joints to form weld junctions.

Abstract: Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), and at least a part of the surface of the opposing terminal (3) turned toward the welding terminal (2) is equipped with a flexible absorbing body (4). It is inventive that the surface of the absorbing body (6) turned toward the welding terminal consists of metal.

Abstract: A system for providing cutting and orbitally welding thin-walled tubing. The system includes a plurality of clamping blocks that hold the tubing while the tubing is trimmed and orbitally welded. The system further includes at least one tooling plate to which the clamping blocks can be mounted such that the tubing is attached to the tooling plate and properly aligned for net length trimming. The system further includes a welding cassette for retaining the clamping blocks and properly aligning the tubing during orbital welding.

Abstract: A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing &mgr;BGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. The center line of the inner lead is recognized, the inner lead is pushed to the chip in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: A method and machine for deburring the burr which is formed when wires are butt welded is disclosed. The machine comprises a deburring head which has a pair of opposed deburring rollers mounted thereon. Each of the rollers has a milled surface formed therein. A linkage is connected to the rollers to cause the rollers to rotate when the linkage is moved between first and second positions. When the linkage is in its first position, the milled surfaces of the rollers face one another to enable the wires and burr to be positioned therebetween. As the linkage moves to its second position, the circumferences of the rollers engage the burr to roll out the same, thereby providing a substantially smooth, cylindrical surface where the burr was located. The method of deburring is also disclosed.

Abstract: A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or a mixture thereof under conditions suitable to cause free-silicon in the surface to react with the carbon and/or nitrogen and thereafter bonding that surface to the substrate, preferably by means of a braze. In a preferred form of the invention, the surface which is bonded to the substrate is acid cleaned after contact of that surface with carbon or nitrogen or a mixture thereof.

Abstract: This invention relates to a wire bonding apparatus for bonding wire to a substrate wherein the components used to guide, bond and cut the wire have a reduced cross-sectional dimension near the substrate to enable close proximity, deep access, fine pitch bonding. This is accomplished in part by forming a wire guide integrally through a substantial portion of the bonding tool, thereby completely eliminating one component found in conventional wire bonding apparatus. This is further accomplished by tapering the size of the bonding tool toward the substrate such that the bonding tool in a lower portion has a smaller cross-sectional area. A cutter extends adjacent the lower portion of the bonding tool and into the area that would otherwise be occupied by the lower portion of the bonding tool if not for the taper. Thus, both the cutter and the lower portion of the bonding tool occupy a minimal amount of space adjacent the substrate.