With Means To Juxtapose And Bond Plural Workpieces Patents (Class 228/4.1)
  • Patent number: 10335903
    Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: July 2, 2019
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xi-Hang Li, Bing Liu, Wei Wu, Qing-Lei Pan, Shi-Li Zhang, Yuan Gao
  • Patent number: 10287832
    Abstract: The invention relates to a tong system for connecting a drill rod element (12) to an often stationary drill rod element (12) or for disconnecting a drill rod element from another drill rod element (12), wherein the tong system comprises at least two clamping blocks (20, 22), which face each other and are intended to fasten the tong system to the stationary drill rod element (12), and wherein at least one clamping block (20, 22) comprises movable means (30, 32) having a centering contour, which movable means (30, 32) are effective for adjusting the tong system in relation to the stationary drill rod element (12). The invention further relates to a clamping block (20, 22) as a component of such a tong system.
    Type: Grant
    Filed: April 25, 2015
    Date of Patent: May 14, 2019
    Assignee: BENTEC GMBH DRILLING & OILFIELD SYSTEMS
    Inventors: Malte Cordes, Heiko Schmidt, Andre Reuter
  • Patent number: 10207395
    Abstract: A vehicle body manufacturing apparatus includes: side jig frames disposed respectively on the right and left sides of a vehicle body; an upper jig frame installed between the side jig frames, the upper jig frames including a pair of front and rear frame members insertable into the inside of the vehicle body through front and rear openings of the vehicle body, respectively; a connection mechanism that removably connects insertion ends of the pair of frame members; and a clamping mechanism that is held on the upper jig frame and that positions the vehicle body.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: February 19, 2019
    Assignee: SUBARU CORPORATION
    Inventor: Noboru Sakamoto
  • Patent number: 10114913
    Abstract: A system for determining a welding sequence is disclosed. The system may have a welding sequence generator configured to create an initial population of welding sequences based on a user-generated constraint. The system may also have a welding simulator configured to simulate welding for at least one welding sequence in the initial population of welding sequences to model distortion for the at least one welding sequence. The welding sequence generator may be further configured to receive the distortion for the at least one welding sequence in the initial population from the welding simulator, determine whether a merit value derived from at least the distortion for the at least one welding sequence satisfies one or more predetermined criteria, output the at least one welding sequence as a potential welding sequence if the merit value satisfies the predetermined criteria.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: October 30, 2018
    Assignee: Caterpillar Inc.
    Inventors: Julian Andres Norato, Sungmoon Jung, Badrinarayan Parthasarathy Athreya, Christopher Ha
  • Patent number: 10006124
    Abstract: A slot-die coating apparatus for manufacturing a patterned coating layer (3) on a substrate (1) comprises a substrate carrier (6), a coating device, a sensor facility (70) and a controller (80). The substrate carrier (6) is arranged on a support for providing the substrate (1). The coating device comprises a head-side unit and a support-side unit (50, 55; 52 resp.) that are mutually movable with respect to each other by a motor (52, 56). The head-side unit comprises a translator part (52) and a slot-die coating head (2). The support-side unit (55) comprises a stator part (56) of the motor. The controller (80) controls the motor (52) to position the slot-die coating head at a desired distance (Ds). The support-side unit (55) has a mass that is at least equal to the mass of the head-side unit (50), and the support-side unit (55) is flexibly coupled to the support (60).
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: June 26, 2018
    Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
    Inventors: Ike Gerke De Vries, Maarten van Lent, Jeroen Anthonius Smeltink
  • Patent number: 9789574
    Abstract: The invention refers to a feed and load unit serving for feeding or removing one or more work pieces in the machining chamber of a machine tool for machining purposes. For this the feed and load unit comprises at least two work piece carriers movably on a guide path. The work piece carrier serves for picking up at least one work piece. In the guide path a guide path section, angularly or diagonally to the direction of conveying of the work pieces on the guide path, movably by a drive is, provided. The guide path section is able to pick up at least one work piece carrier. The guide path section is shifted for loading and unloading purposes in the direction of the machining chamber.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: October 17, 2017
    Assignee: Grob-Werke GmbH & Co. KG
    Inventor: Burkhart H. C. Grob
  • Patent number: 9776286
    Abstract: In a method of manufacturing a vehicle body a side structure and a center structure are positioned in place using a fixture or the like, and fixed by welding with maintained accuracy of mounting positions; annular parts along the width of the cabin of the vehicle and other parts are temporarily mounted to be retained without being welded; additional welding is performed on the center structure and the side structure, and the annular parts along the width of the cabin of the vehicle and other parts are positioned in place using a fixture or the like, and are fixed by welding with maintained accuracy of mounting positions; additional welding is performed on the parts; and a roof complex is mounted and fixed by welding with maintained accuracy of mounting positions.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: October 3, 2017
    Assignee: SUBARU CORPORATION
    Inventors: Kiichiro Tanaka, Ikuo Watanabe, Teruhiko Yajima
  • Patent number: 9685365
    Abstract: A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of the metal wire being proximate a surface of a bonding tool adjacent an aperture through which the metal wire extends. A predetermined length of the metal wire is drawn out from the aperture. The surface of the bonding tool is used to plastically deform a region of the metal wire between the surface of the bonding tool and a metal element at the surface of the first component. The bonding tool then applies tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: June 20, 2017
    Assignee: Invensas Corporation
    Inventor: Ilyas Mohammed
  • Patent number: 9457856
    Abstract: A multi-vehicle type co-production line flexible framing is disclosed, comprising a robot welding system, a high speed transport system, a floor panel intelligent flexible positioning system, and a side panel flexible positioning and switching system. The floor panel intelligent flexible positioning system is correspondingly connected to a transfer rail of the high speed transport system. The side panel flexible positioning and switching system comprises a side panel fixture consolidation system, a fixture storage system, and a fixture switching and rail system. The side panel fixture consolidation system corresponds to the side of the floor panel intelligent flexible positioning system. The fixture storage system is arranged on two sides of the side panel fixture consolidation system in the transfer direction of the high speed transport system. The fixture switching and rail system is connected between the side panel fixture consolidation system and the fixture storage system.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: October 4, 2016
    Assignee: GUANGZHOU MINO AUTOMOTIVE EQUIPMENT CO., LTD.
    Inventors: Weibing Yao, Peter Chihcheng Sun, Meng Yang, Wei He, Yi He, Kai Zhou, Hai Huang
  • Patent number: 9428070
    Abstract: A vehicle charging system may include a charge receptacle and an alignment pin mounted to a vehicle and a ground station. The ground station may include a guide having a locating region configured to receive the alignment pin and in response to the alignment pin contacting the locating region translate along a track. An electrical connector may be configured to engage the charge receptacle. The electrical connector may be disposed within a housing associated with the guide.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 30, 2016
    Assignee: Ford Global Technologies, LLC
    Inventors: Christopher W. Bell, Frank Kallio, John Paul Gibeau, James A. Lathrop
  • Patent number: 9373530
    Abstract: A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: June 21, 2016
    Assignee: Kulicke and Soffa Die Bonding GmbH
    Inventors: Michael Schmidt-Lange, Kam-Shing Wong, Johannes Schuster
  • Patent number: 9327367
    Abstract: The invention relates to a method and a device for guiding bands to be joined to one another along their longitudinal edges, comprising guide elements which form tracks for guiding the bands that are configured such that the bands approach one another in the transport direction and the longitudinal edges thereof rest on one another at a non-overlapping contact point. At least one of the tracks may be configured to undulate with a wavelength of ¼???2, such that transverse displacement of the band guided thereon occurs. The axes of rotation and/or longitudinal central axes of the guide elements may also be inclined towards one another at different angles of inclination in relation to a horizontal plane of reference, such that the band guided on said track is rotated about its longitudinal axis in the transport direction.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: May 3, 2016
    Assignee: WISCO Tailored Blanks GmbH
    Inventors: Jens Plha, Walter Mühlhause, Stefan Wischmann
  • Patent number: 9278410
    Abstract: In a method for assembling a component on a motor-vehicle body structure, a device is set with a manipulator into a condition of connection with a component placed in a pick-up position, according to a predetermined mutual positioning; the component is gripped with the device to connect the component thereto; the device connected to the component is carried with the manipulator to a motor-vehicle body structure that is located in a position, on a conveying line, upstream of a centre for welding or fixing the component on the body structure; the component is constrained with the device to the body structure according to a mutual positioning whereby the component comes to occupy the proper position of assembly; the device is supported with the body structure; and with the device supported by the body structure, the body structure is conveyed with the conveying line to the center.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: March 8, 2016
    Assignee: Comau S.p.A.
    Inventors: Nunzio Magnano, Francesco Di Mino
  • Patent number: 9132872
    Abstract: A system for assembling a vehicle includes a first assembly line having a plurality of first stations, including a welding station for welding first structural components that define a vehicle body portion. The first structural components are formed of a first material. The second assembly line receives the vehicle body portion from the first assembly line and has a plurality of second stations, including a second welding station where a second structural component is secured to the first structural components. The second structural component is formed of the first material or a second material. The second assembly line is configured such that the second component is one of welded to the first components in the second welding station when the second component is formed of the first material and fastened to the first components in the second welding station when the second component is formed of the second material.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 15, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: John Doll, Rhett Chapman, Zach Olding, Kevin Comerford
  • Patent number: 9136243
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: September 15, 2015
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
  • Patent number: 9051015
    Abstract: A vehicle body assemble system includes a moving unit loaded with a floor panel of a vehicle body that is configured to move the floor panel to a working place of a main buck process. A robot hanger clamps a side panel transferred to the working place from an inside of the side panel and rotates the side panel accordingly. An arranging jig is disposed on each side portion of the working place and is moveable up and down and arranges the side panel rotated by the robot hanger in an upright position. A side common jig is mounted to a handling robot and clamps the side panel on the arranging jig. Finally, a side post unit is disposed each side of the floor panel, clamps the side common jig, and moves the side common jig to each side of the floor panel.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: June 9, 2015
    Assignee: Hyundai Motor Company
    Inventor: Yoon Jang
  • Patent number: 8978230
    Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle treating machine, and a beverage bottle shrink wrapping machine in a beverage bottling plant and container handling machines corresponding to the beverage bottle handling machine. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: March 17, 2015
    Assignee: KHS GmbH
    Inventors: Klaus Jendrichowski, Ulrich Wiedemann
  • Patent number: 8955733
    Abstract: A clamping module for a pipe line-up system uses bell crank linkages to transmit pipe alignment and clamping forces between radially moving clamping feet and a central axially moving driving head. The clamping feet are arranged in axially spaced sets to internally engage two pipe sections to be welded independently on either side of a weld zone between the pipe sections, with welding shoes in between the clamping feet and spanning the weld zone. The bell crank linkages provide a force multiplier between the driving heads and the clamping feet.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: February 17, 2015
    Assignee: Tri Tool Inc.
    Inventors: Jerald Vanderpol, Vinh T. Hoang
  • Patent number: 8918980
    Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle pasteurization machine, and a beverage bottle shrink wrap machine in a beverage bottling plant. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims. Therefore, any statements made relating to the abstract are not intended to limit the claims in any manner and should not be interpreted as limiting the claims in any manner.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: December 30, 2014
    Assignee: KHS GmbH
    Inventors: Klaus Jendrichowski, Ulrich Wiedemann
  • Patent number: 8844793
    Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: September 30, 2014
    Assignee: Raytheon Company
    Inventors: Buu Diep, Thomas A. Kocian, Roland W. Gooch
  • Publication number: 20140263583
    Abstract: A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20140175159
    Abstract: A thermocompression bonding method for mounting semiconductor chips on a substrate comprises: picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head; positioning of the chip gripper above the assigned substrate location; lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head; heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again; waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, and lifting of the TC bonding head.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: Besi Switzerland AG
    Inventor: Hannes Kostner
  • Publication number: 20130277361
    Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Inventors: Lian Hok TAN, Wen Ge TU, Pan YANG
  • Patent number: 8544165
    Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: October 1, 2013
    Assignee: Hong Kong Applied Science & Technology Research Institute Co., Ltd.
    Inventors: Chi Kuen Vincent Leung, Bin Xie, Xunqing Shi
  • Publication number: 20130175323
    Abstract: A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers having displacable bottom processing portions. The process begins at a loading station and ends up at an unloading station after various melting and vacuuming of chip/substrate components supported on a device tray through those various chambers to the final joining thereof.
    Type: Application
    Filed: September 17, 2012
    Publication date: July 11, 2013
    Inventors: Jian ZHANG, Chunghsin Lee
  • Patent number: 8464410
    Abstract: A rack feeds sticks of pipe to a machine for serial fusion to the trailing end of a pipeline. Multiple independent spaced apart feeders support transverse bundles of sticks of pipe on beams. Legs which support the beams above the ground have jacks to vary the height and slope of the beams. The slope is set so that sticks tend to roll toward the lower front end of the beam where roller assemblies receive the sticks of pipe as they are manually rolled, one at a time, off the beams. All of the rack components are modular and interchangeably connectable so that the feeder can be quickly adapted for a variety of conditions and applications.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: June 18, 2013
    Assignee: McElroy Manufacturing, Inc.
    Inventors: Timothy A. Lyon, Thomas D. Cravens, Bobby L. Murray
  • Patent number: 8387851
    Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: March 5, 2013
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Chung Sheung Yung, Shing Lui Lau, Chi Ming Chong, Gary Peter Widdowson
  • Patent number: 8336757
    Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: December 25, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Man Chung Ng, Wing Fai Lam, Chung Wai Ku
  • Patent number: 8317076
    Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: November 27, 2012
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventor: Yoshihisa Kajii
  • Patent number: 8256658
    Abstract: A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: September 4, 2012
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Gang Ou, Ajit Gaunekar, Dongsheng Zhang, Ka Shing Kenny Kwan
  • Publication number: 20120211855
    Abstract: A semiconductor apparatus includes: a first sheet-like member having a light receiving surface of an imaging device and a first connection terminal disposed thereon, the imaging device generating an image by receiving incident light from a light collecting section for collecting external light disposed thereon; a second sheet-like member having a second connection terminal to be connected to the first connection terminal provided thereon; a conductive bonding portion made of a conductive material and bonded with the first connection terminal; and a bonding wire connecting the conductive bonding portion and the second connection terminal, wherein the bonding wire is disposed along the plane of the first sheet-like member such that reflected light from the bonding wire does not impinge on the light receiving surface.
    Type: Application
    Filed: January 18, 2012
    Publication date: August 23, 2012
    Applicant: Sony Corporation
    Inventors: Toshiaki IWAFUCHI, Masahiko Shimizu
  • Publication number: 20120175404
    Abstract: A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device.
    Type: Application
    Filed: August 15, 2011
    Publication date: July 12, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIH-CHEN LAI
  • Patent number: 8127415
    Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: March 6, 2012
    Assignee: ThyssenKrupp Drauz Nothelfer GmbH
    Inventors: Josef Kipping, Thomas Klemm
  • Publication number: 20120013016
    Abstract: A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Inventors: Tac Keun OH, Sung Min KIM
  • Publication number: 20110305920
    Abstract: The invention relates to a method for producing a ceramic-metal connection that is repeatedly subjected to great changes in temperature during use, in which the metal and ceramic are brazed to one another two-dimensionally.
    Type: Application
    Filed: December 10, 2009
    Publication date: December 15, 2011
    Inventor: Martin Heuberger
  • Patent number: 8056200
    Abstract: A manufacturing apparatus (2) for components (3), which has at least one movable loading station (20) designed as a tool magazine (13) and having reception points (39) with different tools (4, 5, 6, 7) for different component types A-I. The loading station (20) is connected to one or more machining stations (20, 22?) at which at least one machining device (23) and at least one handling device (24) for handling and releasing the components (3) from the tool (4, 5, 6, 7, 8) are arranged. The selected Figure is FIG. 5.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: November 15, 2011
    Assignee: KUKA Systems GmbH
    Inventors: Johann Hesse, Thomas Kollmar, Bruno Emerich, Roland Heck, Paul Geistdörfer, Ella Geistdöerfer, legal representative, Thomas Ziegler
  • Patent number: 8047422
    Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates (12, 13) at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.
    Type: Grant
    Filed: June 26, 2006
    Date of Patent: November 1, 2011
    Assignee: Nakahara Co., Ltd.
    Inventors: Chikao Tamamori, Keitaro Yokogawa, Nobuji Ota
  • Patent number: 8011556
    Abstract: The invention relates to a device (100) for the connecting of strips to an endless strip with a clamping arrangement (110, 120) with a clamping device (110-r, 120-r) on the inlet side and a clamping device (110-l, 120-l) on the outlet side, a cutting arrangement (155) with an upper cutter (150) and a lower cutter (130) and with a joining arrangement, in which at least the clamping device (110-r, 120-r) on the inlet side and/or the clamping device (110-l, 120-l) on the outlet side is constructed as a premountable unit.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: September 6, 2011
    Assignee: SMS Siemag Aktiengesellschaft
    Inventors: Holger Behrens, Robert Berg, Lutz Küemmel, Manuel Bendler, Ralf-Hartmut Sohl, Peter De Kock, Michael Tomzig
  • Patent number: 7959059
    Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 14, 2011
    Assignee: Nakahara Co., Ltd.
    Inventors: Chikao Tamamori, Keitaro Yokogawa, Nobuji Ota
  • Patent number: 7950141
    Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream of gas, forced through the channel to the top of the component which serves to heat the component, the component being removed through shearing when the component is forced against the tip.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: May 31, 2011
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Richard A. Rochford, Robert F. Madej
  • Patent number: 7926693
    Abstract: A receiving element which can be introduced into a borehole of at least one component includes a bolt presenting an outer surface that is approximately parallel and advantageously coaxial to a longitudinal axis of the bolt. The receiving element requires few materials and can therefore be produced at a low constructional cost while being provided with high dimensional stability and positioning accuracy. The bold includes an abrasion-resistant sintered material, and a metal tip provided on the front end of the shaft. The end part of the tip is engageable in a recess of the bolt, and there is a direct connection between the end part and the recess in the connection region on the front end of the bolt.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: April 19, 2011
    Assignee: Friatec Aktiengesellschaft
    Inventor: Peter Schramm
  • Patent number: 7896051
    Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 1, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventors: Byung Chul Kang, Kwang Duck Koh, Jum Dong Lee, Hwa Seob Lee, Jae Moo Shin
  • Publication number: 20110017803
    Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.
    Type: Application
    Filed: July 27, 2010
    Publication date: January 27, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Karsten Guth, Alfred Kemper, Roland Speckels
  • Patent number: 7854361
    Abstract: The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed to the geometry box (1) using one clamping frame part, while the other clamping frame part is fed empty. Using both clamping frame parts, the component (9, 10) is then fixed precisely in position using positioning and fixing units acting between the geometry box (1) and the clamping frame (7, 8) in such a way that the components (6, 9, 10) to be connected to one another may be connected to one another, in particular welded.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: December 21, 2010
    Assignee: ThyssenKrupp Drauz Nothelfer GmbH
    Inventor: Gerd Gauggel
  • Publication number: 20100230476
    Abstract: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
    Type: Application
    Filed: May 27, 2010
    Publication date: September 16, 2010
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Steven Mak, E. Walter Frasch
  • Publication number: 20100163605
    Abstract: A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability.
    Type: Application
    Filed: August 19, 2009
    Publication date: July 1, 2010
    Applicant: UNITED TEST CENTER INC.
    Inventor: Shiann-Tsong Tsai
  • Patent number: 7744514
    Abstract: A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and at least one robot for transporting the interchangeable clamping frames. The interchangeable clamping frames, in particular the clamping frames for the vehicle body side parts, are divided into a plurality of separable segmental clamping frames, with, to convert to a different type of vehicle body, one segmental clamping frame in each case being transported by a robot from the clamping station to the clamping frame magazine, being deposited there, a segmental clamping frame of a different type being removed from the clamping frame magazine and this segmental clamping frame being transported to the clamping station.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: June 29, 2010
    Assignee: Volkswagen AG
    Inventor: Markus Rössinger
  • Patent number: 7735706
    Abstract: The invention relates to an apparatus and a method for clamping, cutting, and joining strips to a continuous strip. Said device comprises a clamping device (125), a cutting device (155), and a joining device (195). The clamping device, cutting device, and joining device are kinematically coupled to each other.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: June 15, 2010
    Assignee: SMS Siemag Aktiengesellschaft
    Inventors: Ralf-Hartmut Sohl, Peter de Kock, Michael Tomzig
  • Patent number: 7686203
    Abstract: A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: March 30, 2010
    Assignee: Zimmer Technology, Inc.
    Inventors: Brad L. Rauguth, William G. Hutchison, Clarence M. Panchison
  • Patent number: 7677428
    Abstract: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction of body panel movement and a transverse extent; a parking structure upstanding vertically from the base structure on either side of the welding station and each defining parking devices; and a pair of longitudinal side gates each carrying tooling fixtures for engagement with body side panels and each including parking devices operative in coaction with the parking devices on the upstanding parking structures to precisely position the gates on the parking structure and thereby precisely position the tooling fixtures relative to the body panels.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: March 16, 2010
    Assignee: Comau, Inc.
    Inventor: Velibor Kilibarda