Abstract: A dual walled component includes a spar comprising a plurality of pedestals; a coversheet attached to a first set of pedestals from the plurality of pedestals; and a repaired coversheet portion attached to a second set of pedestals from the plurality of pedestals and to the coversheet, where the repaired coversheet portion includes a braze material.

Abstract: A dual walled component includes a spar comprising a plurality of pedestals; a coversheet attached to a first set of pedestals from the plurality of pedestals; and a repaired coversheet portion attached to a second set of pedestals from the plurality of pedestals and to the coversheet, where the repaired coversheet portion includes a braze material.

Abstract: A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.

Abstract: A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Abstract: The invention relates to a device for welding the end faces of thin-walled jackets (12) on a welding plane, said device comprising two cylindrical positioning receiving units (1), which center the jackets (12) to be welded in relation to their outer diameters, both receiving units (1) being located on an alignment base flush with one another and being axially displaceable. A deformable, annular, membrane-type heat exchanger is situated on the exterior of each receiving unit (1), said heat exchanger being formed from a set of sheets (2) consisting of heat-resistant material that are separated from one another. The lower end of the sheets is designed to be in thermal contact with the jacket (12).

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: Inflatable rings for supporting friction welding workpieces, and associated systems and methods. A support assembly for joining multiple workpieces in a representative embodiment includes a carriage and a generally ring-shaped support member that in turn includes a body and at least one inflatable member carried by the body and positioned to expand from a first configuration to a second configuration.

Abstract: A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

Abstract: A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component.

Abstract: The invention relates to a device for heat sealing two layers of foil material. To that end, the device comprises two blocks arranged opposite each other and conveying means for guiding the foil material between these blocks. Between the blocks, at least one heating element is provided, for heating the foil locally, and at least one circulating belt (20), which, in use, is guided along the blocks. The circulating belt (20) is built up from at least one layer of resilient material, so that a force applied by the blocks to the foil material is uniformly distributed over the sealing seam to be formed. The invention further relates to a circulating belt for use in a device according to the invention.

Abstract: A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Abstract: An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.

Abstract: Plate members 17 are respectively rested on first and second tables 1A and 1B relatively movable toward and away from each other. The plate members 17 are caused to abut against reference positioning members 16a and 16b of reference positioning devices protruded ahead of and over opposing ends 1? of the tables 1A and 1B so that opposing ends of the plate members 17 are positioned ahead of the opposing ends 1? of the tables 1A and 1B, and the plate members 17 are positioned laterally. Then, the positioned plate members 17 are locked on the tables 1A and 1B. After the reference positioning devices are retracted, the tables 1A and 1B are relatively moved toward each other to cause the opposing ends of the plate members 17 to abut together for formation of weld line X.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: An apparatus for bonding a lid wafer to a device wafer includes an elastic interface having a first surface and a second surface. Relieved areas may be created in the elastic interface by removing at least some of the elastic material of the interface, leaving a mesh with nodes. Raised areas may be disposed on the nodes in staggered positions on the first surface relative to the second surface. The bonding pressure deflects the raised features on the first surface in one direction and the raised features on the second surface in another direction. The restoring force of the mesh transmits the pressure through the interface and to a lid wafer and a device wafer, to bond the lid wafer to the device wafer.

Abstract: A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component and a gimbal. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween.

Abstract: An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.

Abstract: Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), and at least a part of the surface of the opposing terminal (3) turned toward the welding terminal (2) is equipped with a flexible absorbing body (4). It is inventive that the surface of the absorbing body (6) turned toward the welding terminal consists of metal.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: An object of the present invention is to provide a novel structure of supporting a vibrator having a terminal for electrical connection so that the vibrator can be miniaturized, and the driving impedance can be made constant in a wide temperature range to reduce the temperature drift. The structure has a substrate and bonding wires 45, 46 supported on the surface of the substrate and to be connected with the vibrator. The vibrator is supported with the bonding wire so that the vibrator is not directly contacted with the substrate. The bonding wire is electrically connected with the terminal. The resonance frequency “fr” of the supporting structure, the driving frequency “fd” for the vibrator and the detuning “&Dgr;f” satisfy the following formula.

Abstract: A pressing device including a platen for pressing a workpiece is provided, which has a pressing plate provided between the platen and the workpiece to press the workpiece instead of the platen when the platen is moved toward the workpiece, and a liquid layer formed between the pressing plate and the platen to transfer a force for pressing the workpiece with a required pressure to the pressing plate from the platen through the liquid layer. The platen is a heating platen heatable to a temperature sufficient to heat the workpiece to a temperature required for pressing, and the liquid layer is filled with heat transfer oil. The pressing plate is metal plate with a mirror finished surfaces.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A pressure welding apparatus includes a pressing die assembly 50 which has a plurality of stuffers 54 that pressure-weld electric wires 45 to the pressure-welding parts 34 of contacts 30, and a comb 70. The pressing die assembly 50 has a plurality of pins 60 which are located adjacent to the respective stuffers 54 and which are constantly driven downward by springs 62 so that the pins 60 protrude beyond the lower ends of the stuffers 54. The widths of the respective pins 60 are set so that these widths are substantially equal to the widths of the cavities 16 of the housing 10 in which the contacts 30 are accommodated. As a result, the pins 60 advance into the housing cavities 16 located adjacent to the contact 30 on which pressure-welding is to be performed, and support the housing partition walls 20 from the sides during the pressure welding process.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.

Abstract: In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be smaller than the external circumferential shape of the die to be carried on the die carrying surface, thus avoiding damages to the surface of the die.

Abstract: An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs.

Abstract: A method of brazing together a lightweight metallic aerostructure sandwich panel having at least two spaced face sheets and an intermediate honeycomb core layer comprises: providing a tooling base having a determinable upper surface; assembling spaced upper and lower metal face sheets and an intermediate metal honeycomb core layer together with at least one layer of braze material upon the upper surface of the tooling base to provide an unbrazed aerostructure panel; positioning a layer of conformable working honeycomb core upon the upper face sheet; positioning apressure means upon the layer of conformable working honeycomb core to provide downward pressure upon the layer of conformable working honeycomb core and causing the conformable working honeycomb core to provide a uniform downward pressure over the upper face sheet of the unbrazed aerostructure panel; and subjecting the unbrazed aerostructure panel to a predetermined cycle of elevated temperature and time to permit the layer of braze material to