Abstract: A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.

Abstract: A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: An assembly is disclosed for exothermic welding comprising a mold which is formed of a material which withstands exothermic welding temperatures and includes a weld cavity therein for positioning at least two members which are to be exothermically welded together, and an ignition cavity communicating with the weld cavity. The mold is capable of accommodating any one of several exothermic welding procedures which may involve either a flint igniter or the use of an electrical igniter which is readily accommodated by the mold in the performance of several of the procedures. The electrical igniter is formed of a pair of flat, longitudinally extending conductor strips with a sheet of insulation laminated therebetween, a filament adjacent one end of the strips, and one or more positioning tabs adjacent one end of the strips. A cartridge is also provided which contains the weld metal and the electrical igniter and which may be positioned in the ignition cavity of the mold.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.

Abstract: An electric soldering iron includes a soldering iron head, a sensor, a control unit, an air suction fan, a filtering unit, and an output unit. The control unit is connected to the sensor, the air suction fan, the filtering unit, and the output unit. The air suction fan is connected to the output unit through the filtering unit. The soldering iron head can be used to melt rosin and solder. When the sensor detects there is smoke near the soldering iron head, the sensor outputs a signal to the control unit. The control unit controls the air suction fan, the filtering unit, and the output unit to operate according to the signal. The air suction fan draws the smoke in and outputs the smoke to the filtering unit. The filtering unit filters harmful ingredients from the smoke. The output unit outputs the filtered smoke.

Abstract: The invention relates to a device for welding the end faces of thin-walled jackets (12) on a welding plane, said device comprising two cylindrical positioning receiving units (1), which centre the jackets (12) to be welded in relation to their outer diameters, both receiving units (1) being located on an alignment base flush with one another and being axially displaceable. A deformable, annular, membrane-type heat exchanger is situated on the exterior of each receiving unit (1), said heat exchanger being formed from a set of sheets (2) consisting of heat-resistant material that are separated from one another. The lower end of the sheets is designed to be in thermal contact with the jacket (12).

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: A kind of temperature controlling device of heating element and method thereof detect the actual temperature of heating body of the heating element, and calculate the descending gradient and frequency of temperature based on the detected actual temperature. The norm signal is formed based on the actual temperature, descending gradient and frequency of the temperature to control the switch power as to achieve the split second control for the electric power of the heating element.

Abstract: A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.

Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Abstract: A method for quick temperature compensation for an electric soldering iron is provided. The electric soldering iron includes a static temperature control circuit and a dynamic temperature control circuit. Amount of the static temperature control mainly depends on a temperature setting signal, a real-time temperature detecting signal and a temperature additional signal, while the dynamic temperature control is made on the basis of Kalman digital filter principle. During the dynamic temperature control, a differentially amplified temperature regulation and control signal is identified by a heat transfer function of the soldering iron head, and an temperature additional compensation amount is calculated and output, only when the heat transfer function of the soldering iron head is conformed.

Abstract: An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has an opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited by the electronic thermal igniter assembly. The igniter plug rests on top of the lid and the ignition body is retained in a recess within the igniter plug.

Abstract: A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: An ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has an opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited by the electronic thermal igniter assembly. The igniter plug rests on top of the lid and the ignition body is retained in a recess within the igniter plug.

Abstract: A soldering iron control module applied to a soldering iron and a soldering iron stand is provided. The soldering iron stand accommodates the soldering iron which has a soldering iron bit. The soldering iron control module includes a sensing unit and a soldering iron control system. The sensing unit provides a sensing signal indicating whether the soldering iron is accommodated in the soldering iron stand. The soldering iron control system includes a tin supply unit and a control unit. The control unit determines whether the soldering iron has been accommodated in the soldering iron stand for a first time period according to the sensing signal. When the control unit determines that the soldering iron has been accommodated in the soldering iron stand for the first time period, the tin supply unit provides the tin to the soldering iron bit and the power of the soldering iron is turned off.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream of gas, forced through the channel to the top of the component which serves to heat the component, the component being removed through shearing when the component is forced against the tip.

Abstract: A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Abstract: A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).

Abstract: A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.

Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Abstract: A design and method to keep the iron tip clean by submerging in molten solder with no oxidation and dross is described. Wool submerged in the molten solder and by cone-hole reservoir provide extra protection of the tip. Molten solder has protected from the oxidation by the antioxidant applied over the molten solder and by keeping the solder temperature close to the crystallization temperature and by having the crystallized solder layer above the molten solder. Further improving the tip surface is made possible by the electrolyses provided by current running through the molten solder and the iron tip. Iron battery charging circuit through the molten solder and magnetic connector-holder is described.

Abstract: A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).

Abstract: A thermode comprising: a shank; a tip; and a transition zone between the shank and the tip, the transition zone configured to provide resistance gradients to improve containment of heat in the tip. The thermode may also include an integrated cooling jet. The shank, tip, transition zone and integrated cooling jet may all be formed from a single workpiece. The thermode may also be formed with a compact mount that is integrated with the shank and that can be combined with a clamping arrangement to provide efficient replacement of the thermode from the clamping arrangement.

Abstract: A method for manufacturing a power capacitor including at least one capacitor element and equipment for carrying out the method. The capacitor element includes a roll of alternate dielectric films and electrode films. The roll has first and second end surfaces facing away from each other. The electrode films are connectably exposed. A solder tip is preheated in a pot with a preheated solder. The solder tip is coated with solder, whereupon at least one of the surfaces of the capacitor element is coated with solder by bringing the solder tip into contact with the end surface. The contact is brought to cease. At least one lead is fixed by soldering to the end surface.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: A soldering or a desoldering tool includes a replaceable tip with a recess adapted to receive a portion of a temperature sensor to measure the temperature of the tip. Positioning the temperature sensor within the tip allows the temperature to be quickly measured so that the temperature near the tip may be more accurately monitored and controlled. The temperature sensor may be also integrated with the heater near the tip such that the temperature sensor is between the tip and the heater and near both of them so that the temperature of the tip is substantially that of the temperature of the heater. A sleeve may enclose the temperature sensor and the heater with a portion of the temperature sensor extending out from the foreward end of the sleeve. The replaceable tip may also have a bore adapted to receive a head protruding from the foreward end of the sleeve to couple the tip at a predetermined orientation with respect to the sleeve.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with hot gas from the channeled tip melting the epoxy or solder and with the module forced against the fixed tool to remove it.

Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Abstract: A hot-bar head is adapted for soldering at least two flexible flat cables to a substrate. The hot-bar head includes a head body having a connecting portion that extends in a longitudinal direction, and at least two soldering portions, each of which extends from the connecting portion and has a blade edge adapted for contacting one of the flexible flat cables. Adjacent ones of the soldering portions are spaced apart from each other in the longitudinal direction.

Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.

Abstract: A miniature microwave plasma torch apparatus (10) is described. The microwave plasma torch apparatus (10) is used for a variety of applications where rapid heating of a small amount of material is needed. The miniature microwave plasma torch apparatus (10) operates near or at atmospheric pressure for use in materials processing. The apparatus (10) provides a wide range of flow rates so that discharge properties vary from diffusional flow of radicals for gentle surface processing to high velocity, approaching supersonic, torch discharges for cutting and welding applications. The miniature microwave plasma torch apparatus (10) also has a very small materials processing spot size.

Abstract: The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric that approximates the shape of a soldering tool tip. The metal fabric is formed by weaving the metal ropes around a mold that approximates the shape of the soldering tip. In the preferred embodiment, several such molds are strung together when the metal fabric is woven. After the weaving is complete, the fabric is then cut at those points along its length where the consecutive molds meet, and the molds are then removed, while the fabric retains the approximate shape of the molds. The desoldering sheath is mounted over a soldering tool tip and can conduct heat directly from the soldering tool to the solder and then absorb molten solder by capillary action, making desoldering a one-handed task.

Abstract: Methods and devices are provided for improved large-scale solar installations. In one embodiment, a junction-box free photovoltaic module is used comprising of a plurality of photovoltaic cells and a module support layer providing a mounting surface for the cells. The module has a first electrical lead extending outward from one of the photovoltaic cells, the lead coupled to an adjacent module without passing the lead through a junction box. The module may have a second electrical lead extending outward from one of the photovoltaic cells, the lead coupled to another adjacent module without passing the lead through a junction box. Without junction boxes, the module may use connectors along the edges of the modules which can substantially reduce the amount of wire or connector ribbon used for such connections.

Abstract: This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime.

Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off prove for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.