Abstract: A positioning attachment for definition of torch angle and torch to workpiece distance during welding and/or training is provided. The positioning attachment includes one or more legs of equal or varied lengths capped with a tip, which contacts the workpiece, and a body, which may be permanently attached or removably secured to the welding torch nozzle. Certain embodiments may be made of heat resistant metals or ceramic to withstand high temperatures during welding. The positioning attachment may be mounted on the welding torch nozzle or provided as an extension of the contact tip.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.

Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.

Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.

Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.

Abstract: A fuel-based appliance is equipped with a vocal device. The fuel-based appliance includes a switch installed thereon. The vocal device is installed in the fuel-based appliance. The vocal device includes a circuit board, a chip installed on the circuit board, a speaker installed on the circuit board and a button that is connected with the circuit board and that can be pressed via moving the switch.

Abstract: A soldering iron capable of eliminating static charges accumulated on an operator or materials to be soldered simply without using no particular charge elimination device, the soldering iron comprising a combustion catalyst for complete combustion of a gas mixture of a fuel gas and air, a soldering iron tip heated by the combustion catalyst, a gas conduit for exhausting a combustion exhaust gas from the combustion catalyst along the outer circumference of the soldering iron tip toward the top end, and an electric conduction mechanism for electrically connecting an operator for conducting soldering and the soldering iron tip, fuel gas combustion products which are ionized and forming steams upon catalytic combustion contributing to charge elimination.

Abstract: A soldering heater cartridge with replaceable tips and a soldering iron for use therewith is constructed of a tip heater cartridge with an elongated cartridge body that has a tubular body member, electrical connectors at a first end of the tubular body member for plug-in connection with an electrical connector assembly of a soldering iron handpiece, a soldering tip for mounting on the cartridge body and a heater mounted within the cartridge body and electrically connected to the electrical connectors. The tip end part is located at a second end of the cartridge body and the heater is located within the tip end part, the soldering tip being replaceably mountable over the tip end part in heat exchange contact with it.

Abstract: The vocal circuit for a hand tool includes a circuit board, a switch connected with the circuit board, and a chip and a speaker installed on the circuit board. The hand tool may be a gas-burning soldering device including a fuel reservoir, a soldering iron subject to heat caused via burning fuel flowing from a pipe and an igniter received in the shell for igniting the fuel. The switch of the vocal circuit is located between a button of the igniter and a main switch mounted on the shell. The main switch includes a pin extending into the shell for contact with the switch of the vocal circuit and the button of the igniter through the switch of the vocal circuit.

Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.

Abstract: A self feeding soldering device includes a soldering device; a solder feed mechanism carried on the soldering device; and a solder system controller in controlling connection with the soldering device and the solder feed mechanism. The solder feed mechanism allows the user to control the feed of solder wire onto the heated soldering tip of the soldering device or the area adjacent to the heated soldering tip to be soldered to free one hand of the user to secure the objects to be soldered.

Abstract: Preferred embodiments for methods of removing an integrated circuit (“IC”) from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of heating the IC and substrate to the reflow temperature for the solder connections and pulling the IC from the substrate by means of a vacuum force. Another preferred embodiment of the inventive method provides the step of shearing the IC from the substrate after the substrate and IC are heated, but before solder reflow temperature has been reached, and where the shearing force may be programmed through a computer controlled servomotor. Preferred embodiments of certain apparatus applying the inventive methods for removing an integrated circuit from a substrate are also disclosed.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: A soldering iron device has a gas passage formed by enclosing a soldering iron tip 3 of an electric soldering iron with double pipes 6 and 7 to make a nozzle. By providing projections A, B and C in the spacing between said double pipes, the double pipes are prevented from any eccentricity and biasing, and the velocity of an inert gas G to be supplied is made slow to ensure that the gas is jet through the nozzle tip end. Further, engulfing of oxygen in the atmospheric air can be suppressed, whereby it is possible to prevent defective wetting of solder due to high temperature oxidation of the soldering iron tip and to suppress high temperature oxidation of workpieces and flux cored solder alloy and flux, and excellent solderability is obtained.

Abstract: The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.

Abstract: The high-frequency inductor heating tube (1) for solder injectors is furnished as a hollow cylinder formed at one end as a cylindrical receiver tube. Windings of an inductor (2) are disposed over length of the cylindrical receiver tube. A solder injector (13) made of a highly heat-conducting base material and covered with a ferromagnetic layer (16) is inserted into the cylindrical receiver tube. Claws (8) of a wire spring (9) inserted into elongated holes (7) disposed in a wall of the cylindrical receiver tube lock the solder injector (13) in the cylindrical receiver tube.

Abstract: A specialized desoldering iron utilizes a blade which takes the form of a quadrilateral enclosure having a pair of heating elements mounted to two opposite walls of the enclosure. The enclosure is shaped and dimensioned to fit over a quad flat pack integrated circuit such that the lower edges of the walls of the enclosure come down onto the soldered leads of the integrated circuit. The two heating elements provide enough heat to simultaneously desolder all of the leads of a large quad flat pack, and the enclosure is open-topped so that the large heat sinks which are mounted atop IC's that consume a high level of power do not interfere with the desoldering process.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.

Abstract: A soldering tip is provided with a sensor to sense soldering tip temperature during a soldering cycle. The sensor is embedded in the soldering tip and positioned immediately adjacent to the tip's working surface. The sensor location provides rapid response to changing conditions at the tip's working surface. A microprocessor, responsive to the sensor, is provided to process the tip temperature data to control the power delivered to the heater which provides heat to the soldering tip. A visual and/or audio display also can be coupled to the processor. The microprocessor can be coupled to a further processor having long-term memory so that the collected data may be subsequently retrieved and displayed.

Abstract: An improved tape automated bonding is disclosed. A heater head employs a heat conducting member and a bonding tip member. The heat conducting member formed of a material, such as molybdenum or tungsten, has a U-shaped contour which comprises a pair of halves and an interconnection for generating bonding heat by undergoing high frequency electric current. The bonding tip member is bonded to the interconnection of the conducting member. The tip member is formed of material, such as diamond or cubic boron nitride, which is higher in resistivity and thermal conductivity than the conducting member.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes an upper nozzle mount and a removeable nozzle head which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.

Abstract: An auxiliary soldering device for electric solder iron includes a sleeve member fitted to a handle of the iron, a connecting seat disposed on the sleeve member, a first guide pipe located adjacent to a rear end of a connecting seat and a second guide pipe located adjacent to a front end thereof. The second guide pipe extends forward to the tip portion of the electric solder iron permitting a soldering wire to be fed through the guide pipes to the tip portion of the iron. A pressing plate engaging the soldering wire and a vane member are pivoted to the connecting seat with the vane member located above the pressing plate. The vane member has an elastic pushing plate downward extending to abut against the soldering wire, whereby pressing downward the front end of the vane member, the wire is advanced by the pushing plate through a certain distance for soldering use.

Abstract: A soldering device has a container for accommodating solder bodies, a soldering head, a tubular guide for guiding the solder bodies to the soldering head, and a slider formed to take the solder bodies from the container and transfer them into the tubular guide.

Abstract: A desoldering system utilizes a hot air soldering instrument which includes a hollow elongated cylindrical heating element capable of generating a high temperature. The cold input air is forced to move about the outer surface of the heating element. It is then directed to move between the inner surface of the heating element and the outer surface of an inner tube, whereby a primary and a secondary heating chamber are provided. In each heating chamber an open coil form or spring may be disposed to further increase the tortuous path of the air, and the heated air exits from the inner tube into a soldering tip from it is discharged, thus to provide a very hot air jet for soldering or desoldering purposes. Various modified instruments are disclosed for permitting either a hot air jet tip or a conventional soldering tip to be used. Also, a permanent air connection is featured in another modification to obviate the necessity of disassembling the air hose and other connections.

Abstract: A method and device for automatic soldering multiple intermittently arranged terminals a bridging phenomenon from occurring between the soldered terminals by sliding, virtually horizontally, the iron tip of the soldering iron, which is held upon the arrayed terminals after the application of the solder to those terminals, in a direction which is at right angles to the direction of the arrayed terminals, thus separating it from the arrayed terminals.

Abstract: A soldering gun has a finger actuated rotary solder feed unit and a solder cartridge releasably coupled to the gun. A solder guide tube extends forwardly parallel to the cylinder and guides the solder into engagement with the heated tip. The guide tube is mounted for vertical and angular orientation relative to the cylinder for locating the solder relative to the tip. A rotating ratchet feed wheel is connected to the trigger and has teeth engaging the underside of the solder. A set screw is located in the path of trigger to adjust the trigger stroke and thereby the length of the solder fed to the tip. A pressure wheel is mounted to firmly hold the solder to the feed wheel and is secured to a spring-loaded and pivoted T-shaped lever within the gun housing. The T-shaped lever has the pressure wheel rotatably mounted in the cross bar and the stem projecting upwardly into engagement with a bias spring. The lever has a release arm for manual pivoting of the lever to release of the solder.

Abstract: A soldering tip has a sleeve (10) with an insert (14) therein, both formed of good heat conducting material. An annular passage between the sleeve (10) and the insert (14) enables travel of solder therein by capilliary action when heat is applied to the tip and the latter contacts solder. The insert (14) is movable outwardly of the sleeve (10) to discharge solder in the annular passage from the tip.

Abstract: A soldering iron is provided of a type in which the solder is fed through the interior of the soldering iron to the tip, which is heated by a heating element in the soldering iron. In order to prevent the solder from melting before it reaches the tip, as a result of the heat transmitted from the heating element to the solder, the soldering iron is provided, e.g. on a feed tube for the solder, with an inlet for a coolant, e.g. water or air, which is made to flow through the interior of the soldering iron around the solder, thereby cooling the surroundings of the solder.

Abstract: The soldering apparatus of the invention includes a soldering wire feeding mechanism for feeding soldering wire from a storage spool. The soldering wire feeding mechanism includes a motor which drives a feeding wheel for engaging and transporting the soldering wire into a flexible feeding tube. An eccentric adjusting cylinder is mounted adjacent the wheel and can be turned to fit the diameter of the soldering wire being used. The feeding tube connects to the soldering iron of the invention, which has a metal guide tube through which the soldering wire extends and is fed to the soldering area. The soldering wire travels from the feeding tube to the guide tube through a sleeve to which both tubes are threaded. The free end section of the guide tube adjacent to the tip of the soldering iron extends rectilinearly from a bend or curve such that the soldering wire leaving the tube is rectilinear and not bent.

Abstract: An improved solder extractor has a tip temperature sensor coaxially disposed about the hollow tubular tip forward of the electric heat generating assembly into the which the tip is inserted and thermally insulated therefrom. The tip is held within the heat generating assembly by a plurality of springs formed as angular sections of a hollow cylinder which are symmetrically disposed about the tip between the tip and the heat generating element. The tip is also provided with a chamfered end which mates with a corresponding chamfer on a detent within the heat generating assembly to form a vacuum seal with a source of vacuum.

Abstract: A seam presser including an elongate handle housing circuitry for switching electrical power to a heating element. The heating element conducts heat to a small sole plate which is connected to the handle end by a support means. The sole plate is no wider than the seam to be pressed and is mountable to the support means so that the plane of the sole plate undersurface is angled with respect to the handle, and mountable to the support means at a desired rotational angle with respect to the handle.

Abstract: An attachment for supplying a filler wire to an electric soldering iron of the pen type includes an independent support butt having an upper housing provided with a V-shaped groove defined by two lateral faces of a dihedron. The cylindrical body portion of a pen type soldering iron is received in the groove and fixed therein by a flexible, length adjustable clamp passing around the body and having its ends fastened to the butt so as to maintain the body tangentially to the faces of the dihedron so that it forms a unit with the butt. The adjustable clamp permits soldering irons whose bodies are of different diameters to be immobilized in the groove. The support butt is provided with a manually operable trigger actuated mechanism for incrementally feeding and guiding a length of filler wire toward the heated tip of the supported soldering iron during use. The power supply lead for the electric heating element of the electric soldering iron extends through a passage in the support butt.

Abstract: An unsoldering tip for an electrical apparatus for unsoldering of soldering joints and for removing the solder consists of an electrical resistance wire being designed for being connected to an electrical voltage source at its both ends and becoming heated on current flow therethrough. The resistance wire comprises two legs which partially extend in parallel relation and have there a small distance between 0.1 and 0.3 mm. Both these legs are electrically connected one with the other at one end. At that area, where both these legs extend in parallel relation and with a small distance one from the other, a bend of about 180.degree. is provided, where an enlargement of the small distance is provided to form an enlarged open area or arcuate configuration for receiving the joint to be unsoldered, with the maximum spacing between the legs in the enlarged area being between approximately 0.8 and 1.2 mm.

Abstract: A suction desoldering tool has an elongate handle, an elongate housing defining a bore therethrough and extending co-axially from one end of the handle solder, a collecting chamber in the handle, and a tubular heating bit holder. The holder is mounted in the end of the housing remote from the body and includes a body portion surrounded by an electric heating element for receiving the bit and a tubular portion of lesser wall thickness providing communication between the bit and collecting chamber. The tubular portion is surrounded by an imperforate sleeve which defines an insulating air space along the tubular portion to enable the full length of tubular portion to be maintained above the liquidus temperature for solder melted by the bit during a desoldering operation, so that the melted solder can be drawn into the collecting chamber through the bit and holder by a source of suction connected to the chamber.

Abstract: A motorized strip solder feeding device including a spool of strip solder which may be mounted on a soldering iron for selectively feeding strip solder to the heated tip. When the strip solder on the spool is depleted, the spool may be mechanically connected to the motor to automatically renew the solder supply. The mechanical connection between the motor and spool is formed by a short length of solder.

Abstract: A soldering tool having a handle, a heating element, and a feeder mechanism for feeding wire or strip soldering metal through a passage in the handle arranged as a unit in an attachment piece let into the handle and comprises a manually operated member which can be depressed towards the handle, and a slide which is displaceable in one direction against spring bias by depression of the manuallY operated member. The slide has a driving dog for displacement of the soldering metal together with the slide in said one direction to advance the soldering metal towards the tip of the heating element through a guide tube which is arranged on a bracket supported by the handle, to be adjustable in relation to the heating element. A latch member is arranged to prevent backward movement of the soldering metal at the return of the slide under the spring bias in the other direction.

Abstract: A solder extractor includes a tubular heater and removable tip carrying front unit having a rear cowl of heat insulating material and a relatively oblique rear unit including a tubular handle of heat insulated material and having a front portion with longitudinal outer ribs telescoping the cowl and separably secured thereto by screws. A transparent solder receiver tube is separably housed in the handle and its front end releasably engages a seal plug carried by a conveyor tube extending from the heater bore and its rear end is sealed by a tube coupling carrying closure member which is releasably locked to the handle member. A cooperating window in the cowl and handle permit continuous viewing of the juncture of the tip extension and the solder receiver tube. The handle has a longitudinal channel which slidably houses an electric cable connected to the heater and permits the handle to be slid rearwardly on the cable when the handle is detached from the cowl.

Abstract: A wire stringing apparatus interconnects terminals of electronic components mounted upon a circuit board. A wire stringing head, which is transported on an x-y mechanism driven by a controller, wraps an insulated wire about terminals and guide pins mounted on the circuit board. The insulated wire is connected throughout the circuitry to form all of the necessary interconnections. After the wire is installed an automatic solder feeding mechanism and a heating element are transported over the circuit board to selectively solder the interconnecting wire to the appropriate component terminals. The heat generated for the soldering procedure additionally removes the insulation from the interconnecting wire at the connection terminal. A cutting tool transported over the circuit board severs the interconnecting wire at selected points to form individual conduction paths between circuit terminals.

Abstract: A hand-held, trigger-actuated gun heats solder to be removed from a workpiece and sucks the molten solder from a hollow tip through a small-diameter suction tube into a larger-diameter chamber from which it may be removed at intervals through a discharge tube. The tip placed in contact with the solder is heated by a heater of the type used in soldering irons. A cylinder communicates with the chamber in such manner that solder is not drawn into the cylinder. The piston in the cylinder is actuated either by a solenoid energized when the trigger is pulled or by a mechanical linkage connected to the trigger.

Abstract: A solder removing bit for use in melting solder by heat of the bit and for removing the solder by suction includes an elongated bit body having an inclined front surface. A suction bore extends the length of the body from a suction pipe opening at the rear end thereof and is exposed at the center of the inclined surface by a right-angled notch. A portion of the bore is left on one surface of the notch to form a slight groove which prevents blockage of the bore during use. A cross notch is provided across said surface of the right-angled notch to intersect the groove.

Abstract: Soldering method and apparatus comprising a soldering device having a hand grip portion and an electrically heated soldering element extending from said hand grip portion and terminating in a soldering tip, a housing structure adapted to be supported in a position disposed in spaced relation from the solder device, the housing structure supporting a solder wire supply spool to be unwound therefrom, a tubing structure extending from the housing structure and connected with the soldering device for closely peripherally confining a leading portion of solder wire of substantial longitudinal extent extending from the spool with the free end thereof adjacent the soldering tip and for maintaining such confinement during longitudinal movement thereof in a direction wherein the free end engages the soldering tip while enabling the soldering device to be substantially freely manually moved in spaced relation relative to the housing structure by an operator grasping the hand grip portion thereof, the tubing structure in

Abstract: A solder removing bit for use in melting solder by heat of the bit and for removing the solder by suction includes an elongated suction pipe having a suction bore extending therethrough with the pipe having an open end serving as an inlet to the bore. A tubular metallic bit surrounds the open end portion of the pipe and a tubular electric heater surrounds the bit. The end of the heater is spaced from the end of the bit to define a work contacting end portion on the bit. The end portion of the bit is provided with a coating of fused silica or porcelain enamel to render the end portion of the bit electrically insulative.

Abstract: A soldering iron and tip therefor in which the tip has a bore along its longitudinal axis with a transverse vent opening through the tip connecting with the bore to increase the capillary action of drawing solder up into the bore. An arrangement is also provided for threading a braided wire into the bore to further enhance the capillary action. In the latter case it is preferred that a second hole be formed in the tip at an angle to the bore.