Abstract: A backplane for a display device which includes a plate-like body for securing a rectangular printed circuit board (PCB). The body includes a first clamping part corresponding to a first side edge of the PCB having an L-shaped bend facing towards the PCB for clamping the first side edge. The body further includes a second clamping part corresponding to a second side edge of the PCB having a U-shaped bend facing towards the PCB for clamping the second side edge. The second side edge is parallel to the first side edge. A riveting column is secured on the body uncovered by the PCB, the riveting column is located at the same side of the PCB as the first clamping part, and a spring is secured on the riveting column and presses the edge of the PCB against the body.

Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.

Abstract: A method by which the amount of nickel contained in an alloy having a composition represented by Sn—X—Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn—X—Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400° C., and removing the resultant dross floating on the surface of the liquid phase and containing a P—Ni compound and a P—Sn—Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt %. The phosphorus may be added in the state of a Sn—P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

Abstract: Solder pot intended for a machine for selective soldering of through-hole electronic components on a printed circuit board, characterized in that it is in the form of a right prism, preferably with a hexagonal base.

Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.

Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

Abstract: In a modular soldering apparatus a pump assembly (4) comprising a pump (67, 71) conduit 66 and solder nozzle (92) is removable as a unit and push contacts (42, 52?) which are broken by lifting the assembly are provided for the electrical, data and gas connections (80, 90). A solder bath (10) is also mounted on a support structure (16) and connected to data and power supplies (42) by push fit connections. The pump assembly and solder bath may be coupled together and removed as single unit.

Abstract: A design and method to keep the iron tip clean by submerging in molten solder with no oxidation and dross is described. Wool submerged in the molten solder and by cone-hole reservoir provide extra protection of the tip. Molten solder has protected from the oxidation by the antioxidant applied over the molten solder and by keeping the solder temperature close to the crystallization temperature and by having the crystallized solder layer above the molten solder. Further improving the tip surface is made possible by the electrolyses provided by current running through the molten solder and the iron tip. Iron battery charging circuit through the molten solder and magnetic connector-holder is described.

Abstract: The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the surface is carried out.

Abstract: It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is created to more evenly distribute the solder flow and thus reduce the rate of Cu dissolution near the flow well opening, particularly during a PTH rework process. In one aspect, a flow well for a soldering machine is provided comprising a flow distribution element, wherein solder flowing into the flow well is distributed by the flow distribution element to provide a more laminar flow.

Abstract: A method for manufacturing a power capacitor including at least one capacitor element and equipment for carrying out the method. The capacitor element includes a roll of alternate dielectric films and electrode films. The roll has first and second end surfaces facing away from each other. The electrode films are connectably exposed. A solder tip is preheated in a pot with a preheated solder. The solder tip is coated with solder, whereupon at least one of the surfaces of the capacitor element is coated with solder by bringing the solder tip into contact with the end surface. The contact is brought to cease. At least one lead is fixed by soldering to the end surface.

Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.

Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

Abstract: A soldering apparatus comprises a solder bath, a body positioned in the bath and having a plurality of main conduits for feeding solder from a solder pump to a nozzle or thimble. Each conduit communicates with a pump chamber and a conduit in a thimble plate on which the thimbles are mounted. The thimble plate is readily replaced by lifting the main body clear of the solder on lifting mechanisms. Thimbles can be positioned at any desired location on the plate, conduits being formed in the plate to lead from the outlet of a respective conduit.

Abstract: An electrically-controlled soldering pot apparatus with a timer control mechanism and a temperature control mechanism; a method of alerting a user when to exchange a solder bath of the apparatus before erosion to the solder bath occurs; and a method of varying the heating rate applied to a variety of lead-free solders in a solder bath housed in the apparatus.

Abstract: Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal oil, the melt is moved to another container of oil with a temperature of at least 20° C. greater than the liquidus temperature, stirred there, and subjected to multiple shear treatments using rotors and stators for forming a dispersion comprising solder balls and oil, from which dispersion the solder balls are separated by means of subsequent sedimentation.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2-65 mass % of Sn, 0-5 mass % of Ag, about 0.1-1 mass % of Sb, and 0.01-0.1 mass % of Cu, and 0.01-0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.

Abstract: A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot and the pockets are protected by an atmosphere of hot inert gas introduced under a cover plate which has openings, corresponding to the location of the terminals, through which the pockets pass.

Abstract: In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of the components to one another, the solder, fluxing agent and binder are applied in powder form at high speeds up to 180 m/min onto the surfaces provided for brazing by electrostatic powder coating. The powder particles have a particle size of 5 to 30 &mgr;m. The proportion of binder relative to the total quantity of powder is smaller than 35% by weight. The uniform layer of homogeneously distributed solder, fluxing agent and binder has only a thickness of less than 50 &mgr;m. Heat is used melting this layer.

Abstract: A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.

Abstract: A trough device in a soldering furnace comprises a motor, a soldering pot, support device, a trough part and transmission device. The support device connects with a fixing base of the motor via a micro adjustment device and an inclinometer for adjusting an inclining angle of the soldering pot and informing the adjusted inclining angle. A guidance part with double layer structure is located at the soldering pot and can receive the solder oxide residue falling down from the circuit board or spattered out from the soldering pot to prevent the solder oxide residue from flowing back to the trough part. The transmission device further comprises a transmission shaft, a shaft hub, a fan blade part and fixing plate assembly. The shaft hub surrounds the transmission shaft with bearings being disposed between the shaft hub and the transmission shaft. The fixing plate assembly is arranged at the lower end of the shaft hub and engages with the soldering pot by way of screw threads.

Abstract: A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. The invention also relates to an apparatus for separating dross floating on solder present in a vessel into solder and a residue, wherein the apparatus comprises at least one knife which is movable along a path extending through the vessel, and wherein the at least one knife is adapted to cut through the dross during the movement along the path. Due to the above stated cutting operation the units of the dross formed by nuclei of solder enveloped by metal oxides are destroyed, whereby the solder enveloped by metal oxides are destroyed, whereby the solder is released and added to the solder already present in the bath, and the released metal oxide will float on the solder. A considerable volume and mass reduction of dross to metal oxide herein takes place.

Abstract: An apparatus and method for recovering solder from dross present on the surface of a molten solder includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave against a printed circuit board to be soldered. The solder nozzle includes opposite side troughs inclined downwardly toward one side of the solder reservoir to direct dross toward a dross zone. A semicircular hood extends across the solder reservoir and is located above the dross zone. A screw extends across the solder reservoir and is covered by the hood. The screw is activated to agitate the dross so as to remove oxides and recover solder from the dross.

Abstract: A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.

Abstract: The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixture have distinct advantages over the prior art. These advantages include a higher filler metal yield, an increased tensile strength, and a higher quality corrosion resistant weld. These advantages are accomplished by a process wherein a reactant mixture is provided which has a reducing agent, a metallic compound, and at least two filler metals that at least in part do not chemically react with the metallic compound, one of which is aluminum. The metallic compound subsequently forms, with the reducing agent, having a high heat of formation which provides an exothermic reaction with sufficient heat to melt the filler metals.

Abstract: A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped into a solder pot to refill the thimble with solder, the support rods abut the bottom of the solder pot, and the thimble continues to slide down the support rods causing the scraper to scrape away dross on the thimble.