Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract: A method by which the amount of nickel contained in an alloy having a composition represented by Sn—X—Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn—X—Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400° C., and removing the resultant dross floating on the surface of the liquid phase and containing a P—Ni compound and a P—Sn—Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt %. The phosphorus may be added in the state of a Sn—P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a wiring board support part, a transfer head, and a mounting head. The flux reservoir includes an accommodation recess in an upper surface to accommodate flux. The flux reservoir moving unit linearly moves the flux reservoir. The wafer support part is adjacent to a moving path of the flux reservoir and supports a wafer including a semiconductor chip. The wiring board support part is adjacent to the moving path and supports a wiring board. The transfer head picks up and places the semiconductor chip in the accommodation recess. The mounting head picks up the semiconductor chip from the accommodation recess and mounts the semiconductor chip on the wiring board through a surface mount process.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively connected to the shroud, an arrangement of guides immersed in the solder pot for recirculating liquid solder and a chemical de-oxidizing agent. The impeller and shroud are adjacent to a free surface of the dross which forms at the top portion of the liquid solder. The method includes the steps of adding a measured amount of de-oxidizing agent to the solder pot, agitating and recirculating the liquid solder/de-oxidizer mixture with the impeller to break-up the dross into smaller particles and separate the solder from the dross, and removing a residue of the dross by suction as the recirculating mixture passes beneath the shroud.

Abstract: Apparatus for inerting a wave soldering installation having a solder bath and a conveying system for producing one or more solder waves, in particular for soldering electric printed circuit boards, having an immersion box which is closed on all sides, shaped like a frame, can be immersed in the solder bath and which has porous pipes to distribute nitrogen, the pipes being arranged inside the immersion box in cage-like housings with outlet openings, the cage-like housings being designed such that the porous pipes are arranged therein in such a way that the porous pipes essentially cannot be struck by solder splashes produced during the operation of the wave soldering installation.

Abstract: A soldering apparatus includes a solder wave shape forming device for melting solder and forming a solder wave shape, and a separating agent dusting device for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.