Abstract: A reflow apparatus includes at least one heating unit. Each of the at least one heating unit includes an air blower for circulating air; a partition for defining an air circulating path; at least a first slit heater and a second slit heater for heating a workpiece with the circulating air, the workpiece having a first surface and a second surface; and a furnace housing for accommodating the workpiece. The air blower includes a first fan for blowing the air toward the first surface of the workpiece, a second fan for blowing the air toward the second surface of the workpiece, and a motor for rotating the first fan and the second fan. The first fan and the second fan are provided in correspondence with the at least the first slit heater and the second slit heater.

Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.

Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A method for printing the mask with solder paste is described.

Abstract: A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface temperature of the weld, and a computer to acquire and analyze data from the camera. In one embodiment, the sample is heated on one side and the time-temperature characteristic is monitored as the heat travels through the sample and the spot weld. The computer generates a histogram that represents the relationship between a particular time-temperature characteristic and the number of pixels exhibiting that characteristic, thereby representing the quality and size of the weld nugget. By generating a histogram corresponding to weld quality, the inventive apparatus and method provides an objective weld quality indicator and allows automation of the evaluation process.

Abstract: A soldering station with a control unit and a soldering iron having a replaceable soldering tip, the soldering iron being connected to the control unit by a power cord for receiving electrical power from said control unit is provided with an automatic calibration feature. The control unit has circuitry for controlling the temperature of the soldering iron at the tip by adjusting the supply of power to the tip heater of the soldering iron, a temperature selector for enabling selection of a temperature to which the soldering iron is to be heated by a user, a calibration temperature sensor connected to said circuitry and exposed for enabling it to be engaged by the tip of the soldering iron.

Abstract: An apparatus and process for determining whether a fault has occurred in a welding process while the process is under way. The invention is applicable to welding and cutting processes where there is an arc plasma, such as gas-metal arc welding, tungsten-inert gas welding, pulsed welding, resistance welding and submerged welding. It involves sampling welding voltage and welding current to provide first and second signals, generating artificial third signals from these dependent on values of the first and second signals through generalised discrete point convolution operations, identifying corresponding values as triplets and collecting triplets of values into groups or regions.

Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.

Abstract: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.

Abstract: An apparatus for making wire connections between a first connection area and a second connection area by means of a capillary. The apparatus contains an image recognition system which is designed so that the tip of the capillary enters the image area of the image recognition system immediately before impacting on the respective connection area. In this way, the position of the desired point of impact of the capillary on the connection area as well as the position of the tip of the capillary can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: A positioning device in which an operating member is solid with a mechanical touching member and is displaced together with it by computer controlled displacement devices; both the operating and the touching members are mounted on a common supporting member, thus forming a touching and operating unit on which act the computer controlled displacement devices. The computer is programmed in order to determine by means of the touching member, and to memorize, the positions of a plurality of points on which the operating member should perform its operation, then determining by interpolation the entire work trajectory of the operating member, which may particularly be a welding head; in this case, several touching and operating units form part of a welding apparatus, and particularly of a so-called coupler, intended to automatically perform the inner weldings between the sections of a piping, such as an oil pipeline or the like.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longitudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary descends so that the end of the tail contacts the tail length measuring member; a position of the capillary or a distance by which the capillary is lowered at the time that electrical continuity is established with the tail length measuring member is detected; and the tail length is calculated based upon a height level of the tail length measuring member, the position of the capillary before being lowered for measuring the tail, and the position of the capillary when the wire contacts the tail length measuring member, or upon the height of the capillary above the tail length measuring member before lowering the capillary for measuring the tail, and a distance the capillary is lowered.

Abstract: Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A device for monitoring a wire bonding process measures an electric signal applied to a bond wire during the bonding process, and generates an output which discriminates between successful and unsuccessful bonding. The device employs at least one variable parameter. The value of the variable parameter is determined beforehand in a learning process by monitoring examples of actual wire bonding operations. Thus, the detection method may adapt to changing requirements automatically and operate under optimal conditions for a large variety of circuits to be processed. The electric signal is preferably oscillating, and the measurement preferably includes its peak or RMS amplitude.

Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.

Abstract: A method and apparatus for protecting the stored information on an integrated circuit from being compromised through reverse engineering. To do so, the method and apparatus splits the functionality of an integrated circuit into two separate integrated circuits, which are then connected in an interlocking manner. A detection circuit monitors the interconnection of the two separate integrated circuits. Upon detection of a break in the interconnection of the two circuits, the detection circuit destroys the data stored in the two separate integrated circuits. The two integrated circuits are connected in a flip-chip fashion, thereby preventing access to the underlying conduction paths and charge storage sites which are normally used in reverse engineering an integrated circuit.

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Abstract: Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on the basis of the measured temperature and a time for which brazing filler metal supply nozzles are kept in a wait state is set on the basis of the conversion data to define the timing for supplying the brazing filler metal wires (S40). A heating burner moves forward and then a timer starts counting the time for which the nozzles are kept in the wait state (S42). When the nozzle wait timer has counted the set time and expired, the brazing filler metal supply nozzles move forward and supply the wires to braze the articles (S43 to 45). In this way, the articles to be brazed, heated by the heating burner, are at an increased temperature suitable for brazing at the time when the brazing filler metal wires are supplied.

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract: In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent plate (56), where an expansion amount of the film carrier (52) is changed according to a condition of the heat bonding. A distance between the measured marks (MA, MB) is then obtained. The condition for the heat bonding is determined based on this distance. The heat bonding is performed under this condition determined.

Abstract: A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The second ball mount cell is parallel to and a mirror image of the first ball mount cell. The first ball mount cell and the second ball mount cell can be run by a single operator located between them. In one embodiment of the invention, the BGA ball mount line with dual in-line mounters is implemented in three phases to provide a smooth transition. In the first phase, a proto-line is set-up with a first ball mount cell, a loading cell, a diverter cell, and an unloading cell, to optimize the first ball mount cell. In the second phase, a reflow oven and a flux cleaner are added to form a production line. In the third phase, a second ball mount cell is added to form a BGA ball mount line with a dual in-line mounter.

Abstract: A first substrate is attached to a second substrate by providing solder structures that include a first portion adjacent the second substrate that has a first melting point, and a second portion adjacent the first substrate that has a second melting point that is lower than the first melting point. The solder structures then are heated to a first temperature that is at or above the second melting point but below the first melting point, to melt the second portions. Simultaneous with the heating of the solder structures to the first temperature, the first substrate is attached to the second substrate while the second portions are melted. Finally, the solder structures are heated to a second temperature that is above the first temperature, to alloy at least some of the first portions and the second portions.

Abstract: An apparatus for the temperature regulation processing of electronic components such as semiconductor circuits, printed circuit boards and the like comprises a temperature regulated housing through which the components are conveyed on carriers. The carriers enter through an inlet slot in the housing provided with temperature regulating members and are conveyed onto a magazine and then out through an outlet slot opposite the inlet slot once processing is complete. Inside the housing, the carriers are loaded on a progressively loaded magazine provided with adjacently arranged holders. Once all the holders are loaded, the magazine is filled and in an end position. The magazine is then displaced to its starting position in a fast reverse run. A new carrier is conveyed in through the inlet slot thereby causing the temperature regulated carrier occupying the holder to be conveyed out through the outlet slot.

Abstract: Multi-modal soldering inspection system comprises means for automatic inspection involving imaging means for acquiring solder joint images, mode-selecting means for selecting auto mode, review mode, or eye mode, means for integrating inspection data obtained in the auto and the review modes, replay means for replaying images acquired with the imaging means to display them, input means for inputting the review data, and storage for storing the inspection data.

Abstract: A wave soldering apparatus includes a frame having a first end and wave solder equipment supported with respect to the frame. The wave solder equipment is configured to apply solder to a circuit board. A circuit board transporter is supported with respect to the frame, and is configured to receive a circuit board adjacent the first end of the frame, to move the circuit board away from the first end of the frame and over the wave solder equipment which applies solder to the circuit board, and to return the circuit board for retrieval adjacent the first end of the frame.

Abstract: Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means in the apparatus supplies drive for setting the relative position between the end of the jet-stream nozzle and the piece and a control means also available outputs control signals matching a predetermined condition to the drive means to carry out micro-adjustment of the jet-stream nozzle in short time with high accuracy. At the same time, remote operation can also be performed.

Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A tension mechanism that applies a back tension to a wire in a bonding apparatus including: a first nozzle which has a through-hole through which the wire passes, second and third nozzles which have diameters that are larger than the diameter of the through-hole of the first nozzle and which are disposed above and below the first nozzle, a first air passage formed in the joining surfaces of the first nozzle and second nozzle, and a second air passage formed in the joining surfaces of the second nozzle and third nozzle. A compressed air supply device is connected to the tension mechanism and supplies compressed air to the first air passage from an air supply source, and a vacuum suction device is also connected to the tension mechanism and applies vacuum suction to the second air passage from a vacuum supply source.

Abstract: A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a formation of a coating or surface alloy layer such as tin-oxide, on the solder joint. The coating causes the solder bead or joint to have a higher surface tension and a higher reflow temperature. In an exemplary double-sided double-pass assembly operation, circuit boards pass through a soldering oven on a first pass to attach components to a first side, and then the board is inverted and passed through the oven on a second pass while components are mounted on the opposite side of the board. During the second pass, a gas injection device is aimed at the component-to-board connection points on the inverted side of the board which were soldered on the first pass. The gas is injected at the point in the soldering reflow oven at which the temperature begins to exceed the solder reflow temperature.

Abstract: A computerized system and method for identifying and correcting bond placement errors in a bonder pre-programmed to attach connecting bonds onto bond pads of an integrated circuit by first providing a sacrificial bond pad for a sacrificial bond, then using a vision system associated with the bonder to determine the actual center of the pad as the intended bond location, and instructing the bonder to place a bond in the pre-programmed center of the pad. Second, the vision system is used to determine the actual location of the bond. Next, the error between the intended location and the actual location is determined by computing distances and directions between the pre-programmed and actual centers and the actual bond location. Finally, a new command of the bonder is computed such that a repetition of the initial error would cause the bond to be located in the actual center of another pad. This new command is input to the bonder.

Abstract: An apparatus for making wire connections between a first connection area (2) and a second connection area (3) by means of a capillary (10) contains an image recognition system which is designed so that the tip (27) of the capillary (10) enters the image area of the image recognition system immediately before impacting on the respective connection area (2). In this way, the position of the desired point of impact of the capillary (10) on the connection area (2) as well as the position of the tip (27) of the capillary (10) can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary (10).

Abstract: Assuming that the processes of joining, rolling, coiling, etc. of a material is evaluated by a preset speed pattern after the extraction from a heating furnace, the required time is predicted and calculated for both of a preceding material and a following material. At the time when the following material can catch up with the preceding material at an aiming position on the line, the following material is extracted from the heating furnace according to the result of the above prediction calculation. Control is carried out so that both of the preceding material and the following material finish the process at a preset speed. Also, the traveling speed of the following material is controlled according to the position and the speed of the tail edge of the preceding material in a section close to the catch-up position so that a distance between the tail edge of the preceding material and the leading edge of the following material be closed.

Abstract: A motor vehicle body assembly and welding station comprises a pair of facing tool (12) support conformators (11) designed to work on the body and taken between them by a conveyor system (14). The conformators are movable between a rest position in which the body is free to enter and exit the station and a work position in which the tools are near the body to work on it. At least some of the tools (12) comprise measurement means (20) for the relative position of facing body parts and the conformators have an intermediate position between said work and rest positions. On command control means (19) take the conformator into said intermediate position and activate the measurement means (20) to determine the agreement of body dimensions with predetermined measurement intervals and issue acceptance or rejection signals (22) for the body on the basis of the survey result.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.

Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

Abstract: Two position detectors for a leading strip and two position detectors for the trailing strip are provided so as to be separated each other by a certain distance along each of the strips in a transferring direction of the strips to detect a deviation of a center line of each of the strips in a width direction of the strips with respect to a center line of a processing line. Two alignment devices for the leading strip and two alignment devices for the trailing strip, which are provided so as to be separated by a certain distance in the transferring direction, clamp each of the strips and adjust a position of each of the strips in the width direction in response to each of the detected deviations to align the center line of each of the strips with the center line of the processing line.

Abstract: A plurality of materials are rolled in an upstream stand. While transfer speed of a succeeding material and the front end position thereof are detected, the transfer speed and the rear end position of a preceding material are detected by a measuring roll. The transfer speed of the succeeding material is controlled by adjusting at least the drive speed of the pinch rolls so as the front end of the succeeding material to contact with the rear end of the preceding material at a specified position in a travelling welder. the rear end of the preceding material is joined with the front end of the succeeding material by flash-butt welding using the travelling welder to form a continuous material while letting the travelling welder move at a speed synchronous with the transfer speed of the continuous material. The welded portion on the continuous material is ground and/or cut to remove burr therefrom.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.

Abstract: A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as to sense that the supply of the wire is insufficient, a wire-end detection sensor disposed on the gas-jet-out side of the tension-applying device so as to sense that the supply of the wire from the spool has stopped, and a control device controls so that the spool motor is rotated by a predetermined fixed amount when the wire is sensed by the wire pay-out sensor.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.