Abstract: An apparatus for making cable including an elongate core and a surrounding longitudinally welded tube includes one or more pairs of opposing tube forming rolls which form a tape into a generally tubular shape surrounding the advancing core. A pair of tube forming rolls define exit tube forming rolls mounted to have an adjustable spacing therebetween. A first sensor generates an exit roll spacing signal which is one parameter that may be displayed to the operator or used to directly to control the spacing. Downstream from an induction welding coil, a pair of opposing weld rolls are mounted to have an adjustable spacing therebetween for permitting setting of a desired pressure between the heated opposing longitudinal edges of the advancing tape. A second sensor generates a weld roll spacing signal which may also be displayed or used to directly control the spacing within a desired range. An associated method is also disclosed.

Abstract: Process, apparatus and nozzle device for controlling the soldering and/or desoldering of a land grid array (LGA) component and corresponding circuit grid present on the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum cup for supporting the LGA parallel to the PCB, with the LGA and the circuit grid in contact or slightly spaced, a fixed orifice gap for directing hot inlet gas from a gas source horizontally through the array, a gas outlet, and a thermocouple for sensing the temperature of the hot outlet gas and for signaling a computer to actuate a heater and a flow rate regulator. According to a preferred embodiment, this increases the temperature and decreases the flow rate of the hot gas through the array when a predetermined gas outlet temperature is sensed at the thermocouple.

Abstract: Soldering condition information such as the position and angle of a soldering iron, amount of solder supplied and heating time is stored beforehand, for each grouping of parts, in a part classification table (26) for soldering purposes. Parts to be mounted on a board are stored, in correspondence with the board ID, on a floppy disk of a floppy disk device (24). When the board ID is entered, the parts to be mounted on the board are displayed on a display unit (23). The operator reads out the part classification table (26) for soldering purposes and designates soldering correction information that corresponds to the part groups to which the parts belong. As a result, a teach-data table (27) in which soldering condition information has been stored in correspondence with the parts is created. Soldering is executed automatically in accordance with the teach-data table (27).

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract: A laser robot having a height sensing device (13) arranged at a position very close to a laser-beam projecting machining head (9) so that the axis of the height-sensing device (13) is parallel to the longitudinal axis of the machining head (9), the three-dimensional distance data representing the positional relationship between the laser projecting nozzle (9a) of the machining head (9) and the measuring end (13a) of the height-sensing device (13) being stored in advance in the robot controller (10), the longitudinal distance between the height-sensing device (13) and a starting point of laser-beam machining being automatically measured from directly above the starting point, and a longitudinal distance between the laser beam projecting nozzle (9a) of the machining head (9) and the machining starting point being corrected on the basis of the three-dimensional distance data and the longitudinal distance measured by the height sensing device (13) to thereby accurately locate the machining head at a position corr

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: An automated method for non-destructive inspection and evaluation of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The method includes automatic positioning of a transport apparatus containing EMAT transmitter and receiver coils in proximity of a just-completed weld; scanning the weld; receiving an electrical signal produced in the EMAT receiver coil by a reflected ultrasonic SH shear wave; recording and monitoring the electrical signal; analyzing tie electrical signal relative to predetermined control limits; signaling the presence of a defect in the weld; and communicating electronically with a welding apparatus to reperform and/or alter the way in which subsequent welds are made so as to avoid repetition of the defect. The method also includes automatic receiving, recording, and monitoring of welding apparatus and welding process data, as well as automatic adjustment of corresponding welding apparatus and welding process parameters.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: The present invention provides a wire bonder and its method that is able to automatically inspect whether an initial ball set with a keyboard has been formed.Ball formed on the end of a wire fed from capillary is placed on lead by driving of a bonding head, and the diameter of that ball is measured by photographing that ball by a camera after bonding a portion of the wire to which ball is connected.

Abstract: An automated system for non-destructive inspection of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The system includes: a computer control unit; a transport apparatus having a first EMAT for producing an ultrasonic SH shear wave and a second EMAT for receiving an ultrasonic SH shear wave reflected from a weld; a data acquisition unit and a calibration means. The computer control unit, which is in electrical communication with a welding apparatus, the transport apparatus and the data acquisition unit, coordinates the weld test with completion of the weld. An edge detection sensor, which is affixed to the transport apparatus is used to automatically position the transport apparatus for a weld scan and to signal completion of the scan. The system includes an electrostatic shield to protect the second EMAT from electromagnetic and radio frequency interference.

Abstract: Method of positioning an object on a carrier, device suitable for carrying out this method, and suction tube suitable for use in the device.The method is for laser soldering of an electronic component (7) on a pc-board (1). The component is positioned on a contact face (3) of the pc-board (1) by a device comprising a vibration transducer (53, 69, 85) which is brought into mechanical hard contact with the component (7) while the component is held against the pc-board. Subsequently, a laser (205, 207) heats solder present on the contact face and vibrations generated by the laser in the solder are passed on to the vibration transducer while the mechanical hard contact is being maintained. The vibration transducer then checks for the presence of mechanical contact between the object and the carrier and/or the melting of the solder from a comparatively strong decrease in the vibration amplitude during melting of the solder.

Abstract: Methods and apparatus for monitoring the temperature of a workpiece during fusing operations are provided. The apparatus includes a temperature sensor which monitors the temperature of a commutator bar being fused and outputs an electrical signal corresponding to that temperature. The electric current supplied to the fusing electrode can be interrupted or modified if the temperature of the commutator bar exceeds a predetermined temperature. In this manner, fusing operations can be interrupted if the temperature of the commutator bar approaches a temperature at which other components of the workpiece, such as the core material will be adversely affected. The temperature sensor preferably contacts the workpiece to conduct heat to a sensing element.

Abstract: For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

Abstract: A brush auger machine for assembling a brush to an auger is disclosed. The machine includes a frame for supporting an auger having a shaft and a spiral blade. A welding station is adjacent the frame. A guide chute receives the continuous brush and defines a diameter approximately equal to the outer diameter of the completed brush auger assembly. A discharge frame is positioned adjacent the welding station and includes a motor driven chuck which holds and rotates the end of the auger shaft. The motor and chuck are mounted on a movable platform. Welding is completed at the welding station and rotation of the auger shaft moves the assembly and the platform along the discharge frame.

Abstract: In the first operating unit, the bonding gap and the loop length of the bonding wire are calculated from the first and second bonding points. In the second operating unit, the length of the oblique line of the bonding wire, and the angle made between the oblique line and a line connecting the inner lead and the bed together are calculated from the bonding gap, the loop length, and the loop height. In the automatic operating unit, the reverse height, i.e. the distance by which the capillary is moved upward from the bonding pad position, the reverse amount, i.e. the distance by which the capillary, already ascended to the reverse height, is moved to the opposite side of the bonding position, and the capillary ascending amount, i.e. the distance by which the capillary, already moved by the reverse amount, is moved to the highest position of the capillary from the upper surface of the semiconductor chip are calculated from the length of the oblique line, the angle, and the loop height.

Abstract: In an automated final weld apparatus, a transporter conveys nuclear fuel-loaded cladding tubes successively to a check station to verify the presence of a plenum spring in the open end of each cladding tube, a reader station where a unique first end plug serial number is read, an evacuation/backfill station where the cladding tube is backfilled with helium, a seam welding station where a final end plug is welded to the cladding tube open end, and a seal weld station where the tube is pressurized with helium through a pressurization hole in the final end plug, whereupon the pressurization hole is welded closed. After checking for helium leakage, the seam weld is inspected in a succession of inspection stations, and, depending on inspection results, the finished nuclear fuel rods are sorted into accepted and rejected lots.

Abstract: A die bonding apparatus for bonding a semiconductor die onto a boding surface of a semiconductor lead frame by pressing the semiconductor die under a constant pressure. The apparatus includes a mounting section for mounting the semiconductor die a collet having chucking portion for holding the semiconductor die mounted on the die mounting section, a linear motor for moving the collet up and down, a separating member for separating the semiconductor die from the die mounting section, a horizontal driving section for moving the collet horizontally, a lead frame mounting section for mounting the semiconductor lead frame, a position sensor for detecting vertical positions of the collet and a linear motor control section for controlling vertical travel speed of the collet and bonding pressure of the die against the bonding surface of the semiconductor lead frame, by controllably driving the linear motor on the basis of position information of the collet detected by the position sensor.

Abstract: A TAB method is known to manufacture an electrical component by bonding a semiconductor on a film carrier made of synthetic resin, then punching the lead of the film carrier, and bonding a device obtained by punching to a circuit board. A bonding of a semiconductor to a film carrier as described above is called "an inner lead bonding". Bonding a punched device to a circuit board is called "an outer lead bonding". In the invention, the film carrier fed from the supply reel is punched by a punching unit, and the device obtained by punching is picked up by a bonding head. Then, the positional deviation of the lead of the device picked up with respect to the electrode of the circuit board is detected by the optical means. Subsequently, the positional deviation of the lead is corrected, the device is placed on the circuit board, and the lead is fusion-bonded to the electrode of the circuit board.

Abstract: A bonding apparatus comprising a bonding tool, means for driving the bonding tool, means for detecting an amount of crushing of a bonding portion during bonding, means for calculating a rate of change of the amount of crushing detected by the amount-of-crushing detecting means, means for setting a target value, which is inputted from an external source, of the amount of crushing of the bonding portion, and means for controlling the driving means. When the rate of change of the amount of crushing calculated by the calculating means is smaller than a predetermined value, the controlling means compares the amount of crushing detected by the amount-of-crushing detecting means with the target value. When the amount of crushing detected by the amount-of-crushing detecting means is smaller than the target value, the controlling means discriminates that the bonding is being performed in a satisfactory manner and hence should be continued.

Abstract: An in-jig assembly bond fixture for manufacturing a composite component having a plurality of parts includes at least one fixture for holding each of the plurality of parts in proper alignment relative to one another during a bonding operation. A mechanical mechanism is provided integral with the at least one fixture for applying a predetermined uniform compressive force to each bond line between each of the plurality of parts during the bonding operation. A plurality of heating elements is provided for applying heat directly to each bond joint and are each selectively located within the fixture for applying heat uniformly across each bond line during the bonding operation.

Abstract: Methods and apparatus for monitoring the temperature of a workpiece during fusing operations are provided. The apparatus includes a temperature sensor which monitors the temperature of a commutator bar being fused and outputs an electrical signal corresponding to that temperature. The electric current supplied to the fusing electrode can be interrupted or modified if the temperature of the commutator bar exceeds a predetermined temperature. In this manner, fusing operations can be interrupted if the temperature of the commutator bar approaches a temperature at which other components of the workpiece, such as the core material will be adversely affected. The temperature sensor preferably contacts the workpiece to conduct heat to a sensing element.

Abstract: Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.

Abstract: A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head and camera control unit detect locations of a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip. The program research unit calculates amounts of shift of the detected locations of the first and second bonding pads from reference locations thereof. The microcomputer corrects locations of first and second bonding points and those of first and second cutting points in accordance with the calculated amounts of shift. The control circuit and servo drive unit control the first and second bonding points and the first and second cutting points based on the corrected locations.

Abstract: An apparatus for mounting electronic components on the surface of printed boards by a suction head assembly 4 coupled to a head lift mechanism comprises a force sensor 6 for measuring the pressure exerted on the component by a mounting operation, and a microcomputer 1 for preparing a control signal in accordance with the deviation of the value measured by the force sensor from a desired value of pressure on the component. The rotation of a head lifting motor 51 is controlled based on the control signal.

Abstract: An integrated optical sensor for arc welding having multifunction feedback control. The sensor, comprising generally a CCD camera and diode laser, is positioned behind the arc torch for measuring weld pool position and width, standoff distance, and post-weld centerline cooling rate. Computer process information from this sensor is passed to a controlling computer for use in feedback control loops to aid in the control of the welding process. Weld pool position and width are used in a feedback loop, by the weld controller, to track the weld pool relative to the weld joint. Sensor standoff distance is used in a feedback loop to control the contact tip to base metal distance during the welding process. Cooling rate information is used to determine the final metallurgical state of the weld bead and heat affected zone, thereby controlling post-weld mechanical properties.

Abstract: A welding management apparatus for use with a tube production machine. A workpiece fed from a roll of metal strip is formed in a tubular formation having side surfaces opposite to each other. An upsetting pressure is applied to joint the opposite side surfaces of the workpiece at a jointing point. A high frequency power is supplied to the workpiece to weld the opposite side surfaces at the jointing point so as to produce a metal tube member. The welding management apparatus comprises a camera positioned to have a visual field including the jointing point for producing a video signal indicative of an image including an area luminous with a pre-arc produced in the visual field. An image processor converts the video signal into a luminance distribution pattern. An inference unit is provided for inferring a defective welding condition based upon the luminance distribution pattern. The inference unit includes an alarm unit for producing an alarm when a defective welding condition is inferred.

Abstract: The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at any pin forming station after the IC pins or leads have been electrically isolated from each other and from other ICs on a lead frame. This arrangement will allow for testing of the individual ICs much sooner than has hereinbefore existed after undertaking the encapsulation process.

Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.

Abstract: A method of producing reliable bonds of a lead to a bump on a semiconductor chip is accomplished by controlling the amount of deformation of the lead and the bump during bonding. A differential amplifier is used to sense the deformation and stop the application of force to the lead and the bump when a desired amount of deformation of the lead and the bump is obtained.

Abstract: The method and the corresponding installation detect sealing faults in metal protective tubes for protecting cables having electrical and/or optical conductors, referred to as "protected components", embedded in a sealing material filling the tube. The method consists in priming said sealing material with a detectable "test" gas either prior to or during injection of said material into said tube in a first station for enclosing the protected components inside the tube, and in causing said tube, filled in this way and optionally heated, to advance continuously past a detector, or inside a detection chamber of a second station containing the detector, either directly after the tube has been filled or at a subsequent stage. Application: land or under-sea cables, in particular for monitoring fluid-tight protective microtubes for protecting optical fibers.

Abstract: In order to have metallic articles to be brazed preheated evenly as a whole before transferring them into a brazing chamber of a continuous furnace where a high brazing temperature is created, a difference of temperatures of parts of the articles during their preheating is remotely sensed by means of their infrared energies and is minimized as small as possible by changing a transfer speed of the articles during their preheating with reference to the information based upon the infrared energies then sensed. A brazing period of time in the brazing chamber is kept constant and short, irrespectively of the transfer speed of the articles.

Abstract: A method and apparatus for tinning and soldering metal parts of electronic components and assemblies, and removing excess solder therefrom. The metal parts of the electronic components and assemblies are heated to a temperature near that of molten solder. A holding fixture, adapted to hold the heated components, slidably connects to an acceleration means which dips the metal parts of the components into the molten solder. Then acceleration energy is applied to the acceleration means, causing it to rapidly remove the components from the molten solder. Rapidly removing the components from the molten solder leaves excess solder behind, whereby all metal parts of the components are thoroughly tinned and soldered together without leaving unwanted solder bridges therebetween. A vibration means may also be used to prevent solder voids and promote solder wetting in densely packed leads and rails being tinned.

Abstract: A multi-chip semiconductor die bonder having a plurality of die handling chucks (23) and associated collets (14) which serve to pick up a plurality of semiconductor die (16) then position and bond each semiconductor die in position on a package (17). A plurality of mechanically controlled slides serve to move and correctly position both the plurality of semiconductor die (16) and the package (17) during the bonding process. The die bonder can bond the plurality of semiconductor die (16) in the package (17) without requiring repeated handling of the semiconductor die (16) and packages (17). The collets (14) are mounted on a removable collet guide block assembly (39) to minimize setup time.

Abstract: The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to a real-time feedback circuit. The feedback circuit transmits a force adjustment signal to a z-motion actuator to adjust the force applied to the bond site.

Abstract: A bonder that allows replacement of the bonding tool, corresponding to changes in the type of bonded component, to be performed both easily and rapidly, while also preventing the occurrence of operator-initiated errors accompanying the changes in bonded component type. As a result of allowing a bonding plate, which jointly applies compressive force to bonded components with a bonding tool, to float freely while being held by a diaphragm, the bonded components are adhered to the pressing surface of the bonding tool by the unrestricted bending of the diaphragm so as to follow its motion, thus eliminating the need for an operator to adjust the inclination of the bonding tool, as is necessary in conventional bonders.

Abstract: In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.

Abstract: A wire bonding device which comprises a height detector that detects the surface height of a semiconductor pellet, a position detector that detects the two-dimensional position of the semiconductor pellet, and a bonding head controller that controls a bonding tool, which changes the search height for the bonding operation according to the surface height of the semiconductor pellet detected by the height detector, to thereby make the bonding load constant and stabilize the ahdesive strength of the wire in the wire bonding.

Abstract: The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.

Abstract: Machinery for welding helical-seam pipe from metal strip. It includes a strip feed, a strip shaper, a seam welder, a pipe output, and a downstream pipe sectioner. The pipe sectioner has a cutter that moves back and forth axially, trimming sections of different lengths from the pipe as it rotates around its axis and leaves the machinery. The machinery also has controls that determine the welding gap between the section of the strip and the beginning of the pipe and how rapidly the pipe cutter moves along the pipe. How rapidly (v) the pipe cutter (47) moves along the pipe is controlled by three detectors. One detector (60 determines how rapidly (v.sub.b) the strip is traveling. Another detector (62) determines the strip-infeed angle (.alpha.) between the section (9) of strip and the axis of the pipe. A third detector, a camera (53), determines the axial deviation of the incision (54) over an angle (.beta.) to the pipe cutter at the circumference of the pipe.

Abstract: An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

Abstract: An apparatus for welding overlapping edges of plastic sheeting comprises a wedge-shaped heater assembly having spaced first and second heating surfaces converging to a wedge-tip. A heating element is operably associated with each of the surfaces for causing heating thereof. A sensor is operably associated with each of the surfaces for monitoring the temperature of sheeting passing therealong. A control system is operably associated with each of the sensors and with each associated heating element for controlling oeration of each of the heating elements in response to the temperature monitored by the associated sensor. A drive system is proximate the wedge-tip for causing sheeting to be advanced over the surfaces and to be compressed together upon passing beyond the wedge-tip for thereby being welded together.

Abstract: In order to control the cooldown temperature of a weld produced by a friction welding process, an electrical signal having a low voltage and a high current is passed through the weld thereby providing desired metallurgical properties. The weld acts as a resistor due to its high temperature as compared to the surrounding material such that the current causes the weld to heat up when the current passes through the weld and also causes the electrical signal to change as it passes through the weld. The change in current can be measured and the temperature of the weld can be controlled which allows the cooldown of the weld to be properly maintained for the desired metallurgical properties.

Abstract: A wire bonder and wire bonding method where there is repeatedly calculated the dislocation dy of the end of a capillary, based on the oscillation an elevation angle of a bonding arm which performs oscillating motion, on the end of which said capillary is provided. As a result of controlling the driving of an XY table based on the dislocation dy, the position of the end of the capillary is successively corrected so that the end of said capillary is positioned on a straight line which connects a first bonding point and a second bonding point.

Abstract: Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device are broken by a breaking unit, and a defect mark is applied on the defective semiconductor device by a defective mark putting unit in response to the defect signal, the defect mark applying unit applying the defect mark on an area other than an area to be covered with sealing material.

Abstract: In order to determine the temperature of a weld produced by a friction welding process, an electrical signal having a low voltage and a low current is passed through the weld. The weld acts as a resistor due to its high temperature as compared to the surrounding material such that the current in the electrical signal changes after its interacts with the weld. The change in current can be measured and the temperature of the weld can be determined.

Abstract: A convection braze furnace for brazing aluminum heat exchangers in an inert gas rich atmosphere includes entrance and exit vestibules forming atmosphere barriers of suspended stainless steel strips. The interior of the braze furnace is divided into multiple zones for progressively heating the heat exchangers to a brazing temperature and then cooling the heat exchangers in the final zone. An impeller circulates the heated intent gas atmosphere within each zone to accelerate heat transfer. A chain type conveyor supports the heat exchangers as they are moved through the braze furnace. An isolated return tube surrounds the lower return side of the conveyor chain as it passes through the braze furnace. The braze furnace housing is comprised of inner and outer shells having an inert gas pressurized cavity interstitial therebetween. The inner shell includes a plurality of expansion strips having generally ellipsoidal corner expansion joints.

Abstract: An improved system for the production of semiconductor devices is described. The invention incorporates conventional die attach and lead bond means into a simplified, common machine system. An independently mounted, computer-controlled, television camera system observes, monitors, and controls the operational steps of the die attach-lead bond process using a close loop process. The invention serves to increase throughout and yields while reducing variation of the finished product.

Abstract: For the continuous manufacture of optical modules incorporating optical fibres placed within a metal tube and embedded in a sealing product, the fibres (F) are introduced into a rectilinear guide tube (10) and the metal tube (T) is progressively formed around said guide tube from a tape or ribbon (R). The metal tube is then welded along the joint line slightly upstream of the front end of the guide tube (10). In order to permanently check the length ratio between the fibres and the metal tube in the thus obtained optical module, the fibres are introduced into the guide tube at a speed determined in real time on the basis of the measured values of the tensile force exerted on the welded tube, the speed of movement and the temperature of said tube. The sealing product (G) is injected into the welded tube slightly downstream of the front end of the guide tube (10) at a controlled flow rate so as to ensure a complete and non-excessive filling of the metal tube.

Abstract: An apparatus for forming metal tubes is shown in which a metal strip 2 is passed through the apparatus and is formed by a combination of rollers 17, 17', 19, and dies 15, 24 into a shape defining a tube. Prior to the completion of the formation of the metal strip 2 into a shape defining a tube, a brazing wire 1 is supplied through rollers 8 onto the metal strip 2 between two edge portions thereof to be bonded together. The edge portions are bonded together by means of a frictional wheel 27 rotating at high speed.

Abstract: An automatic braze welding machine for braze welding metal elements comprising a robot, a braze welding head carried by the robot and sensor means for detecting the position of the elements to be welded and the consequent positioning of the head; the head comprises an oxyacetylene torch disposed along a first axis, means for supplying a welding alloy along a second axis convergent with the first axis, and torch displacement means, adapted to cause a reciprocating linear motion of the torch along the first axis coplanar with the axes and orthogonal to the first axis, and its inclination about the first axis.