Laminated Patents (Class 235/488)
  • Patent number: 11562928
    Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the at least one code pattern is visible from a backside of the chip, the at least one code pattern represents a binary number having four bits; and the binary number represents a decimal number to represent a tracing number of the chip.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: January 24, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, Chi-Chih Huang
  • Patent number: 11504993
    Abstract: Provided are a hinged laminate body, a booklet, and a laminate body that are able to increase the installation area of a member for authenticity determination. A hinged laminate body is configured so as to be able to increase the installation area of a member for authenticity determination by being provided with: an upper transparent layer; watermarked paper that is arranged below the upper transparent layer; and a hinge layer that has a hinge portion protruding from the upper transparent layer in a plan view and that is arranged below the watermarked paper. The watermarked paper of the hinged laminate body is provided with: an inner watermarked paper section that is arranged between the upper transparent layer and the hinge layer; and an outer watermarked paper section that is provided to the hinge portion so as to be arranged contiguously with the inner watermarked paper section.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: November 22, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takumi Motoi, Toru Nishioka
  • Patent number: 11498355
    Abstract: The present invention discloses a greeting card having at least two surfaces and at least three edges, the greeting card comprising an intrinsically valuable base material comprising titanium or a titanium alloy and one or more gemstones embedded on one or more of the surfaces or edges; wherein the greeting card has a thickness of between about 1.0 mm and about 1.5 mm, a first dimension between about 70 mm and about 90 mm, and a second dimension between about 50 mm and about 60 mm; and further wherein the greeting card depicts one or more of a letter, number, symbol, artistic design, image, or message.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: November 15, 2022
    Inventor: Chanie Lazar
  • Patent number: 11494604
    Abstract: Identification labels and their incorporation in rubber-based articles are described. The labels include RFID components and can be incorporated in tires. The labels can withstand the relatively harsh conditions associated with vulcanization.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: November 8, 2022
    Assignee: Avey Dennison Corporation
    Inventors: Pavel Janko, Denis Markov
  • Patent number: 11446952
    Abstract: A structure for secure containment of information (SSCI) that is in the form of a laminate which includes at least two layers. The laminate is constructed to contain information such as a code, serial number, informational feature, encryption key or personal identification number (PIN). The information is located between the layer of the laminate such that the code, serial number, informational feature, encryption key, or PIN is not detectable from outside the laminate. The SSCI is configured to provide access and expose the code, serial number, informational feature, encryption key, or PIN by delaminating at least one layer, thereby indicating that tampering has occurred to the laminate. The SSCI can also function as a public key or private key for a blockchain, to provide access to a physical lock or to provide account access to claim financial value.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 20, 2022
    Inventors: Adam Trexler, Laurie Johansen, Paul Diffendaffer, Kelda Diffendaffer
  • Patent number: 11416728
    Abstract: Apparatus and method for producing contact, contactless and dual-interface metal transaction cards that provides enhanced durability and aesthetics, with increased production efficiency. The cards may include (i) a metal core subassembly comprising a metal layer or layers (metal inlay) having a slit (S) allowing for contactless functionality, and (ii) a UV hard coat on a release-carrier layer disposed on one or both sides of the metal core subassembly, and (iii) everything may be laminated together in a single step, providing a metal face smartcard. The hard coat provides a durable, scratch-resistant surface, and protects underlying layers while allowing the passage of a laser beam to write on or within the underlying layer(s), such as a transparent laser-reactive layer. Techniques for hiding or camouflaging the slit provide a more aesthetically pleasing appearance to the metal transaction card.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 16, 2022
    Assignee: Federal Card Services, LLC
    Inventors: David Finn, Daniel Pierrard, Alex Sanchez
  • Patent number: 11312830
    Abstract: It is provided that a polyester film excellent in heat resistant dimension stability, impact-resistant strength properties, easy-slipping properties, mechanical properties, transparency, and gas barrier performance, and a film roll obtained by winding up this polyester film. A polyester film includes at least one layer mainly including a polyester resin containing a dicarboxylic acid component including furandicarboxylic acid as a main component and a glycol component including ethylene glycol as a main component; and the polyester film has a plane orientation coefficient ?P of not less than 0.005 and not more than 0.200, a thickness of not less than 1 ?m and not more than 300 ?m, a heat shrinkage rate of 3.2% or less in each of the MD direction and the TD direction at 150° C. for 30 minutes, and a layer containing at least one additive.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 26, 2022
    Assignees: TOYOBO CO., LTD., Furanix Technologies B.V.
    Inventors: Jun Inagaki, Katsuya Ito, Yukihiro Numata, Shota Hayakawa, Jesper Gabriel Van Berkel
  • Patent number: 11275917
    Abstract: A reading device, a reading method and a reading program that can easily and quickly read a composite symbol, and a settlement processing method are provided. A moving image of a composite symbol which includes a plurality of symbols emerging in the same location and whose appearance changes depending on a viewing angle, is captured. The symbols included in the composite symbol are detected from the moving image obtained by image-capturing. Authenticity of the composite symbol is determined based on the obtained moving image.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: March 15, 2022
    Assignee: FUJIFILM Corporation
    Inventor: Ryo Takao
  • Patent number: 11227201
    Abstract: A transaction card that includes a card body that can include a ceramic material. The card body can include a primary surface and a secondary surface, a laser marked feature disposed on the card body and a laser etched feature disposed on the card body. A method of making a transaction card can include forming a ceramic material slurry comprising a ceramic material and a binder, forming a green body from the ceramic material slurry, firing the green body at a firing temperature to create a fired ceramic body, grinding the fired ceramic body into a card body, and polishing a primary surface of the card body.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 18, 2022
    Assignee: American Express Travel Related Services Company, INC
    Inventors: Troy Patrick Williams, Peter Bates
  • Patent number: 11188804
    Abstract: A manufacturing method of a smart card. The manufacturing method comprises: respectively hollowing out a plurality of substrates to obtain a plurality of hollowed-out substrates (101); synthesizing the plurality of hollowed-out substrates to obtain a multilayer synthesized hollowed-out substrate (102); filling the synthesized hollowed-out substrate with an internal insert (103); and coating the synthesized hollowed-out substrate with adhesive to obtain the smart card (104). By adopting the technical solution that a multilayer synthesized hollowed-out substrate is obtained by synthesizing a plurality of hollowed-out substrates, and the synthesized hollowed-out substrate is filled with an internal insert, the production difficulty of the smart card with a function of human-computer interaction is reduced, and the production efficiency is increased.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: November 30, 2021
    Assignee: Feitian Technologies, Co., Ltd.
    Inventors: Zhou Lu, Huazhang Yu
  • Patent number: 11190158
    Abstract: An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 ?m for electromagnetic signals having frequencies in a kilohertz range.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 30, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Dinhphuoc Vu Hoang, Robert Francis Darveaux
  • Patent number: 11170360
    Abstract: A magnetic secure transmission system includes an inductor, a switching circuit connected to the inductor, and a control circuit. The control circuit controls the switching circuit to adjust a level of a current in the inductor by a first amount over a data transmission period, such that the inductor emits a magnetic pulse including a first magnitude during the data transmission period. The control circuit controls the switching circuit to adjust the level of the current in the inductor such that the level of the current is increased and decreased repeatedly by a second amount between two different levels during a data non-transmission period, and the inductor emits a magnetic pulse including a second magnitude during the data non-transmission period. The second amount is less than the first amount, the first magnitude is greater than a threshold value and the second magnitude is less than the threshold value.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: November 9, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Woo Lee, Hyoung-Seok Oh, Sang-Hee Kang, Kwang-Chan Lee, Dae-Woong Cho, Jung-Wook Heo
  • Patent number: 11170620
    Abstract: Embodiments of the present disclosure generally relate to a wireless identification tag for association with a product to enable product self-identification and system and methods for use thereof. In one implementation, the tag may include at least one antenna tuned to receive energy transmitted at one or more frequencies within certain frequency bands. The tag may also include at least one transmitter that may be configured to send at least one identification signal. The tag may also include at least one circuit. The at least one circuit may be configured to detect whether energy is received in a certain frequency band, and to cause the at least one transmitter to operate in a mode corresponding to the certain frequency band.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: November 9, 2021
    Assignee: NEXITE LTD.
    Inventors: Anat Shakedd, Lior Shakedd
  • Patent number: 11134576
    Abstract: A printed circuit board has a first base region and a flexible region. The printed circuit board includes a core layer including a first insulating layer including a high elastic material and a first wiring layer disposed on the first insulating layer; a first build-up layer disposed on the core layer in the first base region, and including a second insulating layer including a low elastic material, and having a first through portion penetrating through the second insulating layer; and a first electronic component disposed in the first through portion and connected to the first wiring layer.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 28, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jun Oh Hwang
  • Patent number: 11104177
    Abstract: A structure for secure containment of information (SSCI) that is in the form of a laminate which includes at least two layers. The laminate is constructed to contain information such as a code, serial number, informational feature, encryption key or personal identification number (PIN). The information is located between the layer of the laminate such that the code, serial number, informational feature, encryption key, or PIN is not detectable from outside the laminate. The SSCI is configured to provide access and expose the code, serial number, informational feature, encryption key, or PIN by delaminating at least one layer, thereby indicating that tampering has occurred to the laminate. The SSCI can also function as a public key or private key for a blockchain, to provide access to a physical lock or to provide account access to claim financial value.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: August 31, 2021
    Inventors: Adam Trexler, Laurie Johansen, Paul Diffendaffer, Kelda Diffendaffer
  • Patent number: 11048936
    Abstract: An IC card includes a first visible layer comprising a nonmetallic natural material having a physical structure including a unique visual pattern. The IC card further includes a storage device configured to store a reference image of the unique visual pattern. The reference image is a scan of the unique visual pattern. The reference image is configured to be visually compared with the unique visual pattern for authentication. A second layer is included on a bottom surface of the first visible layer. The first visible layer and the second layer are laminated together. Each of the second layer and the nonmetallic natural material of the first visible layer have a same size to define a shape of the IC card.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 29, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Francesco Varone
  • Patent number: 11030513
    Abstract: A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: June 8, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Walther Pachler, Josef Gruber, Juergen Hoelzl, Francois Poensgen, Stephan Rampetzreiter
  • Patent number: 11023796
    Abstract: A flexible card may include a dynamic magnetic stripe communications device having multiple layers, such as an electromagnetic generator, a magnet, and a shield. A shield may form a non-flexible layer within the stack and may bend, but the shield may not be able to stretch or compress. Flexible layers may surround and adhere to the shield such that when the card is flexed, the flexible layers may stretch and compress with the movement of the shield. The dynamic magnetic stripe communications device may include one or more coils. Each coil may contain a stepped material, such that a length of a lower layer of the stepped material is longer than a length of a middle layer of the stepped material which is longer than a length of a top layer of the stepped material.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: June 1, 2021
    Assignee: DYNAMICS INC.
    Inventor: James H. Workley
  • Patent number: 10974534
    Abstract: A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: April 13, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takumi Motoi, Toru Nishioka
  • Patent number: 10977539
    Abstract: Example embodiments of systems and methods for preventing chip fraud are provided. A chip fraud prevention system may comprise a device including a chip, wherein the chip is at least partially encompassed in a chip pocket. One or more connections may be communicatively coupled to one or more surfaces of the chip, and a capacitance member may be coupled to a surface of the chip. The capacitance member may comprise a known capacitance value and the chip may comprise a memory containing an applet, wherein the applet is configured to measure the capacitance value of the capacitance member.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: April 13, 2021
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: Daniel Herrington, Stephen Schneider, Tyler Maiman
  • Patent number: 10954020
    Abstract: A method is described herein for attaching an adhesive label to a plastic object such that upon removal of the adhesive label substantially no adhesive residue is left-behind on the plastic object. In an example, the method can include applying a textured pattern to a portion of a plastic object to provide a textured surface on the plastic object. The textured pattern can be applied post molding of the plastic object. The method can include attaching to the textured surface an adhesive label.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: March 23, 2021
    Assignee: BUCKHORN, INC.
    Inventor: Matthew E. Bruestle
  • Patent number: 10943854
    Abstract: A semiconductor package includes a metal board, a first frame, and a second frame. The metal board has an upper surface with a mount area on which a semiconductor device is mountable. The first frame is located on the upper surface of the metal board to surround the mount area. The second frame is located on a bottom surface of the metal board to overlap the first frame. The metal board includes a protrusion protruding from its bottom surface. The protrusion has side surfaces in contact with inner walls of the second frame. The protrusion has a bottom surface located below the second frame.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: March 9, 2021
    Assignee: KYOCERA Corporation
    Inventors: Michikazu Nagata, Shoujirou Kizu, Shinya Tomida
  • Patent number: 10938090
    Abstract: An antenna module includes: a base substrate including a rigid region and a flexible region; an antenna member disposed on one surface of the rigid region of the base substrate and including antenna patterns; and a semiconductor package disposed on the other surface of the rigid region of the base substrate and including one or more semiconductor chips.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Mi Jung, Seong Hyun Yoo, Ji Hye Shim, Ki Seok Kim
  • Patent number: 10909334
    Abstract: The method comprises a pre-lamination step wherein a layer is placed in contact at least on one side with a lamination plate having a recess and the layer undergoes lamination such that a raised portion is formed on the layer; an assembling step wherein another layer is placed in contact with the layer, and the raised portion of the layer is at least partially placed in an opening of the other layer and a lamination step wherein said layers are laminated together.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 2, 2021
    Assignee: HID Global Rastede GmbH
    Inventor: Carsten Senge
  • Patent number: 10891533
    Abstract: A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: January 12, 2021
    Assignee: NEOLOGY, INC.
    Inventors: Joe Mullis, Steve Gonzalez, Emily Olanoff
  • Patent number: 10885419
    Abstract: A transaction card and a process of making the transaction card are described. The transaction card includes a core having first and second faces, a core thickness therebetween, and an opening, and embedded electronics disposed in the opening.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: January 5, 2021
    Assignee: CompoSecure, LLC
    Inventors: Adam Lowe, Syeda Hussain
  • Patent number: 10865026
    Abstract: A blister package comprises a plastic foil molding furnished with cavities and an opaque cover foil having at least one transparent region arranged outside of the cavities. The plastic foil molding defines the front side of the blister package and the opaque cover foil defines the back side of the blister package, and the blister package additionally has in a certain region, which is formed outside of the region of the cavities of the plastic foil molding and is arranged overlapping at least the transparent region of the opaque cover foil, a semi-transparent function layer. The semi-transparent function layer is constituted such that the blister package has in the transparent region of the opaque cover foil upon viewing in incident light a first, visually recognizable color and upon viewing in transmitted light has a second, visually recognizable color.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: December 15, 2020
    Assignee: GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH
    Inventor: Stephan Wessely
  • Patent number: 10839238
    Abstract: A method for validating a remote user's identity comprises retrieving a user's photo and a user's signature from a digital associated identification card; requesting a real-time photo set, wherein the real-time photo set includes a first photo and a second photo; requesting a real-time written signature with the requested real-time photo set; signature matching the real-time written signature against the user's signature of the digital associated identification card; background matching a background in the first photo of the real-time photo set against a background in the second photo of the real-time photo set; user matching an image of the user from the first photo against the user's photo from the digital associated identification card; and validating the user's identity in response to determining that the signature matching satisfies a first threshold, the background matching satisfies a second threshold, and the user matching satisfies a third threshold.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: November 17, 2020
    Assignee: International Business Machines Corporation
    Inventors: Ying Li, Harummiati Gandasasmita, Chitra Dorai
  • Patent number: 10820418
    Abstract: The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: October 27, 2020
    Assignee: THALES DIS FRANCE SA
    Inventors: Alain Le Loc'h, Jean-Marie Bertolotti, Jean-Christophe Fidalgo
  • Patent number: 10810475
    Abstract: Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: October 20, 2020
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: Daniel Herrington, Stephen Schneider, Tyler Maiman
  • Patent number: 10783422
    Abstract: A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: September 22, 2020
    Assignee: Composecure, LLC
    Inventors: John Herslow, Adam J. Lowe
  • Patent number: 10775490
    Abstract: A radio frequency (RF) system includes a flexible substrate that includes a first portion and a second portion. The first portion overlaps a first surface of a substrate. The first surface is on a first side of the RF system. The second portion overlaps a second surface of the substrate. The second surface is on a second side of the RF system. The RF system further includes an antenna disposed over the first portion of the flexible substrate. The antenna is configured to transmit/receive RF signals on the first side of the RF system. The RF system also includes a transmission line disposed on a bent region of the flexible substrate between the first portion and the second portion. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the second side of the RF system.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: September 15, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ashutosh Baheti, Saverio Trotta
  • Patent number: 10769515
    Abstract: A laminated core stock sheet for use in a composite laminate assembly that is separated into individual cards is provided. The sheet includes a core substrate layer and an intermediate filmic layer coupled to the core substrate layer. The intermediate filmic layer includes a conductive material that provides a security, decorative, or functional feature of the cards. The core substrate layer and the intermediate filmic layer are coupled with another laminated core stock sheet to form the composite laminate assembly. The conductive material has a small thickness within the intermediate filmic layer such that the intermediate filmic layer prevents conduction of electrostatic discharge (ESD) through the intermediate filmic layer and outside of the individual cards.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: September 8, 2020
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Daniel Szumski, Suwit John Sangkaratana, Roger D. Strasemeier
  • Patent number: 10740584
    Abstract: Software on an image-capturing device iteratively captures a visual code in a series of visual codes displayed in a repeating progression on a screen of a mobile device. The visual code was generated from a display block that resulted from a partition of an original data file into a series of display blocks of at least a specified size. The software converts the visual code back into a display block and reads a header for the display block, discarding the display block if it has already been captured, as determined by the ordered identifying block number in a header. The software stops the iterative capturing when all of the display blocks in the series have been captured, as determined by the count in the header and coalesces the captured display blocks into the original data file, using an order determined by the ordered identifying block numbers.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 11, 2020
    Assignee: Ping Identity Corporation
    Inventors: Armin Ebrahimi, Gaurav Khot
  • Patent number: 10719750
    Abstract: Approaches herein provide a transaction card with an ergonomic textured grip. In some approaches, a card includes a body having a first main side and a second main side, and an identification chip along the first main side of the body. The card may further include a textured grip along the second main side of the body, wherein the textured grip comprises a plurality of curvilinear grip elements extending in an undulating arrangement between a first end and a second end of the textured grip.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 21, 2020
    Assignee: Capital One Services, LLC
    Inventors: Daniel Herrington, Tyler Maiman, Stephen Schneider
  • Patent number: 10719756
    Abstract: A UHF band RFID tag with stable communication characteristics when attached to a metal surface. The UHF band RFID tag includes a resin block having a first surface serving as an attaching surface to the metal surface and a second surface opposing the first surface, a substrate on a second surface side of the resin block, a RFIC element mounted on the substrate, and a loop electrode connected to the RFIC element. The loop electrode includes metal bodies provided in the resin block and extending in a direction intersecting the first and second surfaces, a flat plate electrode on a first surface side of the resin block and connecting first ends of the metal bodies, conductor patterns on the second surface side of the resin block and connecting the RFIC element and second ends of metal bodies.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: July 21, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuki Eshima, Makoto Yasutake, Noboru Kato
  • Patent number: 10700422
    Abstract: In one embodiment, the antenna arrangement includes a primary antenna having a conductive sidewall; and a loop antenna disposed in and physically separated from the primary antenna. The loop antenna includes a first conductive loop and a capacitor electrically connected between ends of the first conductive loop.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: June 30, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byeong-Taek Moon, Jae-Suk Lee, Il-Jong Song, Young-Ki Lee, Yo-Han Jang
  • Patent number: 10651897
    Abstract: A near field communication (NFC) package in a portable device and method thereof are provided. The NFC package includes a secure storage device configured to store data, and an NFC controller configured to receive data from the secure storage device, provide the received data to a first external terminal by performing an NFC communication in an NFC mode, and provide the received data to a second external terminal by performing a magnetic secure transmission (MST) communication in an MST mode.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: May 12, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Hyo Lee, Byeong-Taek Moon, Il-Jong Song, Byeong-Hoon Lee
  • Patent number: 10625529
    Abstract: A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: April 21, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takumi Motoi, Toru Nishioka
  • Patent number: 10609820
    Abstract: An electronic component module includes a substrate, a coil element provided in or on the substrate, and an IC element connected to the coil element, in which external terminals are provided on the substrate, the substrate includes a first region and a second region different region from the first region when the substrate is viewed in plan view, the IC element is provided in the first region, the external terminals are provided at least in the first region, the coil element extends across the first region and the second region, and the first region is a rigid region and the second region is more flexible than the first region.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: March 31, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Keito Yonemori
  • Patent number: 10607130
    Abstract: Disclosed embodiments generally relate to a transaction card with a fabric inlay. The transaction card may include a housing component having a first housing surface opposite a second housing surface and an inlay component having a first inlay surface opposite a second inlay surface. The inlay and housing may be joined along the second inlay surface and the first housing surface. In addition, the first inlay surface may include a fabric material and a backer layer configured to support the fabric material of the first inlay surface.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: March 31, 2020
    Assignee: Capital One Services, LLC
    Inventor: Om J Suthar
  • Patent number: 10546760
    Abstract: A method of manufacturing a semiconductor device that includes a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, in which each of the pair of metal plates is exposed at corresponding one of both surfaces of the resin package is disclosed. The method may include preparing an assembly in which the semiconductor element is connected to the pair of metal plates; setting the assembly in a cavity of a mold, wherein one metal plate is in contact with a bottom surface of the cavity and a space is provided above the other metal plate; forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: January 28, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takuya Kadoguchi, Yuuji Hanaki, Atsuko Yamanaka, Shou Funano, Satoshi Takahagi, Shingo Iwasaki
  • Patent number: 10509926
    Abstract: A contactless payment device and method streams a sequence of magnetic-field pulses directly to two or three magnetic-stripe read heads of a point-of-sale terminal. Gaps between magnetic-field pulses are included in the signal to promote differentiation between different portions of the signal by different receiver channels in the point-of-sale terminal, and to encode additional information.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Zhujie (Luke) Liu
  • Patent number: 10479128
    Abstract: A security document with unidirectional visual illumination is disclosed. A security feature is positioned within the document and not visible in normal ambient lighting conditions but becomes visible under specialized lighting conditions, for example in the presence of ultraviolet light. The security feature is constructible such that it is visible only from a single side of the security document, with the side being predeterminable regardless of the orientation of the specialized light.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 19, 2019
    Assignee: ASSA ABLOY AB
    Inventor: Brett Barton Erickson
  • Patent number: 10471761
    Abstract: A transaction card includes a first full thickness portion and a second, reduced thickness portion. Each of the first and second portions includes a top surface and an opposing bottom surface spaced from the top surface by a thickness of the card. The first, full thickness portion includes an extent of the card that remains exposed when the card is inserted into a pocket of a card-carrying case, and a feature deviating from a flat region along at least one of the top surface and the opposing bottom surface of the card. The feature is configured for tactile engagement to facilitate removal of the card from the pocket.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 12, 2019
    Assignee: Capital One Services, LLC
    Inventors: Daniel Herrington, Scott McClellan
  • Patent number: 10474939
    Abstract: A dynamic transaction card that is manufactured using conductive plastic jumpers that will dissolve when in contact with a solvent used to tamper with the dynamic transaction card. Internal components of a dynamic transaction card may be manufactured using a synthetic or semi-synthetic organic material, such as, for example, plastics. These materials may be conductive to provide functionality to a dynamic transaction card, such as a connection between an integrated circuit and other card components such that when the materials dissolve, the connections are broken and the dynamic transaction card may be inactive due to the loss of various connections.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: November 12, 2019
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: David Wurmfeld, James Zarakas, Theodore Markson, Saleem Sangi, Tyler Locke, Kevin Kelly
  • Patent number: 10452967
    Abstract: A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: October 22, 2019
    Assignee: COMPOSECURE, LLC
    Inventors: John Herslow, Adam Lowe, Luis Dasilva
  • Patent number: 10426960
    Abstract: An antenna assembly includes a metal layer configured to emit linearly polarized electromagnetic energy to a receiving antenna implanted underneath a subject's skin; and a feed port configured to connect the antenna assembly to a signal generator such that the antenna assembly receives an input signal from the signal generator and then transmits the input signal to the receiving dipole antenna, wherein the antenna assembly is less than 200 um in thickness, and wherein the metal layer is operable as a dipole antenna with a reflection ratio of at least 6 dB, the reflection ratio corresponding to a ratio of a transmission power of the antenna assembly in transmitting the input signal and a reflection power seen by the antenna assembly resulting from electromagnetic emission of the input signal.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: October 1, 2019
    Assignee: Stimwave Technologies Incorporated
    Inventors: Chad David Andresen, Richard LeBaron, Laura Tyler Perryman
  • Patent number: 10406734
    Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: September 10, 2019
    Assignee: COMPOSECURE, LLC
    Inventor: Adam Lowe
  • Patent number: 10395157
    Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: August 27, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Thomas Spoettl, Jens Pohl, Peter Stampka