Double Rail Patents (Class 246/36)
Impedance bond (Class 246/37)
  • Polishing particles and a polishing agent
    Patent number: 6827639
    Abstract: In polishing particles each having a core-shell structure, a polishing rate can be controlled by adjusting a thickness and/or density of a shell portion. The polishing particles have the core-shell structure with an average diameter in the range from 5 to 300 nm, and the shell portion of the polishing particles includes silica with a thickness in the range from 1 to 50 nm. A density of the shell portion is in the from 1.6 to 2.2 g/cc, while the Na content of the shell portion is less than 10 ppm.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: December 7, 2004
    Assignee: Catalysts & Chemicals Industries Co., Ltd.
    Inventors: Hiroyasu Nishida, Yoshinori Wakamiya, Michio Komatsu