Abstract: A temperature detecting apparatus comprising: a first current reference for providing a first current to an intermediate node; and a second current reference for drawing a second current from the intermediate node; wherein at least one of the first current reference and the second current reference is temperature dependent; a resistor electrically connected to the intermediate node for enabling provision of a third current to the intermediate node or for drawing a third current from the intermediate node; and means for detecting the third current.

Abstract: Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Arsenide (InAs)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

Abstract: A novel and useful system wiring apparatus and related techniques that address the need to feed power and electronic signals to and from a sample board between the cold, low pressure region in a vacuum chamber and outside room temperature and atmospheric pressure. The wiring apparatus balances electrical resistance with the thermal conductivity of the power and signal conductors. Printed flexible cables are used having an annular sealing region which together with O-rings provide vacuum sealing while allowing electrical signals to pass between integrated circuit(s) inside the vacuum chamber and equipment outside the chamber. A thermal anchor is placed along the printed flexible cable to maintain a desired temperature along the cable. The printed flexible circuits are multilayer with two outer layers serving as an RF shield while two inner layers comprise the signal lines which typically require shielding, electrical isolation from each other and from external electromagnetic fields.

Abstract: Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Arsenide (InAs)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

Abstract: A cooled infrared camera includes a window housing comprising a plate having an opening, a window positioned in the opening of the plate, a first sidewall having a first end connected to the plate, a first flange connected to a second end of the first sidewall such that the first sidewall is between the plate and the first flange, a first explosively welded joint between the plate and the first sidewall, and a second explosively welded joint between the first sidewall and the first flange. A header is connected to the first flange of the window housing, and a warm end is connected to the header. The cooled infrared camera further includes a hermetically sealed chamber within the window housing and the header.

Abstract: A light-receiving device according to an embodiment of the present disclosure includes a pixel array including light-receiving elements provided in respective pixels. The light-receiving elements each include a high electric field region and a photoelectric conversion region. A plurality of the light-receiving elements provided in the respective pixels includes a plurality of types of elements that have temperature regions having high photon detection efficiency (PDE). The temperature regions are different from each other and partially overlap each other.

Abstract: In an example, a thermal imaging test article comprises a block configured to be attached to a blackbody on a back side of the block, the block having a variable thickness to represent facial features of a human face, the block including a cutout to allow a thermal imaging device to see the blackbody behind the block through the cutout, and one or more heaters thermally coupled to the block to produce heat to heat the block. The variable thickness of the block and the heat produced by the one or more heaters are selected to simulate thermally the human face on a front side of the block.

Abstract: A danger detector, for example a flame detector, includes an alarm housing with an alarm cover. The housing part of the alarm cover is permeable to heat radiation in the central infrared range. A non-contact, optical heat radiation sensor which is sensitive to the incoming heat radiation and optically oriented to the housing part is arranged in the alarm housing. A processing unit for further processing a sensor signal emitted by the heat radiation sensor is mounted downstream of the heat radiation sensor. The processing unit is designed to monitor the signal emitted by the sensor with respect to significant fluctuations or flicker frequencies for open flames and to determine, based on a direct component of the signal emitted by the sensor, a temperature value for the ambient temperature in the surroundings of the danger detector. The heat radiation sensor may be a thermopile or a bolometer.

Abstract: The invention relates to an improved method for the partial coloring, in particular for the color laser engraving, of plastic parts, in particular thermoplastic plastic parts, more particularly thermoplastic plastic parts that have a multi-layered structure, to the resulting partially colored, preferably color laser engraved, plastic parts, in particular thermoplastic plastic parts, and to a device for the partial coloring of plastic parts.

Abstract: A photodetector comprising a photoabsorber, comprising a doped semiconductor, a contact layer comprising a doped semiconductor and a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, the barrier layer disposed between the photoabsorber and contact layers. The relationship between the photo absorbing layer and contact layer valence and conduction band energies and the barrier layer conduction and valance band energies is selected to facilitate minority carrier current flow while inhibiting majority carrier current flow between the contact and photo absorbing layers.

Abstract: An optical path cover is located on an optical path through which beam light travels. The optical path cover includes a cylindrical portion through which the beam light is capable of passing. A plurality of protruding portions are formed on inner walls of the cylindrical portion, the inner walls facing toward a side of an optical axis of the beam light. The protruding portions, each of which has a convex shape in cross-section taken perpendicularly to the optical axis, are arranged next to each other with the convex shape facing toward the side of the optical axis. Each of the protruding portions has an elongated shape extending along the optical axis.

Abstract: A photodetector comprising a photoabsorber, comprising a doped semiconductor, a contact layer comprising a doped semiconductor and a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, the barrier layer disposed between the photoabsorber and contact layers. The relationship between the photo absorbing layer and contact layer valence and conduction band energies and the barrier layer conduction and valance band energies is selected to facilitate minority carrier current flow while inhibiting majority carrier current flow between the contact and photo absorbing layers.

Abstract: External biasing control unit for a reading circuit of an infrared photodetector element, the control unit being able to adopt: a first configuration wherein it sends a first set of biasing signals to a first stage of the reading circuit so that this first stage adopts a first operating mode corresponding to a first biasing mode of the photodetector, in particular a direct injection mode, a second configuration wherein it sends a second set of biasing signals to said first stage, the signals in the second set being designed so that said first stage adopts a second operating mode corresponding to a second biasing mode of the photodetector, in particular a buffer direct injection mode.

Abstract: Cryogenic analysis systems are provided that can include: at least one sample stage operatively aligned with at least one cooling source; at least one thermal link operationally coupled between the sample stage and the cooling source; and at least one link support between the cooling source and the sample stage, the link support engaging the thermal link. Methods for cooling a sample within a cryogenic analysis system are provided with at least some of the methods including: thermally connecting a cooling source to a sample stage supporting a sample via a thermal link; and supporting the thermal link between the cooling source and the sample stage.

Abstract: A closed cycle cryocooler is thermally connected to an elongated, cup-shaped sample well and cools down the sample well. Gaseous helium at a relatively low pressure is introduced into the sample well so that, as the sample well is cooled by the cryocooler, the gas in the sample well is also cooled. A sample is attached to a sample stick assembly which is then lowered into the sample well where the sample is cooled by the cooled gas to carryout experiments at low temperature. The sample stick assembly is mechanically attached to the spectrometer magnets and a flexible rubber bellows connects the sample stick assembly to the sample well so that vibration generated by the cryocooler is not transferred to the sample.

Abstract: An infrared temperature-measurement probe, including: a probe housing; a reflector; and a reflector adjusting mechanism. The probe housing includes an inner wall, an outer wall, a cooling channel sandwiched between the inner wall and the outer wall, a chamber surrounded by the inner wall, and a light transmission hole communicating with the chamber. The reflector includes a mirror and a mirror frame. The reflector adjusting mechanism includes a motion controller, a drive coupling, and three control rods. The reflector and the three control rods are disposed in the chamber of the probe housing. The motion controller is disposed outside the chamber of the probe housing. The drive coupling is disposed between the motion controller and the three control rods, and the motion controller is adapted to move each of the three control rods via the drive coupling. The mirror is imbedded in and is supported by the mirror frame.

Abstract: A bolometer circuit includes a substrate on which a focal plane array (FPA) of active bolometers is provided. Each active bolometer is configured to receive external infrared (IR) radiation and substantially thermally isolated from the substrate. The bolometer circuit also includes one or more blind arrays of blind bolometers shielded from the external IR radiation and substantially thermally isolated from the substrate. Noises in outputs from each column and/or each row of the FPA are corrected, reduced, or suppressed based on a statistical property of outputs from a corresponding column or row of the one or more blind arrays. Noise in each frame of IR image captured by the FPA may also be corrected, reduced, or suppressed using the one or more blind arrays.

Abstract: The present disclosure relates to the technical field of cryogenic cooling. In particular, the present disclosure relates to a mechanical vibration-isolated, liquid helium consumption-free cryogenic cooling device. The system according to some embodiments of the present disclosure comprises: a closed-cycle cryogenic cooling system, a helium heat exchange gas cooling and vibration isolation interface system, a cryogenic throttle valve cooling system, and a temperature feedback control system. The closed-cycle cooling system includes a cold head, a compressor, and a helium pipeline. The cryogenic throttle valve cooling system is thermally coupled to a low-temperature end of the cooling and vibration isolation interface.

Abstract: A manufacturing method which manufactures articles which have hollow areas inside them which are subject to their own internal vacuum. A 3-D printer can be located inside a vacuum chamber and the article(s) can be 3-D printed, thereby the hollow area inside each such article is subject to its own vacuum. When removed from the vacuum chamber, the article's hollow area remains subject to its own internal vacuum.

Abstract: An iris module and a camera module including the iris module. The iris module includes a base including a yoke, blades disposed on an object side of the base, and a driving magnet movable in a direction perpendicular to an optical axis direction, and disposed to oppose the yoke. The yoke includes holding portions on both ends of the yoke, and the holding portions protrude in a direction of the driving magnet.

Abstract: A cooling system is provided. The cooling system is associated with a dynamic nuclear polarization system and configured to cool a sample to a temperature suitable for dynamic nuclear polarization to be carried out on the sample while the sample is in the cooling system. The cooling system includes a cryogenic chamber that includes a cryogenic fluid. The cooling system also includes a removable sample sleeve insertable within a portion of the cryogenic chamber. The removable sample sleeve is configured to define a sample path for the sample within the cryogenic chamber that is isolated from other parts of the cooling system.

Abstract: A method of controlling FPA system stabilization includes calculating FPA adjustments as a function of FPA temperature and adjusting a TEC set point to assist the FPA adjustments in attaining a predetermined level of FPA performance. Adjusting the TEC set point can include adjusting the TEC set point as a function of at least one of ambient temperature, FPA temperature, or disparity between the predetermined level of FPA performance and a level of FPA performance obtainable by calculating the FPA adjustments as a function of FPA temperature alone without adjusting the TEC set point.

Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.

Abstract: A method for photothermal investigation of a sample (P), including: irradiating a first side of the sample (P) with an electromagnetic excitation pulse; detecting a result of the excitation pulse of one of the first side opposite second side of the sample (P) emitted thermal radiation (26); evaluating the detected thermal radiation based on a range defined by the following equations model: ?2T/?x2=1/?×?T/?t for 0<x<L, t>0 k×?T/?x?h×T=E(t)+??×(T(0,t)?T(L,t)) for x=0, t>0 k×?T/?x+h×d=???×(T(0,t)?T(L,t)) for x=L, t>0 T(x,0)=0 for t=0.

Abstract: The detection device comprises a cold finger which performs thermal connection between a detector fitted on a cooling plate and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the hafnium-based amorphous metal alloy. Advantageously, the whole of the cold finger is made from the hafnium-based amorphous metal alloy.

Abstract: A laser oscillation device includes: a refrigerant container; at least one cartridge which is attached to the refrigerant container and which includes a laser gain medium and an incidence path section for guiding laser seed light to the laser gain medium; at least one nozzle for spraying a refrigerant to the laser gain medium, the at least one nozzle being disposed inside the refrigerant container, and a vacuum heat insulating container housing the refrigerant container inside and forming a vacuum insulation layer on an outer peripheral side of the refrigerant container. The cartridge is disposed so as to be insertable and removable with respect to the refrigerant container along a longitudinal direction of the laser gain medium.

Abstract: An improved system for evaluating one or more components of a vehicle is provided. The system includes a set of imaging devices configured to acquire image data based on infrared emissions of at least one vehicle component of the vehicle as it moves through a field of view of at least one of the set of imaging devices. An imaging device in the set of imaging devices can include a linear array of photoconductor infrared detectors and a thermoelectric cooler for maintaining an operating temperature of the linear array of detectors at a target operating temperature. The infrared emissions can be within at least one of: the mid-wavelength infrared (MWIR) radiation spectrum or the long wavelength infrared (LWIR) radiation spectrum.

Abstract: A blackbody radiometric reference comprising a source plate or a target plate, metallic nanoparticles or other high emissivity coating disposed on the plate, and an intermediate coating such as paint. The plate may comprise copper, aluminum or composites thereof. Apparatus capable of functioning as a radiometric or thermometric reference. A pre-heater or weakly-coupled area may be disposed around or adjacent a highly thermally uniform area. A groove or perforations extending into a front surface of the source plate defining a weakly-coupled edge portion surrounding a thermally-controlled, optically-active area, and connected by bridges or structures thereto. An external probe may be located near the source plate for measuring ambient temperature, for compensating for ambient temperature or for radiative load on the blackbody.

Abstract: An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

Abstract: An infrared detector system is provided for detecting infrared radiation from an infrared radiation source or a scene. The system includes a first area that is semiconductor-based and biased to produce negative luminescence, the first area including at least one semiconductor-based detector. The detector system further includes at least one additional area being semiconductor-based and biased to produce negative luminescence. A low-emissivity specular retro-reflector shield is configured to reflect infrared radiation and covers the first area and the at least one additional area. The shield defines an aperture to allow the at least one semiconductor-based detector to receive incident rays of the infrared radiation from the infrared radiation source or the scene via a low-scatter, low-emission optical system such that the radiation incident from the infrared radiation source or scene substantially fills the solid angle defined by the aperture at any point in the first area.

Abstract: A IDCA system combining thermo-electric cooler (TEC) and an internal nBn photo-detector having a photo absorbing layer comprising an n-doped semiconductor exhibiting a valence band energy level; and a contact layer comprising a doped semiconductor. A barrier layer is disposed between the photo absorbing layer and the contact layer, the barrier layer exhibiting a valence band energy level substantially equal to the valence band energy level of the doped semiconductor of the photo absorbing layer; the barrier layer exhibiting a thickness and a conductance band gap sufficient to prevent tunneling of majority carriers from the photo absorbing layer to the contact area and block the flow of thermalized majority carriers from the photo absorbing layer to the contact area. Alternatively, a p-doped semiconductor is utilized, and conductance band energy levels of the barrier and photo absorbing layers are equalized.

Abstract: A method for detecting infrared radiation includes the steps of: providing a resistive bolometer retina including a plurality of resistive bolometers suspended above a substrate of a bolometric detector; acquiring the infrared radiation by the resistive bolometer retina to produce a plurality of raw read signals provided by the bolometers; correcting a response dispersion of the resistive bolometers in the raw read signals using a gain table, each gain of the gain table being associated with a bolometer of the resistive bolometer retina.

Abstract: An object of the present invention is to provide an infrared lens unit having a high optical quality and an infrared camera system provided with the infrared lens unit. An infrared lens unit according to the present invention to achieve the object is the infrared lens unit to be attached to an infrared camera-module characterized in comprising a data memory for storing lens data and an image focusing condition is controlled according to the data stored in the data memory and temperature data in the infrared lens unit.

Abstract: Optical imaging systems and methods providing having variable lateral zoom. In one example, an optical imaging system with variable lateral zoom includes primary optics configured to receive and direct incident electromagnetic radiation from a viewed scene onto a focal plane to form a substantially planar intermediate image at the focal plane, the intermediate image having substantially uniform lateral magnification, an eyepiece optically coupled to the primary optics and configured to reimage the intermediate image onto an image plane to produce an output image having variable lateral magnification, and a photo-sensitive detector positioned at the image plane.

Abstract: A video camera includes a first temperature sensor, a control logic circuit, a main system, a heating module, a fan and a power supply. After the power supply supplies power to the video camera, the first temperature sensor comes to be active, when the temperature sensed by the first temperature sensor is less than T1, the first temperature sensor outputs a control signal to the control logic circuit, which activates the heating module and the fan and prevents the power supply from supplying to the main system; and when the temperature sensed by the first temperature sensor is greater than T1, the first temperature sensor outputs a control signal to the control logic circuit which enables the power supply to supply to the main system and inactivates the heating module and the fan, and therefore, a normal activation and stable operation of the video camera at low temperatures are ensured.

Abstract: Optical detection apparatus (300) comprising an optical detector (302, 304, 306), a detector amplifier (336, 338, 340), and switching means, e.g., a multiplexer (344, 348), for dynamically selecting at least one of the optical detector or the detector amplifier by switching from among at least two alternative optical detectors and/or at least two detector amplifiers such as to minimize noise equivalent power (NEP) of a selected detector or combination of detector and amplifier under given operating conditions.

Abstract: According to one embodiment, an apparatus includes an optical sensor having one or more thermally sensitive components. The sensor is gimbal mounted on a space or air-borne vehicle and includes a heat sink component thermally coupled to the one or more thermally sensitive components via at least one heat strap and configured to at least passively receive and store thermal energy from the one or more thermally sensitive components without use of a motorized thermal energy transfer device. The apparatus also includes a radiator configured to receive thermal energy from the heat sink component and to dissipate thermal energy to an ambient environment. The radiator is disposed on a first side of an optical path of the sensor opposite a second side of the optical path on which the heat sink component is disposed. The heat sink component is configured to at least partially balance a center-of-gravity of the sensor.

Abstract: An optical lens system for focusing light on a focal plane for detection by a detector device. The optical lens system comprises a series of optical materials including first and last optical materials with a plurality of other optical materials located therebetween. A housing accommodates the series of optical materials, and each of the optical materials is spaced a desired distance from one another. An external entrance pupil supplies infrared light to the series of optical materials of the optical lens system, and the entrance pupil is located in front of the first optical material. A Dewar window and a filter are located between the last optical material and the focal plane. The optical materials are selected and arranged to focus simultaneously both mid-wave infrared light and long-wave infrared light on the focal plane over a wide temperature range.

Abstract: An infrared (IR) imaging system is presented. The system includes a cooling chamber associated with a cooler generating a certain temperature condition inside the chamber. The cooling chamber has an optical window, and includes thereinside an IR detection unit including one or more detectors thermally coupled to the cooler and at least two cold shields thermally coupled to the cooler and carrying at least two imaging optical assemblies. The at least two imaging optical assemblies are enclosed by the cold shields in between the detection unit and the optical window and thereby define at least two different optical channels for imaging light from the optical window onto the one or more detectors of the detection unit.

Abstract: A method of assembling a disk drive according to the invention comprises steps of: providing a base component of a housing of the disk drive; providing a cover component of the housing; mating the base component and the cover component to form an enclosed housing that encloses disk drive components for operation of the disk drive; and sealing the disk drive using low thermal energy bonding. A hermetically sealed disk drive of the invention comprises: a housing comprising a base and a cover; and disk drive components enclosed within the housing for operation of the disk drive, wherein the housing comprises a bondline continuously extending around a periphery of the housing for sealing the same.

Abstract: An ATR sensor has a housing and sensor components in the housing including an electromagnetic radiation source for emitting a predefined wavelength range, a reflection body permeable for radiation and contactable with a fluid to be evaluated, and a detector for the reflected radiation as well as other members for conducting the measurement and for operation. The sensor is particularly suited for measuring a CO2 content of a fluid. Before sealing the housing in a gas-tight manner, in particular for avoiding a measurement value drift and for keeping the radiation paths free of CO2, a CO2 getter material is introduced into the housing and/or into a receiving space of an additional housing that communicates with the interior space of the housing before sealing the interior space and/or the receiving space.

Abstract: A device to detect thermal radiation has a membrane and at least two detector elements that are respectively set up to transduce thermal radiation into an electrical signal and are mounted situated next to one another on the membrane, wherein at least one heat dissipation path is provided on the side of the membrane facing towards the detector elements and/or on the side of the membrane facing away from the detector elements, which heat dissipation path has a higher heat conductivity than the membrane and is connected with the detector elements in a heat-conductive manner via the membrane so that heat can be discharged from the detector elements with the heat dissipation path, whereby the response time of the detector elements is short; and wherein at least one heat barrier that has a lower heat conductivity than the membrane and extends between the detector elements is provided integrated into the membrane, such that a heat conduction in the membrane from the one detector element to the other detector elemen

Abstract: Infrared imagery device with integrated shield against parasite infrared radiation, and method of manufacturing the device. This device comprises a support provided with an infrared radiation detector, at least one optical device facing the detector, and a shield against parasite radiation. The shield comprises at least two continuous beads, spaced from each other, extending from the support as far as the optical device, provided with vents and made of a material that significantly attenuates parasite radiation, penetrating laterally between the support and the optical device. The two beads with their vents 15 form a baffle. The device is manufactured using the flip chip technique.

Abstract: A method for cooling an imaging device includes providing, by a cold finger, a cold sink to the imaging device and conducting heat from a cold shield, a sensor chip assembly and a leadless chip carrier towards the cold finger through a plurality of parallel paths. The imaging device includes a dewar assembly having a cold shield, a sensor chip assembly disposed on a leadless chip carrier (LCC) and configured to capture an infrared image, a cold finger configured to cool the dewar assembly; and a thermal adapter. The thermal adapter is configured to draw heat from the cold shield and sensor chip assembly through a plurality of parallel paths towards the cold finger.

Abstract: An ultra-high temperature optical method incorporates speckle optics for sensing displacement and strain measurements well above conventional measurement techniques. High temperature pattern materials are used which can endure experimental high temperature environments while simultaneously having a minimum optical aberration. A purge medium is used to reduce or eliminate optical distortions and to reduce, and/or eliminate oxidation of the target specimen.

Abstract: An infrared detector may include a substrate, a resonant unit spaced apart from the substrate, the resonant unit configured to generate heat by inducing resonance at a plurality of wavelengths of incident infrared light, a thermistor layer configured to support the resonant unit and be spaced apart from the resonant unit, the thermistor layer having a resistance value that varies according to the heat generated in the resonant unit, and a connection unit configured to support the thermistor layer such that the thermistor layer is spaced apart from the substrate and electrically connect the thermistor layer to the substrate.

Abstract: An infrared detector capable of detecting an infrared spectrum having a wide bandwidth using a broadband light absorber. The infrared detector including a substrate, a light absorber disposed apart from the substrate at a distance, and a pair of thermal legs configured to support the light absorber such that the light absorber is spaced apart from the substrate by the distance. The light absorber includes at least one thermistor layer having a resistance value that varies according to temperature and at least two resonator layers disposed on at least one of upper and lower surfaces of the at least one thermistor layer.

Abstract: A multi-band aperture filter for optically coupling to a focal plane array (FPA) of a camera includes a substrate, and a first spectral coating on a first surface of the substrate that passes both a first longer and a second shorter wavelength band. A second spectral coating that passes the longer wavelength band and blocks the shorter wavelength band is on an outer annulus region, but not on an inner region on the first surface or a second surface of the substrate. The second spectral coating provides a larger aperture area for the longer wavelength band as compared to an aperture area for the shorter wavelength band to passively realize different F-numbers for the bands to provide substantially matched beam spot sizes on the detector array for the longer wavelength band and the shorter wavelength band, such as a long-wave infrared (LWIR) band and a mid-wave IR (MWIR) band.

Abstract: A focal plane assembly facilitates a molybdenum base plate being mounted to another plate made from aluminum. The molybdenum pin is an interference fit (press fit) in the aluminum base plate. An annular cut out area in the base plate forms two annular flexures.

Abstract: A IDCA system combining thermo-electric cooler (TEC) and an internal nBn photo-detector having a photo absorbing layer comprising an n-doped semiconductor exhibiting a valence band energy level; and a contact layer comprising a doped semiconductor. A barrier layer is disposed between the photo absorbing layer and the contact layer, the barrier layer exhibiting a valence band energy level substantially equal to the valence band energy level of the doped semiconductor of the photo absorbing layer; the barrier layer exhibiting a thickness and a conductance band gap sufficient to prevent tunneling of majority carriers from the photo absorbing layer to the contact area and block the flow of thermalized majority carriers from the photo absorbing layer to the contact area. Alternatively, a p-doped semiconductor is utilized, and conductance band energy levels of the barrier and photo absorbing layers are equalized.