Abstract: A sensor includes: a substrate and at least one infrared temperature measurement unit disposed on the substrate. An infrared temperature measurement sub-unit includes: a first support portion, at least one second support portion, a thermocouple, and an infrared absorption portion. The thermocouple includes a first electrode and a second electrode, each of which includes a first end and a second end; the first ends of the first electrode and the second electrode are connected and disposed on the first support portion; the infrared absorption portion is disposed on the first support portion and covers the first ends of the first electrode and the second electrode; the second ends of the first electrode and the second electrode are not connected and disposed on the second support portion; and in the infrared temperature measurement unit, a cavity structure is included between at least the adjacent first and second support portions.

Abstract: Operations of radiometers may be improved by calculating calibration uncertainties for the radiometer. Initially, operational characteristics for the radiometer, and/or historical calibration parameters for a plurality of previously performed calibration processes using the radiometer may be obtained. Additionally, a calibration uncertainty for the radiometer based on the obtained operational characteristics for the radiometer and the obtained historical calibration parameters may be calculated, and desired, calibration parameters for the radiometer may be identified. The identified desired, calibration parameters may be based on the calculated, calibration uncertainty.

Abstract: Metering structure includes a rigid strut configured to support an optical element. A rigid shield mounted on the strut has a shield length which is substantially coextensive with the elongated length of the rigid strut such that rigid shield substantially encloses the strut along the entire shield length. The rigid shield has a surface finish which is highly absorptive of electromagnetic radiation in the optical spectrum. One or more thermal insulating material layers comprise a multi-layer insulation (MLI) system disposed between the rigid strut and the rigid shield. Rigid and flexure brackets secure the rigid shield to the strut.

Abstract: A method of manufacturing an optical sensor arrangement including the steps of providing a substrate having a surface and providing an integrated circuit comprising an optical detector arranged for detecting light of a desired wavelength range. The integrated circuit and a light emitter are mounted onto the surface, wherein the light emitter is arranged for emitting light in the desired wavelength range. The integrated circuit and the light emitter are electrically connected to each other and to the substrate. A light barrier is formed between the optical detector and the light emitter by dispensing a first optically opaque material along a profile of the integrated circuit. A mold layer is formed by at least partly encapsulating the substrate, the integrated circuit and the light emitter with an optically transparent material. A casing, made from a second optically opaque material, is mounted on the light barrier and thereby encloses a hollow space between the casing and the mold layer.

Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.

Abstract: A fluid sensor for performing a reference measurement includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a first waveguide section and a first thermal radiation detector on the top main surface region of the support structure; and a cover structure on at least one part of the first waveguide section. The first waveguide section guides a first portion of the thermal radiation emitted by the thermal emitter to the first thermal radiation detector. The first thermal radiation detector detects the guided first portion of the thermal radiation for performing the reference measurement.

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

Abstract: The present disclosure relates to a microbolometer comprising an array of pixels, each pixel comprising one or more detection cells, each detection cell comprising an absorption layer (530) forming a quarter-wave cavity (533) having a height (h) of between 1.5 and 5 ?m, wherein the pitch of the detection cells in at least one axis in a plane of the pixel array is in the range 2.4 h to 3.6 h.

Abstract: The invention relates to a method for processing raw measurements collected by bolometers of a detector, the method comprising: a) a calculation of masked terms, the calculation consisting in subtracting from the raw measurement of each masked bolometer of a given column the mean value of the raw measurements of the masked bolometers of the said column; b) a correlation between the masked terms and calibrated components of the masked bolometers, determined according to the relation: S_mask ? _cal ? _ ? ( i , j ) = S_mask ? _ref ? _ ? ( i , j ) - 1 n ? ? k = 1 n ? ? S_mask ? _ref ? _ ? ( k , j ) the terms being masked bolometer reference measurements obtained at a reference temperature and by masking the detector with a mask; c) a step of correcting the raw image which comprises the calculation of corrected measurements of a corrected image for each bolometer on the basis of the result of the correlation step b).

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

Abstract: An electromagnetic wave transmissive cover is configured to be employed in a vehicle to which a sensor device is attached. The electromagnetic wave transmissive cover includes a cover body that is attached to the vehicle and covers the sensor device from a front side in an emission direction of the electromagnetic waves, and a seal member that provides a seal between the sensor device and the cover body. The seal member includes an attachment base portion that is attached to the cover body while surrounding the electromagnetic wave transmissive portion, and an annular hollow seal portion that is coupled to the attachment base portion and is in contact with the sensor device while surrounding the electromagnetic wave transmissive portion.

Abstract: An image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, and the first photoelectric conversion component includes: a first metal layer formed on the substrate; a first photoelectric conversion layer formed on the first metal layer; and a second metal layer formed on the first photoelectric conversion layer.

Abstract: The present invention relates to the field of rotary imaging, in particular to a rotary imaging system, a rotary imaging method and a rotary device. A rotary imaging system of a rotary device comprises a rotating body with a lamp belt module group; a circuit board installed on the rotating body, the circuit board rotating synchronously with the rotating body; an acceleration detection component installed at a predetermined position on the circuit board for acquiring acceleration detection data at the predetermined position when the circuit board rotates; and a control module used for obtaining an acceleration value of the predetermined position based on the acceleration detection data, further obtaining a rotation speed value of the circuit board based on the acceleration value and a position parameter corresponding to the predetermined position, and driving the lamp belt module group to realize rotary imaging based on the rotation speed value.

Abstract: A radiation imaging apparatus includes an imaging surface; a light source; and an array of micro mirrors that rotate via radiation absorbed in the micro mirrors and reflect light from the light source to generate a distribution of reflected light on the imaging surface. The array first micro mirrors and second micro mirrors. The first micro mirrors have a first structure and the second micro mirrors have a second structure different than the first structure. The second structure is configured to correct for one or more environmental influences on the radiation imaging apparatus. A photodetector captures an image of the distribution of reflected light on the imaging surface. A processor is coupled to the photodetector. A communication interface is coupled with the processor; and a computing device is located separately from the radiation imaging apparatus and in communication with the communication interface.

Abstract: An arboriculture safety monitoring system (300) comprising at least one arboriculture safety monitoring device (200) and at least one arboriculture safety user interface device (100), the at least one arboriculture safety monitoring device (200) comprising at least one proximity sensor, a controller and a communication interface, the arboriculture safety user interface device (100) comprising alerting means, a communication interface, and a controller wherein the at least one arboriculture safety monitoring device (200) is configured to: connect to at least one of the at least one arboriculture safety user interface device (100), detect that a person has come within range of the at least one proximity sensor, and in response thereto emit an alert through alerting means of the arboriculture safety user interface device (100).

Abstract: A detection system includes a readout substrate, at least one thermal detector associated with a reflector, and at least one compensation device including a compensation transducer in thermal contact with the readout substrate, arranged between the reflector and the readout substrate, and situated facing the reflector so as to be optically insensitive to the incident electromagnetic radiation.

Abstract: A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.

Abstract: A gas sensor includes, in a single housing section, a substrate mounting surface 31 mounted with a substrate including a light emitter and a light receiver and a mirror section including plural reflectors. Then, in the housing section, all of the plural reflectors are integrally molded on an inner surface of the housing section to multiple reflect light emitted from the light emitter and cause the light to enter the light receiver in an opposing direction of one side and the other side in an extension direction of the substrate mounting surface.

Abstract: There is provided an imaging device, an electronic apparatus including an imaging device, and an automotive vehicle including an electronic apparatus including an imaging device, including: a first substrate including a first set of photoelectric conversion units; a second substrate including a second set of photoelectric conversion units; and an insulating layer between the first substrate and the second substrate; where the insulating layer has a capability to reflect a first wavelength range of light and transmit a second wavelength range of light that is longer than the first wavelength range of light.

Abstract: The invention relates to an apparatus for probing a sample comprising a light source for emitting an illuminating light beam, a birefringent element for splitting the illuminating light beam into two sheared beams, a reflective element for reflecting the two sheared beams, wherein the apparatus is configured such that the reflected beams propagate through the birefringent element for recombining the reflected beams, and a detector for detecting the recombined beam, wherein the sample is arrangeable in the optical path of the sheared beams or at the backside of a reflective surface in the optical path of the sheared beams, the reflective surface exhibiting a surface plasmon resonance or a localized surface plasmon resonance.

Abstract: A see-through reflective optical device includes: a reflective metasurface configured for a targeted design optical wavelength, wherein the reflective metasurface comprises a sub-wavelength periodic arrangement of meta-atoms formed by patterned isolated gap surface plasmon (GSP) resonators, where the patterned isolated GSP resonators comprise a patterned optically thin metal layer for the design wavelength, an optically thick metal layer for the design wavelength, and an insulator layer between the patterned optically thin metal layer and the optically thick metal layer; and an array of apertures of random positions and diameters greater than the targeted design wavelength formed through the reflective metasurface providing a designed percentage of light transparency through the reflective metasurface. The reflective metasurface of the see-through reflective optical device may comprise, e.g.

Abstract: An example objective of the present invention is to provide a bolometer capable of reducing its manufacturing cost. A bolometer according to an example aspect of the present invention includes: a substrate; and an infrared detection unit comprising a bolometer film, wherein the infrared detection unit is held on the substrate with a gap therebetween by a supporting unit, wherein the bolometer film is a carbon nanotube film includes semiconducting carbon nanotubes in an amount of 67% by mass or more of the total amount of carbon nanotubes, and the thickness of the carbon nanotube film is in the range of 10 nm to 1 ?m, and the density of the carbon nanotube film is 0.3 g/cm3 or more.

Abstract: Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong mid-IR or LWIR absorbers, such as pyrolytic carbon columns. Each microcavity and the associated absorber(s) rest on hollow pillars that extend from a substrate and thermally isolate the cavity and the absorber(s) from the rest of the bolometer. This ensures that thermal transfer to the absorbers is predominantly from radiation as opposed to from conduction. As the absorbers absorb thermal radiation, they shift the resonance wavelength of the cavity.

Abstract: Various embodiments are directed to telescopic apparatus, systems and methods for daylight imaging of satellites and other objects, a platform/telescope configured for daylight imaging of satellites and other objects, as well as modifications thereto configured to perform specific functions individually and/or in conjunction with other platforms/devices (e.g., radar tracking devices).

Abstract: In a spectroscopic module, a light shielding member is disposed between a plurality of bandpass filters and a light detector. The light shielding member includes a plurality of wall portions. The plurality of wall portions are arranged along an X direction with a light passage opening interposed therebetween, each of a plurality of optical paths from the plurality of bandpass filters to a plurality of light receiving regions passing through the light passage opening. A first wall portion and a second wall portion adjacent to each other among the plurality of wall portions are in contact with the bandpass filter, the bandpass filter corresponding to the light passage opening between the first wall portion and the second wall portion. A width in a Y direction of the light passage opening is larger than a width in the Y direction of the bandpass filter.

Abstract: A mechanically tunable reflective metamirror optical device for a targeted design optical wavelength includes a dynamically deformable substrate and a sub-wavelength periodic arrangement of patterned isolated gap surface plasmon (GSP) resonators positioned in or on the dynamically deformable substrate. The patterned isolated GSP resonators are movable relative to each other and comprise a patterned optically thin metal layer for the design wavelength, a patterned optically thick metal layer for the design wavelength, and a patterned insulator layer between the patterned optically thin and optically thick metal layers.

Abstract: Embodiments of a method for examining shipments are disclosed herein. In the method, at least one shipment is arranged in an examination area. Radiation is emitted into the examination area for examining the at least one shipment by means of a radiation source. Radiation from the examination area is captured by means of a sensor device. The radiation source emits terahertz radiation, and the radiation source covers substantially the entire terahertz frequency spectrum from 1 terahertz to 6 terahertz.

Abstract: A light detector includes a substrate, a membrane disposed on a surface of the substrate, a first and a second electrode post supporting the membrane. The first electrode post includes a first main body portion having a tubular shape spreading from a first electrode pad toward a side opposite to the substrate, and a first flange portion provided in an end portion at the side opposite to the substrate in the first main body portion. The first flange portion is provided with a first sloped surface inclined so as to approach the substrate as it goes away from the first main body portion. A first wiring layer reaches an inner surface of the first main body portion through the first sloped surface. The second electrode post and the second wiring layer are formed similarly to the first electrode post and the first wiring layer.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with a light blocking barrier.

Abstract: A fluid sensor includes a substrate having a top main surface region, wherein the top main surface region of the substrate forms a common system plane of the fluid sensor, a thermal radiation emitter on the top main surface region of the substrate, an optical filter structure on the top main surface region of the substrate, a waveguide on the main top surface region of the substrate, and a thermal radiation detector on the top main surface region of the substrate, wherein the thermal radiation detector provides a detector output signal based on a radiation strength of the filtered thermal radiation received from the waveguide.

Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Abstract: A pixel for an image sensor includes a resistive microbolometer sensor portion, a visible image sensor portion, and an output path. The resistive microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the resistive microbolometer sensor portion. The resistive microbolometer sensor portion uses no bias current. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the resistive microbolometer sensor portion and the visible image sensor portion, and may be controlled to selectively output the signal corresponding to the IR image, the signal corresponding to the visible image, or a fused image based on the IR image and the visible image. The resistive microbolometer sensor portion may sense a near infrared image or a longwave infrared image.

Abstract: A holographic waveguide LIDAR comprises a transmitter waveguide coupled to a beam deflector and a receiver waveguide coupled to a detector module. The transmitter waveguide contains an array of grating elements for diffracting a scanned laser beam into a predefined angular ranges. The receiver waveguide contains an array of grating elements for diffracting light reflected from external points within a predefined angular range towards the detector module.

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

Abstract: An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

Abstract: The present invention provides a display screen and a display device, and the display screen includes at least one first display region and a second display region located outside the at least one first display region; the at least one first display region includes a substrate disposed in the at least one first display region and a light-shielding layer disposed on the substrate; wherein, the light-shielding layer includes at least one first opening located in a non-pixel region between neighboring pixels, and external light enters the display screen through the at least one first opening.

Abstract: Systems and methods for laser stimulated lock-in thermography (LLT) crack detection are provided. The system includes a spatial light modulator and a controller. The spatial light modulator reflects a laser beam to focus the laser beam onto a sample for detection of a crack, hole or scratch. The controller is coupled to the spatial light modulator and controls operation of the spatial light modulator to switch focus of the laser beam onto the sample between a plurality of LLT focus configurations for detection of the crack, hole or scratch on the sample. The method includes using a first one of the plurality of LLT configurations for coarse scanning of the sample to detect a crack, hole or scratch on the sample and, when a crack, hole or scratch is detected on the sample, switching to a second one of the plurality of LLT configurations for fine scanning of the crack, hole or scratch on the sample to determine one or more parameters of the crack, hole or scratch on the sample.

Abstract: This invention provides an information processing apparatus which comprises an image acquiring unit configured to acquire images captured by a plurality of image capturing devices, a contour extracting unit configured to extract a contour of an object from the image acquired by the image capturing device, a matching unit configured to match corresponding points on the contours between the images, a depth calculating unit configured to calculate a depth of the matched point, a reliability extracting unit configured to acquire a reliability of the depth based on an angle formed by an epipolar line and a tangential direction of the contour, and a depth correcting unit configured to correct the depth based on the depth and the reliability.

Abstract: A sensor may be provided, including a substrate having a first semiconductor layer, a second semiconductor layer, and a buried insulator layer arranged between the first semiconductor layer and the second semiconductor layer. The sensor may further include a photodiode arranged in the first semiconductor layer; and a quenching resistive element electrically connected in series with the photodiode. The quenching resistive element is arranged in the second semiconductor layer, and the quenching resistive element is arranged over the photodiode but separated from the photodiode by the buried insulator layer.

Abstract: A MEMS device according to an example embodiment of the present disclosure includes: a lower substrate; an infrared sensor formed on the lower substrate; and a lower bonding pad disposed to cover the infrared sensor. The infrared sensor includes: a metal pad formed on an upper surface of the lower substrate and electrically connected to a detection circuit; a reflective layer formed on the upper surface of the lower substrate and reflecting an infrared band; an absorption plate disposed to be spaced apart from an upper portion of the reflective layer and absorbing infrared rays to change resistance; and an anchor formed on the metal pad to support the absorption plate and to electrically connect the metal pad and the absorption plate to each other. The reflective layer has a curved or stepped shape such that a distance between the reflective layer and the absorption plate varies depending on a position of the reflective layer.

Abstract: The present invention is an optical assembly featuring an architecture which allows adjustment of both objective lenses and the electronic sensing assemblies in the optical assembly. Electrical connections in the housings of the various subassemblies allow focusing adjustment by rotational and/or translational movement for increased adjustability.

Abstract: A gas measurement system as disclosed can include a coherent light source, which emits a light beam; a detector; a beam path formed between the light source) and the detector; and a gas cell arranged in the beam path such that the detector receives light transmitted through the gas cell. The gas cell can include a porous ceramic and have an optical path length which is a multiple of the actual layer thickness of the gas cell. A optical element can be arranged in the beam path between the light source and the gas cell with the light beam emitted by the light being widened and unfocussed as the light beam enters the gas cell.

Abstract: A method of manufacturing bulked continuous carpet filament which, in various embodiments, comprises: (A) grinding recycled PET bottles into a group of flakes; (B) washing the flakes; (C) identifying and removing impurities, including impure flakes, from the group of flakes; (D) passing the group of flakes through an MRS extruder while maintaining the pressure within the MRS portion of the MRS extruder below about 1.5 millibars; (E) passing the resulting polymer melt through at least one filter having a micron rating of less than about 50 microns; and (F) forming the recycled polymer into bulked continuous carpet filament that consists essentially of recycled PET.

Abstract: Various approaches can be used to interrogate a surface such as a surface of a layered semiconductor structure on a semiconductor wafer. Certain approaches employ Second Harmonic Generation and in some cases may utilize pump and probe radiation. Other approaches involve determining current flow from a sample illuminated with radiation. Decay constants can be measured to provide information regarding the sample. Additionally, electric and/or magnetic field biases can be applied to the sample to provide additional information.

Abstract: An electromagnetic wave sensor that limits the influence on bolometer membranes that is caused by heat from a local heat source is provided. Electromagnetic wave sensor has first substrate, second substrate that faces first substrate so as to form inner space between first substrate and second substrate, wherein second substrate transmits infrared rays; a plurality of bolometer membranes that is provided in inner space and that is supported by second substrate; local heat source that is formed in first substrate; first electric connection member that connects first substrate to second substrate; and lead that extends on or in second substrate and that connects first electric connection member to bolometer membrane.

Abstract: One nonlimiting variation of a detection arrangement includes one or more sensors each structured to detect at least one biochemical substance indicative of biochemistry of one or more target insect species and provide a corresponding sensor signal, a controller responsive to the sensor signal of each of the one or more sensors to determine if the one or more insect species are present and generate a corresponding output signal, and an indicator responsive to the output signal to indicate the presence of the one or more insect species.

Abstract: There is described an electronic device testing system for testing an electronic device having a substrate on which is printed a metamaterial structure using an ink. The electronic device testing system generally has: a terahertz radiation emitter configured to emit an incident terahertz radiation beam to be incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; a terahertz radiation receiver configured to receive an outgoing terahertz radiation beam outgoing from the metamaterial structure and to measure an amplitude of an electric field of the outgoing terahertz radiation beam at least at the terahertz resonance frequency; and a controller configured to determine a conductivity value indicative of a conductivity of the ink based on said amplitude of the electric field of the outgoing terahertz radiation beam.

Abstract: A system includes a first tube of a plurality of tubes, the first tube having a first end and a second end. The system further includes a light detector positioned at the second end of the first tube. The light detector is configured to detect an incoming light and determine light intensity information of the incoming light. The system further includes a material coupled to the first end of the first tube. The material is configured to change in transparency. The system further comprises a processor coupled to the light detector and the material. The processor is configured to receive the light intensity information from the light detector. The processor is further configured to determine that an intensity of the incoming light is above a threshold, and, in response to determining that the intensity is above the threshold, cause a change in transparency of the material.