Abstract: The present disclosure relates to a semiconductor device manufacturing system. The semiconductor device manufacturing system can include a chamber and an ion source in the chamber. The ion source can include an outlet. The ion source can be configured to generate a particle beam. The semiconductor device manufacturing system can further include a grid structure proximate to the outlet of the ion source and configured to manipulate the particle beam. A first portion of the grid structure can be electrically insulated from a second portion of the grid structure.

Abstract: A method of direct hybrid bonding first and second semiconductor elements of differential thickness is disclosed. The method can include patterning a plurality of first contact features on the first semiconductor element. The method can include second a plurality of second contact features on the second semiconductor element corresponding to the first contact features for direct hybrid bonding. The method can include applying a lithographic magnification correction factor to one of the first patterning and second patterning without applying the lithographic magnification correction factor to the other of the first patterning and the second patterning. In various embodiments, a differential expansion compensation structure can be disposed on at least one of the first and the second semiconductor elements.

Abstract: The present disclosure relates to a stage apparatus comprising: an object table configured to hold a substrate, the object table comprising an electrode configured to be charged by a power source and an electrical connection configured to electrically connect the electrode to the power source, and an electric field shield configured to shield at least a part of the electrical connection.

Abstract: A large area projection micro stereolithography (LAPuSL) system uses an addressable spatial light modulator (SLM) in coordination with an optical scanning system to make very large stereolithographically produced objects. The SLM is imaged onto a photosensitive material with an optical system that has the ability to scan the image over a large area and speedily manufacture large scale complex three dimensional components with micro scale features.

Abstract: A method for operating a particle beam microscopy system includes recording a first particle-microscopic image at a given first focus and varying the excitations of the first deflection device within a given first range. The method also includes changing the focus to a second focus, and determining a second range of excitations of the first deflection device on the basis of the first range, the first excitation, the second excitation and a machine parameter determined in advance. The method further includes recording a second particle-microscopic image at the second focus and varying the excitations of the first deflection device within the determined second range. The second range of excitations is determined so that a region of the object represented in the second particle-microscopic image was also represented in the first particle-microscopic image.

Abstract: Provided is a setup method which can include: acquiring a position of a reference mark point provided on a noninvasive positioning device in an infrared coordinate system of an infrared positioning system; according to the position of the reference mark point in the infrared coordinate system, a relative position between the reference mark point and an image center point in an electronic scanning image, and a position of an isocenter of a radiotherapy equipment in a patient supporting device PSD coordinate system of the radiotherapy equipment, determining a first offset between the image center point and the isocenter in the PSD coordinate system; and adjusting the first offset to a first target offset by adjusting a position of a patient supporting device in the PSD coordinate system.

Abstract: A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.

Abstract: The present invention provides a processing system that includes a first apparatus and a second apparatus, and processes a substrate, wherein the first apparatus includes a first measurement unit configured to detect a first structure and a second structure different from the first structure provided on the substrate, and measure a relative position between the first structure and the second structure, and the second apparatus includes an obtainment unit configured to obtain the relative position measured by the first measurement unit, a second measurement unit configured to detect the second structure and measure a position of the second structure, and a control unit configured to obtain a position of the first structure based on the relative position obtained by the obtainment unit and the position of the second structure measured by the second measurement unit.

Abstract: The disclosure provides a system for transmitting and receiving optical signals. The system includes a first mirror of a communication device, a first mirror actuator configured to control a pointing direction of the first mirror, a second mirror of the communication device, a second mirror actuator configured to control a pointing direction of the second mirror, and one or more processors. The one or more processors are configured to direct the second mirror actuator to move the second mirror to track a signal within a zone in an area of coverage of the communication device and meanwhile keep the first mirror stationary at a first angle. The one or more processors are also configured to direct the first mirror actuator to move the first mirror to a second angle in a direction of motion of the signal when the signal reaches an edge of the zone and meanwhile move the second mirror to a default angle.

Abstract: Disclosed herein are radiotherapy systems and methods that can display a workflow-oriented graphical user interface(s). In an embodiment, a system comprises a radiotherapy machine comprising: a couch; and a gantry having a camera in communication with a server, wherein the server is configured to: present for display, in real time on a screen associated with the radiotherapy machine, images received from the camera, wherein when the gantry changes its orientation, the camera revises at least one of its orientations, such that images transmitted to the server maintain an original orientation.

Abstract: Disclosed herein are radiotherapy systems and methods that can display a workflow-oriented graphical user interface(s). In an embodiment, a system comprises a radiotherapy machine comprising: a couch; and a gantry having a camera in communication with a server, wherein the server is configured to: present for display, in real time on a screen associated with the radiotherapy machine, images received from the camera, wherein when the gantry changes its orientation, the camera revises at least one of its orientations, such that images transmitted to the server maintain an original orientation.

Abstract: A scanning electron microscope includes: an electron optical column, arranged to generate electron beams and focus the electron beams on a specimen; a first detector, arranged to receive electrons generated by the electron beams acting on the specimen; and a second detector, arranged to receive photons generated by the electron beams acting on the specimen. The second detector includes a reflector and a photon detector. The reflector is in a ring shape and is arranged to cover the perimeter of the specimen. The reflector reflects the photons generated on the specimen onto the photon detector. The scanning electron microscope provided by the present disclosure can collect photons in a wide range, and the photon detector has a high reception efficiency.

Abstract: A measurement apparatus and a measurement method capable of speedily and accurately measuring an edge shape are provided. A measurement apparatus according to an aspect of the present disclosure includes an objective lens positioned so that its focal plane cuts across an edge part of a substrate, a detector including a plurality of pixels and configured to detect a reflected light from the edge part of the substrate through a confocal optical system, an optical head in which the objective lens and the detector are disposed, a moving mechanism configured to change a relative position of the optical head with respect to the substrate so that an inclination of the focal plane with respect to the substrate is changed, and a processing unit configured to measure a shape of the edge part.

Abstract: A wireless substrate-like sensor for teaching transfer coordinates to a robotic substrate handling system is provided. The sensor includes a base portion sized and shaped like a substrate handled by the robotic substrate handling system. An electronics housing is coupled to the base portion. A power module is disposed within the electronics housing and configured to power components of the sensor. At least one edge camera is disposed near an edge of the base portion. The at least one edge camera has a field of view that images an alignment feature of the object within the field of view of the at least one edge camera of the wireless substrate-like sensor. A controller is disposed within the electronics housing and is coupled to the at least one edge camera. The controller is configured to obtain an image from the at least one edge camera and determine a location of the alignment feature and provide the determined location to the robotic substrate handling system.

Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.

Abstract: A method for calibrating an alignment device includes obtaining one or more projection images of a phantom having one or more surface indicators, the one or more surface indicators indicating a first coordinate system relating to the phantom, an origin of the first coordinate system overlapping with a calibration point of the phantom. The method further includes determining a difference between the first coordinate system and a second coordinate system based on the one or more projection images, the second coordinate system being relating to a medical system. The method further includes adjusting the phantom to an updated state according to the difference between the first coordinate system and the second coordinate system such that the first coordinate system overlaps with the second coordinate system. The method also includes adjusting an alignment device according to the one or more surface indicators in the updated state.

Abstract: An atom probe directs two or more pulsed laser beams onto a specimen, with each laser beam being on a different side of the specimen, and with each laser beam supplying pulses at a time different from the other laser beams. The laser beams are preferably generated by splitting a single beam provided by a laser source. The laser beams are preferably successively aligned incident with the specimen by one or more beam steering mirrors, which may also scan each laser beam over the specimen to achieve a desired degree of specimen ionization.

Abstract: There is provided a charged particle beam system capable of determining the type of each cartridge precisely. An electron microscope that embodies the charged particle beam system includes a discriminator for determining the type of each cartridge based on the range or distance measured by a laser range finder. Plural cartridges are received in a magazine. The laser range finder measures the range to a selected one of the plural cartridges which is placed in a measurement position. A first cartridge of a first type included in the plural cartridges has a first measurement surface at a first distance to the laser range finder when placed in the measurement position. A second cartridge of a second type has a second measurement surface at a second range to the laser range finder when placed in the measurement position.

Abstract: A charged particle beam apparatus includes a sample stage on which a sample is mounted, a control device that controls to drive the sample stage, a linear scale that detects a position of the sample stage, laser position detection means for detecting the position of the sample stage, an optical microscope that observes the sample mounted on the sample stage, and a barrel that irradiates the sample mounted on the sample stage with an electron beam, and generates a secondary electron. Image data of a first correction sample mounted on the sample stage is acquired by the optical microscope, and position data of the sample stage is detected by the laser position detection means. The sample stage is positioned with respect to the barrel based on the image data acquired by the optical microscope and the position data of the sample stage detected by the laser position detection means.

Abstract: A photomask includes a patterned photomask plate and a supporting member. The patterned photomask plate has a pattern region and a peripheral region surrounding the pattern region. The patterned photomask plate includes a plurality of openings in the pattern region. The supporting member directly abuts the patterned photomask plate and is in a peripheral region of the patterned photomask plate. The supporting member is formed from a different material than the patterned photomask plate.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: Displacement devices comprise a stator and a moveable stage. The stator comprises a plurality of coils shaped to provide pluralities of generally linearly elongated coil traces in one or more layers. Layers of coils may overlap in the Z-direction. The moveable stage comprises a plurality of magnet arrays. Each magnet array may comprise a plurality of magnetization segments generally linearly elongated in a corresponding direction. Each magnetization segment has a magnetization direction generally orthogonal to the direction in which it is elongated and at least two of the magnetization directions are different from one another. One or more amplifiers may be connected to selectively drive current in the coil traces and to thereby effect relative movement between the stator and the moveable stage.

Abstract: The disclosure provides a method for determining at least one property of an EUV source in a projection exposure apparatus for semiconductor lithography, wherein the property is determined on the basis of the electromagnetic radiation emanating from the EUV source, and wherein a thermal load for a component of the projection exposure apparatus is determined and the property is deduced on the basis of the thermal load determined.

Abstract: A system is disclosed. The system includes a stage assembly configured to receive a specimen and maintain a height of the specimen at a first working distance height during a first characterization mode and an additional working distance height during an additional characterization mode. The system further includes an illumination source configured to generate an illumination beam. The system further includes an illumination arm including a set of optical elements configured to direct a portion of the illumination beam including illumination of a first wavelength to the specimen during the first characterization mode, and direct a portion of the illumination beam including illumination of an additional wavelength to the specimen during the additional characterization mode. The system further includes a detector assembly configured to receive illumination emanated from the specimen, and a controller configured to determine a specimen height value based on the illumination received by the detector assembly.

Abstract: A heatable element is configured to apply sufficient energy density to contaminants in an internal ambient atmosphere with in a sealable housing to drive a reaction that inactivates the contaminants.

Abstract: Laser sources are configured to project planar laser beams in a preselected geometric relationship. A laser detector is configured to detect, locate, and identify the planar laser beams.

Abstract: Scatterometry overlay targets as well as target design and measurement methods are provided, which mitigate the effects of grating asymmetries in diffraction based overlay measurements. Targets comprise additional cells with sub-resolved structures replacing resolved coarse pitch gratings and/or comprise alternating sub-resolved structures with coarse pitch periodicity—to isolate and remove inaccuracies that result from grating asymmetries. Measurement methods utilize orthogonally polarized illumination to isolate the grating asymmetry effects in different measurement directions, with respect to the designed target structures.

Abstract: Embodiments relate to a bidirectional free space optical (FSO) communications system. Specifically, data-encoded FSO beams are transmitted and received between two terminals. A transmit (Tx) direction of a beam transmitted from the first terminal is dithered by a beam steering unit (BSU). As the dithered beam is received by the second terminal, the power levels of the beam are measured. The power levels are then encoded in a data-encoded FSO beam transmitted to the first terminal. This allows the first terminal to decode the received FSO beam and determine the power levels. The power levels allow the first terminal to determine Tx direction misalignments and adjust the Tx direction for the Tx beam sent to the second terminal. This process may be repeated to reduce Tx misalignments and may be performed by both terminals such that each terminal sends power level information to the opposite terminal.

Abstract: A mount includes: A. a mount body including a holding unit that detachably holds a target generation device configured to output a target substance for extreme ultraviolet light generation as a droplet into a chamber; and B. a target position adjustment unit that is provided to the holding unit and configured to adjust a position of the target generation device relative to the chamber; and C. a movement mechanism that moves the mount body at least in a horizontal direction. The target position adjustment unit is a stage configured to move the target generation device in two directions orthogonal to a droplet emission axis.

Abstract: A procedure for calibration of at least one scanning system of a laser sinter or laser melt facility can be carried out in a short time, can take place automatically, and thereby can be carried out before each individual construction process. The procedure may include generation of at least one line pattern through at least one scanning system on a surface at the level of a construction field.

Abstract: A system is provided for alerting of potential vehicle damage when moving into or out of a confined space, the confined space having a side structure which can damage the vehicle when moving into the confined space if the vehicle is too close to the side structure. The system comprises a beam transmitter for transmitting a beam, and a beam receiver for receiving the beam. The beam travels along a path at an angle relative to a ground surface of from about 40 degrees to 60 degrees. An alert generator generates an alert such as light, sound, or both, when a vehicle intersects the beam.

Abstract: Disclosed herein are systems and methods for monitoring calibration of positron emission tomography (PET) systems. In some variations, the systems include an imaging assembly having a gantry comprising a plurality of positron emission detectors. A housing may be coupled to the gantry, and the housing may include a bore and a radiation source holder spaced away from a patient scan region within the bore. A processor may be configured to receive positron emission data from the positron emission detectors and to distinguish the positron emission data from the radiation source holder and from the patient scan region. A fault signal may be generated when the positron emission data from the radiation source holder exceeds one or more threshold parameters or criteria.

Abstract: A method for selecting a transmission of a network device is disclosed. In particular, a method for selecting a transmission of a network device comprising a plurality of queues for storing data frames is disclosed. Here, each of the plurality of queues corresponds to a different traffic class, the method comprising: a step of obtaining information about a transmission selection algorithm for the plurality of queues; and a step of selecting data frames for transmission from a corresponding queue on the basis of transmission selection algorithm information. Here, the transmission selection algorithm may correspond to a strict priority algorithm, a credit-based shaper algorithm, or a burst transmission algorithm.

Abstract: In order to suppress a film from being formed in a gap between a mask and a substrate, a technology of improving adhesion between the mask and the substrate is provided. A film-forming method includes the step of suspending a mask MK by a suspension portion HU in a state in which the suspension portion HU is supported by a supporting portion SU and the step of bringing the mask MK suspended by the suspension portion HU into contact with a glass substrate GS in the state in which the suspension portion HU is supported by the supporting portion SU.

Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

Abstract: An electromagnetic actuator is described the actuator comprising: a magnet assembly comprising: an array of permanent magnets arranged in a first direction and configured to generate, outside the magnet assembly, a spatially varying magnetic field distribution in the first direction; a ferromagnetic member onto which the array of permanent magnets is mounted; a coil assembly, at least partly arranged in the spatially varying magnetic field distribution, configured to co-operate with the magnet assembly to generate an electromagnetic force; wherein a thickness of the array of permanent magnets in a second direction perpendicular to the first direction varies along the first direction and wherein a thickness of the ferromagnetic member in the second direction varies along the first direction such that a combined thickness of the array of permanent magnets and the ferromagnetic member in the second direction is substantially constant along the first direction.

Abstract: In one embodiment, a charged particle beam writing apparatus includes a writer writing a pattern on a substrate placed on a stage by irradiating the substrate with a charged particle beam, a height detector detecting a surface height of a mark on the stage, an irradiation position detector detecting an irradiation position of the charged particle beam on the mark surface by irradiation with the charged particle beam focused at the surface height of the mark, a drift correction unit calculating an amount of drift of the charged particle beam on the mark surface from the irradiation position detected by the irradiation position detector, and generating correction information for correcting a shift in irradiation position caused by a drift on the substrate surface based on the amount of drift, and a writing control unit correcting the irradiation position of the charged particle beam by using the correction information.

Abstract: A dryer, sanitizer, and disinfecting device for make-up brushes includes an outer housing having an upper surface defining a plurality of openings therein with the plurality of openings arranged in a linear array; an inner housing including a retainer having a plurality of recesses corresponding to the plurality of openings defined in the outer housing; and a sterilizing component supported within at least one of the outer housing or the inner housing, wherein the sterilizing component effects the cleaning chamber, and wherein the sterilizing component includes a UV light bulb.

Abstract: A method including obtaining a measurement and/or simulation result of a pattern after being processed by an etch tool of a patterning system, determining a patterning error due to an etch loading effect based on the measurement and/or simulation result, and creating, by a computer system, modification information for modifying a patterning device and/or for adjusting a modification apparatus upstream in the patterning system from the etch tool based on the patterning error, wherein the patterning error is converted to a correctable error and/or reduced to a certain range, when the patterning device is modified according to the modification information and/or the modification apparatus is adjusted according to the modification information.

Abstract: An observation apparatus includes: alight source that emits pulsed light; and an objective that includes a first optical element serving as a light guide part and irradiates a sample with the pulsed light. The first optical element consists of a medium that satisfies the following conditional expression for ?1 and ?2: 0.75<?2/?1<1.33 where ?1=(n2?n1)/(?2??1) and ?2=(n3?n2)/(?3??2) are satisfied (?1 indicates a light wavelength of 706.52 nm; ?2 indicates a light wavelength of 1529.6 nm; ?3 indicates a light wavelength of 2325.4 nm; and n1, n2, and n3 respectively indicate refractive indexes that the medium has for ?1, ?2, and ?3).

Abstract: The present disclosure generally relates to additive manufacturing systems and methods on a large-scale format. One aspect involves a build unit that can be moved around in three dimensions by a positioning system, building separate portions of a large object. The build unit has an energy directing device that directs, e.g., laser or e-beam irradiation onto a powder layer. In the case of laser irradiation, the build volume may have a gasflow device that provides laminar gas flow to a laminar flow zone above the layer of powder. This allows for efficient removal of the smoke, condensates, and other impurities produced by irradiating the powder (the “gas plume”) without excessively disturbing the powder layer. The build unit may also have a recoater that allows it to selectively deposit particular quantities of powder in specific locations over a work surface to build large, high quality, high precision objects.

Abstract: The present disclosure relates to a circuit board, a semiconductor device, an imaging device, a solid-state image sensor, a method for manufacturing a solid-state image sensor, and an electronic apparatus that suppress a decrease in characteristics and a yield. A step portion formed on a substrate surface is configured in a divided state. With this configuration, a photoresist liquid dropped in a lithography process flows through a gap between the divided step portions so that the photoresist liquid uniformly flows on an imaging surface, whereby a decrease in characteristics and a yield due to application unevenness can be suppressed. The present disclosure can be applied to a solid-state image sensor.

Abstract: A surgical table for supporting a patient over a floor and including a base assembly, a support column assembly and a patient support structure. The base assembly supported on the floor and including a first end, a second end opposite the first end, and a member extending along a base longitudinal axis between the first and second ends. The support column assembly moveably coupled with the base assembly and configured to translate between the first and second ends of the base assembly along the member extending therebetween, the support column assembly being the only support column assembly coupled with the base assembly. The patient support structure including a first end, a second end opposite the first end, and a longitudinal axis extending between the first and second ends, the second end of the patient support structure supported off of the support column assembly in a cantilevered fashion.

Abstract: A position control system 1 acquires image data obtained by imaging a workpiece, detects a position of the workpiece on the basis of the image data by first detection processing, outputs a control command for controlling the position of the workpiece in a case in which the position of the workpiece has been detected, detects the position of the workpiece on the basis of the image data in accordance with second detection processing that is more robust than first detection processing in a case in which the position of the workpiece has not been detected, and outputs a control command for controlling the position of the workpiece on the basis of a result of the detection in the second detection processing.

Abstract: A system for determining an orientation of a first device relative to a user includes a first device including a first orientation measuring unit configured to measure an orientation of the first device relative to the earth, a second device configured to be worn by the user on a body part. The second device includes a second orientation measuring unit configured to measure an orientation of the second device relative to the earth. The system also has a processor configured to calculate an orientation of the first device relative to the second device by comparing the measured orientation of the first device relative to the earth with the measured orientation of the second device relative to the earth.

Abstract: A microscope system comprises a microscope body, an image sensor mounted on the microscope body, and a stage that moves in an X-axis direction and a Y-axis direction, and places a slide as an observation object. The stage includes a mark used to indicate a stage reference position. The microscope system obtains positions of the stage in the X-axis direction and the Y-axis direction, and detects the stage reference position indicated by a mark provided on the stage and a slide reference position indicated by a mark provided on a slide placed on the stage. The microscope system manages the position of the stage by coordinates based on the slide reference position if the slide reference position is detected, and manages the position of the stage by coordinates based on the stage reference position if the slide reference position is not detected.

Abstract: Disclosed herein are systems and methods for monitoring calibration of positron emission tomography (PET) systems. In some variations, the systems include an imaging assembly having a gantry comprising a plurality of positron emission detectors. A housing may be coupled to the gantry, and the housing may include a bore and a radiation source holder spaced away from a patient scan region within the bore. A processor may be configured to receive positron emission data from the positron emission detectors and to distinguish the positron emission data from the radiation source holder and from the patient scan region. A fault signal may be generated when the positron emission data from the radiation source holder exceeds one or more threshold parameters or criteria.

Abstract: Methods, systems, and apparatus for applying an imprinting force to an imprint lithography template, including providing, by a controller using a first control loop, a first control signal to a first actuator associated with the first control loop; providing, by the controller using a second control loop, a second control signal to a second actuator associated with the second control loop, wherein the second control loop and the first control loop are different; and applying, to the imprint lithography template, at least one of: a first force by the first actuator in response to the first control signal, and a second force by the second actuator in response to the second control signal.

Abstract: A method for positioning at least one electronic component (3) on a circuit board (1) provided for installation in a vehicle headlamp, wherein the circuit board (1) comprises at least one position mark and the at least one electronic component (3) is positioned relative to the at least one position mark on the circuit board (1), wherein the at least one position mark is detected optically and is used for positioning, wherein the at least one position mark used is at least one alignment mark (5, 6, 7, 8, 8?, 8?) of the circuit board (1) which, in the vehicle headlamp, when the circuit board (1) is installed, interacts mechanically with a positioning means (9, 15) of the vehicle headlamp that is complementary to the alignment mark (5, 6, 7, 8,8?, 8?).

Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.