Iron Group Metal (iron, Cobalt, Nickel) Patents (Class 252/513)
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Patent number: 7491348Abstract: The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character.Type: GrantFiled: April 13, 2004Date of Patent: February 17, 2009Assignee: Electromagnetics CorporationInventor: Christopher J. Nagel
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Publication number: 20090042001Abstract: A conductive paste contains metal powder, an inorganic binder, and an organic vehicle as main ingredients. The organic vehicle includes a solvent having a boiling point of 270° C. or higher, and the proportion of the solvent with respect to the entire solvent included in the organic vehicle is 3 to 100% by weight.Type: ApplicationFiled: January 18, 2007Publication date: February 12, 2009Inventors: Masahiro Yamakawa, Kenji Miyazaki
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Publication number: 20090014693Abstract: Monomeric, oligomeric and polymeric electrically conductive compounds and methods of making the compounds having a repeating unit having formula P1, as follows: where X is S or Se, Y is S or Se, wherein one or both of X and Y is Se, R is a substituent group capable of bonding to the ring structure. R may include hydrogen or isotopes thereof, hydroxyl, alkyl, including C1 to C20 primary, secondary or tertiary alkyl groups, arylalkyl, alkenyl, perfluoroalkyl, perfluororaryl, aryl, alkoxy, cycloalkyl, cycloalkenyl, alkanoyl, alkylthio, aryloxy, alkylthioalkyl, alkynyl, alkylaryl, arylalkyl, amido, alkylsulfinyl, alkoxyalkyl, alkylsulfonyl, aryl, arylamino, diarylamino, alkylamino, dialkylamino, arylarylamino, arylthio, heteroaryl, arylsulfinyl, alkoxycarbonyl, arylsulfonyl, carboxyl, halogen, nitro, cyano, sulfonic acid, or alkyl or phenyl substituted with one or more sulfonic acid, phosphoric acid, carboxylic acid, halo, amino, nitro, hydroxyl, cyano or epoxy moieties.Type: ApplicationFiled: July 13, 2007Publication date: January 15, 2009Applicant: Air Products and Chemicals, Inc.Inventor: Steffen Zahn
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Publication number: 20090014694Abstract: The present invention is directed at providing fine nickel particles with a sharp particle size distribution, and providing an electroconductive paste using the nickel particles. In order to obtain the nickel particles capable of achieving the purpose, a method for producing the nickel particle by elevating a temperature of the reactive solution containing a nickel salt and a polyol to a reduction temperature, and reducing the nickel salt in the reactive solution which is characterized in that the reactive solution is prepared to contain a carboxylic acid or an amine having a carboxyl functional group and/or an amino functional group, and a precious metal catalyst before the solution temperature is elevated to the reduction temperature. Nickel particles obtained with the production method have an average image analytical particle diameter of 1 nm to 300 nm.Type: ApplicationFiled: June 30, 2006Publication date: January 15, 2009Applicant: Mitsui Mining & Smelting Co., LtdInventors: Takashi Mukuno, Katsuhiko Yoshimaru
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Publication number: 20090015154Abstract: An electronic component comprising a layer of organic semiconducting material in which a dopant is dispersed having an energy difference between the work function of the dopant and of the HOMO level of said organic semiconducting material that is less than 0.5 eV. The dopant is an atomic element having an evaporation temperature lower than 1300° C. for a pressure of 10?8 Torr. The invention enables the toxicity problems connected with usual organic acceptor dopants to be avoided. It applies in particular to organic light-emitting diodes.Type: ApplicationFiled: February 28, 2007Publication date: January 15, 2009Applicant: Commissariat A L'Energie AtomiqueInventors: Mohamed Ben Khalifa, David Vaufrey
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Patent number: 7476339Abstract: A composite material including a thermoplastic polymer matrix and a non-carbonaceous resistivity modifier dispersed in the thermoplastic polymer matrix. The composite material has a surface resistivity of about 1.0×104 ohm/sq to about 1.0×1011 ohm/sq and at least a portion of a surface of the composite material has a surface roughness (Ra) not greater than about 500 nm.Type: GrantFiled: August 18, 2006Date of Patent: January 13, 2009Assignee: Saint-Gobain Ceramics & Plastics, Inc.Inventors: Pawel Czubarow, Gwo Swei, Oh-Hun Kwon
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Publication number: 20080314619Abstract: A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.Type: ApplicationFiled: March 13, 2008Publication date: December 25, 2008Applicant: SAMSUNG ELECTRO-MECHANCS CO., LTD.Inventors: Ki-Hwan Kim, Jee-Soo Mok, Myung-Sam Kang
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Patent number: 7462303Abstract: Disclosed is a conductive composition used for a conductor of an electronic component, comprising a metal particle and a metal oxide particle which has an average particle size of 5 to 60 nm, a melting point of 1500° C. or higher, and a content of 0.1 to 10.0 wt % based on the amount of the metal particle. According to the conductive composition, even when the metal particle is made fine, a sintering initiation temperature can be adequately increased, thus a generation of a crack and a de-lamination can be prevented easily and firmly.Type: GrantFiled: August 28, 2006Date of Patent: December 9, 2008Assignee: TDK CorporationInventor: Shuichi Miura
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Publication number: 20080272344Abstract: The present invention relates generally to conductive polymer composites, electrically conductive adhesives, and methods of producing the same. The conductive polymer composites and electrically conductive adhesives may be used for electronic component interconnects, flip chip interconnections, electrical connections to circuit boards, jumper connections, or similar uses. The method of forming a conductive polymer composite includes mixing conductive metal flakes, functionalized conductive metal nanoparticles, and a polymer precursor and curing the polymer precursor to form a composite. In one embodiment, the conductive polymer composites may be composed of microparticles of silver flake and sintered silver nanoparticles between the silver flakes. The polymer composites have an electrical conductivity of less than 10?5 ?·cm.Type: ApplicationFiled: March 21, 2008Publication date: November 6, 2008Applicant: Georgia Tech Research CorporationInventors: HongJin Jiang, Kyoung-sik Moon, Yi Li, Ching Ping Wong
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Publication number: 20080265772Abstract: An electrode composition includes a metal in an amount of about 52% to about 62% by weight of the composition, a glass insulation material in an amount of about 5% to about 7% by weight of the composition, a coloring agent in an amount of about 3% to about 9% by weight of the composition, and a vehicle.Type: ApplicationFiled: April 8, 2008Publication date: October 30, 2008Inventors: Chul-Hong KIM, Jung-Keun AHN, Hyun-Mi JEONG, Yeon-Joo CHOI
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Publication number: 20080268637Abstract: The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.Type: ApplicationFiled: April 26, 2007Publication date: October 30, 2008Applicant: E. I. DUPONT DE NEMOURS AND COMPANYInventor: Akira Inaba
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Patent number: 7442327Abstract: Dispersions useful in making capacitors, printed circuit boards, etc., comprising an electronic particulate solid, a carrier and a dispersant of formula (1): R—(O-A-CO)x(O—B—CO)y-Z wherein R is hydrogen or a polymerisation terminating group; A is C8-20-alkylene and/or C8-20-alkenylene; B is C1-6-alkylene or a lactone thereof; Z is hydroxyl or a basic group or a moiety containing a basic group; x is from 2 to 45; Y is from 0 to 15; and the ration of x:y is not less than 3:1, the carrier is a high boiling organic liquid having a boiling point between 150 and 350° C. selected from monohydric alcohols and esters of dialkylene glycol monoalkyl esters.Type: GrantFiled: March 5, 2004Date of Patent: October 28, 2008Assignee: The Lubrizol CorporationInventors: Dean Thetford, John David Schofield
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Patent number: 7442226Abstract: In an ultrafine metal powder slurry containing an organic solvent, a surfactant, and an ultrafine metal powder, the surfactant is oleoyl sarcosine, the content of the ultrafine metal powder in the ultrafine metal powder slurry is 70 to 95 percent by mass, and more than 0.05 to less than 2.0 parts by mass of the surfactant is contained relative to 100 parts by mass of the ultrafine metal powder. By the above slurry, reduction in labor and treatment time can be realized in a conductive paste forming process. In addition, since aggregation of particles of the ultrafine metal powder is prevented, an ultrafine metal powder slurry can be provided having superior dispersibility and dry film density.Type: GrantFiled: July 27, 2005Date of Patent: October 28, 2008Assignee: JFE Mineral Company, Ltd.Inventor: Morishige Uchida
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Publication number: 20080251770Abstract: The present invention provides an electrically conductive element for a proton exchange membrane fuel cell having low electrical contact resistance and high corrosion resistance. The conductive element comprises a corrosion susceptible metal substrate with a surface, which is preferably treated to activate the surface (i.e., to remove a passivation layer of oxides from the surface) with an acidic treatment solution. The treated surface is then overlaid with an electrically conductive, corrosion-resistant, protective coating to protect the substrate re-forming a passivation layer while exposed to the corrosive environment of the fuel cell. The present invention also provides methods of preparing an electrically conductive element to have low electrical contact resistance and high corrosion resistance.Type: ApplicationFiled: June 20, 2008Publication date: October 16, 2008Applicant: GENERAL MOTORS CORPORATIONInventor: Michael K. Budinski
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Publication number: 20080254567Abstract: The present invention is directed to a thick film conductive composition comprising: a) electrically conductive silver powder; b) ZnO powder; c) lead-free glass frits wherein based on total glass frits: Bi2O3: >5 mol %, B2O3: <15 mol %, BaO: <5 mol %, SrO: <5 mol %, Al2O3: <5 mol %; and d) organic medium, wherein (the content of ZnO / the content of the silver powder)×100 is more than 2.5.Type: ApplicationFiled: April 12, 2007Publication date: October 16, 2008Applicant: E. I. DUPONT DE NEMOURS AND COMPANYInventor: Takuya Konno
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Publication number: 20080251769Abstract: Disclosed herein too is a method of manufacturing an electrically conducting polymeric composition comprising blending an organic polymer composition that comprises a thermoplastic organic polymer; an electrically conducting filler composition that comprises metal fibers; and an electrically insulating composition in an extruder; wherein the electrically insulating composition is fed into the extruder downstream of the location at which the organic polymer composition is fed into the extruder and wherein the electrically conducting filler composition is fed into the extruder at a location downstream of the location at which the electrically insulating composition is fed into the extruder.Type: ApplicationFiled: August 20, 2007Publication date: October 16, 2008Applicant: GENERAL ELECTRIC COMPANYInventors: Gang Li, Xiangping Zou, Sanjay Gurbasappa Charati, Soumyadeb Ghosh
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Patent number: 7435360Abstract: A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S32) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S12) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S18) of adding surfactant, a process (S14) of separating water from the metal particles and a process (S15) of adding acetone or the other second solvent.Type: GrantFiled: March 19, 2004Date of Patent: October 14, 2008Assignee: TDK CorporationInventors: Kazuhiko Oda, Tetsuji Maruno, Akira Sasaki, Kouji Tanaka
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Publication number: 20080237548Abstract: In an ultrafine metal powder slurry containing an organic solvent, a surfactant, and an ultrafine metal powder, the surfactant is oleoyl sarcosine, the content of the ultrafine metal powder in the ultrafine metal powder slurry is 70 to 95 percent by mass, and more than 0.05 to less than 2.0 parts by mass of the surfactant is contained relative to 100 parts by mass of the ultrafine metal powder. By the above slurry, reduction in labor and treatment time can be realized in a conductive paste forming process. In addition, since aggregation of particles of the ultrafine metal powder is prevented, an ultrafine metal powder slurry can be provided having superior dispersibility and dry film density.Type: ApplicationFiled: May 8, 2008Publication date: October 2, 2008Applicant: JFE MINERAL COMPANY, LTD.Inventor: Morishige Uchida
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Publication number: 20080210911Abstract: In a varistor element, Ca exists in the grain interior of grains consisting primarily of ZnO in a varistor element body and Ca also exists in a grain boundary. In this crystal structure Ca replaces oxygen defects in the grain interior of grains consisting primarily of ZnO, in the varistor element body to make the ceramic structure denser Such crystal structure also decreases a ratio of an element tending to degrade the stability of the temperature characteristic of the varistor element, e.g., Si as a firing aid, in the grain boundary between grains. As a result, the varistor element has a stable temperature characteristic, which can decrease change in capacitance and tan? (thermal conversion factor of resistance) against change in temperature.Type: ApplicationFiled: February 25, 2008Publication date: September 4, 2008Applicant: TDK CORPORATIONInventors: Naoyoshi YOSHIDA, Hitoshi TANAKA, Dai MATSUOKA
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Publication number: 20080213565Abstract: Articles are disclosed, comprising a polymer foam layer having a first surface and an opposite second surface; a plurality of cells between the first surface and the opposite second surface of the polymer foam layer, wherein the thickness of the polymer foam layer between the first surface and the opposite second surface is 1.0 to 1.5 times the average height of the plurality of cells; and a plurality of magnetic, electrically conductive particles aligned into a plurality of mutually isolated chains that essentially continuously span the foam between the first surface and the opposite second surface of the polymer foam layer. The foams are useful as gaskets for electromagnetic shielding, grounding pads, battery contact conductive spring elements, and the like.Type: ApplicationFiled: February 6, 2008Publication date: September 4, 2008Applicant: WORLD PROPERTIES, INC.Inventors: Scott Simpson, Ki-Soo Kim, Jason Hoffman
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Publication number: 20080202380Abstract: A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.Type: ApplicationFiled: February 23, 2007Publication date: August 28, 2008Applicant: National Starch and Chemical Investment Holding CorporationInventors: Lirong Bao, Allison Xiao, Bin Wei
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Publication number: 20080206488Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.Type: ApplicationFiled: March 4, 2006Publication date: August 28, 2008Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
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Patent number: 7413686Abstract: A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.Type: GrantFiled: March 25, 2003Date of Patent: August 19, 2008Assignee: Sony Chemicals CorporationInventor: Yukio Yamada
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Publication number: 20080190769Abstract: The invention relates to electrophoretic pigments, wherein the electrophoretic pigments are platelet-like metal pigments coated with at least one coating composition and the coating composition has (a) one or more binder functionalities of anodic electrophoretic paint binders and (b) one or more functional groups for effecting adhesion or binding to the pigment surface, and (c) an acid value of from 15 to 300 mg KOH/g of coating composition. The invention further relates to a method for the production of said electrophoretic pigments and to the use thereof.Type: ApplicationFiled: May 2, 2006Publication date: August 14, 2008Inventors: Thomas Schuster, Christian Schramm, Robert Maul, Harald Weiss, Carolin Schmidt
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Publication number: 20080182090Abstract: Disclosed is a conductive composition which can be used to form an aqueous conductive ink with increased conductivity. The aqueous conductive composition contains conductive particles, preferably silver, an anionic wetting agent and a styrene-acrylic copolymer. The composition is highly conductive and requires reduced drying energy. In addition, it may be applied to low cost substrates by high speed printing processes.Type: ApplicationFiled: September 8, 2006Publication date: July 31, 2008Applicant: SUN CHEMICAL CORPORATIONInventors: Jason H. Rouse, Dave Klein
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Publication number: 20080169452Abstract: The invention relates to a mixture and a method for imprinting textiles. The mixture used for the imprinting of textiles, includes: A) at least one pigment, B) at least one dispersing agent on the basis of oxalkylated linear or branched alkanes, fatty acids or fatty alcohols, and/or alkyl sulfates or alkyl sulfonates, and/or polyelectrolytes, and/or alkylated, and/or arylated glycosides; C) at least one water-soluble or water-dilutable, radiation-hardenable binding agent with a molecular weight above 2000 g/mol and at least two polymerizable groups for each binding agent molecule, which are cross-linked to the binding agent molecule by at least one urethane group or urea group; D) water.Type: ApplicationFiled: December 27, 2005Publication date: July 17, 2008Applicant: ITCF Institut fur Textilchemie Und ChemiefasernInventors: Reinhold Schneider, Marion Funkler
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Publication number: 20080157027Abstract: The present invention includes compositions and methods of making cation-substituted and fluorine-substituted spinel cathode compositions by firing a LiMn2-y-zLiyMzO4 oxide with NH4HF2 at low temperatures of between about 300 and 700° C. for 2 to 8 hours and a ? of more than 0 and less than about 0.50, mixed two-phase compositions consisting of a spinel cathode and a layered oxide cathode, and coupling them with unmodified or surface modified graphite anodes in lithium ion cells.Type: ApplicationFiled: September 25, 2007Publication date: July 3, 2008Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMInventors: Arumugam Manthiram, Wonchang Choi
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Publication number: 20080160356Abstract: Methods for making and using metal-organic solids for use in proton exchange membranes. These proton exchange membranes may also be used in fuel cell applications.Type: ApplicationFiled: December 10, 2007Publication date: July 3, 2008Inventors: George Kisa Hayashi Shimizu, Jeffrey Allen Hurd, Ramanathan Vaidhyanathan, Jared Michael Taylor
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Patent number: 7390442Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 ?m-20 ?m when a contact probe is mounted.Type: GrantFiled: March 3, 2003Date of Patent: June 24, 2008Assignee: Sumitomo Electric Industries, Ltd.Inventors: Hideki Kashihara, Masamichi Yamamoto, Jun Yorita, Hideaki Toshioka, Misako Osoegawa, Keiji Koyama, Masatoshi Majima, Yoshie Tani
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Publication number: 20080142764Abstract: Methods for preparing low resistivity nanocomposite layers that simultaneously offer optical clarity, wear resistance and superior functional performance. Nanofillers and a substance having a polymer are mixed. Both low-loaded and highly-loaded nanocomposites are included. Nanoscale coated and un-coated fillers may be used. Nanocomposite films may be coated on substrates.Type: ApplicationFiled: June 12, 2007Publication date: June 19, 2008Inventors: Tapesh Yadav, Clayton Kostelecky
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Publication number: 20080128661Abstract: A mica-based electrically-conductive filler and reinforcing material, and methods of producing it. The material comprises milled mica particles and an electrically-conductive media such as carbon black or silver or copper adhered to the mica by a binder system. The material contributes both electrical conductivity and improved physical properties such as increased stiffness, increased tensile strength, and increased scratch resistance to materials for antistatic and electromagnetic shielding such as thermoplastic and thermosetting polymers, in a cost-effective manner relative to alternative prior art electrically-conductive and reinforcing materials.Type: ApplicationFiled: November 15, 2007Publication date: June 5, 2008Inventors: Gary Charles Phillips, William Watson Davison
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Publication number: 20080129437Abstract: A current transformer core made of an alloy having a composition represented by the general formula: Fe100-x-a-y-cMxCuaM?yX?c (by atomic %), wherein M is Co and/or Ni, M? is at least one element selected from the group consisting of V, Ti, Zr, Nb, Mo, Hf, Ta and W, X? is Si and/or B, and x, a, y and c are numbers satisfying 10?x?50, 0.1?a?3, 1?y?10, 2?c?30, and 7?y+c?31, respectively; at least part or all of the alloy structure being composed of crystal grains having an average particle size of 50 nm or less.Type: ApplicationFiled: December 16, 2005Publication date: June 5, 2008Applicant: Hitachi Metals, LTD.Inventors: Yoshihito Yoshizawa, Masamu Naoe
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Publication number: 20080116424Abstract: Disclosed herein is an electrically conducting polymer composition and method of making a composition including an organic polymer; and a first filler including at least one ceramic filler, at least one metallic filler, or a combination including at least one of the foregoing fillers, wherein a trip temperature of the composition does not change by an amount of greater than or equal to ±10° C. when the composition is cycled 100 times between room temperature and the trip temperature. Disclosed herein as well is an electrically conducting polymer composition including a first filler including at least one ceramic filler, at least one metallic filler, or a combination including at least one of the foregoing fillers and a second filler. The compositions of the present invention have a trip temperature that is lower than the HDT temperature of the composition and can have tunable trip temperatures.Type: ApplicationFiled: November 20, 2007Publication date: May 22, 2008Applicant: SABIC Innovative Plastics IP BVInventors: Sumanda Bandyopadhyay, Vishwasrao Vasant Gawade, Soumyadeb Ghosh, Ramya Kumaraswamy, Franciscus Petrus Maria Mercx, Suchetana Shetty
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Publication number: 20080105853Abstract: The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.Type: ApplicationFiled: June 23, 2004Publication date: May 8, 2008Inventors: Masayuki Ueda, Hiroshi Saito, Kazuo Hosoya, Noriaki Hata, Yorishige Matsuba
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Patent number: 7368069Abstract: In a PTC thermistor comprising at least a pair of electrodes disposed so as to face each other and a thermistor element disposed between the electrodes and having a positive resistance-temperature characteristic, the thermistor element is a molded body constituted by a high molecular matrix, a low molecular organic compound, and conductive particles having electric conductivity, the molecular weight of the high molecular matrix is between 10,000 and 400,000, the molecular weight of the low molecular organic compound is between 100 and 3,000, and the high molecular matrix is an olefin-type high molecular compound having a melting start temperature of between 85 and 95° C.Type: GrantFiled: February 7, 2003Date of Patent: May 6, 2008Assignee: TDK CorporationInventors: Hisanao Tosaka, Yasuhide Yamashita
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Patent number: 7214419Abstract: A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding to the end faces of conductive layers in the through-hole. Therefore, the paste does not require through-hole plating. The conductive paste comprises (A) 100 parts by weight of a resin component that contains an acrylate resin and an epoxy resin, (B) from 200 to 1800 parts by weight of a metal powder of at least two metals that contain at least one low-melting-point metal having a melting point of not higher than 180° C. and at least one high-melting-point metal having a melting point of not lower than 800° C., (C) from 0.5 to 40 parts by weight of a curing agent that contains from 0.3 to 35 parts by weight of a phenol-type curing agent, and (D) from 0.3 to 80 parts by weight of a flux.Type: GrantFiled: May 27, 2003Date of Patent: May 8, 2007Assignee: Tatsuta Electric Wire & Cable Co., Ltd.Inventors: Hiroaki Umeda, Hisatoshi Murakami, Kiyoshi Iwai
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Patent number: 7186289Abstract: There is provided a nickel powder suitable as conductive particles for use in conductive paste and conductive resin, that is inexpensive, has superior weather resistance, low resistivity when kneaded with resin, and is stable when used in the long-term, and a production method therefor. A nickel powder is produced by a two stage reduction and precipitation process from an aqueous solution containing a bivalent nickel salt, wherein an average primary particle diameter is 0.2 ?m to 2.0 ?m as measured with a scanning electron microscope (SEM), wherein an average secondary particle diameter is 8 ?m to 50 ?m according to laser particle size distribution measurement, wherein a tap density is 0.5 g/ml to 2.0 g/ml, wherein a cobalt content is 1 to 20 weight %. The cobalt may be contained in only the surface layer of the nickel powder at a content of 1 weight % to 40 weight %.Type: GrantFiled: October 19, 2004Date of Patent: March 6, 2007Assignee: Sunitomo Metal Mining Co., Ltd.Inventors: Toshihiro Kato, Shuji Okada, Shoji Futaki
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Patent number: 7160487Abstract: Disclosed is a conductive composition used for a conductor of an electronic component, comprising a metal particle and a metal oxide particle which has an average particle size of 5 to 60 nm, a melting point of 1500° C. or higher, and a content of 0.1 to 10.0 wt % based on the amount of the metal particle. According to the conductive composition, even when the metal particle is made fine, a sintering initiation temperature can be adequately increased, thus a generation of a crack and a de-lamination can be prevented easily and firmly.Type: GrantFiled: November 21, 2003Date of Patent: January 9, 2007Assignee: TDK CorporationInventor: Shuichi Miura
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Patent number: 7147804Abstract: The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors, which compositions are made of a conductive-based powder and a glass frit and can be fired at a low temperature in a nitrogen atmosphere.Type: GrantFiled: September 25, 2003Date of Patent: December 12, 2006Assignee: E. I. du Pont de Nemours and CompanyInventors: Keiichiro Hayakawa, Takuya Konno, Hisashi Matsuno
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Patent number: 7148281Abstract: A method of preparing an electrically conductive polymer blend, and an electrically conductive polymer blend includes steps of selecting at least two polymeric materials that are substantially immiscible together, mixing the polymeric materials into a blend so that at least one of the polymeric materials forms a continuous three-dimensional phase through the entire blend, and mixing an electrically conductive filler into the blend. The difference in surface tension between the polymeric material forming the continuous three-dimensional phase and the other polymeric materials forming the blend is at least 2 mN/m.Type: GrantFiled: October 6, 2003Date of Patent: December 12, 2006Assignee: Premix OyInventors: Taisto Vilkman, Jenni Mustonen, Hannu Minkkinen, Mikko Karttunen
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Patent number: 7134879Abstract: An anisotropic conductive material body includes an insulating medium; and a plurality of conductive members dispersed in the medium. At least a surface of each of the plurality of conductive members is conductive. A force is applied to at least one of the plurality of conductive members so as to change the at least one conductive member, so that the conductive property of the anisotropic conductive material body provided by the at least one conductive member is changed to an insulating property.Type: GrantFiled: June 4, 2004Date of Patent: November 14, 2006Assignee: Sharp Kabushiki KaishaInventors: Mitsuhiro Sugimoto, Hisao Kawaguchi, Shingo Sekiguchi
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Patent number: 7122131Abstract: The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.Type: GrantFiled: February 25, 2005Date of Patent: October 17, 2006Assignee: Kyocera CorporationInventor: Hisashi Satou
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Patent number: 7083744Abstract: The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors which have a metal oxide component selected from SnO2, V2O5 and MoO3. The compositions can be fired at a low temperature in a nitrogen atmosphere.Type: GrantFiled: September 25, 2003Date of Patent: August 1, 2006Assignee: E. I. du Pont de Nemours and CompanyInventors: Hisashi Matsuno, Hiroyuki Soshi
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Patent number: 7074349Abstract: The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors, which compositions are made of a copper-based powder and an organic binder that can be fired at a low temperature in a nitrogen atmosphere.Type: GrantFiled: September 25, 2003Date of Patent: July 11, 2006Assignee: E. I. du Pont de Nemours and CompanyInventors: Takuya Konno, Takayuki Kaneda
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Patent number: 7063809Abstract: A flame-retardant and electromagnetic wave-shielding thermoplastic resin composition is provided, which comprises 100 parts by weight of a thermoplastic resin (A); from 0.5 to 30 parts by weight of a flame retardant of a halogen-free phosphate (B) represented by the following general formula (1): wherein R1, R2, R3, and R4 each independently represent a hydrogen atom or a monovalent organic group, at least one of R1, R2, R3, and R4 is a monovalent organic group, X is a bivalent organic group, k, l, m, and n are each independently 0 or 1, and N is an integer of 0 to 10; from 5 to 35 parts by weight of a metal-coated fiber (C); and from 3 to 30 parts by weight of a filler in a scaly shape or an acicular shape (D). Such a composition has excellent flame retardance, good appearance, and excellent molding flowability.Type: GrantFiled: October 25, 2001Date of Patent: June 20, 2006Assignee: Nippon A & L IncorporatedInventors: Koichi Tabushi, Bunzou Mori
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Patent number: 7033469Abstract: Ceramic inert anodes useful for the electrolytic production of aluminum are disclosed. The inert anodes comprise oxides of Ni, Fe and Al. The Ni—Fe—Al oxide inert anode materials have sufficient electrical conductivity at operation temperatures of aluminum production cells, and also possess good mechanical stability. The Ni—Fe—Al oxide inert anodes may be used to produce commercial purity aluminum.Type: GrantFiled: November 8, 2002Date of Patent: April 25, 2006Assignee: Alcoa Inc.Inventors: Douglas A. Weirauch, Jr., Joseph M. Dynys, Robert A. DiMilia, Siba P. Ray, Xinghua Liu, Frankie E. Phelps
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Patent number: 7022266Abstract: A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a monomer which is polymerisable to yield a polymer, wherein the polymer is cross-likable under the action of a chemical cross-linking agent, and (d) a chemical cross-linking agent for the polymer, the cross-linking agent having fluxing properties and being unreactive with the polymer without catalysis. The polymer will generally be an epoxy resin and the cross-linking agent will generally be a polyacid. The composition preferably is one in which the metal powder and/or solder powder generates and/or has adhered thereto a catalyst for the cross-linking agent which is liberated on application of heat.Type: GrantFiled: August 15, 1997Date of Patent: April 4, 2006Assignee: Dow Corning CorporationInventor: Hugh P. Craig
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Patent number: 7019613Abstract: A PTC thermistor 10 comprises, at least, a pair of electrodes 2, 3 and a thermistor body 1, disposed between the electrodes 2, 3, having a positive resistance vs. temperature characteristic. The thermistor body includes, at least, a thermoplastic resin and an electrically conductive particle made of a metal powder. The thermoplastic resin and electrically conductive particle have respective contents and a state of dispersion adjusted so as to yield a magnetization of 4.0×10?5 to 6.0×10?5 Wb·m·kg?1 when a magnetic field of 3.98×105 A·m?1 is applied to the thermistor body.Type: GrantFiled: June 18, 2003Date of Patent: March 28, 2006Assignee: TDK CorporationInventors: Yoshito Nihira, Noriaki Hirano, Hisanao Tosaka
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Patent number: 6982047Abstract: The present invention improves the oxidation resistance of an ultrafine metal powder for use in the internal electrode of a multilayer ceramic capacitance and suppresses an increase in the thickness of a metal internal electrode film resulting from the spheroidization of the molten metal under surface tension during the formation of the metal internal electrode film. The ultrafine metal powder has a sulfur-containing compound of not less than one element selected from the group consisting of Y, Zr, and La present on the surface of the particle thereof and is produced by performing an ultrafine metal powder purification step of dispersing the ultrafine metal powder in a slurry, a surface treatment step of adding an aqueous solution containing a sulfate of not less than one element selected from the group consisting of Y, Zr, and La to the slurry to form the compound on the surface of the metal particle, a filtering step, and a drying step.Type: GrantFiled: November 14, 2003Date of Patent: January 3, 2006Assignee: Kawatetsu Mining Co., Ltd.Inventor: Morishige Uchida
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Conductive metal particles, conductive composite metal particles and applied products using the same
Patent number: 6926751Abstract: Disclosed are provides conductive metal particles and conductive composite metal particles by which conductive materials having stable conductivity can be provided, and applied product thereof. The conductive metal particles have a number average particle diameter of 5 to 100 ?m, a BET specific surface area of 0.01×103 to 0.7×103 m2/kg, a sulfur element content of at most 0.1% by mass, an oxygen element content of at most 0.5% by mass and a carbon element content of at most 0.1% by mass. The conductive composite metal particles are obtained by coating the surfaces of the conductive metal particles with a high-conductive metal.Type: GrantFiled: September 15, 2003Date of Patent: August 9, 2005Assignee: JSR CorporationInventors: Terukazu Kokubo, Naoki Yanadori