Free Metal Containing Patents (Class 252/512)
  • Patent number: 11493672
    Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 8, 2022
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Jaroslaw Zieba, Kelly Janssen, Fred Thomas
  • Patent number: 11413685
    Abstract: A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 ?m or more and 50 ?m or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: August 16, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Genta Sasaki, Taku Okano, Yoshio Moteki, Yu Saito
  • Patent number: 11415004
    Abstract: Disclosed is a superalloy gas turbine engine component including a glass coating. The glass coating is configured for resistance to hot corrosion caused by molten salts of sodium, magnesium, vanadium, and/or sulfur dioxide. The glass coating includes a mixture of two or more metal oxides, which are preferably selected from: barium oxide, silicon oxide, strontium oxide, aluminum oxide, magnesium oxide, calcium oxide, cobalt oxide, boron oxide, iron oxide, zirconium oxide, nickel oxide, and titanium oxide. The glass coating is in fully crystalline form and/or a mixture of crystalline and glass phases, and it has a coefficient of thermal expansion of from about 10 to about 18 ?m/m-° C. The glass coating has a thickness over the superalloy gas turbine engine component of about 0.5 mils to about 10 mils.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: August 16, 2022
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Mahdi Mohajeri, Bahram Jadidian
  • Patent number: 11414554
    Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: August 16, 2022
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
  • Patent number: 11411476
    Abstract: A method of manufacturing an armature includes: a step of placing a bonding agent on bonding surfaces of the distal ends of a plurality of segment conductors; a step of placing the plurality of segment conductors on an armature core; a step of bonding the distal ends to each other; and a step of increasing a viscosity of the bonding agent placed on the distal ends, after the step of placing the bonding agent on the distal ends, and before the step of bonding the distal ends to each other.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 9, 2022
    Assignee: AISIN CORPORATION
    Inventors: Kiyotaka Koga, Tomotsugu Sugihara
  • Patent number: 11358866
    Abstract: Provided is a fibrous carbon nanostructure that is easy to surface modify. A symmetry factor of a peak of a first derivative curve of a thermogravimetric curve obtained through thermogravimetric analysis of the fibrous carbon nanostructure in a dry air atmosphere is 3.70 or less. The first derivative curve of the thermogravimetric curve can be a temperature derivative curve of the thermogravimetric curve or a time derivative curve of the thermogravimetric curve.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 14, 2022
    Assignee: ZEON CORPORATION
    Inventor: Osamu Kawakami
  • Patent number: 11359124
    Abstract: The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: June 14, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kenji Takenaka, Atsushi Sakamoto
  • Patent number: 11360244
    Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: June 14, 2022
    Assignee: VIAVI SOLUTIONS INC.
    Inventors: Jaroslaw Zieba, Kelly Janssen, Fred Thomas
  • Patent number: 11328834
    Abstract: A method of fabricating a transparent conductor is provided. The method includes forming a nanowire dispersion layer on a substrate, forming a nanowire network layer on the substrate by drying the nanowire dispersion layer, and forming a matrix material layer on the nanowire network layer.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 10, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Jonathan S. Alden, Haixia Dai, Michael R. Knapp, Shuo Na, Hash Pakbaz, Florian Pschenitzka, Xina Quan, Michael A. Spaid, Adrian Winoto, Jeffrey Wolk
  • Patent number: 11286355
    Abstract: There is provided a composite article comprising a composite material comprising 60 wt % to 98 wt % of a hydrolytically stable thermoplastic resin; and 1 wt % to 11 wt % long conductive metal fibers coated with a polymer selected from at least one of aromatic polycarbonates, aromatic polycarbonate alloys, aromatic polyethers, maleated polyolefins, semi-aromatic nylons, stabilized nylons, and combinations thereof.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 29, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Benjamin A. Johnson, Terry R. Hobbs, Patrick J. Kilps, Patrick R. McKellips, Ambuj Sharma, Jeffrey M. Smits
  • Patent number: 11253921
    Abstract: An object of the present invention to provide copper fine particles which can be sintered at a lower temperature than that of the conventional copper fine particles without causing a cost increase, a decrease in productivity, a method for producing the copper fine particles, and a sintered body, and the present invention provides copper fine particles having a coating film containing cuprous oxide and copper carbonate on the surface thereof.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: February 22, 2022
    Assignee: Taiyo Nippon Sanso Corporation
    Inventors: Yuji Sakuramoto, Hiroshi Igarashi, Takayuki Fujimoto
  • Patent number: 11228080
    Abstract: The invention relates to a method of manufacturing a dielectric filter. The method comprises the steps of: (a) preparing a ceramic substrate; (b) applying a conductive paste on the ceramic substrate, wherein the conductive paste comprises, (i) 100 parts by weight of a conductive powder, (ii) 0.1 to 10.0 parts by weight of a glass frit comprising silicon oxide, boron oxide, aluminum oxide and an alkaline metal oxide, and (iii) an organic vehicle; and (c) firing the applied conductive paste.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: January 18, 2022
    Assignee: DUPONT ELECTRONICS, INC.
    Inventor: Yusuke Tachibana
  • Patent number: 11227719
    Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: January 18, 2022
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L Renner, John Bultitude, Allen Hill
  • Patent number: 11222762
    Abstract: Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: January 11, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Andrea Redaelli, Giorgio Servalli
  • Patent number: 11185991
    Abstract: The present application relates to a machining assembly comprising an effector intended to be mounted on a robot with multiple degrees of freedom, in which invention the mounting of the motor spindle relative to the intermediate supports and frame of the effector allows a numerically controlled movement along three axes X, Y, Z of a trihedron, the effector bearing on the piece to be machined or on the surrounding tools by means of a ball joint at the foot end of the effector. Since the effector bears on the piece to be machined or on the surrounding tools it is possible to create local stiffness and to obtain the precision required to guarantee the quality of the machining process.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: November 30, 2021
    Assignee: LE CRENEAU INDUSTRIEL
    Inventors: Alain Auffret, Cédric Bastien
  • Patent number: 11183315
    Abstract: A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: November 23, 2021
    Assignee: SHOEI CHEMICAL INC.
    Inventors: Hayato Tateno, Junichi Ikuno, Hiroshi Mashima
  • Patent number: 11136257
    Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 5, 2021
    Assignee: KOA Corporation
    Inventors: Natsuki Iguchi, Yuya Iguchi, Koichi Urano
  • Patent number: 11117120
    Abstract: A catalyst for synthesizing a carbon nanotube includes a support containing a metal, and an active metal impregnated on the support. The active metal includes cobalt and manganese. A surface molar ratio of the active metal relative to the metal of the support is 40% or less of a bulk molar ratio of the active metal relative to the metal of the support. A carbon nanotube having high purity and low resistance is obtained from the catalyst.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 14, 2021
    Assignees: SK Innovation Co., Ltd., SK Global Chemical Co., Ltd.
    Inventors: Hye Ryun Seo, Yong Tak Kwon
  • Patent number: 11096318
    Abstract: In accordance with the present invention, there is provided a noise suppression sheet that is capable of absorbing noise at a wide frequency range of from 10 MHz to 1 GHz. The present invention relates to a ferrite laminate formed by laminating a conductive layer comprising a conductive filler and a resin and a magnetic layer comprising ferrite; the conductive layer has a surface electrical resistance of of 100 to 5000 ?/?; the ferrite is partitioned into small parts; and a real part of a magnetic permeability of the ferrite as measured at 10 MHz is 130 to 480, and an imaginary part of of the magnetic permeability of the ferrite as measured at 10 MHz is 30 to 440.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: August 17, 2021
    Assignee: TODA KOGYO CORP.
    Inventors: Yoji Okano, Akihiro Yoshida, Kazumi Yamamoto, Yuji Omote
  • Patent number: 11081683
    Abstract: A method for predicting the likelihood of coagulation of active material particles contained in a slurry for electrode preparation includes measuring rheological properties before and after the slurry is subjected to a shear. The estimation method enables a prediction of filter clogging with a slurry, and thus makes it possible to estimate the likelihood of filter clogging with a slurry without passing the slurry directly through the filter, thereby improving the efficiency of a battery manufacturing process.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: August 3, 2021
    Inventors: Jeongyong Lee, Ki Yeon Jo, Hyejin Han, Sangeun Kim, Myunghan Lee, Changkwon Chung
  • Patent number: 11070190
    Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: July 20, 2021
    Assignee: Statek Corporation
    Inventors: Yue Fang, Thomas Pham
  • Patent number: 11009729
    Abstract: A flexible display device including a flexible substrate and a conductive pattern. The flexible substrate includes a bending part in which a bending occurs. At least a portion of the conductive pattern is disposed on the bending part and the conductive pattern includes grains. Each grain has a grain size of about 10 nm to about 100 nm.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: May 18, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyungseop Kim, Sangyoun Han, Sangkyu Choi, Jae-wook Kang, Sungkyun Park, Yongwoo Park, Jungha Son
  • Patent number: 10976082
    Abstract: A heating and/or cooling device having one or more thermoelectric threads. The thermoelectric thread includes a plurality of individual thermoelectric elements, each thermoelectric element having a first side and a second side. A set of first side electrodes connects at least some of the thermoelectric elements at the first side, and a set of second side electrodes connects at least some of the thermoelectric elements at the second side. An electrically insulative covering at least partially surrounds the plurality of individual thermoelectric elements. The electrically insulative covering is configured to be woven into or otherwise integrated with a fabric.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: April 13, 2021
    Assignee: The Regents of the University of Michigan
    Inventors: Sridhar Lakshmanan, Sean Ahlquist, Michael Putty
  • Patent number: 10920337
    Abstract: Methods for forming single crystal silicon ingots with improved resistivity control and, in particular, methods that involve gallium or indium doping are disclosed. In some embodiments, the ingots are characterized by a relatively high resistivity.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: February 16, 2021
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Richard J. Phillips, Parthiv Daggolu, Eric Gitlin, Robert Standley, HyungMin Lee, Nan Zhang, Jae-Woo Ryu, Soubir Basak
  • Patent number: 10829838
    Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: November 10, 2020
    Assignee: M. TECHNIQUE CO., LTD.
    Inventors: Masaki Maekawa, Daisuke Honda, Masakazu Enomura, Kazuya Araki
  • Patent number: 10822529
    Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 45 to 100 ?m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: November 3, 2020
    Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
    Inventors: Chih-Ming Lin, Chien-Hui Lee
  • Patent number: 10796815
    Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: October 6, 2020
    Assignee: KYOCERA Corporation
    Inventor: Kazuki Imagawa
  • Patent number: 10763018
    Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: September 1, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Noritaka Yoshida, Kenichi Matsushima
  • Patent number: 10749102
    Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: August 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Nagahara, Muneyuki Daidai, Masahiro Saito, Atsushi Sugimasa, Hiroki Kitayama, Shigehisa Yago
  • Patent number: 10717896
    Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: July 21, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
  • Patent number: 10703571
    Abstract: Disclosed is an industrial belt that can be used in, for example, conveying or forming engineered wood composites or other industrial products. The industrial belt has a seamable base belt with a coating that includes a polymer, an anti-contaminant, and a conductive anti-static component.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 7, 2020
    Assignee: Albany International Corp.
    Inventors: Mark Levine, Thomas Israel, Heather Weber, Chad VanHandel, Douglas England
  • Patent number: 10658116
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10647830
    Abstract: A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 ?m and crushed alumina having an average particle size of 0.1-5 ?m as a thermally conductive filler, contains 15-55 mass % of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass % of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 12, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Takanori Ito
  • Patent number: 10636541
    Abstract: A conductive paste including a conductive powder, a glass frit, and an organic vehicle, wherein the conductive powder includes copper and/or nickel as a main component(s), and the glass frit is substantially free of Pb, Cd, and Bi, comprises 40 to 65% by mass of BaO, 15 to 23% by mass of B2O3, 2 to 12% by mass of Al2O3, 4 to 8% by mass of SiO2, 0 to 5% by mass of ZnO, 0.5 to 7% by mass of TiO2, 3 to 7.5% by mass of CaO, and comprises any one or more of MnO2, CuO, and CoO in the ranges of 0 to 7% by mass of MnO2, 0 to 16% by mass of CuO, and 0 to 5% by mass of CoO, in terms of oxide.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: April 28, 2020
    Assignee: SHOEI CHEMICAL INC.
    Inventors: Kousuke Nishimura, Naoto Shindo, Nobuo Nishioka
  • Patent number: 10629323
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 21, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose Manuel Rodriguez-Parada
  • Patent number: 10629322
    Abstract: An electrically conductive oxide sintered compact according to one embodiment of the present invention includes a crystal phase that has a perovskite oxide crystal structure represented by the composition formula: REaCobCucNidOx where RE is a rare-earth element; a+b+c+d=1; and 1.25?x?1.75, wherein the values of a, b, c and d respectively satisfy the following conditions: 0.474?a?0.512; 0.050?b?0.350; 0?c?0.250; and 0.050?d?0.350.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: April 21, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Hisashi Kozuka, Yasuyuki Okimura, Kazushige Ohbayashi
  • Patent number: 10611931
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 7, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Patent number: 10602619
    Abstract: An anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 ?m.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 24, 2020
    Assignee: DEXERIALS CORPORATION
    Inventors: Daisuke Sato, Akifumi Higuchi
  • Patent number: 10590542
    Abstract: The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: March 17, 2020
    Assignee: IONES CO., LTD.
    Inventors: Mun Ki Lee, Byung Ki Kim, Jae Hyuk Park, Dae Gean Kim, Myoung No Lee
  • Patent number: 10510496
    Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masato Kimura, Yasuhiro Nishisaka
  • Patent number: 10510908
    Abstract: A solar cell panel includes a first solar cell and a second solar cell; and a plurality of leads connecting the first solar cell and the second solar cell. Each of the first solar cell and the second solar cell includes: a first electrode including a plurality of finger lines in a first direction and a plurality of first bus bars in a second direction crossing the first direction; and a second electrode including a plurality of second bus bars in the second direction. The plurality of leads have a diameter or width of 100 to 500 ?m, and include 6 or more leads arranged at one surface side of the first or second solar cell. The plurality of leads are connected to the plurality of first bus bars of the first solar cell and the plurality of second bus bars of the second solar cell by a solder layer, respectively.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: December 17, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinhyung Lee, Jungmin Ha, Sangwook Park
  • Patent number: 10483554
    Abstract: Disclosed is a carbon support for a fuel cell catalyst that supports a metal. The carbon support includes a conductive carbon support and nitrogen atoms doped into the conductive carbon support. Also disclosed is a method for preparing the carbon support. Also disclosed is a catalyst including the carbon support. The catalyst has greatly improved degradation resistance compared to conventional catalysts for fuel cells. In addition, the catalyst is not substantially degraded even when applied to a single cell.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: November 19, 2019
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jin Young Kim, Sung Jong Yoo, Dirk Henkensmeier, Jong Hyun Jang, Hyoung-Juhn Kim, Yeon Hun Jeong, Nayoung Kim, Chang Won Yoon, Jonghee Han, Suk Woo Nam, Tae Hoon Lim
  • Patent number: 10477681
    Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 12, 2019
    Assignee: Korea Electronics Technology Institute
    Inventors: Yoonjin Kim, Jinwoo Cho, Kwonwoo Shin, Yonggon Seo, Yeonwon Kim, Sanghyeon Jang, Namje Jo
  • Patent number: 10464153
    Abstract: A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: November 5, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Arata Kishi, Hiroki Maruo
  • Patent number: 10456871
    Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 29, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Sebastian Fritzsche, Jürgen Schulze, Jörg Trodler
  • Patent number: 10458004
    Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 ?m to 10 ?m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: October 29, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kozo Ogi, Kenichi Inoue, Atsushi Ebara, Akihiro Asano, Hideyuki Fujimoto, Takahiro Yamada
  • Patent number: 10446299
    Abstract: In one embodiment a varistor may include a ceramic body. The varistor may further comprise a multilayer coating disposed around the ceramic body. The multilayer coating may include a first layer comprising a phenolic material or a silicone material; and a second layer adjacent the first layer, the second layer comprising a high dielectric strength coating.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: October 15, 2019
    Assignee: Dongguan Littelfuse Electronics Company Limited
    Inventors: Wen Yang, Hao Cheng
  • Patent number: 10438900
    Abstract: A high voltage (HV) converter implemented on a printed circuit board (PCB) includes a double diffused metal oxide semiconductor (DMOS) package comprising a lead frame and a main DMOS chip. The lead frame includes a gate section electrically connected to a gate electrode of the main DMOS chip, a source section electrically connected to a source electrode of the main DMOS chip and a drain section electrically connected to a drain electrode of the main DMOS chip. The PCB layout includes a large area source copper pad attached to and overlapping the source section of the DMOS package to facilitate cooling and a small area drain copper pad attached to and overlapping the drain section of the DMOS package to reduce electromagnetic interference (EMI) noise.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 8, 2019
    Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Zhiqiang Niu, Kuang Ming Chang, Lin Chen, Ning Sun, QiHong Huang
  • Patent number: 10431700
    Abstract: The present invention relates to a conductive paste, which imparts an electrode formed therefrom with enhanced adhesion strength to a semiconductor substrate by incorporation of LiAlO2 (lithium aluminate) therein. The present invention further relates to an electrode formed from the conductive paste and a semiconductor and in particular, a solar cell comprising the electrode produced therefrom.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: October 1, 2019
    Assignee: Giga Solar Materials Corp.
    Inventors: Po-Yang Shih, Yu-Shuo Yang, Pi-Yu Hsin
  • Patent number: 10418504
    Abstract: An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 17, 2019
    Assignee: The Boeing Company
    Inventor: Eric M. Rehder