Abstract: A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.

Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.

Abstract: The present disclosure relates to a method of manufacturing a liquid metal-based electrode using a light sintering process. The method of manufacturing a liquid metal-based electrode includes a step of preparing a metal nanoparticle solution, a step of adding metal micron particles and a surface modifier to the metal nanoparticle solution to prepare a mixed solution, a step of adding a liquid metal to the mixed solution to prepare a composite ink containing the liquid metal having a surface oxide film formed thereon, a step of forming an electrode by applying the composite ink onto a substrate, and a step of irradiating the electrode with light to destroy the surface oxide film.

Abstract: A method for manufacturing Group-III nitride semiconductor nanoparticles includes synthesizing Group-III nitride semiconductor nanoparticles having a particle size of 16 nm or less by reacting materials containing one or more Group-III elements M in a liquid phase, wherein a coordination solvent is used, and trimethyl M is used as at least one Group-III element material among the materials containing one or more Group-III elements M.

Abstract: The present invention provides a copper powder which is capable of fusion bonding with a low energy laser by enabling heat to be efficiently inputted with a high absorption rate for laser irradiation and has high convenience in handling, and provides a method for manufacturing the copper powder. One embodiment of the present invention is a copper powder, having an absorption rate for light having a wavelength ?=1060 nm of 18.9% to 65.0%, and an index, which is indicated by (the absorption rate for light having a wavelength ?=1060 nm)/(an oxygen concentration), of 3.0 or more.

Abstract: The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.

Abstract: Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.

Abstract: A method for a pouch film according to an embodiment of the present invention includes: a step of applying an adhesive on one surface of a first polymer layer; a step of depositing metal particles on the adhesive; a step of applying heat and a pressure to the deposited metal particles to sinter the metal particles and thereby forming a gas barrier layer; and a step of laminating a second polymer layer on one surface of the gas barrier layer.

Abstract: An electronic device characterized by including a substrate, a bonding layer provided on the substrate, the bonding layer containing copper in an amount of greater than 0 mass % but 60 mass % or less, the copper having its crystal grain size of 50 nm or less, an electronic component provided on the bonding layer, and a coating film covering a side of the bonding layer, the coating film containing at least one compound selected from copper (I) oxide (Cu2O) and copper (II) oxide (CuO).

Abstract: A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.

Abstract: This negative electrode active material for a secondary cell which is one aspect of the present disclosure comprises: a silicate phase that contains Li, Si, and Mx (Mx alkali metal, alkaline earth metal, and an element other than Si); silicon particles dispersed in the silicate phase; and oxide particles that contain Zr dispersed in the silicate phase. The content of each element with respect to the total of the elements other than oxygen in the silicate phase is 3 to 45 mol % for Li, 40 to 78 mol % for Si, and 1 to 40 mol % for Mx.

Abstract: This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

Abstract: A coil component includes a nonmagnetic body having a cured product of a polymer resin, an insulating substrate embedded in the body and having a thickness of 30 ?m or less, a coil portion including first and second coil patterns respectively disposed on first and second opposing surfaces of the insulating substrate, and first and second external electrodes disposed on a surface of the body to be connected to each of the first and second coil patterns exposed to the surface of the body.

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The internal electrode layer includes zirconium (Zr) and germanium (Ge). A ratio of a sum of contents (at %) of zirconium (Zr) and germanium (Ge), contained in the internal electrode layer, to an entirety of the internal electrode layer is 3.3 at % or more to 3.7 at % or less.

Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 ?m to 5 ?m and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

Abstract: A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5?X) wt %, and the ceramic particles include CeO2(X) wt %, where 0.05?X?0.1.

Abstract: To provide a fine nickel powder for an internal electrode paste of an electronic component, the nickel powder obtained by a wet method and having high crystallinity, excellent sintering characteristics, and heat-shrinking characteristics. The nickel powder is obtained by precipitating nickel by a reduction reaction in a reaction solution including at least water-soluble nickel salt, salt of metal nobler than nickel, hydrazine as a reducing agent, and alkali metal hydroxide as a pH adjusting agent and water; the reaction solution is prepared by mixing a nickel salt solution including the water-soluble nickel salt and the salt of metal nobler than nickel with a mixed reducing agent solution including hydrazine and alkali metal hydroxide; and the hydrazine is additionally added to the reaction solution after a reduction reaction initiates in the reaction solution.

Abstract: A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.

Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

Abstract: A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.

Abstract: A vaporizer includes an outer tube configured to receive a flow of heated gas and an inner tube disposed at least partially within the outer tube. The inner tube is spaced apart from the outer tube such that the flow of heated gas is channeled through an annular space therebetween. The vaporizer also includes a crucible disposed at least partially within the inner tube. The crucible is extendable and retractable relative to the inner tube and within the outer tube. The crucible is configured to hold a molten metal such that a surface area of the molten metal exposed to the flow of heated gas is adjustable based on the position of the crucible relative to the inner tube. A heater is configured to vaporize the molten material and the vapor mixes with the flow of heated gas.

Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.

Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

Abstract: A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 ?m or more and 50 ?m or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.

Abstract: Disclosed is a superalloy gas turbine engine component including a glass coating. The glass coating is configured for resistance to hot corrosion caused by molten salts of sodium, magnesium, vanadium, and/or sulfur dioxide. The glass coating includes a mixture of two or more metal oxides, which are preferably selected from: barium oxide, silicon oxide, strontium oxide, aluminum oxide, magnesium oxide, calcium oxide, cobalt oxide, boron oxide, iron oxide, zirconium oxide, nickel oxide, and titanium oxide. The glass coating is in fully crystalline form and/or a mixture of crystalline and glass phases, and it has a coefficient of thermal expansion of from about 10 to about 18 ?m/m-° C. The glass coating has a thickness over the superalloy gas turbine engine component of about 0.5 mils to about 10 mils.

Abstract: A method of manufacturing an armature includes: a step of placing a bonding agent on bonding surfaces of the distal ends of a plurality of segment conductors; a step of placing the plurality of segment conductors on an armature core; a step of bonding the distal ends to each other; and a step of increasing a viscosity of the bonding agent placed on the distal ends, after the step of placing the bonding agent on the distal ends, and before the step of bonding the distal ends to each other.

Abstract: Provided is a fibrous carbon nanostructure that is easy to surface modify. A symmetry factor of a peak of a first derivative curve of a thermogravimetric curve obtained through thermogravimetric analysis of the fibrous carbon nanostructure in a dry air atmosphere is 3.70 or less. The first derivative curve of the thermogravimetric curve can be a temperature derivative curve of the thermogravimetric curve or a time derivative curve of the thermogravimetric curve.

Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.

Abstract: The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.

Abstract: A method of fabricating a transparent conductor is provided. The method includes forming a nanowire dispersion layer on a substrate, forming a nanowire network layer on the substrate by drying the nanowire dispersion layer, and forming a matrix material layer on the nanowire network layer.

Abstract: There is provided a composite article comprising a composite material comprising 60 wt % to 98 wt % of a hydrolytically stable thermoplastic resin; and 1 wt % to 11 wt % long conductive metal fibers coated with a polymer selected from at least one of aromatic polycarbonates, aromatic polycarbonate alloys, aromatic polyethers, maleated polyolefins, semi-aromatic nylons, stabilized nylons, and combinations thereof.

Abstract: An object of the present invention to provide copper fine particles which can be sintered at a lower temperature than that of the conventional copper fine particles without causing a cost increase, a decrease in productivity, a method for producing the copper fine particles, and a sintered body, and the present invention provides copper fine particles having a coating film containing cuprous oxide and copper carbonate on the surface thereof.

Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

Abstract: The invention relates to a method of manufacturing a dielectric filter. The method comprises the steps of: (a) preparing a ceramic substrate; (b) applying a conductive paste on the ceramic substrate, wherein the conductive paste comprises, (i) 100 parts by weight of a conductive powder, (ii) 0.1 to 10.0 parts by weight of a glass frit comprising silicon oxide, boron oxide, aluminum oxide and an alkaline metal oxide, and (iii) an organic vehicle; and (c) firing the applied conductive paste.

Abstract: Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.

Abstract: The present application relates to a machining assembly comprising an effector intended to be mounted on a robot with multiple degrees of freedom, in which invention the mounting of the motor spindle relative to the intermediate supports and frame of the effector allows a numerically controlled movement along three axes X, Y, Z of a trihedron, the effector bearing on the piece to be machined or on the surrounding tools by means of a ball joint at the foot end of the effector. Since the effector bears on the piece to be machined or on the surrounding tools it is possible to create local stiffness and to obtain the precision required to guarantee the quality of the machining process.

Abstract: A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.

Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

Abstract: A catalyst for synthesizing a carbon nanotube includes a support containing a metal, and an active metal impregnated on the support. The active metal includes cobalt and manganese. A surface molar ratio of the active metal relative to the metal of the support is 40% or less of a bulk molar ratio of the active metal relative to the metal of the support. A carbon nanotube having high purity and low resistance is obtained from the catalyst.

Abstract: In accordance with the present invention, there is provided a noise suppression sheet that is capable of absorbing noise at a wide frequency range of from 10 MHz to 1 GHz. The present invention relates to a ferrite laminate formed by laminating a conductive layer comprising a conductive filler and a resin and a magnetic layer comprising ferrite; the conductive layer has a surface electrical resistance of of 100 to 5000 ?/?; the ferrite is partitioned into small parts; and a real part of a magnetic permeability of the ferrite as measured at 10 MHz is 130 to 480, and an imaginary part of of the magnetic permeability of the ferrite as measured at 10 MHz is 30 to 440.

Abstract: A method for predicting the likelihood of coagulation of active material particles contained in a slurry for electrode preparation includes measuring rheological properties before and after the slurry is subjected to a shear. The estimation method enables a prediction of filter clogging with a slurry, and thus makes it possible to estimate the likelihood of filter clogging with a slurry without passing the slurry directly through the filter, thereby improving the efficiency of a battery manufacturing process.

Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

Abstract: A flexible display device including a flexible substrate and a conductive pattern. The flexible substrate includes a bending part in which a bending occurs. At least a portion of the conductive pattern is disposed on the bending part and the conductive pattern includes grains. Each grain has a grain size of about 10 nm to about 100 nm.

Abstract: A heating and/or cooling device having one or more thermoelectric threads. The thermoelectric thread includes a plurality of individual thermoelectric elements, each thermoelectric element having a first side and a second side. A set of first side electrodes connects at least some of the thermoelectric elements at the first side, and a set of second side electrodes connects at least some of the thermoelectric elements at the second side. An electrically insulative covering at least partially surrounds the plurality of individual thermoelectric elements. The electrically insulative covering is configured to be woven into or otherwise integrated with a fabric.

Abstract: Methods for forming single crystal silicon ingots with improved resistivity control and, in particular, methods that involve gallium or indium doping are disclosed. In some embodiments, the ingots are characterized by a relatively high resistivity.

Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.

Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 45 to 100 ?m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.

Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.

Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.