Free Metal Containing Patents (Class 252/512)
  • Patent number: 10763018
    Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: September 1, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Noritaka Yoshida, Kenichi Matsushima
  • Patent number: 10749102
    Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: August 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Nagahara, Muneyuki Daidai, Masahiro Saito, Atsushi Sugimasa, Hiroki Kitayama, Shigehisa Yago
  • Patent number: 10717896
    Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: July 21, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
  • Patent number: 10703571
    Abstract: Disclosed is an industrial belt that can be used in, for example, conveying or forming engineered wood composites or other industrial products. The industrial belt has a seamable base belt with a coating that includes a polymer, an anti-contaminant, and a conductive anti-static component.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 7, 2020
    Assignee: Albany International Corp.
    Inventors: Mark Levine, Thomas Israel, Heather Weber, Chad VanHandel, Douglas England
  • Patent number: 10658116
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10647830
    Abstract: A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 ?m and crushed alumina having an average particle size of 0.1-5 ?m as a thermally conductive filler, contains 15-55 mass % of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass % of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 12, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Takanori Ito
  • Patent number: 10636541
    Abstract: A conductive paste including a conductive powder, a glass frit, and an organic vehicle, wherein the conductive powder includes copper and/or nickel as a main component(s), and the glass frit is substantially free of Pb, Cd, and Bi, comprises 40 to 65% by mass of BaO, 15 to 23% by mass of B2O3, 2 to 12% by mass of Al2O3, 4 to 8% by mass of SiO2, 0 to 5% by mass of ZnO, 0.5 to 7% by mass of TiO2, 3 to 7.5% by mass of CaO, and comprises any one or more of MnO2, CuO, and CoO in the ranges of 0 to 7% by mass of MnO2, 0 to 16% by mass of CuO, and 0 to 5% by mass of CoO, in terms of oxide.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: April 28, 2020
    Assignee: SHOEI CHEMICAL INC.
    Inventors: Kousuke Nishimura, Naoto Shindo, Nobuo Nishioka
  • Patent number: 10629322
    Abstract: An electrically conductive oxide sintered compact according to one embodiment of the present invention includes a crystal phase that has a perovskite oxide crystal structure represented by the composition formula: REaCobCucNidOx where RE is a rare-earth element; a+b+c+d=1; and 1.25?x?1.75, wherein the values of a, b, c and d respectively satisfy the following conditions: 0.474?a?0.512; 0.050?b?0.350; 0?c?0.250; and 0.050?d?0.350.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: April 21, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Hisashi Kozuka, Yasuyuki Okimura, Kazushige Ohbayashi
  • Patent number: 10629323
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 21, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose Manuel Rodriguez-Parada
  • Patent number: 10611931
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 7, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
  • Patent number: 10602619
    Abstract: An anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 ?m.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 24, 2020
    Assignee: DEXERIALS CORPORATION
    Inventors: Daisuke Sato, Akifumi Higuchi
  • Patent number: 10590542
    Abstract: The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: March 17, 2020
    Assignee: IONES CO., LTD.
    Inventors: Mun Ki Lee, Byung Ki Kim, Jae Hyuk Park, Dae Gean Kim, Myoung No Lee
  • Patent number: 10510496
    Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masato Kimura, Yasuhiro Nishisaka
  • Patent number: 10510908
    Abstract: A solar cell panel includes a first solar cell and a second solar cell; and a plurality of leads connecting the first solar cell and the second solar cell. Each of the first solar cell and the second solar cell includes: a first electrode including a plurality of finger lines in a first direction and a plurality of first bus bars in a second direction crossing the first direction; and a second electrode including a plurality of second bus bars in the second direction. The plurality of leads have a diameter or width of 100 to 500 ?m, and include 6 or more leads arranged at one surface side of the first or second solar cell. The plurality of leads are connected to the plurality of first bus bars of the first solar cell and the plurality of second bus bars of the second solar cell by a solder layer, respectively.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: December 17, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinhyung Lee, Jungmin Ha, Sangwook Park
  • Patent number: 10483554
    Abstract: Disclosed is a carbon support for a fuel cell catalyst that supports a metal. The carbon support includes a conductive carbon support and nitrogen atoms doped into the conductive carbon support. Also disclosed is a method for preparing the carbon support. Also disclosed is a catalyst including the carbon support. The catalyst has greatly improved degradation resistance compared to conventional catalysts for fuel cells. In addition, the catalyst is not substantially degraded even when applied to a single cell.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: November 19, 2019
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jin Young Kim, Sung Jong Yoo, Dirk Henkensmeier, Jong Hyun Jang, Hyoung-Juhn Kim, Yeon Hun Jeong, Nayoung Kim, Chang Won Yoon, Jonghee Han, Suk Woo Nam, Tae Hoon Lim
  • Patent number: 10477681
    Abstract: The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 12, 2019
    Assignee: Korea Electronics Technology Institute
    Inventors: Yoonjin Kim, Jinwoo Cho, Kwonwoo Shin, Yonggon Seo, Yeonwon Kim, Sanghyeon Jang, Namje Jo
  • Patent number: 10464153
    Abstract: A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: November 5, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Arata Kishi, Hiroki Maruo
  • Patent number: 10458004
    Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 ?m to 10 ?m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: October 29, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kozo Ogi, Kenichi Inoue, Atsushi Ebara, Akihiro Asano, Hideyuki Fujimoto, Takahiro Yamada
  • Patent number: 10456871
    Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 29, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Sebastian Fritzsche, Jürgen Schulze, Jörg Trodler
  • Patent number: 10446299
    Abstract: In one embodiment a varistor may include a ceramic body. The varistor may further comprise a multilayer coating disposed around the ceramic body. The multilayer coating may include a first layer comprising a phenolic material or a silicone material; and a second layer adjacent the first layer, the second layer comprising a high dielectric strength coating.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: October 15, 2019
    Assignee: Dongguan Littelfuse Electronics Company Limited
    Inventors: Wen Yang, Hao Cheng
  • Patent number: 10438900
    Abstract: A high voltage (HV) converter implemented on a printed circuit board (PCB) includes a double diffused metal oxide semiconductor (DMOS) package comprising a lead frame and a main DMOS chip. The lead frame includes a gate section electrically connected to a gate electrode of the main DMOS chip, a source section electrically connected to a source electrode of the main DMOS chip and a drain section electrically connected to a drain electrode of the main DMOS chip. The PCB layout includes a large area source copper pad attached to and overlapping the source section of the DMOS package to facilitate cooling and a small area drain copper pad attached to and overlapping the drain section of the DMOS package to reduce electromagnetic interference (EMI) noise.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 8, 2019
    Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Zhiqiang Niu, Kuang Ming Chang, Lin Chen, Ning Sun, QiHong Huang
  • Patent number: 10431700
    Abstract: The present invention relates to a conductive paste, which imparts an electrode formed therefrom with enhanced adhesion strength to a semiconductor substrate by incorporation of LiAlO2 (lithium aluminate) therein. The present invention further relates to an electrode formed from the conductive paste and a semiconductor and in particular, a solar cell comprising the electrode produced therefrom.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: October 1, 2019
    Assignee: Giga Solar Materials Corp.
    Inventors: Po-Yang Shih, Yu-Shuo Yang, Pi-Yu Hsin
  • Patent number: 10418504
    Abstract: An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 17, 2019
    Assignee: The Boeing Company
    Inventor: Eric M. Rehder
  • Patent number: 10388846
    Abstract: A method for forming a densified solid object corresponding to a thermoelectric element from a mixture of uncompressed, powdered constituent materials. A powdered precursor material may be selected to cause a shrinkage of at least twenty percent in at least two mutually orthogonal linear dimensions of a densified solid object compared to corresponding dimensions of a mold cavity. In some embodiments, a precursor material is selected to produce a thermoelectric material having electrical and mechanical properties suitable for a thermoelectric module. In some embodiments, at least two thermoelectric elements are electrically connected to conductive plates to form a thermoelectric module.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: August 20, 2019
    Assignee: MATRIX INDUSTRIES, INC.
    Inventors: Andrew C. Miner, Kathryn E. Alexander
  • Patent number: 10388423
    Abstract: An electrically conductive composition comprising a binder and filler particles in which at least a portion of the particles are silver-plated. In one embodiment the composition comprises a binder such as a polyurethane, electrically conductive filler particles, silver-plated filler particles and solvent.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: August 20, 2019
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Adrianus Peter Van Veen, Corina Prent
  • Patent number: 10366799
    Abstract: A transparent conductor, a method of manufacturing the same, and a display including the same, the transparent conductor including metal nanowires; and a matrix in which the metal nanowires are embedded, wherein a capping layer is formed on surfaces of the metal nanowires, the capping layer including a sulfur-containing compound, and the capping layer has a thickness of about 0.025 or less times an average diameter of the metal nanowires.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: July 30, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Do Young Kim, Kyoung Ku Kang, Dong Myeong Shin, Dae Seob Shim, Young Hoon Kim, Ji Hyeon Yim, Yong Un Jung, Oh Hyeon Hwang
  • Patent number: 10344189
    Abstract: A conductive adhesive, such as an anisotropic conductive adhesive, comprising a population of conductive particles and a population of signal particles in an adhesive; wherein both the conductive particle population and the signal particle population have an average particle diameter of <200 ?m with a coefficient of variance of <10%; wherein the signal particles are arranged to provide an indication when they are deformed to a pre-determined height; and wherein the conductive particles are arranged such that they will not fail, e.g. crack or fracture, when deformed to a height larger than or equal to the pre-determined height at which the signal particles are arranged to provide the indication.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: July 9, 2019
    Assignee: Conpart AS
    Inventors: Keith Redford, Helge Kristiansen
  • Patent number: 10345640
    Abstract: A color filter substrate is disclosed, including a substrate, a black matrix disposed on the substrate and multiple color resist blocks separated by the black matrix and disposed on the substrate. Each color resist block is filled with a color resist material, the color resist material includes pigment molecules, including at least one photosensitive substituent. A liquid crystal display device having the same is also disclosed. Utilizing an UV irradiation step in the CF process, the pigment molecules are aligned directionally, which can increase the transmittance of the color filter substrate, the utilization rate of the backlight, and decrease the power consumption. Under the same display brightness, the thickness of the color filter substrate can be decreased; the pigment molecules aligned directionally can make an emitting light to be along a same direction to reduce the light interference between adjacent sub-pixels having different colors to greatly decrease the color shift.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: July 9, 2019
    Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd
    Inventor: Biao Pan
  • Patent number: 10337118
    Abstract: An apparatus for doping a melt of semiconductor or solar-grade material is provided. The apparatus includes a seed chuck, a seed crystal connected to the seed chuck, and a dopant container connected to the seed chuck. The seed chuck defines a first end of the apparatus, and the seed crystal defines a second end of the apparatus. The seed crystal is configured to initiate crystal growth when placed in contact with the melt. The dopant container is positioned between the first end and the second end of the apparatus, and defines a reservoir for holding dopant therein. The dopant container is configured to dispense liquid dopant into the melt when positioned proximate the melt. The dopant container and the seed crystal are connected to the seed chuck simultaneously.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: July 2, 2019
    Assignee: Corner Star Limited
    Inventors: Jihong Chen, Joseph Holzer
  • Patent number: 10336270
    Abstract: A vehicle and a manufacturing method thereof is provided in which separation of positively charged airflow from a positively charged surface of a vehicle body can be prevented. A vehicle body is insulated from a road surface, and positive static charges accumulate on the vehicle body during propulsion. The vehicle comprises a self-discharge device that is adapted to decrease a positive potential of at least any one of specific points at which positively charged airflow flowing along a vehicle surface deviates therefrom, during propulsion of the vehicle, by discharging static electricity to produce negative ions according to the positive potential of the specific point.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 2, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Koshi Yamada, Toshio Tanahashi, Hisashi Yabuki, Kazuhiko Omasa, Yoji Kanehara, Nagataka Sassa, Naohiko Saito, Narito Fujii, Tsuyoshi Ohkita, Masaaki Morimoto, Kazuhiro Maeda, Taro Yamashita, Fumiatsu Suzuki
  • Patent number: 10320097
    Abstract: An electrical connector allowing a connection between two substantially facing electrical contacts respectively pertaining to a housing and a support, and including a main body including a first end for secure connection thereof to the housing and a second end for secure connection thereof to the support, the main body being bent in at least one bending area.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: June 11, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Francois De Crecy, Bernard Diem, Christine Ferrandon, Thierry Hilt
  • Patent number: 10308856
    Abstract: A class of paste materials for thermal, and mechanical bonding, and in some cases electrical interconnection, of two solid surfaces includes particles and an organic vehicle which is partially or completely removed during processing. The paste includes hybrids of inorganic materials for meeting the thermal, electrical and mechanical bonding functionality requirements and organic materials for meeting the process, application and protection requirements. The inorganic materials include high thermal and optionally electrical conductivity materials in forms from nanoparticles to micro-powders. The organic materials may include small molecules, surfactant, oligomers, and polymers.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: June 4, 2019
    Assignee: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
    Inventors: Hao Wang, Bahgat Sammakia
  • Patent number: 10290456
    Abstract: Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: May 14, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Andrea Redaelli, Giorgio Servalli
  • Patent number: 10249718
    Abstract: A semiconductor device according to an embodiment includes a metal layer; an n-type first silicon carbide region; and a second silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt) and positioned between the metal layer and the first silicon carbide region.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: April 2, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuo Shimizu, Masayasu Miyata, Hirotaka Nishino, Yoshihiko Moriyama, Yuichiro Mitani
  • Patent number: 10236337
    Abstract: A semiconductor device comprises a first conductive layer. A second conductive layer is formed over the first conductive layer. A semiconductor component is disposed over the first conductive layer. The second conductive layer lies in a plane between a top surface of the semiconductor component and a bottom surface of the semiconductor component. A third conductive layer is formed over the semiconductor component opposite the first conductive layer. The semiconductor device includes a symmetrical structure. A first insulating layer is formed between the first conductive layer and semiconductor component. A second insulating layer is formed between the semiconductor component and third conductive layer. A height of the first insulating layer between the first conductive layer and semiconductor component is between 90% and 110% of a height of the second insulating layer between the semiconductor component and third conductive layer. The semiconductor component includes a passive device.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 19, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: JinHee Jung, HyungSang Park, SungSoo Kim
  • Patent number: 10232355
    Abstract: The present invention applies carbon nanotubes to catalyst particles, thereby providing catalyst particles which are usable in fluidized bed reactions, have high catalytic activity, and are easy to handle. The catalyst particles are carbon nanotube-coated catalyst particles which each comprise a carrier particle and a coating layer disposed on the surface of the carrier particle, wherein the carrier particles are flowable in fluidized beds and the coating layer comprises carbon nanotubes which have metal nanoparticles supported thereon and/or which have been doped with nitrogen or boron. The carbon nanotube-coated catalyst particles are flowable in fluidized bed reactions.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: March 19, 2019
    Assignee: NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
    Inventors: Reiji Noda, Ryosuke Atsumi, Kyoya Wanibuchi
  • Patent number: 10225966
    Abstract: A composite metal surface that looks metallic, but permits effective transmission of an electromagnetic field. The composite metal surface can be integrated into various electronic equipment, such as telephones, remote controls, battery doors, keyboards, mice, game controllers, cameras, laptops, inductive power supplies, and essentially any other electronic equipment. The composite metal surface can also be integrated into non-electrically conductive heat sinks, high permeability shielding, and polished metal non-electrically conductive surfaces.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: March 5, 2019
    Assignee: PHILIPS IP VENTURES B.V.
    Inventors: David W. Baarman, Benjamin C. Moes, Neil W. Kuyvenhoven, Joshua K. Schwannecke, Roy M. Taylor, Jr., Kaitlyn J. Turner, Robert Wolford, Matthew J. Norconk, Ryan D. Schamper
  • Patent number: 10208156
    Abstract: Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: February 19, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Xianping Zeng, Liexiang He, Yongjing Xu
  • Patent number: 10208211
    Abstract: Monodispersed metal nanoparticles are prepared by preparing a homogeneous metal complex solution by mixing metal salt with a complexing agent in solvent. A precipitating agent is added into the homogeneous metal complex solution to form a slurry. A homogeneous mixture of reducing agent and solvent is added to perform reducing reaction on the slurry to form metal nanoparticles in a controlled environment under gas purge. A capping agent is added to modify surface properties of metal nanoparticles. The metal nanoparticles are washed and the metal nanoparticles are recovered by phase extraction or centrifugation. The technique can be used to prepare conductive pastes with bimodal particle size distribution.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: February 19, 2019
    Assignee: CN Innovations Limited
    Inventor: Ka Ming Ng
  • Patent number: 10190198
    Abstract: A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 29, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Howard David Glicksman, Adele Amelia Pliscott
  • Patent number: 10112457
    Abstract: In a method for producing a vehicle heater (10), a main body (12) of the vehicle heater (10) is equipped with a non-intrinsically safe heat conductor layer (14), and a sensor device (16, 18, 20) for detecting exceedances of a temperature threshold value. To form the sensor device (16, 18, 20) a sensor layer (16) is sprayed on without the main body (12) being exposed to temperatures normal for baking processes. A vehicle heater (10) is equipped with a main body (12) carrying a non-intrinsically safe heat conductor layer (14), and with a sensor device (16, 18, 20) allocated to the heat conductor layer (14) and provided to detect the exceedance of a temperature threshold value. The sensor device (16, 18, 20) comprises a sprayed-on sensor layer (16) produced without the main body (12) assuming temperatures that are normal for baking processes.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 30, 2018
    Assignee: Webasto SE
    Inventors: Dietmar Bytzek, Thorsten Kabelitz, Karl Goettl, Daniel Eckert
  • Patent number: 10113079
    Abstract: The present invention relates to a conductive composition, and more particularly, to a conductive copper ink or paste composition for forming fine pattern which comprises a metal precursor and copper powder to increase the density of metal pattern formed during sintering and improve surface roughness, thereby being capable of achieving excellent electrical conductivity, adhesion strength to a substrate, and printability.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: October 30, 2018
    Assignee: DONGJIN SEMICHEM CO., LTD.
    Inventors: Seung Hyuk Lee, Ju Kyung Han, Young Mo Kim, Hyun Seok Yoo, Kyung Eun Kim
  • Patent number: 10104766
    Abstract: A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1 ?L2).
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: October 16, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 10072177
    Abstract: This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: September 11, 2018
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Michael Zanoni Burrows, Mark Steven Critzer, Jay Robert Dorfman
  • Patent number: 10040956
    Abstract: Disclosed herein are purified surfactant formulations including purified short-chain fluorosurfactant and iodide additive and a two-part coating kit having the same and a silver nanowire formulation.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: August 7, 2018
    Assignee: CAM Holding Corporation
    Inventors: Teresa Ramos, Lin Zhang, Lily Pay
  • Patent number: 10023717
    Abstract: A method of forming a salt-containing carbon-metal particle, the method including forming an aqueous mixture of acidic carbon black and one or more metals and applying energy to the aqueous mixture, whereby applying energy to the aqueous mixture results in the metal chemisorbing to the acidic carbon black. The aqueous mixture may be prepared by preparing an aqueous dispersion of the acidic carbon black and adding metal particles in a zero oxidation state to the aqueous dispersion of the acidic carbon black; or dissolving a metal in a zero oxidation state in an acidic aqueous solution, preparing an aqueous dispersion of the acidic carbon black, and adding the aqueous dispersion of the acidic carbon black to the acidic aqueous solution of the dissolved metal. The acidic carbon black may be oxidized carbon black, and the metal may be zinc, aluminum, gold, iron, lead, silver, copper, or combinations thereof.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: July 17, 2018
    Assignee: PENN COLOR, INC.
    Inventors: Ronald W. Schuck, Charles B. Rybny
  • Patent number: 10020415
    Abstract: A device and a method of forming a device. The method comprises forming an oxide material film; forming two metal electrodes on the oxide material film, the two metal electrodes laterally spaced from each other such that an electric path between the two electrodes comprises at least a portion of the oxide material film; configuring the oxide material film such that a current-voltage characteristic of the device as measured via the two metal electrodes exhibits nonlinearity and rectification.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: July 10, 2018
    Assignee: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Alwyn Rebello, Adekunle Adeyeye
  • Patent number: 10020409
    Abstract: A conductive reflective film which is formed by calcining a substrate on which a composition containing metal nanoparticles is coated, the conductive reflective film including pores which appear on the film contact surface in the substrate side having an average diameter of 100 nm or less, an average depth of 100 nm or less in terms of position of the pores, and a number density of the pores of 30 pores/?m2 or less.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: July 10, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuhiko Yamasaki, Yoshiaki Takata, Toshiharu Hayashi
  • Patent number: 10003102
    Abstract: An electrolyte additive for a lithium battery, an electrolyte including the electrolyte additive, and a lithium battery including the electrolyte additive are disclosed. The electrolyte additive for a lithium battery includes a sulfonylmethylisocyanide-based compound. The electrolyte additive including the sulfonylmethylisocyanide-based compound may form a protective layer having improved high-temperature stability on positive and negative electrodes of a lithium battery, thereby improving the safety of the lithium battery.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: June 19, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Erang Cho, Duckhyun Kim, Moonsung Kim, Jeonghye Lee, Woocheol Shin
  • Patent number: 9983448
    Abstract: A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: May 29, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Yuki Suto, Tetsu Hammura