Free Metal Containing Patents (Class 252/512)
Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum) (Class 252/514)
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Patent number: 11894189Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The internal electrode layer includes zirconium (Zr) and germanium (Ge). A ratio of a sum of contents (at %) of zirconium (Zr) and germanium (Ge), contained in the internal electrode layer, to an entirety of the internal electrode layer is 3.3 at % or more to 3.7 at % or less.Type: GrantFiled: January 5, 2022Date of Patent: February 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Joon Oh, Jeong Ryeol Kim
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Patent number: 11817398Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 ?m to 5 ?m and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.Type: GrantFiled: September 24, 2019Date of Patent: November 14, 2023Assignee: NAMICS CORPORATIONInventors: Masashi Kajita, Masahiro Kitamura, Takayuki Higuchi, Noritsuka Mizumura
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Patent number: 11804462Abstract: A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5?X) wt %, and the ceramic particles include CeO2(X) wt %, where 0.05?X?0.1.Type: GrantFiled: September 7, 2021Date of Patent: October 31, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Kunmo Chu, Junghoon Lee, Byonggwon Song
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Patent number: 11772160Abstract: To provide a fine nickel powder for an internal electrode paste of an electronic component, the nickel powder obtained by a wet method and having high crystallinity, excellent sintering characteristics, and heat-shrinking characteristics. The nickel powder is obtained by precipitating nickel by a reduction reaction in a reaction solution including at least water-soluble nickel salt, salt of metal nobler than nickel, hydrazine as a reducing agent, and alkali metal hydroxide as a pH adjusting agent and water; the reaction solution is prepared by mixing a nickel salt solution including the water-soluble nickel salt and the salt of metal nobler than nickel with a mixed reducing agent solution including hydrazine and alkali metal hydroxide; and the hydrazine is additionally added to the reaction solution after a reduction reaction initiates in the reaction solution.Type: GrantFiled: May 13, 2022Date of Patent: October 3, 2023Assignees: SUMITOMO METAL MINING CO., LTD., MURATA MANUFACTURING CO., LTD.Inventors: Junji Ishii, Shingo Murakami, Hiroyuki Tanaka, Takahiro Kamata, Toshiaki Terao, Masaya Yukinobu, Yuji Watanabe, Tsutomu Tanimitsu, Yoshiyuki Kunifusa, Haruo Nishiyama
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Patent number: 11697155Abstract: A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.Type: GrantFiled: July 19, 2019Date of Patent: July 11, 2023Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Christian Schwarzer, Wolfgang Schmitt
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Patent number: 11692241Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: GrantFiled: December 21, 2017Date of Patent: July 4, 2023Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
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Patent number: 11676743Abstract: A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.Type: GrantFiled: June 18, 2018Date of Patent: June 13, 2023Assignee: TDK Electronics AGInventors: Bettina Milke, Bernhard Ostrick
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Patent number: 11626213Abstract: A vaporizer includes an outer tube configured to receive a flow of heated gas and an inner tube disposed at least partially within the outer tube. The inner tube is spaced apart from the outer tube such that the flow of heated gas is channeled through an annular space therebetween. The vaporizer also includes a crucible disposed at least partially within the inner tube. The crucible is extendable and retractable relative to the inner tube and within the outer tube. The crucible is configured to hold a molten metal such that a surface area of the molten metal exposed to the flow of heated gas is adjustable based on the position of the crucible relative to the inner tube. A heater is configured to vaporize the molten material and the vapor mixes with the flow of heated gas.Type: GrantFiled: July 21, 2020Date of Patent: April 11, 2023Assignee: TerraPower, LLCInventors: Christopher M. Regan, Jacob Wilcox
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Patent number: 11542381Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.Type: GrantFiled: January 28, 2019Date of Patent: January 3, 2023Assignees: Mitsubishi Materials Corporation, Mitsubishi Materials Electronic Chemicals Co., Ltd.Inventors: Hiroto Akaike, Kazuhiko Yamasaki, Kensuke Kageyama, Hirokazu Tsukada
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Patent number: 11493672Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.Type: GrantFiled: February 28, 2018Date of Patent: November 8, 2022Assignee: VIAVI SOLUTIONS INC.Inventors: Jaroslaw Zieba, Kelly Janssen, Fred Thomas
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Patent number: 11414554Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).Type: GrantFiled: March 27, 2017Date of Patent: August 16, 2022Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
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Patent number: 11413685Abstract: A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 ?m or more and 50 ?m or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.Type: GrantFiled: September 19, 2018Date of Patent: August 16, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Genta Sasaki, Taku Okano, Yoshio Moteki, Yu Saito
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Patent number: 11415004Abstract: Disclosed is a superalloy gas turbine engine component including a glass coating. The glass coating is configured for resistance to hot corrosion caused by molten salts of sodium, magnesium, vanadium, and/or sulfur dioxide. The glass coating includes a mixture of two or more metal oxides, which are preferably selected from: barium oxide, silicon oxide, strontium oxide, aluminum oxide, magnesium oxide, calcium oxide, cobalt oxide, boron oxide, iron oxide, zirconium oxide, nickel oxide, and titanium oxide. The glass coating is in fully crystalline form and/or a mixture of crystalline and glass phases, and it has a coefficient of thermal expansion of from about 10 to about 18 ?m/m-° C. The glass coating has a thickness over the superalloy gas turbine engine component of about 0.5 mils to about 10 mils.Type: GrantFiled: December 9, 2020Date of Patent: August 16, 2022Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Mahdi Mohajeri, Bahram Jadidian
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Patent number: 11411476Abstract: A method of manufacturing an armature includes: a step of placing a bonding agent on bonding surfaces of the distal ends of a plurality of segment conductors; a step of placing the plurality of segment conductors on an armature core; a step of bonding the distal ends to each other; and a step of increasing a viscosity of the bonding agent placed on the distal ends, after the step of placing the bonding agent on the distal ends, and before the step of bonding the distal ends to each other.Type: GrantFiled: November 30, 2018Date of Patent: August 9, 2022Assignee: AISIN CORPORATIONInventors: Kiyotaka Koga, Tomotsugu Sugihara
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Patent number: 11360244Abstract: There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.Type: GrantFiled: February 28, 2018Date of Patent: June 14, 2022Assignee: VIAVI SOLUTIONS INC.Inventors: Jaroslaw Zieba, Kelly Janssen, Fred Thomas
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Patent number: 11359124Abstract: The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.Type: GrantFiled: May 31, 2018Date of Patent: June 14, 2022Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kenji Takenaka, Atsushi Sakamoto
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Patent number: 11358866Abstract: Provided is a fibrous carbon nanostructure that is easy to surface modify. A symmetry factor of a peak of a first derivative curve of a thermogravimetric curve obtained through thermogravimetric analysis of the fibrous carbon nanostructure in a dry air atmosphere is 3.70 or less. The first derivative curve of the thermogravimetric curve can be a temperature derivative curve of the thermogravimetric curve or a time derivative curve of the thermogravimetric curve.Type: GrantFiled: November 30, 2018Date of Patent: June 14, 2022Assignee: ZEON CORPORATIONInventor: Osamu Kawakami
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Patent number: 11328834Abstract: A method of fabricating a transparent conductor is provided. The method includes forming a nanowire dispersion layer on a substrate, forming a nanowire network layer on the substrate by drying the nanowire dispersion layer, and forming a matrix material layer on the nanowire network layer.Type: GrantFiled: January 21, 2020Date of Patent: May 10, 2022Assignee: Cambrios Film Solutions CorporationInventors: Jonathan S. Alden, Haixia Dai, Michael R. Knapp, Shuo Na, Hash Pakbaz, Florian Pschenitzka, Xina Quan, Michael A. Spaid, Adrian Winoto, Jeffrey Wolk
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Patent number: 11286355Abstract: There is provided a composite article comprising a composite material comprising 60 wt % to 98 wt % of a hydrolytically stable thermoplastic resin; and 1 wt % to 11 wt % long conductive metal fibers coated with a polymer selected from at least one of aromatic polycarbonates, aromatic polycarbonate alloys, aromatic polyethers, maleated polyolefins, semi-aromatic nylons, stabilized nylons, and combinations thereof.Type: GrantFiled: September 20, 2018Date of Patent: March 29, 2022Assignee: 3M Innovative Properties CompanyInventors: Benjamin A. Johnson, Terry R. Hobbs, Patrick J. Kilps, Patrick R. McKellips, Ambuj Sharma, Jeffrey M. Smits
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Patent number: 11253921Abstract: An object of the present invention to provide copper fine particles which can be sintered at a lower temperature than that of the conventional copper fine particles without causing a cost increase, a decrease in productivity, a method for producing the copper fine particles, and a sintered body, and the present invention provides copper fine particles having a coating film containing cuprous oxide and copper carbonate on the surface thereof.Type: GrantFiled: February 5, 2018Date of Patent: February 22, 2022Assignee: Taiyo Nippon Sanso CorporationInventors: Yuji Sakuramoto, Hiroshi Igarashi, Takayuki Fujimoto
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Patent number: 11228080Abstract: The invention relates to a method of manufacturing a dielectric filter. The method comprises the steps of: (a) preparing a ceramic substrate; (b) applying a conductive paste on the ceramic substrate, wherein the conductive paste comprises, (i) 100 parts by weight of a conductive powder, (ii) 0.1 to 10.0 parts by weight of a glass frit comprising silicon oxide, boron oxide, aluminum oxide and an alkaline metal oxide, and (iii) an organic vehicle; and (c) firing the applied conductive paste.Type: GrantFiled: November 5, 2019Date of Patent: January 18, 2022Assignee: DUPONT ELECTRONICS, INC.Inventor: Yusuke Tachibana
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Patent number: 11227719Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.Type: GrantFiled: March 1, 2018Date of Patent: January 18, 2022Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L Renner, John Bultitude, Allen Hill
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Patent number: 11222762Abstract: Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.Type: GrantFiled: April 4, 2019Date of Patent: January 11, 2022Assignee: Micron Technology, Inc.Inventors: Andrea Redaelli, Giorgio Servalli
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Patent number: 11185991Abstract: The present application relates to a machining assembly comprising an effector intended to be mounted on a robot with multiple degrees of freedom, in which invention the mounting of the motor spindle relative to the intermediate supports and frame of the effector allows a numerically controlled movement along three axes X, Y, Z of a trihedron, the effector bearing on the piece to be machined or on the surrounding tools by means of a ball joint at the foot end of the effector. Since the effector bears on the piece to be machined or on the surrounding tools it is possible to create local stiffness and to obtain the precision required to guarantee the quality of the machining process.Type: GrantFiled: May 29, 2017Date of Patent: November 30, 2021Assignee: LE CRENEAU INDUSTRIELInventors: Alain Auffret, Cédric Bastien
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Patent number: 11183315Abstract: A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.Type: GrantFiled: July 18, 2017Date of Patent: November 23, 2021Assignee: SHOEI CHEMICAL INC.Inventors: Hayato Tateno, Junichi Ikuno, Hiroshi Mashima
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Patent number: 11136257Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.Type: GrantFiled: August 22, 2018Date of Patent: October 5, 2021Assignee: KOA CorporationInventors: Natsuki Iguchi, Yuya Iguchi, Koichi Urano
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Patent number: 11117120Abstract: A catalyst for synthesizing a carbon nanotube includes a support containing a metal, and an active metal impregnated on the support. The active metal includes cobalt and manganese. A surface molar ratio of the active metal relative to the metal of the support is 40% or less of a bulk molar ratio of the active metal relative to the metal of the support. A carbon nanotube having high purity and low resistance is obtained from the catalyst.Type: GrantFiled: October 30, 2018Date of Patent: September 14, 2021Assignees: SK Innovation Co., Ltd., SK Global Chemical Co., Ltd.Inventors: Hye Ryun Seo, Yong Tak Kwon
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Patent number: 11096318Abstract: In accordance with the present invention, there is provided a noise suppression sheet that is capable of absorbing noise at a wide frequency range of from 10 MHz to 1 GHz. The present invention relates to a ferrite laminate formed by laminating a conductive layer comprising a conductive filler and a resin and a magnetic layer comprising ferrite; the conductive layer has a surface electrical resistance of of 100 to 5000 ?/?; the ferrite is partitioned into small parts; and a real part of a magnetic permeability of the ferrite as measured at 10 MHz is 130 to 480, and an imaginary part of of the magnetic permeability of the ferrite as measured at 10 MHz is 30 to 440.Type: GrantFiled: July 11, 2016Date of Patent: August 17, 2021Assignee: TODA KOGYO CORP.Inventors: Yoji Okano, Akihiro Yoshida, Kazumi Yamamoto, Yuji Omote
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Patent number: 11081683Abstract: A method for predicting the likelihood of coagulation of active material particles contained in a slurry for electrode preparation includes measuring rheological properties before and after the slurry is subjected to a shear. The estimation method enables a prediction of filter clogging with a slurry, and thus makes it possible to estimate the likelihood of filter clogging with a slurry without passing the slurry directly through the filter, thereby improving the efficiency of a battery manufacturing process.Type: GrantFiled: July 2, 2018Date of Patent: August 3, 2021Inventors: Jeongyong Lee, Ki Yeon Jo, Hyejin Han, Sangeun Kim, Myunghan Lee, Changkwon Chung
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Patent number: 11070190Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.Type: GrantFiled: March 27, 2018Date of Patent: July 20, 2021Assignee: Statek CorporationInventors: Yue Fang, Thomas Pham
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Patent number: 11009729Abstract: A flexible display device including a flexible substrate and a conductive pattern. The flexible substrate includes a bending part in which a bending occurs. At least a portion of the conductive pattern is disposed on the bending part and the conductive pattern includes grains. Each grain has a grain size of about 10 nm to about 100 nm.Type: GrantFiled: October 10, 2018Date of Patent: May 18, 2021Assignee: Samsung Display Co., Ltd.Inventors: Kyungseop Kim, Sangyoun Han, Sangkyu Choi, Jae-wook Kang, Sungkyun Park, Yongwoo Park, Jungha Son
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Patent number: 10976082Abstract: A heating and/or cooling device having one or more thermoelectric threads. The thermoelectric thread includes a plurality of individual thermoelectric elements, each thermoelectric element having a first side and a second side. A set of first side electrodes connects at least some of the thermoelectric elements at the first side, and a set of second side electrodes connects at least some of the thermoelectric elements at the second side. An electrically insulative covering at least partially surrounds the plurality of individual thermoelectric elements. The electrically insulative covering is configured to be woven into or otherwise integrated with a fabric.Type: GrantFiled: March 7, 2019Date of Patent: April 13, 2021Assignee: The Regents of the University of MichiganInventors: Sridhar Lakshmanan, Sean Ahlquist, Michael Putty
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Patent number: 10920337Abstract: Methods for forming single crystal silicon ingots with improved resistivity control and, in particular, methods that involve gallium or indium doping are disclosed. In some embodiments, the ingots are characterized by a relatively high resistivity.Type: GrantFiled: December 27, 2017Date of Patent: February 16, 2021Assignee: GlobalWafers Co., Ltd.Inventors: Richard J. Phillips, Parthiv Daggolu, Eric Gitlin, Robert Standley, HyungMin Lee, Nan Zhang, Jae-Woo Ryu, Soubir Basak
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Patent number: 10829838Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.Type: GrantFiled: July 12, 2017Date of Patent: November 10, 2020Assignee: M. TECHNIQUE CO., LTD.Inventors: Masaki Maekawa, Daisuke Honda, Masakazu Enomura, Kazuya Araki
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Patent number: 10822529Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 45 to 100 ?m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.Type: GrantFiled: December 27, 2017Date of Patent: November 3, 2020Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.Inventors: Chih-Ming Lin, Chien-Hui Lee
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Patent number: 10796815Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.Type: GrantFiled: June 28, 2017Date of Patent: October 6, 2020Assignee: KYOCERA CorporationInventor: Kazuki Imagawa
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Patent number: 10763018Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.Type: GrantFiled: March 13, 2018Date of Patent: September 1, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Noritaka Yoshida, Kenichi Matsushima
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Patent number: 10749102Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.Type: GrantFiled: August 18, 2017Date of Patent: August 18, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koji Nagahara, Muneyuki Daidai, Masahiro Saito, Atsushi Sugimasa, Hiroki Kitayama, Shigehisa Yago
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Patent number: 10717896Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).Type: GrantFiled: June 20, 2017Date of Patent: July 21, 2020Assignee: SHOWA DENKO K.K.Inventors: Yoichiro Sakaguchi, Kentarou Takahashi, Keisuke Mameda
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Patent number: 10703571Abstract: Disclosed is an industrial belt that can be used in, for example, conveying or forming engineered wood composites or other industrial products. The industrial belt has a seamable base belt with a coating that includes a polymer, an anti-contaminant, and a conductive anti-static component.Type: GrantFiled: January 29, 2019Date of Patent: July 7, 2020Assignee: Albany International Corp.Inventors: Mark Levine, Thomas Israel, Heather Weber, Chad VanHandel, Douglas England
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Patent number: 10658116Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.Type: GrantFiled: February 1, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Patent number: 10647830Abstract: A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 ?m and crushed alumina having an average particle size of 0.1-5 ?m as a thermally conductive filler, contains 15-55 mass % of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass % of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.Type: GrantFiled: April 26, 2017Date of Patent: May 12, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Takanori Ito
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Patent number: 10636541Abstract: A conductive paste including a conductive powder, a glass frit, and an organic vehicle, wherein the conductive powder includes copper and/or nickel as a main component(s), and the glass frit is substantially free of Pb, Cd, and Bi, comprises 40 to 65% by mass of BaO, 15 to 23% by mass of B2O3, 2 to 12% by mass of Al2O3, 4 to 8% by mass of SiO2, 0 to 5% by mass of ZnO, 0.5 to 7% by mass of TiO2, 3 to 7.5% by mass of CaO, and comprises any one or more of MnO2, CuO, and CoO in the ranges of 0 to 7% by mass of MnO2, 0 to 16% by mass of CuO, and 0 to 5% by mass of CoO, in terms of oxide.Type: GrantFiled: September 26, 2016Date of Patent: April 28, 2020Assignee: SHOEI CHEMICAL INC.Inventors: Kousuke Nishimura, Naoto Shindo, Nobuo Nishioka
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Patent number: 10629322Abstract: An electrically conductive oxide sintered compact according to one embodiment of the present invention includes a crystal phase that has a perovskite oxide crystal structure represented by the composition formula: REaCobCucNidOx where RE is a rare-earth element; a+b+c+d=1; and 1.25?x?1.75, wherein the values of a, b, c and d respectively satisfy the following conditions: 0.474?a?0.512; 0.050?b?0.350; 0?c?0.250; and 0.050?d?0.350.Type: GrantFiled: December 7, 2015Date of Patent: April 21, 2020Assignee: NGK SPARK PLUG CO., LTD.Inventors: Hisashi Kozuka, Yasuyuki Okimura, Kazushige Ohbayashi
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Patent number: 10629323Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.Type: GrantFiled: August 28, 2015Date of Patent: April 21, 2020Assignee: DUPONT ELECTRONICS, INC.Inventors: Minfang Mu, Dan Feng, Jose Manuel Rodriguez-Parada
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Patent number: 10611931Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.Type: GrantFiled: August 28, 2015Date of Patent: April 7, 2020Assignee: DUPONT ELECTRONICS, INC.Inventors: Minfang Mu, Dan Feng, Jose M. Rodriguez-Parada
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Patent number: 10602619Abstract: An anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 ?m.Type: GrantFiled: March 27, 2017Date of Patent: March 24, 2020Assignee: DEXERIALS CORPORATIONInventors: Daisuke Sato, Akifumi Higuchi
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Patent number: 10590542Abstract: The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.Type: GrantFiled: December 4, 2014Date of Patent: March 17, 2020Assignee: IONES CO., LTD.Inventors: Mun Ki Lee, Byung Ki Kim, Jae Hyuk Park, Dae Gean Kim, Myoung No Lee
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Patent number: 10510496Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.Type: GrantFiled: October 12, 2018Date of Patent: December 17, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masato Kimura, Yasuhiro Nishisaka
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Patent number: 10510908Abstract: A solar cell panel includes a first solar cell and a second solar cell; and a plurality of leads connecting the first solar cell and the second solar cell. Each of the first solar cell and the second solar cell includes: a first electrode including a plurality of finger lines in a first direction and a plurality of first bus bars in a second direction crossing the first direction; and a second electrode including a plurality of second bus bars in the second direction. The plurality of leads have a diameter or width of 100 to 500 ?m, and include 6 or more leads arranged at one surface side of the first or second solar cell. The plurality of leads are connected to the plurality of first bus bars of the first solar cell and the plurality of second bus bars of the second solar cell by a solder layer, respectively.Type: GrantFiled: March 21, 2017Date of Patent: December 17, 2019Assignee: LG ELECTRONICS INC.Inventors: Jinhyung Lee, Jungmin Ha, Sangwook Park