Organic Compounds Of Nonmetals Other Than C, H, And O Patents (Class 252/75)
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Patent number: 9458369Abstract: Antifreeze concentrate with corrosion protection which is suitable for coolants and heat transfer fluids and comprises freezing point-lowering liquids and also particular sulfur-comprising organic compounds, inorganic molybdate salts, inorganic phosphate salts and aliphatic, cycloaliphatic or aromatic monocarboxylic, dicarboxylic or tricarboxylic acids as corrosion inhibitors. Aqueous coolant compositions which are suitable for cooling an internal combustion engine whose cooling apparatus has been made of aluminum using a soldering process using a fluoroaluminate flux can be obtained therefrom.Type: GrantFiled: March 30, 2015Date of Patent: October 4, 2016Assignee: BASF SEInventors: Harald Dietl, Uwe Nitzschke, Gerhard Weiss
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Patent number: 9388328Abstract: A lapping slurry and method of making the lapping slurry are provided. The lapping slurry comprises abrasive grains dispersed in a carrier. The carrier comprises water, ethylene glycol and between about 0.5 wt % to about 60 wt % surfactant. Abrasive particles are positively charged when dispersed in ethylene glycol having a pH in a range of from 5 to 9, as evidenced by zeta potentials.Type: GrantFiled: August 23, 2013Date of Patent: July 12, 2016Assignee: Diamond Innovations, Inc.Inventor: Shuang Ji
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Patent number: 9382467Abstract: A corrosion inhibitor composition and method of inhibiting corrosion on a surface in an oil or gas application is disclosed and claimed. The corrosion inhibitor includes at least one fatty acid; at least one alkanolamine; at least one alkylamine; and at least one organic sulfonic acid. The method of inhibiting corrosion includes on a surface in an oil or gas application comprises contacting an effective dosage of the corrosion inhibitor with the surface.Type: GrantFiled: November 21, 2013Date of Patent: July 5, 2016Assignee: Nalco CompanyInventors: G. Richard Meyer, Keith Allen Monk
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Patent number: 9358218Abstract: The present invention relates to use of a tall oil fatty acid which is modified by saponification in enhancing rumen fermentation and/or lowering rumen methane production.Type: GrantFiled: May 14, 2013Date of Patent: June 7, 2016Assignee: Hankkija OyInventors: Juhani Vuorenmaa, Hannele Kettunen
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Patent number: 9249371Abstract: A lubricating composition comprising a major amount of base oil and a minor amount of an additive package, wherein the additive package comprises (A) a friction modifier component selected from: (a) one or more a reaction products of an alcohol with a compound of the formula IV: wherein R is a linear or branched, saturated, unsaturated, or partially saturated hydrocarbyl group having about 8 to about 22 carbon atoms; and (b) one or more compounds of the Formulae II-III: wherein R is as defined above and R2 and R3 are independently selected from hydrogen, C1-C18hydrocarbyl groups, and C1-C18hydrocarbyl groups containing one or more heteroatoms; and wherein R is as defined above; and X is an alkali metal, alkaline earth metal or ammonium cation and n is the valence of cation X; and (B) at least one dispersant.Type: GrantFiled: December 21, 2012Date of Patent: February 2, 2016Assignee: Afton Chemical CorporationInventors: John T. Loper, Jeremy P. Styer
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Patent number: 9228127Abstract: The present invention refers to a vapor space anticorrosive composition comprising corrosion inhibitors, surfactants and possibly thickeners, wherein one surfactant is selected from alkylamine ethoxylates, and being useful as an engine run-in composition and as a coolant.Type: GrantFiled: April 19, 2013Date of Patent: January 5, 2016Assignee: BASF SEInventors: Harald Dietl, Uwe Nitzschke
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Patent number: 9090751Abstract: Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.Type: GrantFiled: July 21, 2010Date of Patent: July 28, 2015Assignee: Ticona LLCInventors: Yuji Saga, Narumi Une
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Patent number: 9080093Abstract: Antifreeze concentrate with corrosion protection which is suitable for coolants and heat transfer fluids and comprises freezing point-lowering liquids and also particular sulfur-comprising organic compounds, inorganic molybdate salts, inorganic phosphate salts and aliphatic, cycloaliphatic or aromatic monocarboxylic, dicarboxylic or tricarboxylic acids as corrosion inhibitors. Aqueous coolant compositions which are suitable for cooling an internal combustion engine whose cooling apparatus has been made of aluminum using a soldering process using a fluoroaluminate flux can be obtained therefrom.Type: GrantFiled: February 10, 2014Date of Patent: July 14, 2015Assignee: BASF SEInventors: Harald Dietl, Uwe Nitzschke, Gerhard Weiss
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Patent number: 9052724Abstract: An integrated circuit chip having micro-channels formed in multiple regions of the integrated circuit chip and a method of cooling the integrated circuit chip. The method includes for any region of the multiple regions, allowing a coolant to flow through micro-channels of the region only when a temperature of the region exceed a first specified temperature and blocking the coolant from flowing through the micro-channels of the region when a temperature of the region is below a second specified temperature.Type: GrantFiled: August 7, 2012Date of Patent: June 9, 2015Assignee: International Business Machines CorporationInventors: Kerry Bernstein, Kenneth J. Goodnow, Clarence R. Ogilvie
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Patent number: 9051515Abstract: An engine coolant additive for use in combination with a major amount of a coolant liquid is described. The engine coolant additive has an alkaline pH, and includes a salt of a monobasic carboxylic acid compound, a salt of an azole compound, and from about 25 weight percent to about 35 weight percent water. The additive may optionally include a transition metal compound such as molybdenum-containing compounds to assist in corrosion inhibition.Type: GrantFiled: March 15, 2013Date of Patent: June 9, 2015Assignee: Ashland Licensing and Intellectual Property LLC.Inventor: David E. Turcotte
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Publication number: 20150137027Abstract: An ionic liquid can disperse graphene at a high concentration. The ionic liquid can be represented by general formula (1): in which R1 and R5 may be the same or different and each independently represents a substituted or unsubstituted C1-7 linear or branched alkyl group; R2 is represented by formula (2): in which R6 and R7 may be the same or different and each independently represents a C1-4 linear or branched alkylene group, and m represents an integer of 1-5; R3 and R4 may be the same or different and each independently represent a hydrogen atom, substituted or unsubstituted C1-4 linear or branched alkyl group; X? represents a counter ion; and n represents 0-30.Type: ApplicationFiled: May 14, 2013Publication date: May 21, 2015Inventors: Takuzo Aida, Chiyoung Park, Saisuwan Ravi, Michio Matsumoto
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Publication number: 20150137026Abstract: The invention relates to boron nitride agglomerates, comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles are connected to one another by means of an inorganic binding phase comprising at least one nitride and/or oxynitride. The invention also relates to a method for producing such boron nitride agglomerates, wherein boron nitride starting powder in the form of boron nitride primary particles is mixed with binding-phase raw materials, processed into granules or moulded bodies and these are then subjected to a temperature treatment at a temperature of at least 1000° C. in a nitriding atmosphere, and the obtained granules or moulded bodies are comminuted and/or fractionated if necessary. The boron nitride agglomerates according to the invention are suitable as a filler for polymers to be used for producing polymer-boron nitride composite materials.Type: ApplicationFiled: March 19, 2013Publication date: May 21, 2015Inventors: Martin Engler, Krishna B. Uibel
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Publication number: 20150122422Abstract: A plasma processing apparatus includes a thermally conductive silicone sheet between a mounting table and a focus ring. The thermally conductive silicone sheet has 100 parts by weight to 2000 parts by weight of thermally conductive particles with respect to 100 parts by weight of polyorganosiloxane, and the sheet has a thermal conductivity of 0.2 W/m·K to 5 W/m·K. Further, when the sheet has a shape of 38 mm in length, 38 mm in width, and 3 mm in thickness and is interposed between filter papers each having a diameter of 70 mm and kept under a load of 1 kg at 70° C. for 1 week, a bleed-out amount of a liquid component is 30 mg or less.Type: ApplicationFiled: November 4, 2014Publication date: May 7, 2015Inventors: Yusuke Hayasaka, Katsuyuki Suzumura
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Publication number: 20150125646Abstract: Thermally conductive polymer materials having thermally conductive charges and polymer network compositions characterized by the fact that the network is able to reorganize by exchange reactions that allow it to relax stresses and/or flow while maintaining network connectivity. As a result, the polymer network is characterized by its finite viscosity at elevated temperatures in spite of the crosslinking. These characteristics provide such materials remarkable properties for use as thermal interface and notably improved adhesion, self-repairing, in addition to greater processing flexibility, better mechanical properties, improved chemical resistance.Type: ApplicationFiled: November 5, 2013Publication date: May 7, 2015Inventors: Francois Tournilhac, Ludwik Leibler, Jacques Lewiner, Ugo Lafont, Sybrand Van Der Zwaag, Henk Van Zeijl
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Publication number: 20150118505Abstract: A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body and the radiator when the heat conductive sheet is disposed therebetween. The method includes: a step (A) of dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; a step (C) of slicing the formed molded block into a sheet; and a step (D) of pressing the sliced surface of the obtained sheet.Type: ApplicationFiled: July 5, 2013Publication date: April 30, 2015Inventor: Keisuke Aramaki
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Patent number: 9005471Abstract: A heat transfer fluid comprising a carrier fluid and a nano-additive is provided. The heat transfer fluid is manufactured by dispersing the nano-additive in the carrier fluid. The nano-additive comprises nano-particles having a porous structure that provides dispersion stability of the nano-additive in the heat transfer fluid. The nano-additive structure has an aspect ratio of about 1.0 to about 10,000, a porosity of about 40% to about 85%, a density of about 0.4 g/cc to about 3.0 g/cc, an average pore diameter of about 0.1 nanometer to about 100 nanometers, and a specific surface area of about 1 m2/g to about 4000 m2/g. The nano-additive increases the heat transfer efficiency of the heat transfer fluid and also reduces the moisture content of the heat transfer fluid.Type: GrantFiled: January 19, 2011Date of Patent: April 14, 2015Assignee: Dynalene Inc.Inventor: Satish Chandra Mohapatra
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Publication number: 20150097138Abstract: A thermally conductive silicone composition comprising: (A) an organopolysiloxane that is liquid at 25° C. and preferably has a viscosity of from 100 to 1,000,000 mPa·s; (B) an aluminum oxide powder having an average particle size of not more than 10 ?m and preferably from 1 to 8 ?m; and (C) an aluminum hydroxide powder having an average particle size of greater than 10 ?m and preferably not greater than 50 ?m, has low thixotropy, low specific gravity, and high thermal conductivity.Type: ApplicationFiled: March 8, 2013Publication date: April 9, 2015Inventors: Tomoko Kato, Kazumi Nakayoshi
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Publication number: 20150090422Abstract: A heat storage material composition contains sodium acetate, water, and an organic compound comprising a hydrophobic group and a hydrophilic group. A weight ratio R (sodium acetate/water) of the sodium acetate to the water is 57/43 or less. A concentration Ws of the sodium acetate in three components of the sodium acetate, the water, and the organic compound comprising a hydrophobic group and a hydrophilic group is 52% by weight or more. A concentration Wa of the organic compound comprising a hydrophobic group and a hydrophilic group in the three components is 1% by weight or more.Type: ApplicationFiled: September 25, 2014Publication date: April 2, 2015Inventors: MOTOHIRO SUZUKI, IZUMI HIRASAWA
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Publication number: 20150076395Abstract: The present invention relates to a light emitting diode fixture assembly, having at least one component made out of thermally conductive thermoplastic which is comprised of a thermally conductive thermoplastic composition which is comprised of at least one thermoplastic polymer and at least one thermally conductive filler. The light emitting diode fixture assembly is comprised of (1) at least one light emitting diode, (2) a lens covering a portion of the light emitting diode, (3) a back plate to which the light emitting diode is affixed, (4) the housing for the light emitting diode and the base plate, and (5) electrical connectors which are in electrical communication with the light emitting diode and an electrical supply source with a enclosing cup/sleeve.Type: ApplicationFiled: November 14, 2014Publication date: March 19, 2015Applicant: OVATION POLYMER TECHNOLOGY AND ENGINEERED MATERIALS, INC.Inventors: Nishant Negandhi, Asis Banerjie
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Publication number: 20150079401Abstract: A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1): (In the formula (1), R1 represents a C4-20 hydrocarbyl group; R2 represents a C1-20 saturated hydrocarbylene group; R3 represents a C2-3 saturated hydrocarbylene group; R4 represents a C1-8 hydrocarbylene group; k represents an integer of 0 to 20; l represents an integer of 0 to 20; m represents an integer of 0 to 20; and n represents an integer of 1 or 2, wherein where a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other; k —COR2O— groups, l —R3O— groups, and m —COR4COO— groups may be in any order; and where n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.Type: ApplicationFiled: March 28, 2013Publication date: March 19, 2015Inventor: Hideki Ohno
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Publication number: 20150069290Abstract: Disclosed herein are thermally conductive blended polycarbonate compositions with improved thermal conductivity and mechanical performance properties. The resulting compositions, comprising one or more polycarbonate polymers and one or more thermally conductive fillers, can be used in the manufacture of articles requiring thermally conductive materials with improved mechanical properties such as electronic devices. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.Type: ApplicationFiled: September 10, 2013Publication date: March 12, 2015Inventors: Mingcheng Guo, Yaqin Zhang, Yun Zheng
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Publication number: 20150070454Abstract: An intermediate transfer member containing a thermally conductive nanofiller dispersed in a polymer base, a method of forming the intermediate transfer member, and a method of printing an image to a substrate using the intermediate transfer member.Type: ApplicationFiled: September 9, 2013Publication date: March 12, 2015Applicant: XEROX CORPORATIONInventors: Carolyn MOORLAG, Barkev KEOSHKERIAN, Yu QI, Brynn Mary DOOLEY
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CHEMICAL MECHANICAL POLISHING COMPOSITION FOR POLISHING A SAPPHIRE SURFACE AND METHODS OF USING SAME
Publication number: 20150053642Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.Type: ApplicationFiled: August 26, 2013Publication date: February 26, 2015Applicant: NITTA HAAS INCORPORATEDInventors: Allen S. Bulick, Hideaki Nishizawa, Kazuki Moriyama, Koichi Yoshida, Shunji Ezawa, Selvanathan Arumugam -
Publication number: 20150048272Abstract: According to an implementation of the present subject matter, a method for producing stable nanofluids is described. The method includes mixing of a base fluid with a dispersant and a metal oxide powder to form a primary mixture. The base fluid is a heat transfer fluid and the metal oxide powder includes particles of size greater than 100 nm. The method further includes grinding the primary mixture to obtain a concentrated nanoparticle suspension where the dispersant is added to the primary mixture during the grinding after every pre-determined time period.Type: ApplicationFiled: December 8, 2011Publication date: February 19, 2015Applicant: TATA CONSULTANCY SERVICES LIMITEDInventors: Beena Rai, Abhinandan Chiney, Vivek Ganvir, Pradip
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Publication number: 20150034473Abstract: This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.Type: ApplicationFiled: July 14, 2014Publication date: February 5, 2015Inventors: Vincenzo ARANCIO, Jay Robert DORFMAN
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Publication number: 20150030835Abstract: The present invention relates to an anisotropic heat conductive composition including flake graphite particles and a resin composition for the particles to be dispersed therein. When the particles have a basal plane, a maximum diameter a in a direction of the basal plane, and a thickness c perpendicular to the basal plane, a/c is 30 or more on average, and a content of the particles is more than 40 mass % and 90 mass % or less. Since the composition includes the particles having a particular shape, when it is formed into a sheet, an anisotropic heat conductive path can be efficiently created therein. Thus, the present invention can provide a molded product in sheet form, suited to have therein a heat conductive path capable of dispersing heat from a high temperature region to a low temperature region.Type: ApplicationFiled: November 12, 2012Publication date: January 29, 2015Applicant: PANASONIC CORPORATIONInventors: Atsushi Tanaka, Naomi Nishiki, Kazuhiro Nishikawa, Hidetoshi Kitaura, Kimiaki Nakaya, Katsufumi Shimanaka, Akiyoshi Azechi
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Publication number: 20150014727Abstract: A silicone-grafted core-shell particle is described wherein the silicone-grafted core-shell particle comprises a core of an inorganic particle and a shell of a grafted poly(dimethylsiloxane) polymer formed from a bi-terminated poly(dimethylsiloxane) having reactive groups at each terminal end. The silicone-grafted core-shell particles may be dispersed in a polysiloxane polymer matrix and employed as an LED encapsulant.Type: ApplicationFiled: January 15, 2013Publication date: January 15, 2015Applicant: OSRAM SYLVANIA INC.Inventors: Maxim N. Tchoul, Alan L. Lenef, David W. Johnston
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Publication number: 20150014577Abstract: Disclosed are thermally conductive composites that include a polymer matrix functionalized with a carbon-containing species covalently coupled with the polymer matrix. Also disclosed are methods that generally include functionalizing a carbon-containing species and incorporating the functionalized carbon-containing species into the polymer, such that the carbon-containing species are covalently bonded to the polymer matrix via a coupling agent.Type: ApplicationFiled: September 23, 2014Publication date: January 15, 2015Inventors: Sumana Roy Chowdhury, Padma Priya Sudharshana, Srinivasan Duraiswamy
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Publication number: 20150008361Abstract: A putty-like heat transfer material of the present invention includes heat conductive particles dispersed in an organopolysiloxane. The organopolysiloxane is a silicone sol produced by partially crosslinking a base polymer (a) with a crosslinking component (b). The base polymer (a) includes an organopolysiloxane that contains an average of two or more alkenyl groups each bound to a silicon atom located at a terminal of a molecular chain in a molecule. The crosslinking component (b) includes an organopolysiloxane that contains an average of two or more hydrogen atoms each bound to a silicon atom in a molecule, and the partial crosslinking is carried out at such a ratio that the amount of the crosslinking component (b) is less than 1 mol with respect to 1 mol of the alkenyl groups bound to silicon atoms contained in the component (a).Type: ApplicationFiled: February 28, 2013Publication date: January 8, 2015Inventor: Masakazu Hattori
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Publication number: 20150010759Abstract: The present invention provides a heat dissipating coating composition in a liquid or paste form for application to a heat generating article, comprising an infrared absorbing binder resin (A), infrared absorbing inorganic particles (B), and an organic solvent, having such proportions of the component (A) and the component (B) that the component (A) is 10 to 70 vol % and the component (B) is 90 to 30 vol % based on the total of both components being 100 vol %, and satisfying conditions 1, 2, and 3 specified herein, and also provides a heat dissipating coating film obtained by applying the heat dissipating coating composition to a heat dissipating article and then thermally curing the composition.Type: ApplicationFiled: March 2, 2013Publication date: January 8, 2015Inventors: Eiji Iwamura, Masaki Kobayashi, Yasutaka Morozumi, Naoya Takahashi
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Publication number: 20150001440Abstract: A moldable mass contains graphite and a phase change material (PCM). The moldable mass further contains a binder and microcapsules having the PCM. A process produces a molding from the moldable mass, and the molding is used to produce various products such as cooling elements, battery temperature control elements, cooling elements for vehicle cabins, electronic components, and motors.Type: ApplicationFiled: September 15, 2014Publication date: January 1, 2015Inventors: DIETER KOMPALIK, SEBASTIAN GOEPFERT
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Publication number: 20150001439Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: ApplicationFiled: May 11, 2012Publication date: January 1, 2015Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Publication number: 20150000887Abstract: A heat conductivity improving agent which can provide high heat conductivity to a resin. The heat conductivity improving agent comprises a magnesium hydroxide particle having a thickness of 10 nm to 0.2 ?m and an aspect ratio (long diameter/thickness) measured by a SEM method of not less than 10.Type: ApplicationFiled: January 18, 2013Publication date: January 1, 2015Inventors: Hitoshi Manabe, Daisuke Kudo, Kohei Oohori, Shigeo Miyata
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Publication number: 20140374649Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.Type: ApplicationFiled: December 20, 2013Publication date: December 25, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Kuo Hsun CHEN, Meng Chun Ko, Yi An Sha, Hsiang Yun Yang
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Publication number: 20140374079Abstract: Materials that readily adhere to and conform to various surfaces can be desirable for a number of applications. In heat transfer and thermal management applications, for example, conformable materials can be used in establishing a thermal interface between a heat source and a heat sink. There are limited materials that provide good thermal conductivity values while maintaining capabilities to readily adhere and conform to a surface. Compositions including a conformable and adhesive solid can include a reaction product formed by heating a mixture containing a plurality of metal nanoparticles, one or more amines, and one or more carboxylic acids. The compositions can further include one or more additives dispersed in the conformable and adhesive solid.Type: ApplicationFiled: June 16, 2014Publication date: December 25, 2014Inventors: Alfred A. ZINN, Jerome Chang, Randall Mark Stoltenberg
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Publication number: 20140366817Abstract: The invention relates to an engine coolant composition, and a method of increasing the operational life of a coolant composition in an engine, wherein an isononanoic acid is incorporated into the generally glycol based coolant fluid in place of nitrous acid or its salt to reduce pitting corrosion on iron containing surfaces.Type: ApplicationFiled: June 12, 2013Publication date: December 18, 2014Inventors: David E. Turcotte, Ladislaus Meszaros, David F. Embaugh, Gefei Wu
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Publication number: 20140356613Abstract: A carbon nanotube studded carbon fiber tow and matrix prepreg includes a body comprising a tow of surface fibers and interior bulk fibers. The surface fibers are studded with carbon nanotubes and the carbon fibers are infiltrated with a matrix material.Type: ApplicationFiled: May 31, 2013Publication date: December 4, 2014Applicants: Materials Sciences Corporation, The University of Kentucky Research FoundationInventors: Matthew Collins Weisenberger, John Davis Craddock, Richard Foedinger
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Publication number: 20140353543Abstract: Disclosed herein are methods and compositions of blended polyamide compositions with improved thermal conductivity. The resulting blended polymer compositions, comprising one or more polyamide polymers, one or more thermally conductive fillers, and a laser direct structuring additive, wherein the blended polymer composition has improved thermal conductivity.Type: ApplicationFiled: June 4, 2014Publication date: December 4, 2014Applicant: SABIC Global Technologies B.V.Inventors: Tong Wu, Mingcheng Guo, Jiwen Wang, Yaqin Zhang, Yuxian An
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Publication number: 20140353544Abstract: Disclosed herein are thermally conductive blended polycarbonate compositions with improved flame retardant properties. The resulting compositions, comprising a polycarbonate polymer, a phosphorus-containing flame retardant, a metal hydroxide, optionally an anti-dripping agent, and optionally a silicone-containing char-forming agent, can be used in the manufacture of articles requiring thermally conductive materials with improved flame retardant properties such as electronic devices. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.Type: ApplicationFiled: June 4, 2014Publication date: December 4, 2014Inventors: Mingcheng Guo, Yaqin Zhang, Yuxian An, Qingya Shen
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Patent number: 8900476Abstract: The invention relates to a heat-transporting fluid and to the use thereof. The heat-transporting fluid of the invention is formed of an aqueous colloidal sol including water and up to 58.8 wt %, relative to the total fluid weight, in a-Al2O3 particles, the thickness of which is the smallest dimension and less than or equal to 30 nm 90% to 95% of said a-Al2O3 particles have a size less than or equal to 210 nm, among which 50% have a size less than or equal to 160 nm. The invention is of use in the field of cooling, in particular nuclear reactor backup cooling.Type: GrantFiled: November 30, 2010Date of Patent: December 2, 2014Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Olivier Poncelet, Lionel Bonneau, Daniel Getto, Francois Tardif
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Publication number: 20140349089Abstract: The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.Type: ApplicationFiled: October 26, 2012Publication date: November 27, 2014Inventors: Daisuke Ueyama, Masanobu Sogame, Chisato Saito, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20140339461Abstract: The present disclosure provides a high heat radiation composite material including a hybrid filler comprising expanded graphite filled with expandable polymeric beads, and a fabrication method thereof. In the method, a dispersion solution is prepared by dispersing expandable polymeric beads in ethanol. Expanded graphite is immersed in the dispersion solution, and heat-treated to remove ethanol, thereby producing the hybrid filler. The hybrid filler is dispersed into the matrix polymer via an extrusion/injection process, thereby producing the composite material.Type: ApplicationFiled: August 1, 2014Publication date: November 20, 2014Inventors: Kyong Hwa Song, Han Saem Lee, Jin Woo Kwak, Byung Sam Choi
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RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number: 20140341242Abstract: According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 ?m or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 ?m is less than 5%. Here, d95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%.Type: ApplicationFiled: May 28, 2012Publication date: November 20, 2014Applicant: SUMITOMO BAKELITE CO., LTD.Inventors: Ryuichi Murayama, Yasuo Shimobe, Naoya Kanamori -
Publication number: 20140339780Abstract: In an embodiment is a seal including an elastomer; and boron nitride nanoparticles disposed in the elastomer, wherein the seal is thermally conductive and electrically insulating. In another embodiment, is a method of making a seal, the method includes compounding an elastomer with boron nitride nanoparticles to provide a composition; and molding the composition into a shape.Type: ApplicationFiled: July 31, 2014Publication date: November 20, 2014Applicant: BAKER HUGHES INCORPORATEDInventors: Oleg A. Mazyar, Ashley D. Leonard, Joshua C. Falkner
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Publication number: 20140332711Abstract: In at least one embodiment, a compressed gaseous fuel storage pellet is provided comprising a gas adsorbent material and a thermally conductive material extending substantially an entire dimension of the pellet and having a thermal conductivity of at least 75 W/mK. The pellet may include at least two layers of gas adsorbent material spaced apart along a compression direction of the pellet and a substantially continuous layer of the thermally conductive material disposed between the at least two layers of gas adsorbent material. The pellet may further include thermally conductive projections which intersect the layer(s) of thermally conductive material.Type: ApplicationFiled: May 13, 2013Publication date: November 13, 2014Applicant: Ford Global Technologies, LLCInventors: Rachel Blaser, Michael J. Veenstra, Chunchuan Xu
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Publication number: 20140329092Abstract: Heat-transfer fluids and lubricating fluids comprising deaggregated diamond nanoparticles are described herein. Also described are composites comprising deaggregated diamond nanoparticles, and methods of making such composites. Method of using deaggregated diamond nanoparticles, for example, to improve the properties of materials such as thermal conductivity and lubricity are also disclosed.Type: ApplicationFiled: April 8, 2014Publication date: November 6, 2014Applicant: Vanderbilt UniversityInventors: Blake T. Branson, Charles M. Lukehart, Jim L. Davidson
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Patent number: 8865016Abstract: Biodegradable, frost proof heat-transfer fluid, use thereof in near-surface geothermal installations, and a concentrate: subject matter of the present invention is the use of a triazole-free composition which as well as water comprises a) 9.2% to 49.5% by weight of at least one C2 to C3 alkylene glycol, C2 to C3 polyalkylene glycol or glycerol, b) 0.1% to 4% by weight of at least one corrosion inhibitor, with the provisos that c) the composition is readily degradable biologically in accordance with test method OECD 301 A, d) the composition has an anaerobic biodegradability of at least 75% in accordance with test method OECD 311, e) the corrosion inhibitor or all corrosion inhibitors used are readily degradable biologically in accordance with OECD 301 A (for water-soluble corrosion inhibitors) or OECD 301 B (for corrosion inhibitors of low water-solubility), in near-surface geothermal installations as a heat-transfer fluid.Type: GrantFiled: February 18, 2011Date of Patent: October 21, 2014Assignee: Clariant Finance (BVI) LimitedInventors: Michael Waidelich, Achim Stankowiak, Johann Schuster, Martina Unterhaslberger, Sabine Dronia
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Publication number: 20140299811Abstract: Disclosed are methods for forming carbon-based fillers as may be utilized in forming highly thermal conductive nanocomposite materials. Formation methods include treatment of an expanded graphite with an alcohol/water mixture followed by further exfoliation of the graphite to form extremely thin carbon nanosheets that are on the order of between about 2 and about 10 nanometers in thickness. Disclosed carbon nanosheets can be functionalized and/or can be incorporated in nanocomposites with extremely high thermal conductivities. Disclosed methods and materials can prove highly valuable in many technological applications including, for instance, in formation of heat management materials for protective clothing and as may be useful in space exploration or in others that require efficient yet light-weight and flexible thermal management solutions.Type: ApplicationFiled: June 23, 2014Publication date: October 9, 2014Inventors: Ya-Ping Sun, John W. Connell, Lucia Monica Veca
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Publication number: 20140299812Abstract: This invention relates to an energy saving fluid composition used in both cooling and heating heat transfer systems. The energy saving fluid composition reduces the energy consumption and increases the heat transfer performance in heat transfer systems operated with water.Type: ApplicationFiled: October 30, 2012Publication date: October 9, 2014Applicant: ISTANBUL KURUMSAL PAZARLAMA DANISMANLIK KIMYA SANAYI VE TICARET ANONIM SIRKETIInventor: Umit Ozdoruk
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Publication number: 20140290996Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.Type: ApplicationFiled: July 12, 2012Publication date: October 2, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sung Bae Moon, Hae Yeon Kim, Jae Man Park, Jong Heum Yoon, In Hee Cho