Abstract: The present invention relates to a method, according to claim 1, for separating at least one solid body layer (1), particularly a solid body disk, from a donor substrate (2).

Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.

Abstract: Subject matter disclosed herein may relate to devices and techniques for cooling three-dimensional integrated circuit (IC) devices. In particular embodiments, an IC device may comprise a three-dimensional structure having a first surface adapted to face a mounting surface and a second surface opposite the first surface, and having one or more cavities to extend at least below the second surface.

Abstract: A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.

Abstract: There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting between a melted material and a peripheral member can be suppressed even when a fuse portion is melted by an excessive current. An electric-power conversion apparatus includes an electric power semiconductor device, an electrode wiring member, a case, a fuse portion formed in the electrode wiring member, a fuse resin member disposed between the fuse portion and the case, and a sealing resin member that seals the electric power semiconductor device, the electrode wiring member, the fuse portion, and the fuse resin member in the case.

Abstract: Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes NAND memory cells and a first bonding layer including first bonding contacts. The semiconductor device also includes a second semiconductor structure including DRAM cells and a second bonding layer including second bonding contacts. The semiconductor device also includes a third semiconductor structure including a programmable logic device and a third bonding layer including third bonding contacts. The semiconductor device further includes a first bonding interface between the first and third bonding layers, and a second bonding interface between the second and third bonding layers. The first bonding contacts are in contact with a first set of the third bonding contacts at the first bonding interface. The second bonding contacts are in contact with a second set of the third bonding contacts at the second bonding interface.

Abstract: A package-on-package (PoP) semiconductor package includes an upper package and a lower package. The lower package includes a first semiconductor device in a first area, a second semiconductor device in a second area, and a command-and-address vertical interconnection, a data input-output vertical interconnection, and a memory management vertical interconnection adjacent to the first area.

Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

Abstract: An electronic component includes one or more circuits having electrical connections coupled therewith. The electrical connections include a lead frame as well as electrical wires coupling the circuit or circuits to respective portions of the lead frame. The electrical wires may be formed as one piece with the respective portion of the lead frame without joints therebetween, e.g., by 3D printing.

Abstract: According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and a second connecting terminal not overlapping the first or second bumps in plan view. At least one inspection wire includes a connecting conductor between itself and the second connecting terminal, and at least one fuse portion, a narrower width part of the inspection wire in plan view.

Abstract: A pin comprising a conical body having a central axis and a cross-sectional area that decreases with distance from a first end to a second end. A coating applied to the conical body has a melting temperature that is lower than a melting temperature of the conical body. The coating melting temperature is lower than a friction temperature and the body melting temperature is higher than the friction temperature. The friction temperature is achieved at an interface of the pin and a component when the pin is forcibly positioned into the component to repair a defect. The coating comprises a material having a first tensile strength value of a bond formed between the conical body and the component in response to softening and rehardening of the coating.

Abstract: The instant disclosure provides an integrated circuit device including a transmission line which includes a first ground line and a signal line. The first ground line includes a first pad, a second pad and a first bonding wire that is a bond wire structure connecting the first pad and the second pad. The first signal line includes a third pad, a fourth pad and a second bonding wire that is a bond wire structure connecting the third pad and the fourth pad.

Abstract: A semiconductor device, overvoltage detection structure is described that includes a current path including a Zener diode connected in series with a fuse. The Zener diode is configured to conduct a current in response to an overvoltage condition at a semiconductor device and the fuse is configured to permanently break the current path of the overvoltage detection structure in response to the Zener diode conducting the current.

Abstract: A semiconductor module includes a circuit board and a power semiconductor chip embedded in the circuit board. The power semiconductor chip has a first load electrode. The semiconductor module further includes a power terminal connector electrically connected to the first load electrode. The embedded power semiconductor chip is positioned laterally within a footprint zone of the power terminal connector.

Abstract: A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting the semiconductor die to the carrier substrate, an insulating material coated on the bonding wires, and a molding compound covering the top surface and encapsulating the semiconductor die, the plurality of bonding wires, and the insulating material.

Abstract: Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

Abstract: A bypass avoiding only abnormal cells or abnormal electronic components in an electronic appliance having a plurality of battery cells or electronic components is formed to decrease resistance while keeping functionality. An insulating substrate 2; a heat-generating resistor 3 arranged on the insulating substrate 2; a first and a second electrodes 4, 5 arranged adjacently to each other on the insulating substrate 2; a third electrode 6 arranged adjacently to the first electrode 4 and electrically connected to the heat-generating resistor; and a first meltable conductor 8 arranged between the first and third electrodes 4, 6 to constitute a current path capable of being blown by a heat generated by the heat-generating resistor 3 are provided. The first meltable conductor 8 melted by heat from the heat-generating resistor 3 gathers on the first and second electrodes 4, 5 to short-circuit them.

Abstract: A bypass avoiding only abnormal cells or abnormal electronic components in an electronic appliance having a plurality of battery cells or electronic components is formed to decrease resistance while keeping functionality.

Abstract: A bypass avoiding only abnormal cells or abnormal electronic components in an electronic appliance having a plurality of battery cells or electronic components is formed to decrease resistance while keeping functionality.

Abstract: A fuse includes first, second, and third terminals disposed on a substrate. Respective ends of one or more primary conductors of the fuse are connected to one of the first and the second terminals. The primary conductors have a first conductivity and are configured to open when a primary current between the first and the second terminals exceeds a first predetermined threshold. One or more secondary conductors have an end connected to the third terminal. The secondary conductors are configured to ignite when a secondary current through the secondary conductors exceeds a second predetermined threshold. When ignited, the secondary conductors open the primary conductors to thereby stop the primary current.

Abstract: A three dimensional (3D) multiplexer structure may include a first two dimensional (2D) inductor capacitor (LC) filter layer. The first 2D LC filter layer may include a first 2D spiral inductor and a first capacitor(s). The 3D multiplexer structure may also include a second 2D LC filter layer. The second 2D LC filter layer may include a second 2D spiral inductor and a second capacitor(s) stacked directly on and communicably coupled to the first 2D LC filter.

Abstract: An e-Fuse structure is provided on a surface of an insulator layer of a semiconductor-on-insulator substrate (SOI). The e-Fuse structure includes a first metal semiconductor alloy structure of a first thickness, a second metal semiconductor alloy structure of the first thickness, and a metal semiconductor alloy fuse link is located laterally between and connected to the first and second metal semiconductor alloy structures. The metal semiconductor alloy fuse link has a second thickness that is less than the first thickness.

Abstract: A redistribution film for IC package is disclosed, which comprises a top redistribution layer configured on top of a bottom redistribution layer. The top redistribution layer is fabricated following PCB design rule, and the bottom redistribution layer is fabricated following IC design rule. Further, the interface between the top redistribution layer and the bottom redistribution layer is optionally made roughed to increase bonding forces therebetween.

Abstract: Methods of fabricating a microelectronic device comprising forming a microelectronic substrate having a plurality microelectronic device attachment bond pads and at least one interconnection bond pad formed in and/or on an active surface thereof, attaching a microelectronic device to the plurality of microelectronic device attachment bond pads, forming a mold chase having a mold body and at least one projection extending from the mold body, wherein the at least one projection includes at least one sidewall and a contact surface, contacting the mold chase projection contact surface to a respective microelectronic substrate interconnection bond pad, disposing a mold material between the microelectronic substrate and the mold chase, and removing the mold chase to form at least one interconnection via extending from a top surface of the mold material to a respective microelectronic substrate interconnection bond pad.

Abstract: Embodiments of mechanisms for forming a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate. The usage of the interconnect substrate enables cost reduction because it is cheaper to make than an interposer with through silicon vias (TSVs). The interconnect substrate also enables dies with different sizes of bump structures to be packaged in the same die package.

Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Abstract: Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead top side; forming a lower interior conductive layer directly on the lead top side; forming an interior insulation layer directly on the lower interior conductive layer; forming an upper interior conductive layer directly on the interior insulation layer; and mounting an integrated circuit over the upper interior conductive layer.

Abstract: A differential port and a method of arranging the differential port are described. The method includes arranging a first electrode to receive a drive signal, and arranging a second electrode to receive a guard signal, the guard signal having a different phase than the drive signal and the first electrode and the second electrode having a gap therebetween. The method also includes disposing a signal line from the first electrode to drive a radio frequency (RF) device.

Abstract: A semiconductor device of the present invention includes an n-channel first thin film transistor and a p-channel second thin film transistor on one and the same substrate. The first thin film transistor has a first semiconductor layer (27), and the second thin film transistor has a second semiconductor layer (22). The first semiconductor layer (27) and the second semiconductor layer (22) are formed from one and the same film. Each of the first semiconductor layer (27) and the second semiconductor layer (22) has a slope portion (27e, 22e) positioned in the periphery and a main portion (27m, 22m) which is a portion excluding the slope portion. A p-type impurity is introduced into only a part of the slope portion (27e) of the first semiconductor layer with higher density than the main portion (27m) of the first semiconductor layer, the main portion (22m) of the second semiconductor layer, and the slope portion (22e) of the second semiconductor layer.

Abstract: A method of forming multiple conductive structures in a semiconductor device includes forming spacers adjacent side surfaces of a mask, where the mask and the spacers are formed on a conductive layer. The method also includes etching at least one trench in a portion of the conductive layer not covered by the spacers or the mask. The method may further include depositing a material over the semiconductor device, removing the mask and etching the conductive layer to remove portions of the conductive layer not covered by the spacers or the material, where remaining portions of the conductive layer form the conductive structures.

Abstract: A method of programming a memory cell includes causing a current to flow through a first silicide-containing portion and a second silicide-containing portion of the memory cell; and causing, by the current, an electron-migration effect to form an extended silicide-containing portion within the gap such that the memory cell is converted from a first state into a second state. The memory cell includes a silicon-containing line continuously extending between a first region and a second region; the first silicide-containing portion over the silicon-containing line and adjacent to the first region; and the second silicide-containing portion over the silicon-containing line and adjacent to the second region. The first silicide-containing portion and the second silicide-containing portion are separated by a gap if the memory cell is at the first state. The extended silicide-containing portion extends from the second silicide-containing portion towards the first silicide-containing portion.

Abstract: A fuse, a method of making the fuse and a circuit containing the fuse. The fuse includes an electrically conductive and conformal liner on sidewalls and the bottom of a trench; a copper layer on the conformal liner, a first thickness of the copper layer over the bottom of the trench in a lower portion of the trench greater than a second thickness of the copper layer over the sidewalls of the trench in an abutting upper portion of the trench; and a dielectric material on the copper layer in the trench, the dielectric material filling remaining space in the upper portion of said trench.

Abstract: A guard ring for a through via, and a method of manufacture thereof, is provided. The guard ring comprises one or more rings around a through via, wherein the rings may be, for example, circular, rectangular, octagon, elliptical, square, or the like. The guard ring may be formed from a contact through an inter-layer dielectric layer and interconnect structures (e.g., vias and lines) extending through the inter-metal dielectric layers. The guard ring may contact a well formed in the substrate.

Abstract: Provided is a semiconductor package which may include a package substrate which includes a power supply region and an interconnection region around the power supply region, a plurality of ground terminals and a plurality of power terminals, which are disposed in the power supply region with a dielectric interposed between the ground terminals and the power terminals, wherein the ground terminals and the power terminals extend from a top surface of the package substrate to a bottom surface of the package substrate, and at least one semiconductor chip mounted on the package substrate, the semiconductor chip includes a plurality of ground pads which are commonly connected to a ground terminal of the ground terminals and a plurality of power pads which are commonly connected to a power terminal of the power terminals.

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: An integrated circuit connection comprises a substrate, first and second transmission lines, a die, and a conductive ribbon. The first transmission line has a first end and is arranged on the substrate. The die is spaced from the first end. The die has a first surface, which is arranged on the substrate, and a second surface, which is opposite to the first surface and which has the second transmission line arranged thereon. The second transmission line has a second end. The conductive ribbon electrically couples the first and the second ends.

Abstract: A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.

Abstract: A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines.

Abstract: An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board.

Abstract: A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Abstract: In order to improve the reliability of a semiconductor device having a fuse formed by a Damascene technique, a barrier insulating film and an inter-layer insulating film are deposited over a fourth-layer wiring and a fuse. The barrier insulating film is an insulating film for preventing the diffusion of Cu and composed of a SiCN film deposited by plasma CVD like the underlying barrier insulating film. The thickness of the barrier insulating film covering the fuse is larger than the thickness of the underlying barrier insulating film so as to improve the moisture resistance of the fuse.

Abstract: An embodiment is a fuse structure. In accordance with an embodiment, a fuse structure comprises an anode, a cathode, a fuse link interposed between the anode and the cathode, and cathode connectors coupled to the cathode. The cathode connectors are each equivalent to or larger than about two times a minimum feature size of a contact that couples to an active device.

Abstract: An electronic device manufacturing process includes depositing a bottom electrode layer. Then an electronic device is fabricated on the bottom electrode layer. Patterning of the bottom electrode layer is performed after fabricating the electronic device and in a separate process from patterning a top electrode. A first dielectric layer is then deposited on the electronic device and the bottom electrode layer followed by a top electrode layer. The top electrode is then patterned in a separate process from the bottom electrode. Separately patterning the top and bottom electrodes improves yields by reducing voids in the dielectric material between electronic devices. One electronic device the manufacturing process is well-suited for is magnetic tunnel junctions (MTJs).

Abstract: A portion-to-be-melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the meltdown portion of the fuse. This makes it possible to facilitate meltdown of the fuse. The meltdown portion of the fuse in a folded form, rather than in a single here a fuse composed of a straight-line form, is more successful in readily concentrating the heat generated in the fuse under current supply into the meltdown portion, and in further facilitating the meltdown of the fuse.

Abstract: A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.

Abstract: A semiconductor device includes a first pad row and a second pad row, a first ground potential supply electrode which is connected to a first interconnect provided near the first pad row, and a second ground potential supply electrode which is connected to a second interconnect provided near the second pad row. The first pad row includes a first pad connected to the first circuit within the chip and connected to the first interconnect via a first bonding wire, and includes a second pad connected to a second circuit within the chip and connected to the second interconnect via a second bonding wire crossing over the second pad row.

Abstract: A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.

Abstract: A method for forming a semiconductor structure includes forming an isolation region in a semiconductor substrate; forming a conductive layer over the isolation region; forming a first dielectric layer over the conductive layer; forming a plurality of conductive vias extending through the first dielectric layer to the conductive layer and electrically contacting the conductive layer; forming a second dielectric layer over the first dielectric layer; and forming a conductive ground plane in the second dielectric layer. Each of the plurality of conductive vias is in electrical contact with the conductive ground plane, and the conductive ground plane includes an opening, wherein the opening is located directly over the conductive layer. At least one interconnect layer may be formed over the second dielectric layer and may include a transmission line which transmits a signal having a frequency of at least 30 gigahertz.