Abstract: A semiconductor memory device includes word lines, normal bit lines, a redundant bit line, and normal memory cells for storing data and each of which is coupled to one of the word lines and to one of the normal bit lines. The device also includes redundant memory cells each of which is coupled to one of the word lines and to the redundant bit line. The device further includes a coincidence circuit that receives a first address signal, indicating an address of one of the normal bit lines, and a second address signal, indicating an address of one of the normal bit lines to which a defective memory cell is coupled, and which selects the redundant bit line when the first address signal coincides with the second address signal.

Abstract: The semiconductor memory device includes normal word lines, spare word lines and bit lines. Space between the spare word lines is made wider than the space between the normal word lines. Further, the space between the normal word line and the spare word line is also made wider. Thus possibility of contact defect caused by a foreign matter in the steps of manufacturing can be reduced. Further, the size of the storage node of a spare memory cell is made larger than that of the storage node of a normal memory cell. Thus capacitance of the spare memory cell can be increased. Thus possibility of defects in spare memory cells is reduced ensuring repairment.

Abstract: A gate insulating film is formed on the principal surface of a semiconductor substrate. A silicon film is formed on the gate insulating film. Impurities are doped in the silicon film. In this case, impurities are doped into the silicon film to make a region of the silicon film in the memory cell area have a first impurity concentration and to make a region of the silicon film in the logic circuit area have a second impurity concentration lower than the first impurity concentration. The doped silicon film is patterned.

Abstract: A semiconductor device has a plurality of basic units formed on a semiconductor substrate, each including a memory element and a logic element and having the same or bilateral symmetry structure. Each basic unit has a DRAM cell formed in a first active region, serially connected transistors of a logic element formed in a second active region and having second and third gate electrodes and source/drain regions with silicide layers, first and second signal lines connected to the source/drain regions of the transistor pair, a third signal line connected to the second gate electrode, and a conductive connection terminal formed under the storage electrode of a DRAM capacitor for connecting the storage electrode and third gate electrode. A semiconductor device is provided which has a plurality of basic units each including a memory cell and a logic cell formed on the same semiconductor substrate, the device being easy to manufacture and capable of high integration.

Abstract: A semiconductor memory configuration includes bit lines in a bit-line plane, a further plane different from the bit-line plane, word lines, and a memory cell area adjacent the bit-line plane, some of the bit lines having a twist running alongside others of the bit lines being untwisted, pairs of the some of the bit lines with a twist each respectively defining a twist bit-line pair, the twist bit-line pair having contacts for crossing one bit line of the twist bit-line pair over another bit line of the twist bit-line pair and over the memory-cell area through the further plane, the untwisted others of the bit lines having dummy contacts leading from the bit-line plane to the further plane. The dummy contacts lead to the word-line plane to give the word lines a homogeneous environment. The further plane can be a word-line plane including the word lines. The bit lines in the twist-free area can be approximately from 150 nm to 250 nm wide, preferably 200 nm.

Abstract: An SRAM cell and method for fabricating the same including first and second access transistors, first and second drive transistors, and first and second load resistors. A first terminal of the first access transistor, a gate terminal of the second drive transistor, and a first load resistor terminal are connected to one another to form a first cell node terminal. A first terminal of the second access transistor, a gate terminal of the first drive transistor, and a second load resistor terminal are connected to one another to form a second cell node terminal. The SRAM cell includes a gate electrode of each of the first and second drive transistors arranged over a semiconductor substrate in a first direction, and a gate electrode of each of the first and second access transistors arranged in the first direction overlapped with portions of the gate electrodes of the first and second drive transistors.

Abstract: A structure of dynamic random access memory with slanted active regions, comprising: a substrate; a plurality of slanted active regions formed on the substrate, wherein each of the plurality of slanted active regions has a bit line contact; a plurality of word line regions formed on the substrate to control transistors of the dynamic random access memory; a plurality of bit line regions formed on the substrate, wherein each of the bit line regions cross the bit line contact hole so that the bit line contact hole is completely covered by the bit line regions; a plurality of capacitors formed between the plurality of bit line regions.

Abstract: A semiconductor memory device includes bit lines which transfer data of memory cells, a plurality of first sense amplifier circuits connected to odd-number lines of the bit lines, a plurality of second sense amplifier circuits connected to even-number lines of the bit lines, and a clamp-voltage generation circuit which supplies a first clamp voltage to the first sense amplifier circuits, and supplies a second clamp voltage to the second sense amplifier circuits, whereby during test operation, the odd-number lines are clamped to the first clamp voltage, and the even-number lines are clamped to the second clamp voltage.

Abstract: A semiconductor device having a compact folded bitline architecture. Bitlines for a memory cell array arranged into bitline pairs constituting, when in use, a selected bitline and its complement. The selected bitline and its complement are adjacent in upper and lower levels, and exchange levels at selected breakpoints in the lower level bitline. The breakpoints are determined so as to establish a diagonally-oriented pattern of “twist regions” across the array. Adjacent bitline pairs exchange levels in alternating twist regions. The upper bitlines are positioned at a predetermined angle, relative to the lower bitlines, in selected intervals between the twist regions. The predetermined angle introduces an offset between the upper bitlines and their associated complement lower bitlines as the upper bitlines enter twist regions to exchange levels.

Abstract: The semiconductor memory device of the present invention comprises: memory cells arranged in a matrix; word lines extending in a row direction; bit line pairs extending in a column direction; exchange blocks for exchanging the bit lines of the different neighboring bit line pairs.

Abstract: An embodiment of the present invention discloses a memory device having an array with digit lines arranged in complementary pairs, the array comprising; a substantially planar layer having trenches therein; a first level of digit lines residing at least partially in the trenches; a second level of digit lines residing on the surface of the layer, the second level extending in generally parallel relation to the digit lines in the first level. The first level of digit lines are in alternating positions with the second level of digit lines and the alternating positions comprise a repeating pattern of a first complementary pair of digit lines at the first level adjacent a second complementary pair of digit lines at the second level.

Abstract: A semiconductor device adopting an interlayer contact structure between upper and lower conductive layers and a method of manufacturing the semiconductor device adopting the structure are provided. The lower conductive layer includes a first conductive layer and a first silicide layer stacked together. The upper conductive layer includes a second conductive layer doped with impurities and a second silicide layer stacked together. In the interlayer contact structure, the first and second conductive layers are in direct contact with each other. This decreases the contact resistance between the two conductive layers and improves the electrical properties of the device.

Abstract: A pair of semiconductor memory cells comprises active regions having rectangular shapes, arranged in uniform intervals in plan view, said active regions constituting channel regions and source/drain regions of switching transistors; word lines arranged so as to be perpendicular to the active regions; and an extraction electrode connected to a bit line through bit a line contact formed in connection to the active regions constituting the pair of switching transistors.

Abstract: A memory cell, in accordance with the invention, includes a trench formed in a substrate, and an active area formed in the substrate below a gate and extending to the trench. The active area includes diffusion regions for forming a transistor for accessing a storage node in the trench, the transistor being activated by the gate. The gate defines a first axis wherein a portion of the active area extends transversely therefrom, the portion of the active area extending to the trench. The trench has a side closest to the portion of the active area, the side of the trench being angularly disposed relative to the gate such that a distance between the gate and the side of the trench is greater than a minimum feature size.

Abstract: Integrated circuit memory devices having highly integrated SOI memory cells therein include an SOI substrate having a semiconductor active layer therein. A first trench isolation region is also provided. The first trench isolation region extends into and partitions the semiconductor active layer into first and second active regions. These first and second active regions are preferably electrically isolated from each other by the first trench isolation region. First and second access transistors are provided in the first and second active regions, respectively, and a first electrically insulating layer is provided on the SOI substrate. A first bit line is also provided at a first level. The first bit line is electrically connected to a first source/drain region of the first access transistor by a first bit line contact. This first bit line contact extends through the first electrically insulating layer and contacts the first source/drain region of the first access transistor.

Abstract: A novel vertical poly load device in 4T SRAM and a method for fabricating the same are disclosed. The poly load structure is a vertical device formed on a buried contact. The poly load vertical device is constructed by forming a hollow in a planarized dielectric layer with a high temperature oxide layer on the walls of the hollow and with lightly doped n-type polysilicon in the hollow. The poly load is connected to the respective drain of the driver transistor through the buried contact and to the gate of the respective gate of the other driver transistor through a connecting line. The resistance of the poly load will increase, as the voltage of the buried contact becomes low thereby reducing the standby current.

Abstract: A semiconductor structure and method of making the same are disclosed which includes a DRAM cell which has a transistor which includes a gate. The gate includes an individual segment of gate conductor such as polysilicon on a thin dielectric material. The transistor further has a single crystal semiconductor substrate having a source/drain region. An active conducting wordline is deposited on top of and electrically contacting a segment gate conductor, the wordline being a conductive material having a top and sidewalls. Electrically insulating material completely surrounds the active wordline except where the active wordline contacts the segment gate conductor. The insulating material surrounding the active wordline includes silicon nitride overlying the top and surrounding a portion of the sidewalls thereof, and silicon dioxide surrounds the remainder of the side walls of the active wordline.

Abstract: A DRAM cell arrangement and method for manufacturing same, wherein a storage capacitor is connected via a first source/drain zone of a vertical selection transistor and a bit line. Since the storage capacitor and the bit line are arranged substantially above a substrate, the bit line can be manufactured of materials having high electrical conductivity, and materials having a high dielectric constant can be utilized for the storage capacitor. At least the first source/drain zone and a channel zone are parts of a projection-like semiconductor structure that is laterally limited by at least two sidewalls. A respective word line can be arranged at the two sidewalls. An element that prevents the drive of the selection transistor by this word line is arranged between the channel zone and one of the word lines.

Abstract: An object is to provide a structure of a semiconductor device which allows higher degree of integration both in vertical and horizontal directions, and to provide manufacturing method therefor. The semiconductor device includes source.drain electrodes connected to n.sup.- and n.sup.+ source.drain regions of an MISFET and has a function as a part of a bit line, and a gate electrode connected to a first interconnection as a word line. Electrodes are insulated from each other by a sidewall insulating film, silicon oxide film or a silicon nitride film provided inbetween. Since the word line and the bit line do not cross in the same plane, the difference in level in the vertical direction can be reduced.

Abstract: There is a bi-level bit line architecture. Specifically, there is a DRAM memory cell and cell array that allows for six square feature area (6F.sup.2) cell sizes and avoids the signal to noise problems. Uniquely, the digit lines are designed to lie on top of each other like a double decker overpass road. Additionally, this design allows each digit line to be routed on both conductor layers, for equal lengths of the array, to provide balanced impedance. Now noise will appear as a common mode noise on both lines, and not as differential mode noise that would degrade the sensing operation. Furthermore, digit to digit coupling is nearly eliminated because of the twist design.

Abstract: An integrated memory circuit comprises a plurality of memory cells and access transistors; and a digit line comprising conductive tabs extending from at least one side of a conductive digit line. The use of one digit line allows for a reduction in internal noise and coupling between digit line pairs. The use of one digit line also allows for a reduction in array size.

Abstract: A dynamic random access memory (DRAM) cell and associated array are disclosed. The DRAM cell (300) includes a storage capacitor (304) and a pass transistor (302). The pass transistor (302) includes a source region (322), drain region (320) and channel region (324). A top gate (318) is disposed over the channel region (324) and a bottom gate (310) is disposed below the channel region (324). The top gate (318) and bottom gate (310) are commonly driven to provide greater control of the pass transistor (302) operation, including an off state with reduced source-to-drain leakage. The DRAM array (400) includes memory cells (414) having pass transistors (500) with double-gate structures. Memory cells (414) within the same row are commonly coupled to a top word line and bottom word line. The resistance of the top and bottom word lines is reduced by a word line strap layer (600). The DRAM array (400) further includes a strapping area that is void of memory cells.

Abstract: An SRAM of the present invention has a first load resistor connected between a first power source terminal and a first node, a second load resistor connected between the first power source terminal and a second node, a first drive transistor having a source-drain path connected between the first node and a second power source terminal, and a gate connected to the second node, a second drive transistor having a source-drain path connected between the second node and the second power source terminal, and a gate connected to the first node, a first switching transistor having a source-drain path connected between the first node and a first bit line, and a gate connected to a word line, and a second switching transistor having a source-drain path connected between the first node and a second bit line, and a gate connected to the word line.

Abstract: A circuit element comprising a semiconductor substrate. A well region of a first conductivity type is formed in a surface of the substrate. A dielectric film is formed on the substrate. A gate conductor of the first conductivity type is formed on the dielectric film over the well region of the substrate. The gate conductor is formed of a polycrystalline silicon film. The gate conductor has an impurity concentration substantially lower than a standard impurity concentration for the gate conductor of an MOS device. A polycrystalline silicon edge spacer is formed on each side of the gate conductor. A first pair of first conductivity type impurity diffusion regions are formed adjacent to the polycrystalline silicon edge spacers. The polycrystalline silicon film and edge spacers lie on a portion of the substrate between the first pair of first conductivity type impurity diffusion regions.

Abstract: A decoder circuit formed on an integrated circuit substrate including at least one short channel depletion transistor having a low resistance path formed between the source and the drain regions. The low resistance path is provided by an implant into the channel region that forms a depletion channel wherein the channel region has a length less than a length of a channel region of transistors in the decoder circuit that handle input/output voltage levels for the decoder circuit.

Abstract: A process sequence, cell structure, and cell layout for an eight square folded bit line dynamic random access memory (DRAM) cell allows a transfer device channel length of two lithographic features. The process sequence may allow elimination of deep trench collar or cap deposition, or reduction of word line to word line capacitance. The cell prepared by the method allows a two lithographic feature transfer device channel length in an eight square folded bit line DRAM cell. The method uses conventional processing techniques with no spacer defined features and uses conventional structures. The cell requires only one additional mask (GPC) and minimal additional processing. The process sequence starts with deep trench (DT) processing, followed by deposition of SiO.sub.2, planarization and pad strip. Then gate SiO.sub.2, polysilicon, and pad are deposited. The structure is etched using a shallow trench isolation mask and filled with SiO.sub.2.

Abstract: An integrated memory circuit comprises a plurality of memory cells and access transistors; and a digit line comprising conductive tabs extending from at least one side of a conductive digit line. The use of one digit line allows for a reduction in internal noise and coupling between digit line pairs. The use of one digit line also allows for a reduction in array size.

Abstract: There is a bi-level bit line architecture. Specifically, there is a DRAM memory cell and cell array that allows for 6F**2 cell sizes and avoids the signal to noise problems. Uniquely, the digit lines are designed to lie on top of each other like a double decker overpass road. Additionally, this design allows each digit line to be routed on both conductor layers, for equal lengths of the array, to provide balanced impedance. Now noise will appear as a common mode noise on both lines, and not as differential mode noise that would degrade the sensing operation. Furthermore, digit to digit coupling is nearly eliminated because of the twist design.

Abstract: A dynamic random access memory array having an array of memory cells. Individual cells of the array are addressable by a plurality of word lines and a plurality of bit lines. The memory cells are disposed in active areas of the array. The array of memory cells includes a first strip of memory cells. The dynamic random access memory array includes a lower metal layer and an upper metal layer disposed above the lower metal layer. The dynamic random access memory array further includes a dielectric layer disposed between the lower metal layer and the upper metal layer. There is further included a first bit line of the plurality of bit lines which includes a lower metal first bit line portion implemented in the lower metal layer. The lower metal first bit line portion is coupled to a first plurality of memory cells of the first strip of memory cells. The first bit line also includes an upper metal first bit line portion implemented in the upper metal layer.

Abstract: N type impurity regions are formed at the surface of N well similarly to a DRAM memory cell. Electrode layers corresponding to storage nodes and conductive layers 9a and 9b corresponding to cell plates are formed for predetermined impurity regions among the impurity regions. Conductive layers are isolated from each other electrically in a DC fashion and connected to electrode nodes VA and VB, respectively. The sets of capacitors formed by a predetermined number of memory cell capacitors connected in parallel through the N well are connected in series. As a result, a capacitor with excellent area efficiency which utilizes the characteristics of the memory cell capacitor can be realized.

Abstract: A semiconductor memory device has two complementary pairs of bit lines coupled to the same memory cells. According to a first aspect of the invention, the bit lines in one complementary pair cross over, so that each bit line in the first pair runs adjacent to one bit line in the second pair for one part of its length, and adjacent to the other bit line in the second pair for another part of its length. Coupling noise is thereby neutralized. Data-inverting circuitry is provided to compensate for the inversion of data that results from the cross-over of the bit lines. According to a second aspect of the invention, the two complementary pairs of bit lines are placed in separate interconnecting layers, to reduce coupling noise by reducing the capacitive coupling between the bit lines.

Abstract: A plurality of bit line contacts provided on one bit line BL are arranged on every other one of spaces each provided between every adjacent two of word lines WL and a plurality of bit line contacts provided on an adjacent bit line BL are arranged on every other one of spaces each provided between every adjacent two of word lines WL which is different from the space in which a corresponding one of the bit line contacts formed on the former bit line is arranged.

Abstract: A semiconductor integrated device having a current regulating diode may be substantially reduced in size and improved in performance by forming the current regulating diode of a plurality of MOS transistors each having a gate, a drain region, and a source region formed in a semiconductor substrate, the source regions and the substrate regions being electrically coupled to each other, the drain regions of at least two of the MOS transistors being electrically coupled, and the source regions of each of the MOS transistors being electrically coupled, the coupled drain regions, the coupled source regions, and the coupled gates forming a drain terminal, a source terminal and a gate terminal, respectively. In order to set a desired regulated current, selected coupling lines in the current regulating diode may be cut.

Abstract: An interconnection array layout and method are provided for a plurality of paired line conductors of a given length extending principally parallel. A single crossing region traverses the paired line conductors intermediate the given length, wherein the line conductors of each pair of line conductors cross such that inter-pair capacitive coupling is matched. Intra-pair capacitive coupling is avoided by separating the line conductors of each pair of line conductors by two pitches and disposing therebetween a line conductor of a different pair of line conductors. Applications include semiconductor memory arrays, such as DRAM structures, and address/data busses wherein paired true/complement line conductors are employed.

Abstract: An improved EEPROM cell structure is disclosed which provides protection against external detection of data stored within the cell. One or more cavities filled with a high etching film and extending in a substantially vertical direction are provided in a region adjacent to an end of the floating gate such that during an attempted deprocessing of the cell using an etching process, the etchant will rapidly diffuse through these cavities and expose the floating gate via these cavities before exposing and removing the control gate via the insulating layers overlapping the control gate. Any charge once present on the floating gate will dissipate before the control gate can be removed, thereby making it impossible to read data stored within the cell.

Abstract: A dynamic random access memory includes a plurality of DRAM cell units having a bit contact region and DRAM cells formed on an active region, wherein the DRAM cells each comprised of a transistor and a capacitor connected to the transistor are arranged symmetrically to the right and left sides in a bit contact connected with the active region to form the DRAM cell unit; and the DRAM cell units are arranged with a prescribed pitch in the direction of X and arranged in the direction of Y shifted with one third of the pitch toward the direction of X.

Abstract: A dynamic random access memory having an improved layout capable of having a large storage capacity with a small memory cell area as well as preventing the occurrence of short-circuiting by an increase in the process margin, and a method of arranging memory cells of the same. Each active region includes a first diffusion region, a second diffusion region in common with an adjacent memory cell and a channel forming region located between the first and second diffusion regions. First diffusion regions of adjacent active regions are located at positions symmetrical with respect to the common second diffusion region, at a predetermined angle. Each of uniformly spaced bit lines has a protrusion having a predetermined width and length and extending from its one edge in a direction that the word lines extend. At the protrusion, one second diffusion region is disposed. Uniformly spaced word lines cross bit lines. Each capacitor is positioned between two adjacent bit lines and between two adjacent word lines.

Abstract: A tamper resistant structure has a pattern which covers portions of an IC but exposes other portions of the IC so that etching away the tamper resistant structure destroys the exposed portions. The IC can not be easily disassembled and reverse engineered because the tamper resistant structure hides active circuitry and removing the tamper resistant structure destroys active circuitry. One embodiment of the tamper resistant structure includes a metal layer and a cap layer. The cap layer typically includes material that is difficult to remove, such as silicon carbide, silicon nitride, or aluminum nitride. The metal layer typically includes a chemically resistant material such as gold or platinum. A bonding layer of nickel-vanadium alloy, titanium-tungsten alloy, chromium, or molybdenum, may be used to provide stronger bonds between layers. Some embodiments provide an anti-corrosion seals for bonding pads in addition to the tamper residant structure.

Abstract: A semiconductor memory is provided which comprises memory cell regions disposed on a substrate, word lines which are connected respectively to the memory cells in the memory cell regions for controlling at least reading information from the memory cells, first bit lines which are formed in a first layer on the substrate and connected respectively to the memory cells for transmitting information, and second bit lines which are formed in a second layer and connected respectively to the memory cells for transmitting information, the second layer being formed on the substrate and electrically insulated from the first layer. The limitation of the layout upon the decrease of the bit line pitch can be eliminated, so that the reduction of the chip occupation area by shrinkage of areas between each adjacent memory cell regions can be realized. The first and second bit lines each is preferable to be patterned like stairs.

Abstract: A new interdigitated folded bit line (IFBL) architecture for a future generation high density semiconductor memory design is disclosed. In the architecture, the basic cross-point memory cells are organized orthogonally in rows and columns to form an array matrix. The bit lines run in a row direction while the word lines run in a column direction. Transfer transistors are designed to be shared with the same drain junction and the same bit line contact in order to save area. A choice of at least two described embodiments are provided. In one embodiment, referred to as the offset bit line structure, the bit lines are constructed by using two layers of interconnection lines to connect the interdigitated cells associated to it. By connecting the bit line contacts and with two different interconnecting layers and in an alternating row order, the true and complement bit lines and will run parallel to both sides of the memory array.