Abstract: A light-emitting substrate includes a base, a first conductive pattern layer disposed on the base and a second conductive pattern layer disposed on a side of the first conductive pattern layer away from the base. The first conductive pattern layer includes first signal lines. The second conductive pattern layer includes lamp bead pads. The lamp bead pads include first lamp bead pads and at least one second lamp bead pad. A vertical projection of each first lamp bead pad on the base at least partially overlaps with a vertical projection of a first signal line on the base. A vertical projection of each second lamp bead pad on the base is outside vertical projections of the first signal lines on the base. A distance between a first lamp bead pad and the base is substantially the same as a distance between a second lamp bead pad and the base.

Abstract: A vehicular driver monitoring system includes a camera disposed at an interior rearview mirror assembly of a vehicle, an electronic control unit (ECU) with an image processor for processing image data captured by the camera. The camera is disposed at a mirror head of the interior rearview mirror assembly and moves in tandem with the mirror head when the mirror head is adjusted relative to a mounting portion of the interior rearview mirror assembly. The camera includes an imaging array sensor and a lens. The vehicular driver monitoring system, responsive to processing at the ECU of image data captured by the camera, monitors a body portion of a driver of the vehicle. The vehicular driver monitoring system adjusts viewing of the body portion of the driver by the camera to accommodate a change in a scene viewed by the camera.

Abstract: An optical waveguide on a wiring substrate includes a first cladding layer, a first metallic film forming protrusion formed on the first cladding layer and including an inclined surface inclined with respect to an upper surface of the first cladding layer, a first metallic film formed on at least the inclined surface, a core layer formed on the first cladding layer so as to cover a portion of the first metallic film, a second cladding layer formed on the first cladding layer, so as to cover at least an upper surface and both side surfaces of the core layer, and a pair of first protrusions formed on the first cladding layer with the core layer interposed therebetween in a plan view and protruding from the first cladding layer, so as to be separated from the core layer and the first metallic film forming protrusion.

Abstract: Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on a first surface of the board, a connector mounted on a second surface of the board on the opposite side with respect to the first surface, an optical element that converts an optical signal and an electrical signal and positioned on the opposite side with respect to the first surface such that the optical element is at least partially embedded in the board, a path that is formed in the board and electrically connects the logic IC on the first surface and the optical element on the opposite side with respect to the first surface, and an optical waveguide that is embedded on the opposite side with respect to the first surface and optically connects the connector on the second surface and the optical element on the opposite side with respect to the first surface.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on the printed wiring board, a connector mounted on the printed wiring board, an optical element that is accommodated inside the printed wiring board and converts an optical signal to an electrical signal and/or the electrical signal to the optical signal, an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector, and an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.

Abstract: An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.

Abstract: A package comprises a first die and a bridging element. The first die includes a compute element and/or memory element, a first region, a first portion of a photonic transceiver, and a first die interconnect region. The first region intersects a center of the first die. The first portion of a photonic transceiver includes and AMS block with a driver and transimpedance amplifier, coupled with the first die interconnect region. The bridging element includes a modulator and photodetector, connected with a bridging interconnect region. An optical interface, photonically linked with the first photonic transceiver, routes packets from an external device optical interface to the compute and/or memory element.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

Abstract: Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.

Abstract: A light-emitting device is provided with a light source and a controller. The light source includes multiple light-emitting elements and multiple driving elements that are provided in correspondence with the light-emitting elements and drive the light-emitting elements to light up by going to an ON state. The controller controls a switching between a successive lighting operation that causes the light-emitting elements to light up successively and a simultaneous lighting operation that causes the light-emitting elements to light up simultaneously in parallel. The light source includes a power supply line set to a reference potential or a power supply potential, a driving signal line that is connected to the power supply line and that supplies a driving signal to the driving elements, and a lighting signal line that supplies a lighting signal for causing the light-emitting elements to light up.

Abstract: Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.

Abstract: A PIC comprising an optical edge coupler having a plurality of optical cores within a heterogeneous stack of dielectric layers providing an optical cladding for the optical cores. The layer stack comprises first and second groups of layers, wherein refraction-index differences between individual layers of the same group are much smaller than refraction-index differences between any two layers from different groups. The optical cores are arranged in a plurality of parallel planar arrays enabling a large MFD change. At least one of the arrays is located within the first group of layers, and at least another one of the arrays is located within the second group of layers. End sections of the optical cores are adjacent to an edge of the PIC and may be optically coupled to an external optical fiber or on-chip waveguide of another PIC for a low-loss transfer of optical power therebetween.

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: A light fixture system comprising a light fixture comprising light sources arranged in groups, wherein each group comprises one or more light sources, and a controller, wherein the controller is arranged to control the groups so that each of the groups is repeatedly switched on and off, wherein at a first point in time some groups are switched on and others are switched off, at a second point in time some of the groups which were switched on at the first point in time are switched off, and some of the groups which were switched off at the first point in time is switched on, and at a third point in time some of the groups which were switched on at the second point in time are switched off, and some of the groups which were switched off at the second point in time are switched on.

Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.

Abstract: A vehicular driver monitoring system includes a camera disposed at an interior rearview mirror assembly of a vehicle equipped with the vehicular driver monitoring system, an electronic control unit (ECU) with an image processor for processing image data captured by the camera. The camera includes an imaging array sensor and a lens and the camera is adjustable by at least one of (i) adjusting a position of the imaging array sensor relative to the lens and (ii) adjusting a position of the lens relative to the imaging array sensor. The system, responsive to processing at the ECU of image data captured by the camera, monitors a body portion of a driver of the vehicle and adjusts the camera to adjust the position of where the monitored body portion of the driver is imaged at the imaging array sensor.

Abstract: A light emission device includes: a wiring board; a plurality of light-emitting elements being disposed on the wiring board and electrically connected to a wiring layer of the wiring board; a first light diffusing member being disposed on the wiring board, the first light diffusing member having a plurality of throughholes and containing a light-diffusive material, each of the plurality of light-emitting elements being disposed in a corresponding one of the plurality of throughholes; a plurality of second light diffusing members covering the plurality of light-emitting elements and being disposed in the plurality of throughholes, each second light diffusing member containing a light-diffusive material, such that a content ratio of the light-diffusive material in each second light diffusing member is higher than a content ratio of the light-diffusive material in the first light diffusing member; and a wavelength converting member.

Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.

Abstract: The disclosed technology relates to a hard and soft light module having a housing with a first surface that accommodates a lens. A first plurality of LEDs are disposed along a periphery of the first surface, the first plurality of LEDs are configured to generate light in a first direction toward an edge of the lens. A second plurality of LEDs are disposed proximate to the first surface, the second plurality of LEDs are configured to generate light in a second direction through the lens. The first plurality of LEDs are configured to generate a soft light and the second plurality of LEDs are configured to generate a hard light.

Abstract: A sensor switch includes abase unit having bottom, top and intermediate layer assemblies cooperatively defining a receiving space. One of the bottom, top and intermediate layer assemblies has a mounting surface. A sensor unit is disposed in the receiving space and includes a light emitter, a light receiver, and a rolling member for changing the amount of light received by the light receiver. A conducting unit includes a power supply section, a power supply conducting element disposed on the mounting surface, and a signal conducting element disposed on the mounting surface and spaced apart from the power supply conducting element.

Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, a switching element, an input-side terminal, an output-side terminal, and a resin layer. The light-emitting element, the light-receiving element and the switching element are provided at the front side of the resin layer. The light-receiving element and the switching element are arranged in a first direction along the front side of the resin layer. The switching element is electrically connected to the light-receiving element. The light-receiving element is provided between the light-emitting element and the resin layer. The input-side and output-side terminals are provided at the backside of the resin layer. The input-side terminal is electrically connected to the light-emitting element. The output-side terminal is electrically connected to the switching element.

Abstract: A light emitting device including a first LED sub-unit, a second LED sub-unit disposed under the first LED sub-unit, a third LED sub-unit disposed under the second LED sub-unit, a first ohmic electrode interposed between the first LED sub-unit and the second LED sub-unit, and in ohmic contact with the first LED sub-unit, a second ohmic electrode interposed between the second LED sub-unit and the third LED sub-unit, and in ohmic contact with the second LED sub-unit, a third ohmic electrode interposed between the second ohmic electrode and the third LED sub-unit, and in ohmic contact the third LED sub-unit, a plurality of electrode pads disposed on the first LED sub-unit, in which at least one of the first ohmic electrode, the second ohmic electrode, and the third ohmic electrode has a patterned structure.

Abstract: Light-emitting devices are described herein. A device includes a packaging substrate having a top surface and a bottom surface and a hybridized device having a bottom surface on the top surface of the packaging substrate. The hybridized device includes a silicon backplane that includes input/output (I/O) pins and a light-emitting diode (LED) array having a bottom surface on a top surface of the silicon backplane. Passive components are disposed on the top surface of the packaging substrate. Conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: A light-emitting module includes: a semiconductor light-emitting element; a circuit board on which a lighting control circuit configured to perform control to turn on and off the semiconductor light-emitting element is provided; and an element metal plate on which the semiconductor light-emitting element is mounted. The circuit board is a resin substrate in which a wiring portion connecting the semiconductor light-emitting element and the lighting control circuit is provided.

Abstract: PIC die packages may include a PIC die including: a body having a plurality of layers including a plurality of interconnect layers. A first optical fiber is positioned in a groove and a second optical fiber positioned in another groove in the edge of the body. The first optical fiber is aligned with an optical component in a first layer of the body at a first vertical depth, and the second optical fiber is aligned with another optical component in a second, different layer of the body at a second different vertical depth. A cover is over at least a portion of the body. The cover includes a member having a face defining a first seat therein having a first height to receive a portion of the first optical fiber, and defining a second seat therein having a second, different height to receive a portion of the second optical fiber.

Abstract: An optical sensor includes a substrate, a light emitting element, a light receiving element, and an electronic circuit element. Light from the light emitting element is blocked by a detection object to detect the detection object. The light emitting element, the electronic circuit element and the light receiving element are mounted on the same surface of the substrate. The electronic circuit element is disposed between the light emitting element and the light receiving element on a mounting surface of the substrate.

Abstract: Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: A semiconductor package includes a base material, a capture land, an interconnection structure, a semiconductor chip and an encapsulant. The base material has a top surface and an inner lateral surface. The capture land is disposed in or on the base material, and has an outer side surface. The interconnection structure is disposed along the inner lateral surface of the base material, and on the capture land. The interconnection structure has an outer side surface. An outer side surface of the semiconductor package includes the outer side surface of the capture land and the outer side surface of the interconnection structure. The semiconductor chip is disposed on the top surface of the base material. The encapsulant is disposed adjacent to the top surface of the base material, and covers the semiconductor chip.

Abstract: An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrates.

Abstract: An LED lighting device capable of adjusting color temperature by software and hardware cooperative control to achieve high-performance output includes at least one light source and a drive circuit. The light source includes first-wavelength LED, second-wavelength LED, third-wavelength LED and fourth-wavelength LED. When a modulator is operated to select only one of the first-wavelength LED, the second-wavelength LED, the third-wavelength LED and the fourth-wavelength LED to receive a maximum rated current, the drive circuit outputs four times of the maximum drive power to the corresponding LEDs; or when the first-wavelength LED, the second-wavelength LED, the third-wavelength LED and the fourth-wavelength LED receive a quarter of the maximum rated current separately, the drive circuit outputs a quarter of the maximum drive power to the LEDs separately, and the output pulse width of the drive power will be modulated to maintain the light source to carry a constant rated power.

Abstract: A light emitting device including a substrate, a first semiconductor layer disposed on the substrate, a mesa including a second semiconductor layer and an active layer disposed on the first semiconductor layer, a first contact electrode contacting the first semiconductor layer, a second contact electrode contacting the second semiconductor layer, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode, and including a first opening disposed on the first contact electrode and a second opening disposed on the second contact electrode, and first and second bump electrodes electrically connected to the first and second contact electrodes through the first and second openings, respectively, in which the first and second bump electrodes are disposed on the mesa, the passivation layer is disposed between the first bump electrode and the second contact electrode, and the first contact electrode includes an alloy layer.

Abstract: A sensor package includes a sensor, at least one external wall, and an interposer, arranged between the sensor and the at least one external wall. The sensor is wire bonded to the interposer and the interposer is wire bonded to the at least one external wall. Using an interposer, wire bonded to both the sensor and the at least one external wall, is an improved approach to electrically connecting a sensor and a sensor package. The interposer allows for short wire bonds from the sensor and the at least one external wall to the interposer, replacing the single, long wire bond from the sensor to the at least one external wall in the prior art. This provides improved resilience of the sensor package under high stress. Furthermore, it allows an existing sensor and package combination to be improved without needing to redesign either component.

Abstract: A display module including a display panel comprising a plurality of pixels each comprising a plurality of sub pixels, the pixels being disposed on a plurality of row lines of the display panel and a driver. The driver being configured to apply a pulse width modulation (PWM) data voltage to the sub pixels in a sequential order of the row lines; and drive the display panel such that the sub pixels included in a plurality of consecutive row lines among the plurality of row lines emit light, in the sequential order of the row lines, for a time corresponding to the applied PWM data voltage.

Abstract: Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.

Abstract: An endoscope apparatus includes a camera and circuitry. The camera is detachably connected to a base of an endoscope adapted to be inserted in a subject and includes a sensor configured to image a subject image captured by the endoscope. The circuitry is configured to process an image captured by the camera and generate a video signal for display, calculate a gain in white balance based on the captured image, and perform mask edge detecting processing for detecting a boundary point between the subject image and a mask area other than the subject image included in the captured image.

Abstract: Disclosed herein are photonic package assemblies, packages, and devices that include photonic dies and optical coupling structures aligned with photonic dies to enable exchange of electromagnetic signals. In one aspect, a photonic package assembly includes a photonic integrated circuit (PIC) die having one or more PICs, and an optical coupling structure (OCS) positioned adjacent to the PIC die such that electromagnetic signals may be exchanged between at least one of the one or more PICs and the OCS. The assembly further includes a structure that forms a bridge, and, thereby, provides mechanical coupling, between the OCS and the PIC die. Providing a bridge structure that directly attaches an OCS to a PIC die may improve achieving and maintaining the desired alignment between the OCS and the PIC die, which may lead to an improved coupling performance over the lifetime of products.

Abstract: An endoscope includes an insertion portion in which a rigid distal end portion, a bending portion, and a flexible portion are provided in a connected row arrangement, and an optical fiber that is inserted through the insertion portion. The endoscope has, in the rigid distal end portion, an optical transmission module in which an image pickup device, an optical device in which a light-emitting portion is formed, and a holding member that has a through hole. A length in the bending portion of the optical fiber whose distal end portion is inserted into and fixed in the through hole of the holding member is longer than a length L0 of the bending portion.

Abstract: An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

Abstract: A high-power packaged laser array that is thermal reflow compatible is described. Notably, a high-power III-V laser array is integrated on a silicon substrate with a matching array of ball lenses, an isolator and a coupler (such as a reflective layer) to achieve an edge-coupled or a surface-normal output laser array. In some embodiments, an isolator with a permanent magnet is used to preserve the magnetic domain or state of the isolator during the thermal reflow(s), which can involve temperatures up to 250 C. In order to relax the misalignment tolerance when integrating with the silicon chip, a laser array with a larger optical mode may be used to increase the output beam size. Moreover, a III-V laser array with an angled output optical waveguide can be used to improve the stability of the lasers at high power.

Abstract: An integrated photonic module includes a semiconductor substrate configured to serve as an optical bench. Alternating layers of insulating and conducting materials are deposited on the substrate and patterned so as to define electrical connections. An optoelectronic chip is mounted on the substrate in contact with the electrical connections. A drive chip is mounted on the substrate so as to provide an electrical drive current to the optoelectronic chip via the electrical connections.

Abstract: A method of reducing data transfer while increasing image information over an 802.15.4 network includes obtaining an image with a sensor, modulating a representation of the image using a first 802.15.4 modem, sending the representation of the image to a coordinator, demodulating the representation of the image using a second 802.15.4 modem, and digitally enhancing at least one of the representation of the image and the image. A system for communication over an 802.15.4 network includes a sensor for obtaining data, the size of the data being at least an order of magnitude greater than the size of an 802.15.4 packet, a first 802.15.4 modem coupled to the sensor, a buffer for temporarily storing the data to allow transmission of portions of the data; the buffer being coupled to the sensor, a coordinator coupled to the sensor, the coordinator being capable of communicating with a computer, and a second 802.15.4 modem coupled to the coordinator.

Abstract: A light irradiation device includes a plurality of light-emitting portions that emit light by being supplied with a current. The light-emitting portions each have a first power supply terminal, and a second power supply terminal; a plurality of light-emitting elements; and a wiring pattern. The wiring pattern has a first wiring region and a second wiring region. Two of the light-emitting portions that are disposed adjacent to each other are disposed such that the space between the respective first wiring regions or the space between the respective second wiring regions is smaller than the space between the first wiring region of one of the light-emitting portions and the second wiring region of the other of the light-emitting portions.

Abstract: An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

Abstract: A method of reducing data transfer while increasing image information over an 802.15.4 network includes obtaining an image with a sensor, modulating a representation of the image using a first 802.15.4 modem, sending the representation of the image to a coordinator, demodulating the representation of the image using a second 802.15.4 modem, and digitally enhancing at least one of the representation of the image and the image. A system for communication over an 802.15.4 network includes a sensor for obtaining data, the size of the data being at least an order of magnitude greater than the size of an 802.15.4 packet, a first 802.15.4 modem coupled to the sensor, a buffer for temporarily storing the data to allow transmission of portions of the data; the buffer being coupled to the sensor, a coordinator coupled to the sensor, the coordinator being capable of communicating with a computer, and a second 802.15.4 modem coupled to the coordinator.

Abstract: This invention discloses a method of manufacturing a package assembly, a package assembly, and a display device. The method includes: providing a base substrate, provided with a first pattern layer and a second pattern layer located outside the first pattern layer; forming a first cladding layer on the base substrate, the first cladding layer covering a second pattern layer and a region surrounded by the second pattern layer; forming a second cladding layer on the first cladding layer, the second cladding layer covering a top portion of the first pattern layer and a region surrounded by the first pattern layer; forming an organic layer on the first cladding layer and the second cladding layer, the organic layer covering the first pattern layer and a region surrounded by the first pattern layer; and forming a third cladding layer on the organic layer and the first cladding layer.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.