Abstract: An organic light emitting diode (OLED) display includes a substrate main body, a plurality of organic light emitting elements on the substrate main body, a column spacer on the substrate main body and between two or more of the plurality of organic light emitting elements, and an encapsulation thin film covering at least one of the organic light emitting elements and having regions divided by the column spacer.

Abstract: An organic light emitting diode display and a method of manufacturing the same, the display including a substrate; a plurality of thin film transistors on the substrate; a protective film covering the plurality of thin film transistors; a pixel electrode on the protective film; a pixel defining film on the protective film, the pixel defining film having an opening exposing the pixel electrode; an organic emission layer on the pixel electrode and the pixel defining film; and a common electrode covering the organic emission layer, wherein a cross-section of an opening sidewall of the opening in the pixel defining film has a rounded shape.

Abstract: A display apparatus includes a substrate including a display area, an encapsulation member facing the substrate, a pad unit around the display area of the substrate, the pad unit including a contact area and an exposure area that is spaced apart from the contact area, and a flexible printed circuit (FPC) that is connected to the contact area of the pad unit and is curved towards the encapsulation member.

Abstract: A method of manufacturing an OLED display includes: forming an organic light emitting element on a first substrate; forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate; providing a second substrate; forming a flexible protection layer on the second substrate; attaching the first substrate and the second substrate to each other; and separating the second substrate from the flexible protection layer.

Abstract: A display device and method thereof which minimizes introduction of oxygen and moisture from the outside includes an insulating substrate, a display part formed on the insulating substrate, a cover substrate combined with the insulating substrate, a filler provided between the insulating substrate and the cover substrate, the filler includes a first region and a second region spaced from the first region and formed at a circumference of the first region, and a moisture absorbent formed in a space between the first region and the second region.

Abstract: Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED.

Abstract: A method for producing a light emitting diode device includes the steps of preparing a board mounted with a light emitting diode; preparing a hemispherical lens molding die; preparing a light emitting diode encapsulating material which includes a light emitting diode encapsulating layer and a phosphor layer laminated thereon, and in which both layers are prepared from a resin before final curing; and disposing the light emitting diode encapsulating material between the board and the lens molding die so that the phosphor layer is opposed to the lens molding die to be compressively molded, so that the light emitting diode is directly encapsulated by the hemispherical light emitting diode encapsulating layer and the phosphor layer is disposed on the hemispherical surface thereof.

Abstract: Disclosed is an organic light emitting display which avoids an occurrence of Newton's rings in coalesced substrate and sealing substrate. A first substrate includes a pixel region and a non-pixel region. An array of organic light emitting pixels including a first electrode, an organic layer, and a second electrode is formed at the pixel region. A second substrate opposes the first substrate. A frit is disposed between the non-pixel region of the first substrate and the second substrate for interconnecting the first substrate and the second substrate. The second electrode of the array directly contacts a region corresponding to a pixel region of the second substrate.

Abstract: In one embodiment, a semiconductor package includes a vertical semiconductor chip having a first major surface on one side of the vertical semiconductor chip and a second major surface on an opposite side of the vertical semiconductor chip. The first major surface includes a first contact region and the second major surface includes a second contact region. The vertical semiconductor chip is configured to regulate flow of current from the first contact region to the second contact region along a current flow direction. A back side conductor is disposed at the second contact region of the second major surface. The semiconductor package further includes a first encapsulant in which the vertical semiconductor chip and the back side conductor are disposed.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes an organic light emitting element formed over a substrate and an encapsulation portion covering the organic light emitting element. Further, the encapsulation portion may include at least one organic layer and at least one inorganic layer, wherein ends of the inorganic layer and the organic layer directly contact the substrate, and wherein the organic layer is thicker than the inorganic layer.

Abstract: An embodiment of the present memory cell a first layer of a chosen conductivity type, and a second layer which includes ferroelectric semiconductor material of the opposite conductivity type, the layers forming a pn junction. The first layer may be a conjugated semiconductor polymer, or may also be of ferroelectric semiconductor material. The layers are provided between first and electrodes. In another embodiment, a single layer of a composite of conjugated semiconductor polymer and ferroelectric semiconductor material is provided between first and second electrodes. The various embodiments may be part of a memory array.

Abstract: A method is provided for preparing a printed metal surface for the deposition of an organic semiconductor material. The method provides a substrate with a top surface, and a metal layer is formed overlying the substrate top surface. Simultaneous with a thermal treatment of the metal layer, the metal layer is exposed to a gaseous atmosphere with thiol molecules. In response to exposing the metal layer to the gaseous atmosphere with thiol molecules, the work function of the metal layer is increased. Subsequent to the thermal treatment, an organic semiconductor material is deposited overlying the metal layer. In one aspect, the metal layer is exposed to the gaseous atmosphere with thiol molecules by evaporating a liquid containing thiol molecules in an ambient air atmosphere. Alternatively, a delivery gas is passed through a liquid containing thiol molecules. An organic thin-film transistor (OTFT) and OTFT fabrication process are also provided.

Abstract: An organic light emitting diode display includes a substrate, an organic light emitting diode on the substrate, an organic film configured to cover the organic light emitting diode on the substrate in an organic film deposition area having a first diameter, and an inorganic film configured to cover the organic film on the substrate in an inorganic film deposition area having a second diameter, wherein L1 is the first diameter of the organic film deposition area in ?m, wherein L2 is the second diameter of the inorganic film deposition area in ?m, wherein D is a thickness of the organic film in ?m, and wherein L2?L1?2 (171D+150 ?m).

Abstract: An organic light emitting diode (OLED) display includes: a first substrate including a display area and a non-display area; a driving element on the display area of the first substrate, and including a driving thin film transistor, a switching thin film transistor, and a capacitor; a circuit unit on the non-display area of the first substrate; an organic light emitting element on the driving element, and including a pixel electrode, an organic emission layer, and a common electrode; an inorganic protective layer covering the circuit unit and the common electrode of the organic light emitting diode; a sealing member on the inorganic protective layer in the non-display area of the first substrate; and a second substrate on the sealing member.

Abstract: In an organic light-emitting display device and a method of manufacturing the same, the organic light-emitting display device comprises: a substrate including a transistor region; a buffer layer and a semiconductor layer sequentially formed on the substrate; a gate electrode formed on the semiconductor layer; an interlayer insulating film formed on the gate electrode; source and drain electrodes, each formed on the interlayer insulating film and having a portion penetrating the interlayer insulating film so as to contact the semiconductor layer; a mask pattern formed on each of the source and drain electrodes; and a pixel defined layer formed on the mask pattern.

Abstract: A display apparatus includes a substrate including a display area, an encapsulation member facing the substrate, a pad unit around the display area of the substrate, the pad unit including a contact area and an exposure area that is spaced apart from the contact area, and a flexible printed circuit (FPC) that is connected to the contact area of the pad unit and is curved towards the encapsulation member.

Abstract: An organic light emitting device (OLED) is formed by assembling a first substrate and a second substrate. The second substrate includes several sub-pixels. The first substrate includes several transistors electrically connected to each other and, for each subpixel, a first connecting electrode electrically connected to one of the transistors. Each subpixel includes a light-emitting region and a non light-emitting region. A second connecting electrode is formed in the non light-emitting region and electrically connected to the respective first connecting electrode.

Abstract: A light-emitting surface element includes a connection device, a light-generating element having at least two electrical connections electrically conductively connected to assigned connection lines on the connection device, and at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element.

Abstract: An OLED display and a manufacturing method thereof are disclosed. The OLED display includes: a first substrate, an organic light emitting diode formed over the first substrate, the organic light emitting diode including a reflective surface configured to reflect light incident to the organic light emitting diode, a phase delay capping layer formed over the organic light emitting diode, configured to input linearly polarized light and output circularly polarized light, a second substrate disposed over the phase delay capping layer, and a polarizing plate formed over the second substrate, configured to pass through only linearly polarized light.

Abstract: An organic light emitting diode (OLED) display according to an exemplary embodiment of the invention includes: a display substrate including a plurality of pixel areas; a tilt layer formed on the display substrate of each of the plurality of pixel areas, and having a tilt angle with respect to the display substrate; a first electrode formed on the tilt layer; an organic emission layer formed on the first electrode; a second electrode formed on the organic emission layer; an encapsulation substrate disposed on the second electrode and in parallel with the display substrate; and a prism sheet formed on the encapsulation substrate and having a plurality of prisms.

Abstract: An organic light-emitting display includes a substrate including a pixel region and a transistor region; a first transparent electrode and a second transparent electrode formed over the pixel region and the transistor region of the substrate, respectively; a gate electrode formed over the second transparent electrode; a gate insulating film formed over the gate electrode; a semiconductor layer formed over the gate insulating film; a source and drain electrode having an end connected to the semiconductor layer and the other end connected to the first transparent electrode; a pixel defining layer disposed over the source and drain electrode to cover the source and drain electrode and having an opening disposed over the first transparent electrode; a light-blocking layer formed over the pixel defining layer; and an organic light-emitting layer formed over the first transparent electrode.

Abstract: An organic light emitting diode display includes a substrate, a display portion on the substrate, and a sealing substrate fixed on the substrate and sealingly engaging the display portion. The sealing substrate is fixed by an adhesive layer that surrounds the display portion. The sealing substrate includes a composite member, at least one conductive portion, and an insulation sheet. The composite member includes a resin base layer and a plurality of carbon fibers. The at least one conductive portion extends over inner and outer sides of the composite member and penetrates the composite member. The at least one conductive portion includes a double-layered structure having a metal foil layer and a plating layer. The insulation sheet is on the outer side of the composite member and the insulation sheet covers the at least one conductive portion.

Abstract: A stacked structure including an organic layer; a conductor or a semiconductor layer; a protective layer made of an insulating material and covering at least a part of a top surface or an undersurface of the organic layer; and a plurality of grains an outside of each of which is covered with an affinity layer that has an affinity with the insulating material, the plurality of grains being dispersed in the protective layer.

Abstract: A display device includes an array of pixels including a plurality of organic EL elements each having a pair of electrodes and an organic compound layer including a light-emitting layer and disposed between the pair of electrodes and includes a protective layer disposed on the plurality of the organic EL elements. The protective layer has a first protective layer made of an inorganic material, a second protective layer made of a resin material and disposed on the first protective layer, and a third protective layer made of an inorganic material and disposed on the second protective layer. The second protective layer includes lenses for diverging at least part of light emitted from the light-emitting layer. The lenses have an elongated concave shape.

Abstract: An alternating current light-emitting device includes a substrate, a plurality of microdie light-emitting elements formed on the substrate, a rectifying element-dedicated member formed on a surface of a portion of microdie light-emitting elements, a rectifying unit formed on the rectifying element-dedicated member and provided with at least four rectifying elements forming a Wheatstone bridge circuit, and an electrically conductive structure electrically connecting the rectifying elements and the microdie light-emitting elements. With the rectifying unit being formed on the rectifying element-dedicated member, the rectifying elements are highly tolerant of reverse bias and feature low starting forward bias. Also, the present invention provides a method for fabricating an alternating current light-emitting device.

Abstract: According to one embodiment, an organic EL device includes an insulating substrate, first and second interlayer insulators, pixel electrodes, an organic layer, and a counter electrode. The first interlayer insulator is positioned above the insulating substrate. The second interlayer insulator is positioned on the first interlayer insulator and provided with slits. The pixel electrodes are arranged on the second interlayer insulator. Two or more of the pixels are adjacent to each other with one of regions corresponding to the slits interposed therebetween. The organic layer is positioned on the pixel electrodes and includes an emitting layer. The counter electrode is positioned above the organic layer.

Abstract: A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are seated by the first sealing material and the second sealing material.

Abstract: An organic light emitting diode (OLED) display according to an exemplary embodiment of the invention includes: a display substrate including a plurality of pixel areas; a tilt layer formed on the display substrate of each of the plurality of pixel areas, and having a tilt angle with respect to the display substrate; a first electrode formed on the tilt layer; an organic emission layer formed on the first electrode; a second electrode formed on the organic emission layer; an encapsulation substrate disposed on the second electrode and in parallel with the display substrate; and a prism sheet formed on the encapsulation substrate and having a plurality of prisms.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes an organic light emitting element formed over a substrate and an encapsulation portion covering the organic light emitting element. Further, the encapsulation portion may include at least one organic layer and at least one inorganic layer, wherein ends of the inorganic layer and the organic layer directly contact the substrate, and wherein the organic layer is thicker than the inorganic layer.

Abstract: Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED.

Abstract: An organic electroluminescent device includes a substrate; a plurality of light-emitting elements disposed on the substrate and including first transparent electrodes, a second transparent electrode, and light-emitting layers held therebetween; reflective layers disposed opposite the light-emitting layers with the first electrodes therebetween; a first insulating film disposed between the substrate and the reflective layers and formed of an organic material; and a second insulating film disposed between the first electrodes and the reflective layers so as to cover the reflective layers and the first insulating film. The second insulating film has a first through-hole at a position not overlapping the first electrodes in plan view. The first through-hole extends through the second insulating film to reach the first insulating film.

Abstract: Disclosed herein is a light emitting device, which includes a first substrate, a protective layer, a second substrate, a buffer member and a sealant. The first substrate has an illuminating member thereon. The protective layer covers the illuminating member and has a first coefficient of thermal expansion. The second substrate is disposed over the protective layer. The buffer member is disposed between the first and second substrates and surrounds the protective layer, wherein the buffer member has a second coefficient of thermal expansion which is less than the first coefficient. The sealant surrounds the buffer member and seals off the space between the first and second substrates, wherein the sealant has a third coefficient of thermal expansion which is less than the second coefficient.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane prepolymer with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: An electronic device includes a substrate. The substrate includes a first pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart from each other. The first conductive member is connected to the first pixel driving circuit. The second conductive member is part of a power transmission line. The electronic device further includes a well structure overlying the substrate and defining a pixel opening, a via, and a channel. The pixel opening is connected to the via through the channel. In addition, the electronic device includes a first electronic component. The electronic component includes a first electrode that contacts the first conductive member in the pixel opening, a second electrode that contacts the second conductive member in the via, and an organic layer lying between the first and second electrodes.

Abstract: An organic light emitting display includes a substrate, a semiconductor layer arranged on the substrate, an organic light emitting diode arranged on the semiconductor layer, an encapsulant arranged on an top surface periphery of the substrate, which is an outer periphery of the semiconductor layer and the organic light emitting diode, an encapsulation substrate bonded to the encapsulant, and a bonding agent arranged on an under surface of the substrate which is opposite to the encapsulant.

Abstract: In an organic light emitting device and method of fabricating the same, a hole is formed in a reflecting layer formed below a first electrode or the reflecting layer itself is patterned to form a reflecting layer pattern, and an opening is formed in the reflecting layer positioned below the first electrode, so that light generated in an organic layer is transmitted toward the bottom as well as the top, and an aperture ratio of the opening may be adjusted to control the amount of the transmitted light and the reflected light. The organic light emitting device includes: a substrate; a first electrode; an organic layer having at least an organic emission layer; and a second electrode formed on the substrate. A reflecting layer is positioned below the first electrode, and has at least one hole or at least one island pattern formed therein.

Abstract: An organic light emitting display (OLED) and a method of manufacturing the OLED is disclosed. The OLED, which has a transparent metal layer substantially preventing an oxide layer from forming on a pad metal, and a method of manufacturing the OLED are disclosed. The OLED includes a substrate, a display unit formed on the substrate including gate and source/drain electrodes, and a pad unit formed on the substrate configured to transmit electrical signals to the display unit. The pad unit includes a wiring line terminal in which a transparent metal layer is formed in a predetermined shape and a predetermined region.

Abstract: This invention relates to dibenzothiopyran compounds. This invention also relates to layers and devices including at least one of these compounds.

Abstract: Methods for protecting circuit device materials, optoelectronic devices, and caps using a reflowable getter are described. The methods, devices and caps provide advantages because they enable modification of the shape and activity of the getter after sealing of the device. Some embodiments of the invention provide a solid composition comprising a reactive material and a phase changing material. The combination of the reactive material and phase changing material is placed in the cavity of an electronic device. After sealing the device by conventional means (epoxy seal for example), the device is subjected to thermal or electromagnetic energy so that the phase changing material becomes liquid, and consequently: exposes the reactive material to the atmosphere of the cavity, distributes the getter more equally within the cavity, and provides enhanced protection of sensitive parts of the device by flowing onto and covering these parts, with a thin layer of material.

Abstract: An organic EL device has an organic EL element provided on a substrate and includes a lower electrode, an organic EL layer, an upper electrode, and a protective layer for moisture protection, and a protective substrate laminated onto the organic EL element via an adhesive layer. The protective layer is a laminated body including first through nth layers, in order, from a side close to the upper electrode (where n is an integer equal to or greater than 3). Each layer of the protective layer includes silicon oxynitride or silicon nitride, and two adjacent layers layer have different chemical compositions. The first layer has a refractive index smaller than that of the upper electrode and the nth layer has a refractive index larger than that of the adhesive layer. The refractive index (k) of the kth layer satisfies a relationship: refractive index (k?1)>refractive index (k).

Abstract: A method includes the steps of providing a carrier comprising a plurality of cavities; placing at least one semiconductor element into each of the cavities; filling the plurality of cavities with a packaging material; and removing the carrier.

Abstract: In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

Abstract: A semiconductor device is made by forming a first conductive layer over a sacrificial carrier. A conductive pillar is formed over the first conductive layer. An active surface of a semiconductor die is mounted to the carrier. An encapsulant is deposited over the semiconductor die and around the conductive pillar. The carrier and adhesive layer are removed. A stress relief insulating layer is formed over the active surface of the semiconductor die and a first surface of the encapsulant. The stress relief insulating layer has a first thickness over the semiconductor die and a second thickness less than the first thickness over the encapsulant. A first interconnect structure is formed over the stress relief insulating layer. A second interconnect structure is formed over a second surface of encapsulant opposite the first interconnect structure. The first and second interconnect structures are electrically connected through the conductive pillar.

Abstract: A light emitting device having an encapsulant with scattering features to tailor the spatial emission pattern and color temperature uniformity of the output profile. The encapsulant is formed with materials having light scattering properties. The concentration of these light scatterers is varied spatially within the encapsulant and/or on the surface of the encapsulant. The regions having a high density of scatterers are arranged in the encapsulant to interact with light entering the encapsulant over a desired range of source emission angles. By increasing the probability that light from a particular range of emission angles will experience at least one scattering event, both the intensity and color temperature profiles of the output light beam can be tuned.

Abstract: Embodiments of the invention explore solution-based deposition of a cathode for an OLED structure. A typical embodiment of the invention may include a method performed according to the following steps: Glass substrates including deposited Indium Tin-Oxide (ITO) are prepared. The substrates are subjected to ultrasonic cleaning with deionized water and organic solvents. Features are etched into the ITO using high concentration HCl solution. A hole injecting layer is deposited by spin coater. The layer is annealed on a hot plate, then a polyphenylene vinylene (PPV) polymer is deposited by spin coater and annealed on a hot plate. Low work function cathode metal is then deposited in an electroless solution and annealed on a hot plate. The device is encapsulated.

Abstract: By introducing new concepts into a structure of a conventional organic semiconductor element and without using a conventional ultra thin film, an organic semiconductor element is provided which is more reliable and has higher yield. Further, efficiency is improved particularly in a photoelectronic device using an organic semiconductor. Between an anode and a cathode, there is provided an organic structure including alternately laminated organic thin film layer (functional organic thin film layer) realizing various functions by making an SCLC flow, and a conductive thin film layer (ohmic conductive thin film layer) imbued with a dark conductivity by doping it with an acceptor and a donor, or by the like method.

Abstract: According to one embodiment, an organic EL device includes an insulative substrate, a switching element above the insulative substrate, an insulation film above the switching element and includes a contact hole reaching the switching element, a pixel electrode above the insulation film and includes a contact portion extending into the contact hole and electrically connected to the switching element, an organic layer extending over the pixel electrode including the contact portion, and extending over the insulation film in a vicinity of the pixel electrode, and a counter-electrode above the organic layer.

Abstract: An organic light emitting diode (OLED) display and a method of manufacturing the same are provided. The OLED display includes: a substrate main body; an OLED that is formed on the substrate main body; a hydrophilic polymer layer that is formed on the substrate main body to cover the OLED and that includes a hydrophilic surface having an angle of contact within a range of larger than 0° and smaller than or equal to 50°; and an inorganic protective layer that is formed on the hydrophilic surface of the hydrophilic polymer layer.

Abstract: There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.