Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

Abstract: Provided are a laminated chip composite resistor combining a thermistor and a varistor, and a preparation method thereof. The composite resistor comprises a varistor part, a transition layer part and a thermistor part overlapped sequentially, wherein the varistor part is formed by alternately laminating a ceramic layer of a varistor, a first electrode layer, another ceramic layer of a varistor and a second electrode layer; the thermistor part is formed by alternately laminating a ceramic layer of a thermistor, a third electrode layer, another ceramic layer of a thermistor and a fourth electrode layer; and the transition layer part is located between the thermistor part and the varistor part. Co-firing is employed and the base metal Ni is the main material of inner electrodes, which can reduce costs, simplify the preparation process, and improve the reliability.

Abstract: A mold (30), which has a first region (10) comprising an electroceramic material and a second region (20) comprising a structural ceramic material, is provided. A heating device with this mold is also specified. Furthermore, a method for producing a mold is provided.

Abstract: An electrical component having a base body includes a layer stack of mutually overlapping, electrically conductive electrode layers that are separated from one another by electrically conductive ceramic layers. The electrically conductive ceramic layers are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient. The electrically conductive ceramic layers are produced of ceramic green films that are sintered in common with the electrode layers, and outside electrodes that are electrically conductively connected to the electrode layers are arranged at two opposite outside surfaces of the base body. A method for the manufacture of the component and to the employment of the component is also provided.

Abstract: A method for bonding an electrically conductive silicon carbide structure to an electrically conductive siliconized silicon carbide structure by temporarily securing the siliconized silicon carbide structure to the silicon carbide structure; placing the silicon carbide structure with secured siliconized silicon carbide structure into an induction heating furnace having an induction coil which heats electrically conductive material in the furnace when sufficient electrical power at a frequency of from about 300 to about 1000 KC is passed through the coil; and causing sufficient electrical power at a frequency of from about 300 to about 1000 KC to be passed through the coil to raise the temperature of the siliconized silicon carbide structure and silicon carbide structure to a temperature above about 1500° C.

Abstract: Thermistor elements composed mainly of a metal oxide sintered body are prepared by mixing a metal oxide precursor in a liquid phase to prepare a solution or slurry of the precursor. The precursor solution or slurry is sprayed to form droplet particles which are heat treated to form a thermistor raw material powder which powder is then molded and sintered into a shape to provide a metal oxide sintered body.

Abstract: A resistor,which is solidified from a melt, is provided for a refractory shaped body, and includes a refractory mineral metal-oxide main component having elasticizers of a general formula A2+B3+2O4 in an amount so that solubility of the main component for the elasticizer is exceeded with the elisticizers providing precipitation areas in the main component. The resistor is produced by a joint melting of the main component with oxides which form the elasticizers. A process is provided for the production of the resistor.

Abstract: A method for manufacturing a ceramic resistor wherein the resisting material of the resistor is a ceramic material prepared by a method comprising the steps of providing four or more types of substance, compound, or composite as starting raw materials, admixing the starting raw materials, forming the resultant mixture, and firing the formed material, characterized in that the admixing step is carried out in a mixing vessel (1) by the use of a first agitating blade (2) as a means for allowing the starting materials to flow over the whole mixing vessel and a second agitating blade (3) as a means for diaggregating the aggregates of the starting materials. The method can be employed for suppressing the variation of resistance values.

Abstract: A process for the production of electrical circuits which include resistors (1) contacted by noble metals and electrically connected by way of conductor tracks of copper, and possibly dielectrics, wherein at least the contacts (2) of the resistors of noble metal and the adjoining conductor tracks (4) of copper are produced by applying pastes and sintering thereof, and wherein the operation of sintering the conductor tracks of copper is effected at temperatures below 850° C. and below the temperature at which copper forms a eutectic with the noble metal, in a nitrogen atmosphere, and there is an electrically conductive separating layer (5) between noble metal contacts (2) and conductor track (4).

Abstract: A process for producing a monolithic ceramic electronic component, which includes: providing a ceramic slurry, a conductive paste, and a ceramic paste; forming a plurality of composite structures each comprising a ceramic green sheet produced by shaping the ceramic slurry, internal circuit element films formed by applying the conductive paste partially onto a main surface of the ceramic green sheet so as to provide step-like sections, and a ceramic green layer which compensates for spaces defined by the step-like sections, the ceramic green layer being formed by applying the ceramic paste onto the region on the main surface of the sheet on which the element films are not formed, so as to substantially compensate for the spaces; forming a green laminate by laminating the composite structures; and firing the green laminate, wherein the ceramic paste contains ceramic powder, an organic solvent, and an organic binder.

Abstract: A method of manufacturing a multilayer ceramic device includes forming first and second glass-ceramic green sheets from a ceramic material containing glass by laminating the material to form a green sheet laminate having a cavity with an open surface at one surface thereof. Then, shrinkage-suppressing layers which are formed with shrinkage-suppressing inorganic material having a higher sintering temperature than the ceramic material are applied over the surfaces of the green sheet laminate. Thus, a composite laminate is obtained. Then, the composite laminate is pressed in the laminating direction such that the bottom portion of the cavity receives the same amount of pressure as the surrounding region of the cavity via an opening. Then, the composite laminate is fired, and the shrinkage-suppressing layers are removed.

Abstract: The invention provides spacers for separating and supporting a faceplate structure and a backplate structure in a flat panel display, and methods for fabricating these spacers. Each spacer is typically made of ceramic, such as alumina, containing transition metal oxide, such as titania, chromia or iron oxide. Each spacer can be fabricated with an electrically insulating core and electrically resistive skins. The insulating core can be a wafer formed of ceramic such as alumina, and the resistive skins can be formed by laminating electrically resistive wafers, formed from alumina containing transition metal oxide, to the outside surfaces of the insulating core. Each spacer can also have a core of electrically insulating ceramic composition made of a ceramic containing a transition metal oxide in its higher oxide states, and electrically resistive outside surfaces made of a ceramic containing a transition metal oxide in lower oxide states.

Abstract: In order to produce a ceramic heater for an oxygen sensor, a method is used, which comprises the steps of: (a) molding a green cylindrical object from a ceramic material which contains a binder; (b) provisionally baking the green cylindrical object at a relatively lower temperature thereby to produce an insufficiently baked cylindrical object, the lower temperature being sufficient for removing the binder from the cylindrical object; (c) printing a heater pattern on a cylindrical surface of the insufficiently baked cylindrical object, the heater pattern being constructed of an electrically conductive material; (d) coating the printed cylindrical surface of the insufficiently baked cylindrical object with a green protection layer thereby to produce a layer-coated cylindrical object; and (e) baking said layer-coated cylindrical object at a relatively higher temperature sufficient for baking the insufficiently baked cylindrical object, the heater pattern and the green protection layer.

Abstract: A method of manufacturing a resistor integrated in a sintered body, by patterning a plurality of metal thin films which are formed by a thin film forming method, thereafter transferring the patterned metal thin films onto a ceramic green sheet (11), stacking another ceramic green sheet and/or a ceramic green sheet stacked with another metal thin film thereon for obtaining a laminate, and firing the resulting laminate, thereby forming a resistor integrated in a sintered body which is structured by by alloying the plurality of metal thin films in a ceramic sintered body.

Abstract: The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of:A. providing a green electronic component;B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component;C. placing the green electronic component in the opening in the stack to form a structure; andD. laminating and firing the structure so as to provide the monolithic electronic structure.