Having Patterned Metal Electrical Conductor Other Than Electrode (e.g., Printed Circuit, Etc.) Patents (Class 264/619)
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Patent number: 12049428Abstract: A baking slurry composition of the present invention contains an amino alcohol compound represented by formula, inorganic powder , a polyvinyl alcohol resin, and water. In the formula, R is a hydrogen atom or an alkyl group having a carbon number larger than or equal to 1 and smaller than or equal to 20, and m and n being values satisfying conditions m?0, n?0, and m+n?1.Type: GrantFiled: March 13, 2019Date of Patent: July 30, 2024Assignee: GOO CHEMICAL CO., LTD.Inventor: Yutaka Kawai
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Patent number: 11926570Abstract: A composite sintered body includes a base material that includes ceramic as a main component, and an electrode arranged inside the base material or on a surface of the base material. The electrode contains W and ZrO2.Type: GrantFiled: August 20, 2021Date of Patent: March 12, 2024Assignee: NGK INSULATORS, LTD.Inventors: Kyohei Atsuji, Keita Miyanishi, Asumi Nagai, Hirofumi Yamaguchi
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Patent number: 11309203Abstract: A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.Type: GrantFiled: July 1, 2019Date of Patent: April 19, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kazuyuki Tomizawa, Masashi Kikuchi, Michio Ishikawa, Takafumi Noguchi, Kazuhiro Yamamuro
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Patent number: 10796855Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.Type: GrantFiled: November 8, 2018Date of Patent: October 6, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Hyung Kang, Yong Koo Kim, Hyung Kyu Kim, Won Hee Yoo, Jong Hyun Cho, Byung Kil Yun, Seok Kyoon Woo, Hyun Sung Dong
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Publication number: 20140306382Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate with a plurality of micro-channels. First and second material compositions are provided. The first material composition is coated over the substrate and micro-channels and then removed from the substrate surface but not the micro-channels. The second material composition is coated over the substrate, in the micro-channels, and over the first materials, and then removed from the substrate surface but not the micro-channels. The first and second material compositions are cured in the micro-channels in a common step to form a cured first material layer and a cured second material layer in the micro-channels. The cured first material layer and the cured second material layer form an electrically conductive multi-layer micro-wire in each micro-channel.Type: ApplicationFiled: April 16, 2013Publication date: October 16, 2014Inventor: Ronald Steven Cok
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Publication number: 20140251667Abstract: Among other things, self-assembled conductive networks are formed on a surface of substrate containing through holes. The conductive network having a pattern is formed such that at least some of the conductive material in the conductive network reaches into the holes and, sometimes, even the opposite surface of the substrate through the holes. The network on the surface of the substrate electrically connects to the conductive material in the holes with good conductance.Type: ApplicationFiled: October 29, 2012Publication date: September 11, 2014Applicant: CIMA NANOTECH ISRAEL LTD.Inventors: Eric L. Granstrom, Arkady Garbar, Lorenzo Mangolini
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Publication number: 20140196936Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the respective first and second internal electrodes; and first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes.Type: ApplicationFiled: March 15, 2013Publication date: July 17, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Pyo HONG, Hyun Hee GU, Doo Young KIM, Young Ghyu AHN, Chang Hoon KIM
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Publication number: 20140196944Abstract: A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one conductor track to the base layer. A further amount of a pre-ceramic substance is introduced into the mold onto at least a partial region of the conductor track. A top region of the receptacle is formed directly on the base layer while at least partially covering over the conductor track by molding the further pre-ceramic substance in the injection mold. The method also includes debinding and sintering the molded body. The method forms a receptacle for a sensor element that has conductor tracks lying on the inside and incorporated in a gas-tight manner in a ceramic body.Type: ApplicationFiled: January 10, 2014Publication date: July 17, 2014Applicant: Robert Bosch GmbHInventors: Thomas Loibl, Imke Heeren
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Patent number: 8647560Abstract: A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.Type: GrantFiled: April 11, 2011Date of Patent: February 11, 2014Assignee: Brother Kogyo Kabushiki KaishaInventor: Hiroto Sugahara
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Patent number: 8435440Abstract: A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.Type: GrantFiled: April 25, 2006Date of Patent: May 7, 2013Assignee: Brother Kogyo Kabushiki KaishaInventor: Hiroto Sugahara
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Publication number: 20120329633Abstract: Provided is a mono- or multilayer ceramic substrate which exhibits a high flexural strength. The substrate contains a sintered ceramic which includes respective crystal phases of quartz, alumina, fresnoite, sanbornite, and celsian, in which the relationship between the diffraction peak intensity A in the (201) plane of the fresnoite and the diffraction peak intensity B in the (110) plane of the quartz, measured by a powder X-ray diffractometry in the range of the diffraction peak angle 2?=10 to 40°, is A/B?2.5. The fresnoite crystal phase preferably has an average crystal grain size of 5 ?m or less. In firing to obtain this ceramic sintered body, the maximum temperature falls within the range of 980 to 1000° C.Type: ApplicationFiled: August 6, 2012Publication date: December 27, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Machiko Motoya, Takahiro Sumi, Tsuyoshi Katsube, Yoichi Moriya
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Publication number: 20110005810Abstract: An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an electrically conductive material powder, and a stress relaxation layer 4 formed on the other side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an alloy powder or a mixed powder to be formed into a metal composite. The wiring layer 3 is formed of a spark sintered body of a powder selected from the group consisting of an Al powder, a Cu powder, an Ag powder, and an Au powder. The stress relaxation layer 4 is formed of a spark plasma sintered body of a powder selected from the group consisting of an Al—Si alloy powder, a mixed powder of a Cu powder and an Mo powder, a mixed powder of a Cu powder and a W powder, a mixed powder of an Al powder and an SiC powder, and a mixed powder of an Si powder and an SiC powder.Type: ApplicationFiled: March 19, 2009Publication date: January 13, 2011Applicant: Showa Denko K.K.Inventors: Daisuke Uneno, Koji Hisayuki
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Patent number: 7736772Abstract: This invention relates to a stack comprising a continuous solid-phase matrix and tubular fuel cells embedded in the matrix. Each fuel cell comprises an inner electrode layer, an outer electrode layer, and an electrolyte layer sandwiched between the inner and outer electrode layers. The matrix is sufficiently porous to allow a first reactant to flow through the matrix and to the outer electrode of each fuel cell, and have sufficient mechanical strength to support the fuel cells in the stack. The fuel cells are embedded such that a second reactant may be flowed through the inside of each tubular fuel cell and to the inner electrode thereof. Alternatively, a stack of tubular separation membranes or a stack of tubular membrane reactors may be embedded in the matrix. The matrix material may comprise solid state foam, metal filament, or metal, cermet, or ceramic wool.Type: GrantFiled: February 14, 2003Date of Patent: June 15, 2010Assignee: Alberta Research Council, Inc.Inventors: Partho Sarkar, Hongsang Rho
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Patent number: 7722797Abstract: A method is disclosed for producing a ceramic substrate made of base that includes a stack of layers. Each layer in the stack includes a non-sintered ceramic material and a binder. The method includes debinding the layers in a temperature interval of TE1-TE3, where TE1 is a minimum debinding temperature and TE3>TE1, and sintering the layers at a temperature TS, where TS?TE3. Debinding and sintering are performed in a same furnace, and a temperature T of the base does not fall below TE1 during debinding and sintering.Type: GrantFiled: August 4, 2003Date of Patent: May 25, 2010Assignee: EPCOS AGInventors: Anke Althoff, Holger Grabner
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Patent number: 7682998Abstract: Provided is a ceramic powder for a green sheet that gives a low-temperature fired ceramic substrate that can be fired at a temperature of 900° C. or lower and has excellent dielectric properties in the higher frequency bands such as microwave and millimeter-wave bands, has a low hygroscopicity, and has minor warping and creasing even in the case of co-firing with a silver-based conductor paste, the ceramic powder for a green sheet including a glass powder and an alumina powder, in which the glass powder contains 35 to 39% by weight of SiO2, 9 to 17% by weight of Al2O3, 21 to 40% by weight of B2O3, 10 to 20% by weight of R?O, wherein R? is one or more kinds selected from the group consisting of Mg, Ca and Ba, 0.2 to 2% by weight of Li2O, and 0.5 to 2% by weight of MO2, wherein M is one or more kinds selected from the group consisting of Ti and Zr, so that the total is 100% by weight.Type: GrantFiled: February 5, 2008Date of Patent: March 23, 2010Assignee: Mitsubishi Electric CorporationInventors: Ayumi Nozaki, Akira Yamada, Kiyoshi Saito
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Patent number: 7632451Abstract: The print head and screen assembly of a Semi-Automatic Screen Printer is raised above its normal printing height and selective attachment of several different fixtures on the nest plate for holding the substrate in a desired position during a screen printing operation for printing gold on LTCC substrates.Type: GrantFiled: October 8, 2004Date of Patent: December 15, 2009Assignee: Northrop Grumman CorporationInventors: Marissa A. O'Donnell, Cynthia W. Berry, Rena Y. Jacobson, Wayne A. Smythe, Glenn A. Cooke, Shane H. Dennison, Robert H. Fisher
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Patent number: 7547407Abstract: A manufacturing method for a sintered body having a metallic member buried therein is provided, and includes forming an alumina sintered body, forming a metallic member by printing a printing paste including a refractory metal on the alumina sintered body, forming a green alumina compact on the metallic member, and sintering the alumina compact, the metallic member, and the alumina sintered body or the alumina presintered body.Type: GrantFiled: May 31, 2005Date of Patent: June 16, 2009Assignee: NGK Insulators, Ltd.Inventors: Hiroto Matsuda, Kazuhiro Nobori, Yutaka Mori
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Patent number: 7413699Abstract: A ceramic electronic element having improved the continuity of inner electrode layers while suppressing the decrease in adhesion between its dielectric layers and inner electrode layers and the deterioration in functions of the inner electrode layers, and a method of making the same are provided. In the method of making a ceramic capacitor (10) in accordance with the present invention, an electrode paste (22) is applied to a surface (20a) of a green sheet (20) and fired, so as to form a dielectric layer (12) laminated with an electrode layer (14). Since the electrode paste (22) is doped with a BaTiO3 powder, the adhesion between the dielectric layer (22) and inner electrode layer (14) after firing is significantly restrained from lowering, and the sintering start temperature of the electrode paste (22) is close to that of the green sheet (20).Type: GrantFiled: September 17, 2004Date of Patent: August 19, 2008Assignee: TDK CorporationInventors: Shuichi Miura, Tetsuji Maruno, Kazuhiko Oda, Akira Sasaki, Kouji Tanaka
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Patent number: 7396785Abstract: A ceramic substrate composition is provided which can be co-fired with a low-melting metal and exhibits excellent dielectric characteristics at high frequencies, particularly tens of gigahertz. The ceramic substrate composition mainly contains a glass represented by aB2O3-bRe2O3-cZnO, wherein the molar ratios (a, b, and c) fall within a region defined in a ternary composition diagram by Point A (0.4, 0.595, 0.005), Point B (0.4, 0.25, 0.35), Point C (0.52, 0.01, 0.47), Point D (0.9, 0.005, 0.095), and Point E (0.9, 0.09, 0.01).Type: GrantFiled: September 1, 2004Date of Patent: July 8, 2008Assignee: Murata Manufacturing Co. LtdInventors: Takahiro Takada, Hirobumi Yamamoto, Keisuke Kageyama
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Publication number: 20080044685Abstract: This invention discloses novel nanocomposite material structures which are strong, highly conductive, and fatigue-resistant. It also discloses novel fabrication techniques to obtain such structures. The new nanocomposite materials comprise a high-conductivity base metal, such as copper, incorporating high-conductivity dispersoid particles that simultaneously minimize field enhancements, maintain good thermal conductivity, and enhance mechanical strength. The use of metal nanoparticles with electrical conductivity comparable to that of the base automatically removes the regions of higher RF field and enhanced current density. Additionally, conductive nanoparticles will reduce the surface's sensitivity to arc or sputtering damage. If the surface is sputtered away to uncover the nanoparticles, their properties will not be dramatically different from the base surface.Type: ApplicationFiled: December 23, 2004Publication date: February 21, 2008Inventor: Sungho Jin
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Patent number: 6986865Abstract: A method for manufacturing an electrostatic chuck is disclosed wherein a sintered ceramic body having a dielectric layer made from Alumina (Al2O2) and Titanium Nitride (TiN) having a specific range of particle size is heat treated in an oxygen-rich environment in order to produce a uniform dielectric layer having no pores or micro-cracks.Type: GrantFiled: July 10, 2002Date of Patent: January 17, 2006Assignee: Watlow Electric Manufacturing CompanyInventors: Hongy Lin, Jason Eugene Smith, Thomas Michael Laskowski
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Patent number: 6964718Abstract: Co-fired multilayer piezoelectric ceramic materials with base metal electrodes based on copper, copper alloy, are found as an effective approach to manufacture low cost multilayer piezoelectrics. The method of the invention is performed at low firing temperature and without the oxidation of base metal or reduction of ceramic components. A variety of ceramic materials may be used and copper is the preferred base metal in the multi-layer piezoelectric devices of the invention. This copper has additional protection against oxidation with a small inorganic coating on the surface. With such protection, the binder and other organics can also be efficiently removed and produce superior performance in the piezoelectric structured devices.Type: GrantFiled: November 16, 2001Date of Patent: November 15, 2005Assignee: The Penn State Research FoundationInventors: Clive A. Randall, Amanda L. Baker, Yi Fang, Thomas Shrout, Alfons Kelnberger
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Patent number: 6841343Abstract: Organic solvent-based photothermographic materials comprise one or more mercaptotriazoles represented by the following Structure I as toner(s): wherein R1 and R2 independently represent hydrogen, or an alkyl, aryl, aralkyl, alkenyl, cycloalkyl, or aromatic or non-aromatic heterocyclyl group, M is hydrogen or a cation, or R1 and R2 taken together can form a saturated or unsaturated heterocyclic ring, or still again, R1 and R2 taken together can represent a divalent linking group, provided that R1 and R2 are not simultaneously hydrogen or an unsubstituted phenyl group, and further provided that when R2 is hydrogen, R1 is not a methyl or phenyl group having a solubilizing substituent.Type: GrantFiled: July 11, 2002Date of Patent: January 11, 2005Assignee: Eastman Kodak CompanyInventors: Doreen C. Lynch, Stacy M. Ulrich, Chaofeng Zou
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Patent number: 6824907Abstract: This invention relates to a fuel cell sub-stack comprising a plurality of tubular fuel cells, and a solid-state matrix in which the fuel cells are embedded. Each fuel cell comprises an inner electrode layer, an outer electrode layer, and an electrolyte layer sandwiched between the inner and outer electrode layers. The matrix is electronic or mixed (electronic and ionic) conductive, porous enough for a first reactant to flow through the matrix and to the outer electrode of each fuel cell, and strong enough to support the fuel cells in the stack. The fuel cells are embedded such that a second reactant may be flowed through the inside of each tubular fuel cell and to the inner electrode thereof. The sub-stack may be combined with other sub-stacks to form a fuel cell stack.Type: GrantFiled: February 14, 2002Date of Patent: November 30, 2004Assignee: Alberta Reasearch Council, Inc.Inventors: Partho Sarkar, Hongsang Rho
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Publication number: 20040097359Abstract: The purpose of the present invention is to provide a method for manufacturing a ceramic substrate hardly causing cracks and damages and the like attributed to pushing pressure and the like since the strength of the above-mentioned ceramic substrate is higher than that of a conventional one even in the case of manufacturing a large size ceramic substrate capable of placing a semiconductor wafer with a large diameter and the like. The present invention is to provide a method for manufacturing a ceramic substrate having a conductor formed on the surface thereof or internally thereof, including the steps of: firing a formed body containing a ceramic powder to produce a primary sintered body; and performing an annealing process to the primary sintered body at a temperature of 1400° C. to 1800° C., after the preceding step.Type: ApplicationFiled: September 27, 2002Publication date: May 20, 2004Inventors: Yasuji Hiramatsu, Yasutaka Ito
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Patent number: 6667256Abstract: When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.Type: GrantFiled: May 2, 2003Date of Patent: December 23, 2003Assignee: Murata Manufacturing Co., Ltd.Inventor: Kenji Masuko
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Patent number: 6641775Abstract: Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower melting point metals and alloys.Type: GrantFiled: December 3, 2001Date of Patent: November 4, 2003Assignee: NanoProducts CorporationInventors: Anthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Publication number: 20030173719Abstract: A process for the production of electrical circuits which include resistors (1) contacted by noble metals and electrically connected by way of conductor tracks of copper, and possibly dielectrics, wherein at least the contacts (2) of the resistors of noble metal and the adjoining conductor tracks (4) of copper are produced by applying pastes and sintering thereof, and wherein the operation of sintering the conductor tracks of copper is effected at temperatures below 850° C. and below the temperature at which copper forms a eutectic with the noble metal, in a nitrogen atmosphere, and there is an electrically conductive separating layer (5) between noble metal contacts (2) and conductor track (4).Type: ApplicationFiled: March 13, 2003Publication date: September 18, 2003Inventor: Klaus-Peter Wilczek
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Patent number: 6613270Abstract: A novel process of the production and processing of high quality, high Tc BSCCO or (Bi,Pb)SCCO superconductors starts with fabrication of a forming a bundle including a plurality of billets, each billet containing at least one filament comprising a dominant amount of an tetragonal BSCCO phase with selected intermediate phases, and substantially surrounded by a constraining metal. The bundle is thermomechanically consolidated to form a multifilamentary precursor article by applying pressure and heat to the bundle under conditions cooperatively selected to cause interdiffusion of said constraining metal at the interfaces between said metal and said filaments and substantially complete elimination of voids in said bundle, and the consolidation step is completed before any high strain longitudinal deformation is performed on the bundle.Type: GrantFiled: May 30, 2000Date of Patent: September 2, 2003Assignee: American Superconductor CorporationInventors: Qi Li, Gilbert N. Riley, Jr., Lawrence J. Masur, Eric R. Podtburg, Ronald D. Parella, Martin W. Rupich, Donald R. Parker, William L. Carter, William J. Rosati, Mark D. Teplitsky
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Patent number: 6610621Abstract: When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.Type: GrantFiled: November 28, 2001Date of Patent: August 26, 2003Assignee: Murata Manufacturing Co., Ltd.Inventor: Kenji Masuko
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Patent number: 6551427Abstract: The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of theType: GrantFiled: March 11, 2002Date of Patent: April 22, 2003Assignee: Murata Manufacturing Co. Ltd.Inventors: Sadaaki Sakamoto, Hirofumi Sunahara
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Patent number: 6544090Abstract: A method for chemically etching of a foam glass layer to provide at least one cavity pattern in the foam glass layer. The method utilizes a substrate with at least one major surface suitable for receiving a glass layer. At least one layer of a glass paste composition in then applied onto the major surface of the substrate. The substrate and glass paste composition are then heated to a temperature sufficient enough to obtain a foam glass layer bonded to the major surface of the substrate. At least a portion of the foam glass layer is chemically etched to obtain at least one cavity pattern in the foam glass layer. The chemical etching of the foam glass layer results in an anisotropic etching rate.Type: GrantFiled: June 16, 2000Date of Patent: April 8, 2003Assignee: E. I. du Pont de Nemours and CompanyInventors: Paul R. Anderson, Charles J. Barnhart, Randall J. Cutcher, Jill M. Wyse
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Patent number: 6514453Abstract: This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. devices in which one or more materials have the domain size precision engineered to less than 500 nanometers, preferably to dimensions less than the domain sizes where quantum confinement effects become significant and modify the electrical or thermal properties of the materials. The invention can be used to monitor absolute values of and changes in temperature of gases, inorganic and organic liquids, solids, suspensions, and mixtures of one or more of the said phases. The invention can be used to monitor radiation, power, heat and mass flow, charge and momentum flow, and phase transformation.Type: GrantFiled: February 17, 1998Date of Patent: February 4, 2003Assignee: NanoProducts CorporationInventors: Anthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Patent number: 6471805Abstract: A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.Type: GrantFiled: November 4, 1999Date of Patent: October 29, 2002Assignee: Sarnoff CorporationInventors: Barry Jay Thaler, Ashok Narayan Prabhu
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Publication number: 20020146523Abstract: Very thin cast ceramic tape, preferably approximately 12 &mgr;m in thickness, is wrapped, preferably in a reversing spiral or helix, around a mandrel, preferably a mandrel made of steel and coated with a wax releasing agent, for so many times, preferably five or greater, as achieves a desired thickness of a tube wall, preferably about 100 &mgr;m. The green ceramic tube is then laminated in a pressure laminator, preferably a hydrostatic laminator at 3000 to 5000 psi, linking polymer chains between each ceramic layer, cross-linking polymer chains within each ceramic layer, and densifying the produced ceramic laminate tube by reducing porosity.Type: ApplicationFiled: April 5, 2001Publication date: October 10, 2002Inventors: Alan D. Devoe, Mary Trinh
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Patent number: 6444066Abstract: A highly reliable ceramic electronic device is manufactured by suppressing diffusion of silver, the ceramic device having a silver-based conductive pattern on a sintered glass ceramic compact primarily composed of BaO—TiO2—ReO3/2 dielectric ceramic powder. A method for manufacturing the ceramic electronic device involves the steps of blending BaO—TiO2—ReO3/2 dielectric ceramic powder and glass powder to form a powdered glass ceramic mixture, in which Re is a rare-earth element, molding the powdered glass ceramic mixture to form a glass ceramic compact having a predetermined shape, forming a silver-based conductive pattern on the glass ceramic compact, and heating the glass ceramic compact provided with the silver-based pattern at a heating rate of at least about 10° C./minute from a temperature of at least about 500° C., in which the total baking time at the temperature of at least about 500° C. is set to be about 20 to 90 minutes.Type: GrantFiled: August 30, 2000Date of Patent: September 3, 2002Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasutaka Sugimoto
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Patent number: 6436332Abstract: The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO3, SrTiO3 and Ta2O5 produce the most effective results.Type: GrantFiled: November 2, 2000Date of Patent: August 20, 2002Assignee: International Business Machines CorporationInventors: Benjamin V. Fasano, Robert A. Rita
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Publication number: 20020063365Abstract: Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower melting point metals and alloys.Type: ApplicationFiled: December 3, 2001Publication date: May 30, 2002Inventors: Anthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Patent number: 6395118Abstract: The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body-with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of theType: GrantFiled: May 31, 2000Date of Patent: May 28, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Sadaaki Sakamoto, Hirofumi Sunahara
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Patent number: 6319343Abstract: Ceramic green sheets of controlled microporosity and method of making same have been provided. Controlled microporosity is achieved by including certain ionic species in the ceramic composition, particularly boron, phosphorus and copper oxide.Type: GrantFiled: September 11, 1996Date of Patent: November 20, 2001Assignee: International Business Machines CorporationInventors: Cynthia N. Felisberto, Stephen A. Milkovich, Robert Wolff Nufer
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Patent number: 6270716Abstract: A process for the production of dielectric porcelain composition includes: a first step of admixing Bi2O3 and CuO with a BaO—TiO2—ReO{fraction (3/2)} main material, wherein Re is a lanthanoid element, to give a material mixture; a second step of calcining the material mixture at a temperature of 950° C. or higher; a third step of milling the calcined material mixture to a mean particle diameter of about 2.0 &mgr;m or less; a fourth step of admixing a B2O3—SiO2 glass component and CuO with the milled material mixture to give a material for a dielectric porcelain composition; and a fifth step of forming the material into a target shape and firing the shaped material at a temperature of 1000° C. or lower. The obtained dielectric porcelain composition is sinterable at low temperatures and has a high specific dielectric constant and Q-value and a satisfactory thermostability.Type: GrantFiled: November 30, 1999Date of Patent: August 7, 2001Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasutaka Sugimoto
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Publication number: 20010009314Abstract: This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. devices in which one or more materials have the domain size precision engineered to less than 500 nanometers, preferably to dimensions less than the domain sizes where quantum confinement effects become significant and modify the electrical or thermal properties of the materials. The invention can be used to monitor absolute values of and changes in temperature of gases, inorganic and organic liquids, solids, suspensions, and mixtures of one or more of the said phases. The invention can be used to monitor radiation, power, heat and mass flow, charge and momentum flow, and phase transformation.Type: ApplicationFiled: February 17, 1998Publication date: July 26, 2001Inventors: ANTHONY VIGLIOTTI, TAPESH YADAV, CLAYTON KOSTELECKY, CARRIE WYSE
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Patent number: 6254819Abstract: A method of making an ink jet printer channel member for use in ink delivery includes molding piezoelectric ceramic powders into a slab in the green state having top and bottom surfaces, forming alternating grooves on the top and bottom surfaces of the green state slab which provides peaks and valleys in opposite sides of the green state slab, wherein the valleys in the top surface are disposed in an offset relationship to the peaks in the bottom surface, sintering and poling the grooved green state slab; and forming electrically conductive surfaces on the exposed top and bottom surfaces of the sintered state slab. A slot is then cut through the top conductive layer in each of the valleys in the top surface of the grooved sintered green state slab. An orifice plate is positioned over the conductive surface on the top peak surfaces of the slotted sintered slab and a substrate on the conductive surface on the bottom peak surfaces to produce the ink jet printer channel member.Type: GrantFiled: July 16, 1999Date of Patent: July 3, 2001Assignee: Eastman Kodak CompanyInventors: Dilip K. Chatterjee, Donn B. Carlton, David L. Sime, Syamal K. Ghosh
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Patent number: 6242075Abstract: A multilayer ceramic device has top and bottom green ceramic layers machined and fired. Intermediate green ceramic layers are machined, have conductors laid down in the machined areas, are laminated, and are fired to form an enclosure layer. The areas of the layers which will be in contact with each other are coated with a bonding agent. The layers are aligned and bonded to form a structure having arbitrarily shaped, interior channels adjacent to the top and bottom layers which are not subject to detrimental nonplanarities.Type: GrantFiled: November 20, 1998Date of Patent: June 5, 2001Assignee: Hewlett-Packard CompanyInventors: Clinton C. Chao, Daniel J. Miller, Hubert A. VanderPlas
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Patent number: 6217821Abstract: A method of forming a distortion-free circuit whereby a conductive composition is applied to at least one layer of green ceramic tape. The conductive composition formulation is based on total composition, conductive powder selected from Ag, Pd, Pt and mixtures thereof and 0.5 to 1.5 wt. % boron; wherein a and b are dispersed in organic medium. The green tape formulation is, based on total composition, 25-50 wt. % glass composition comprising, based on mole %, 50-67% B2O3; 20-50% alkaline earth metal oxide; 2-15% rare earth oxide and 0-6% alkali metal oxide and 0-10% Al2O3; 50-75 wt. % refractory oxide and organic polymeric binder. The assemblage is fired to form a distortion-free circuit.Type: GrantFiled: June 2, 1999Date of Patent: April 17, 2001Assignee: E. I. du Pont de Nemours and CompanyInventor: Paul C. Donohue
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Patent number: 6174489Abstract: A method for manufacturing an oxygen sensor unit of the type which includes at least a shaped body of a solid electrolyte, an inner electrode provided on an inside surface of the shaped body and exposed to a reference gas, an outer electrode provided on an outside surface of the shaped body and exposed to a gas to be measured, and a porous protective layer covering the outer electrode and a portion of the shaped body adjoining to said outer electrode wherein the solid electrolyte is made of a mixture of zirconia and a stabilizer therefor and is constituted of a sintered product of partially stabilized zirconia. The method is characterized in that the partially stabilized, sintered zirconia is obtained according to a high temperature sintering process which includes at least the step of sintering the mixture at a temperature of 1200° C.Type: GrantFiled: August 26, 1998Date of Patent: January 16, 2001Assignee: Denso CorporationInventors: Kiyomi Kobayashi, Naoto Miwa, Toshitaka Saito, Hiromi Sano, Namitsugu Fujii
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Patent number: 5989484Abstract: A multilayer glass ceramic substrate having a plurality of conductor layers each laminated through a glass ceramic layer. The glass ceramic layer has a composition comprising of alumina, borosilicate magnesium glass and cordierite crystal produced by chemical reaction between alumina and borosilicate magnesium glass. The content of alumina is 12 to 59.6 wt %, the content of borosilicate magnesium glass is 18 to 69.6 wt %, the content of the cordierite crystal is 1 to 50 wt % and the sum of components is 100 wt %. The multilayer glass ceramic substrate shows improved mechanical strength.Type: GrantFiled: December 24, 1997Date of Patent: November 23, 1999Assignee: NEC CorporationInventors: Kazuhiro Ikuina, Yuzo Shimada
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Patent number: 5985068Abstract: A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method.Type: GrantFiled: February 28, 1997Date of Patent: November 16, 1999Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiroyuki Kawakami, Yoshiaki Kohno, Noriyuki Kubodera
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Patent number: 5948193Abstract: Greensheets having enhanced flexibility and strength are prepared from a greensheet casting composition comprising alumina or other ceramic having a mean particle size of less than about 1 micron and being substantially unimodal, a binder resin, a solvent system and a plasticizer. The greensheets may be formed having a thickness of about 50 microns using conventional greensheet fabricating devices. The greensheets are particularly suitable as dielectric layers for internal layer capacitors in a multilayer ceramic substrate. A preferred co-sintering heating profile to avoid blistering of the MLC package is also provided to form the capacitor containing MLC.Type: GrantFiled: June 30, 1997Date of Patent: September 7, 1999Assignee: International Business Machines CorporationInventors: Michael A. Cohn, Jon A. Casey, Christopher N. Collins, Robert A. Rita, Robert J. Sullivan, Adrienne M. Tirch, Leslie J. Wiands, Ryan W. Wuthrich
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Patent number: 5932043Abstract: A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500.degree. C.Type: GrantFiled: March 18, 1997Date of Patent: August 3, 1999Assignee: International Business Machines CorporationInventors: Richard Allen Bates, Carla Natalia Cordero, Benjamin Vito Fasano, David Brian Goland, Robert Hannon, Lester Wynn Herron, Gregory Marvin Johnson, Andrew Michael Reitter, Subhash Laxman Shinde, Lisa Michelle Studzinski