Abstract: A substrate holder including: a main body having a main body surface; a plurality of burls projecting from the main body surface and configured for supporting the substrate; and an edge seal projecting from the main body surface, wherein: the edge seal is spaced apart from the plurality of burls so as to define a gap therebetween, the gap having a width greater than or equal to about 75% of a pitch of the plurality of burls; the plurality of burls includes a first group of burls and a second group of burls surrounding the first group of burls; and the stiffness in the direction perpendicular to the support plane per unit area of the second group of burls is greater than or equal to about 150% of the stiffness in the direction perpendicular to the support plane per unit area of the first group of burls.

Abstract: A bottom ring is configured to support a moveable edge ring. The edge ring is configured to be raised and lowered relative to a substrate support. The bottom ring includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide channels provided through the bottom ring from the lower surface to the upper surface of the bottom ring. Each of the guide channels includes a first region having a smaller diameter than the guide channel, and the guide channels are configured to receive respective lift pins for raising and lowering the edge ring.

Abstract: A screen tensioning device includes a supporting frame with a mounting surface and a plurality of air floating assemblies arranged on the mounting surface, each of the air floating assemblies includes an air floating base mounted on the mounting surface; a supporting tray arranged on a side of the air floating base away from the mounting surface, the supporting tray includes a first surface facing the air floating base and a second surface disposed opposite to the first surface and for supporting a mask frame; at least one air hole disposed toward the first surface of the supporting tray, so as to float the supporting tray when air is blown; and a limiting component connected between the air floating base and the supporting tray, and for limiting a displacement of the supporting tray in a direction parallel to the mounting surface.

Abstract: A heat treatment unit U2 includes a heat plate 20 configured to place a wafer W thereon and heat the wafer W placed thereon; multiple gap members 22 formed along a front surface 20a of the heat plate 20 on which the wafer W is placed, and configured to support the wafer W to secure a clearance V between the heat plate 20 and the wafer W; a suction unit 70 configured to suck the wafer W toward the heat plate 20; and an elevating pin 51 configured to penetrate the heat plate 20 and configured to be moved up and down to move the wafer W placed on the heat plate 20 up and down. The front surface 20a of the heat plate 20 has a concave region 20d inclined downwards from an outer side toward an inner side thereof.

Abstract: A laser processing apparatus includes a laser beam applying mechanism for applying a laser beam to a workpiece held by a holding mechanism while keeping a converged spot of the laser beam in the workpiece, and a temperature detector for detecting a temperature of the holding mechanism or a temperature of an actuator of a moving mechanism that moves the holding mechanism in a processing feed direction. The laser beam applying mechanism has a converged spot position adjusting unit. The controller, depending on a temperature change detected by the temperature detector, controls the converged spot position adjusting unit to establish a position of the converged spot of the laser beam in a thicknesswise direction of the workpiece.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: In one embodiment, a transfer system is configured to move a portion of a strip within a belt forming system. The transfer system may comprise a first segment comprising a main body adapted to engage a strip. A plurality of slots may be disposed in a surface of the main body. Fluid communication may be provided from a fluid supply to the plurality of slots, such that the fluid communication with the plurality of slots enables holding the strip against the main body or blowing the strip off the main body. The plurality of slots may be arranged in a series of rows, wherein a first slot in a first row is positioned directly adjacent to a second slot in the first row. First and second strips of different dimensions may be transferred without any mechanical adjustments being made to the main body.

Abstract: The present relates to a device and a procedure for the extrusion and application of a spacer profile of insulating glass, particularly for a machine adapted to compose the spacer frame directly against one or more glass panes constituting the insulating glass starting from a thermoplastic product prevalently contained in drums, displacing the extrados thereof to an adjustable and controlled distance referred to the margin of one or more glass panes.

Abstract: A method for manufacturing a semiconductor package structure and a clamp apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; (b) moving a pressing tool transversely to above the package body; and (c) pressing the package body on the chuck through the pressing tool.

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

Abstract: The present invention discloses a multifunctional single wafer soaking-spinning-cleaning device and a wafer processing method. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cleaning device, the device has a spin drive device, a wafer turntable, and a wafer receiving tray. A soaking tank is formed on the wafer receiving tray, and a watertight contact gasket is disposed on the wafer receiving tray to contact the wafer water-tightly such that in the soaking step, an appropriate water level of the liquid medicine can be accumulated to fully soak the wafer.

Abstract: A suction holding table for holding a holdable object under suction includes a base seat rotatable about a rotational axis, and a plurality of holders erected from the base seat and angularly spaced at equal angular intervals along a circle around the rotational axis, in which each of the holders has an upper surface functioning as a holding surface with a suction port defined therein, and attract the holdable object to the holder under a negative pressure applied via the suction port.

Abstract: A material picker assembly is disclosed, including: a connector configured to be attached to an actuator device; and a plurality of picker mechanisms, wherein each picker mechanism includes a suspension element that is configured to absorb impact on the picker mechanism by one or more objects.

Abstract: A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

Abstract: Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.

Abstract: A flotation conveyance apparatus according to an embodiment conveys a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes an upper plate disposed on the substrate side including a plurality of ejecting ports for ejecting the gas and a lower plate disposed under the upper plate. Flow-paths for supplying the gas to the plurality of ejecting ports are provided on at least one of the upper plate and the lower plate.

Abstract: A processing apparatus includes a chuck table for holding a plate-shaped workpiece under suction on a holding surface thereof, a processing unit for processing the workpiece held on the holding surface of the chuck table, and a moving unit for moving a support base supporting the chuck table thereon in a processing-feed direction. The chuck table is formed from a porous material having pores, and has the holding surface and a mountable assembly positioned opposite the holding surface and mountable on an upper surface of the support base. Fluid passages defined in the chuck table for allowing a negative pressure transmitted from the support base to act on the holding surface are provided only by the pores in the porous material.

Abstract: A substrate support apparatus includes a housing and a plurality of spherical supports. The housing has a top surface, the top surface including a plurality of openings. The housing is configured to position the plurality of spherical supports within the plurality of openings so that topmost surfaces of the plurality of spherical supports are arranged in a plane above the top surface. A spherical support of the plurality of spherical supports is rotatable within the housing.

Abstract: A suction box for a gripper includes: a first part made of composite material, a second part made of composite material, the second part including orifices, and a third part connected, on the one hand, to the first part and, on the other hand, to the second part to form at least one cavity of the suction box. The third part is made of composite material. The first part and the third part are connected to each other by bonding. The second part and the third part are connected to each other by bonding.

Abstract: [Object] To provide an electrostatic chuck that stably supports a substrate while suppressing a rapid increase in the volume of a gas, a vacuum processing apparatus, and a substrate processing method. [Solving Means] An electrostatic chuck according to an embodiment of the present invention includes: a chuck plate that has a first surface supporting a substrate and a second surface opposite to the first surface. The chuck plate includes an exhaust passage that exhausts a gas from between the substrate and the first surface, the gas being emitted from the substrate between the substrate and the first surface when the substrate is supported by the first surface.

Abstract: A cutting apparatus comprising a cutting table and a first cutting material belt movably supported about the cutting table about a first roller and a second roller. A second cutting material belt is removably supported above the first cutting material belt about the first roller and a third roller, wherein the second roller is intermediate the first roller and the second roller.

Abstract: Disclosed is a pin lifting device which includes a housing extending along an adjustment axis, a housing end at a first end region of the housing and has a housing opening, a drive part arranged at a second end region of the housing, an adjusting device having a part which can move in the housing in the direction of the adjustment axis, a guide section for the adjusting device formed on the inside of the housing between a first stop at the frontal housing end and a second stop remote therefrom, a tight connecting device formed inside the housing between the frontal housing end and the adjusting device, and a connecting channel extending from the first stop to the second stop at the guide section. A contiguous second inner region leads to minimal changes in the volume of the second inner region even during movements of the movable part.

Abstract: A system for damping machine-induced vibration in a workpiece includes a plurality of workpiece holders to hold the workpiece in a work cell. The system also includes a machine tool located in the work cell. The machine tool performs a machining operation on the workpiece while the workpiece is held by the plurality of workpiece holders. The system further includes a damping apparatus coupled to the workpiece. The damping apparatus controls machine-induced vibrations in the workpiece during the machining operation.

Abstract: An extraction apparatus (20) for a cutting machine (10). The extraction apparatus (20) comprises first and second portions (21, 22) rotatable one relative to the other for angular movement between two opposed positions. A slidable coupling (27) defines a fluid flow path (29) for fluid communication between the first and second portions (21, 22) during said angular movement between the two opposed positions, whereby fluid can flow from the interior (45) of the first portion (21) into the second portion (22). The slidable coupling (27) comprises first and second coupling sections (61, 62) slidable one with respect to the other. The second coupling section (62) is hollow to define an open interior (63). The first coupling section (61) defines a duct (65) opening onto the interior (63) of the second coupling section (62), whereby the duct (65) and the interior (63) of the second coupling section (62) cooperate to define the fluid flow path (29).

Abstract: Aspects of the present disclosure provide a wafer processing device for optimizing wafer shape. For example, the wafer processing device can include a first hot plate, a second hot plate and a controller. The first hot plate can be configured to heat a wafer. For example, the first hot plate can provide uniform heating across a surface of the first hot plate. The second hot plate has multiple heating zones with each heating zone independently controllable such that each heating zone can be set to a temperature value independent of other heating zones. The controller is configured to control the first hot plate to provide the uniform heating, receive a bow measurement from wafer curvature measurement of a wafer, and set the multiple heating zones of the second hot plate to their respective temperature values that correspond to the bow measurement.

Abstract: A vacuum adsorption module includes a supporting block, a carrier installed and positioned on the supporting block, and a plurality of valves installed on the supporting block. The supporting block has a plurality of air connection holes, each row of air connection holes is connected to a total air path formed in the supporting block via a branch air path formed in the supporting block. The carrier has a plurality of air suction holes corresponding to the air connection holes. The valves control closing and opening of the branch air paths between the plurality of rows of air connection holes and the total air path. An adsorption length of the carrier in a column direction of the array is adjustable to match a length of an article to be adsorbed by the carrier by changing a number of the valves to be closed or opened.

Abstract: Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.

Abstract: A heater includes an insulating base, a resistance heating element, and a hollow member. The base includes an upper surface and a lower surface. The resistance heating element extends inside the base along the upper surface and the lower surface. The hollow member includes a first plate-shaped part laid over the lower surface, a second plate-shaped part facing the first plate-shaped part through a space, and a side surface part surrounding the space from an outside in a planar direction of the first plate-shaped part and the second plate-shaped part.

Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.

Abstract: A heat dissipation device includes a heat absorbing member being provided with a first accommodating chamber for accommodating a working medium and a mounting hole in communication with the first accommodating chamber; and a valve installed in the mounting hole. The valve is adjustable between a first state and a second state to change the first accommodating chamber between a closed state and an open state. When the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside so that the working medium can be injected into or discharged from the first accommodating chamber, so as to adjust the amount of the working medium in the first accommodating chamber. Thus, the heat dissipation device is applicable to various applications with different heat dissipating requirements.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A device for stabilizing a workpiece, in particular a thin-walled workpiece mounted in a machine tool, comprises at least one base; and a plurality of stabilizing elements. The stabilizing elements protrude away from one surface of the base, wherein the stabilizing element comprises a cylinder and a rod arranged therein and the rod can be driven hydraulically to move in the axial direction of the stabilizing element such that the rod of at least two of the stabilizing elements can be brought into contact with one surface of the workpiece.

Abstract: The machine tool (1) having a work head (9) adapted to support a tool (21), a workpiece holder (30) having a two substantially parallel beams (31) arranged at a distance adjustable orthogonally to the longitudinal extension of the beams, a carriage (35) on each beam (31) movable along the longitudinal extension of the beam (31), on each carriage (35) a suction cup (39) for blocking the workpieces (P) to be machined. The position of each suction cup (39) with respect to the carriage (35) onto which the cup is mounted is adjustable by rotating around an axis (D-D) which is substantially orthogonal to a blocking surface, for blocking the workpieces, defined by the suction cups (39). To each suction cup (39) an actuator (46, 48) is associated, controlling the rotation of the suction cup (39) with respect to the carriage (35) onto which the cup is mounted.

Abstract: A fruit peeler includes a base and a planing blade. The base includes a first rotating member and a second rotating member rotatable relative to the first rotating member. The first rotating member has a fixed arm that has a first position perpendicular to the first rotating member. One end of the fixed arm is connected to the first rotating member, and another end of the fixed arm has an insertion pin extending toward an inner side direction of the fixed arm and rotatable relative to the fixed arm. The planing blade is mounted on a planer frame that is arranged at the fixed arm, and is connected to the second rotating member. The planer frame has a third position perpendicular to the second rotating member. The planing blade can perform a reciprocating curve movement in an axial direction of the insertion pin when the second rotating member rotates.

Abstract: A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.

Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.

Abstract: Systems and methods are provided for trimming and installation. One embodiment is a system for cutting out portions of a fuselage section. The system includes an Inner Mold Line (IML) tool comprising an inner gripping element configured to apply suction to a portion of the fuselage section, and further comprising an outer gripping element configured to apply suction to an area surrounding the portion, an Outer Mold Line (OML) tool configured to operate a cutter to cut the portion out from the fuselage section while suction is applied to the portion and to the area surrounding the portion, and a track that is disposed between the IML tool and the OML tool, wherein the fuselage section is configured to be pulsed in a process direction along the track, such that the fuselage section remains disposed between the IML tool and the OML tool when pulsed in the process direction.

Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.

Abstract: An insulated glass assembly line generally includes a first and second automated lite picker, a washer, a vertical gas filling and wetting station, a robot, and an applicator station.

Abstract: The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.

Abstract: A mouthpiece for a setting device setting a blind rivet element is disclosed which comprises a hollow, which may be a hollow-cylindrical, body having an abutting end and a central through bore through which a pulling mandrel of the setting device is movable. Further, a first endless sealing is arranged adjacent to the central through bore at the abutting end for abutting at a head portion of the blind rivet element. Additionally, a second endless sealing is arranged radially outwardly of the first endless sealing at the abutting end for abutting at a component. Finally, a fluid channel extends at least partly through the hollow, which may be a hollow-cylindrical, body such that an exit opening is provided between the first and the second endless sealing and an entry opening for supplying a testing fluid is provided, which may be remote to the abutting end.

Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.

Abstract: A carrier device that carries a substrate to a noncontact holder that is configured to support the substrate in a noncontact manner is equipped with: holding pads that hold a part of the substrate at a first position located above the noncontact holder; a drive section that moves downward the holding pads holding the substrate so that the substrate is supported in a noncontact manner by the noncontact holder; and adsorption pads that hold the substrate supported in a noncontact manner by the noncontact holder, after the substrate held by the holding pads is moved by the drive section, wherein the drive section moves the holding pads from the first position to a second position where the substrate can be delivered to the adsorption pads.

Abstract: A chuck for retaining a superstrate or a template. The chuck comprises a geometric structure formed on a surface of the chuck. The geometric structure includes at least one of a rounded edge portion and a roughened surface portion, such that an intensity variation of light transmitting through the geometric structure and an area of the chuck adjacent to the geometric structure is reduced.

Abstract: A grinding equipment includes: a frame which has a central shaft disposed collinearly to one side of the polishing wheel and rotates about the central shaft; a plurality of seating portions which are disposed on the upper side of the frame, each have a space formed in the central portion thereof, seat a workpiece on the upper surfaces thereof, and are arranged radially from the central shaft of the frame; a plurality of vacuum portions which are disposed in the central portions of the plurality of seating portions respectively, seat the workpiece on the upper surfaces thereof, and each have a plurality of flow channels so as to secure the workpiece by suctioning air through the flow channels; and a control unit for controlling the rotation of the frame.

Abstract: Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.

Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus and a plurality of support elements extend from the body and separate each of the plurality of cavities. In one embodiment, a first plurality of ports are formed in a top surface of the body and extend to a bottom surface of the body through one or more of the plurality of support elements. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body. In yet another embodiment, a first electrode assembly is disposed adjacent the top surface of the body within each of the plurality of support elements and a second electrode assembly is disposed within the body adjacent each of the plurality of cavities.

Abstract: An automated sheet material cutting and handling system for producing sheet material articles having a planar shape comprises a cutting surface with a suction hold-down, a suction lifting apparatus, a robotic actuation system for moving the suction lifting apparatus, and a control system for controlling the operation of the cutting device and the suction lifting apparatus. The suction lifting apparatus comprises a suction lifting head including a suction lifting portion comprising a suction lifting plate for applying suction through a plurality of holes in the plate. The control system is configured to operate the cutting device to make at least one cut through the planiform blanks. A resiliently compressible template is adhered to the suction lifting plate. Also, methods.

Abstract: Various embodiments disclosed herein provide for a lip assembly for a vacuum gripper or suction device that is designed to work well with both soft flexible packages and articles with rigid surfaces. The lip assembly can have a compliant or flexible inner lip that soft packages can blossom over when suction is applied, while the outer lip of the lip assembly is also suited to working with hard, rigid packages. The vacuum gripper can be mounted on an end of arm tool of a robotic arm and can therefore be configured to work with a wide variety of packages and package types. The small footprint achieved by having a single vacuum gripper that is able to work with both types of packages enables a better opportunity to pick individual packages at one time and maintain a grasp on the package during medium to high-speed transport.

Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.