Vacuum-type Holding Means Patents (Class 269/21)
  • Patent number: 10537981
    Abstract: An apparatus for picking up and positioning an item includes a vacuum assembly capable of applying a suction force to the item. The apparatus further includes an item engaging plate positioned adjacent the vacuum assembly. The apparatus still further has a blocking member positioned adjacent the vacuum assembly. The blocking member is capable of interrupting the suction force. The blocking member is positionable in a first position allowing the item to be picked up and in a second position interrupting the suction force to assist disengagement of the item.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: January 21, 2020
    Assignee: NIKE, INC.
    Inventors: Kuo-Hung Lee, Yu-Jui Liu, Hung-Yu Wu
  • Patent number: 10527092
    Abstract: A support table, a method of loading a substrate, a lithographic apparatus and a method of manufacturing a device using a lithographic apparatus are disclosed. In one arrangement, a support table is configured to support a substrate. The support table has a base surface. The base surface faces a bottom surface of the substrate when the substrate is supported by the support table. One or more gas cushion members are provided above the base surface. Each of the gas cushion members includes a recess. The recess is shaped and configured such that a lowering of the substrate into a position on the support table at which the substrate is supported by the support table causes a localized build-up of pressure within the recess. The localized build-up of pressure provides a localized gas cushioning effect during the lowering of the substrate.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: January 7, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Siegfried Alexander Tromp, Antonie Hendrik Verweij, Abraham Alexander Soethoudt, Jan Pieter Van De Poel, Mark Constant Johannes Baggen
  • Patent number: 10518421
    Abstract: A universal object holding mechanism for holding three-dimensional objects for printing thereon uses multiple conformable balls mounted within a pattern of holes in a two part back plate. The multiple conformable balls are pressed into an object which in turn is pressed against a datum surface that represents desired spacing away from print heads. Vacuum is applied to the multiple conformable balls which grip the object. The multiple conformable balls are filled with particulates that cause the multiple conformable balls to become rigid when the vacuum is applied. This contributes to keeping the object from moving when it is being moved past a print head.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 31, 2019
    Assignee: Xerox Corporation
    Inventors: Jeffrey J Bradway, Linn C Hoover, Erwin Ruiz, Paul M Fromm
  • Patent number: 10500737
    Abstract: A pick-and-place device for picking a work-piece from a first location to a second location and having force measurement is disclosed. The pick-and-place device comprises: (a) a positive pressure chamber formed among a pick-and-place holder, a force measuring membrane and a cover, wherein a positive pressure is supplied to the positive pressure chamber via a pressure supply inlet provided on the pick-and-place holder, and thus the force measuring membrane is being preloaded; (b) a vacuum chamber formed among the pick-and-place holder, the force measuring membrane and a pick-up membrane, wherein a negative pressure is provided via a vacuum supply inlet provided on the pick-and-place holder, wherein the pick-and-place device provides a pressure difference between the work-piece and the pick-and-place device, enabling a pick-and-place capability.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 10, 2019
    Assignee: AKRIBIS SYSTEMS PTE LTD
    Inventors: Sastra Budiman, Yong Peng Leow
  • Patent number: 10504756
    Abstract: An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 10497605
    Abstract: Embodiments of substrate carriers and method of making the same are provided herein. In some embodiments, a substrate carrier includes a substantially planar body; and a plurality of holding elements arranged on a surface of the substantially planar body, wherein the plurality of holding elements are configured to hold a plurality of substrates on the surface of the substantially planar body, and wherein the plurality of holding elements includes at least three holding elements disposed around a corresponding position of each of the plurality of substrates.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: December 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Vijay D. Parkhe
  • Patent number: 10468288
    Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 5, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Aviv Balan, Luping Huang, Savita Chandan, Chia-Chu Chen, Teck Meriam
  • Patent number: 10449693
    Abstract: A numeric-control work center can be used for carrying out cutting operations or grinding and/or milling operations on plates of stone, marble, or, in general, natural or synthetic stone material, or ceramic material. The work center comprises at least one working head movable along at least two mutually orthogonal horizontal axes on a work surface. The work surface includes a rigid supporting board, which defines a first planar supporting surface, and a series of sacrificial elements rigidly connected to the rigid supporting board. The sacrificial elements are arranged in positions spaced apart from each other and define a second supporting surface located at a higher level than the first planar supporting surface, so that a cutting tool coupled to the working head engraves the sacrificial elements, without interfering with the supporting board during a cutting operation on a plate resting on the sacrificial elements, whichever is the path followed by the cutting tool.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: October 22, 2019
    Assignee: Biesse S.p.A.
    Inventors: Matteo Traini, Marco Belli
  • Patent number: 10442555
    Abstract: A method and apparatus for supporting a structure. The apparatus may comprise a support, a load-balancing structure associated with the support, and a set of connection devices associated with the load-balancing structure. The set of connection devices may be configured to connect to the structure to form a set of control points. Each of the set of connection devices may be configured to independently control a location of a corresponding control point in the set of control points.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 15, 2019
    Assignee: The Boeing Company
    Inventors: Matthew Ray DesJardien, Eric M. Reid, Steven A. Best, Jaeeun Shin
  • Patent number: 10391600
    Abstract: A system and method for orienting a workpiece on an assembly line to prepare the workpiece for an operation is provided. The method includes positioning a flexible fixture on the assembly line. The flexible fixture has a base and at least one adjustable component. The workpiece is positioned on the flexible fixture. A first orientation of the workpiece relative to the flexible fixture is detected with a detection device and transmitted to a calibrator. The calibrator determines a difference between the detected first orientation of the workpiece and a predetermined fixture orientation and transmits instructions from the calibrator to the flexible fixture to move the workpiece from the detected first orientation to the predetermined fixture orientation. The workpiece is moved with the at least one adjustable component into the predetermined fixture orientation and is fixedly held with the adjustable component.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 27, 2019
    Assignee: MAGNA INTERNATIONAL INC.
    Inventors: Alexander Zak, Frank Gabbianelli, Rajesh Angadi
  • Patent number: 10384350
    Abstract: A carrier system and method carries a plate-like object to an object mounting member provided with an object mounting section. The system includes an adjustment device that changes a shape of the plate-like object into a predetermined shape before the plate-like object is mounted onto the object mounting section. The plate-like object whose shape is changed into the predetermined shape is mounted onto the object mounting section.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: August 20, 2019
    Assignee: NIKON CORPORATION
    Inventor: Hideaki Hara
  • Patent number: 10373847
    Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: August 6, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Toshifumi Inamasu
  • Patent number: 10350789
    Abstract: A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool for processing and cutting materials, incorporates suckers able to cause the device to adhere to and be fixed to the materials being machined. Further, a cutting head having a protection device with incorporated suckers, a cutting spindle having a protection device with incorporated suckers and a machine for machining the materials, having a cutting spindle incorporating suckers.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: July 16, 2019
    Assignee: BRETON SPA
    Inventor: Renzo Codemo
  • Patent number: 10335984
    Abstract: Provided is an imprint apparatus for contacting a resin applied to a substrate with a mold to perform patterning on the substrate. The imprint apparatus includes a substrate holding unit for holding the substrate, wherein the substrate holding unit comprises a plurality of holding areas arranged in a predetermined direction, the plurality of holding areas has different width dimension in the direction respectively based on positions in the direction, a surface ratio between two holding areas of the plurality of holding areas with different width dimension respectively is within a range of 0.8 to 1.2.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: July 2, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Byung-jin Choi, Anshuman Cherala, Zhengmao Ye, Xiaoming Lu, Kang Luo, Nobuto Kawahara, Yoshikazu Miyajima
  • Patent number: 10328681
    Abstract: Disclosed is a vacuum laminating device and a method of using such a vacuum laminating device to laminate a first object and a second object together.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: June 25, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Dapeng Wang, Hongwei Cui
  • Patent number: 10323921
    Abstract: A roundness measuring device including: an angle detector detecting a current rotation angle of a table relative to an X axis direction; a joystick (external operator) issuing an instruction for an operation amount of a rotation axis line of the table; a centering controller calculating a CX axis displacement amount and a CY axis displacement amount from the operation amount and the rotation angle, and displacing a CX axis displacement mechanism and CY axis displacement mechanism based on the calculated CX axis displacement amount and CY axis displacement amount; and a centering controller calculating an LX axis tilt amount and an LY axis tilt amount from the operation amount and the rotation angle, and displacing an LX axis tilt mechanism and LY axis tilt mechanism based on the calculated LX axis tilt amount and LY axis tilt amount.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: June 18, 2019
    Assignee: MITUTOYO CORPORATION
    Inventors: Tatsuki Nakayama, Kazushige Ishibashi
  • Patent number: 10319614
    Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: June 11, 2019
    Assignee: E&R ENGINEERING CORP.
    Inventors: Wen Ren Wu, Cho Chun Chung
  • Patent number: 10279456
    Abstract: A universal object holding mechanism for holding three-dimensional objects for printing thereon uses an array of suction cups reciprocally connected to a vacuum box to acquire objects from a staging platen while in a horizontal position and then pivot into a vertical position for movement of the objects past print heads. A plenum connected to the vacuum box is valve controlled to allow a low flow rate to the vacuum box to acquire objects and then a high flow rate pulse to close off all un-sealed suction cups with ball valves.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: May 7, 2019
    Assignee: Xerox Corporation
    Inventors: Paul M Fromm, Jeffrey J Bradway, Erwin Ruiz, Linn C Hoover
  • Patent number: 10259104
    Abstract: A clamp for selectively inhibiting movement of a first object relative to a second object includes (i) a first clamp component coupled to the first object; (ii) a second clamp component coupled to the second object; and (iii) a fluid source that directs a fluid to the second clamp component to create a fluid bearing between the first clamp component and the second clamp component that allows for movement of the first clamp component relative to the second clamp component, and wherein the fluid source directs less fluid to the second clamp component to inhibit relative movement.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: April 16, 2019
    Assignee: NIKON CORPORATION
    Inventors: Fardad A. Hashemi, Travis D. Bow, Patrick Chang
  • Patent number: 10262883
    Abstract: A method of modifying a substrate carrier to improve process performance includes depositing material or fabricating devices on a substrate supported by a substrate carrier. A parameter of layers deposited on the substrate is then measured as a function of their corresponding positions on the substrate carrier. The measured parameter of at least some devices fabricated on the substrate or a property of the deposited layers is related to a physical characteristic of substrate carrier to obtain a plurality of physical characteristics of the substrate carrier corresponding to a plurality of positions on the substrate carrier. The physical characteristic of the substrate carrier is then modified at one or more of the plurality of corresponding positions on the substrate carrier to obtain desired parameters of the deposited layers or fabricated devices as a function of position on the substrate carrier.
    Type: Grant
    Filed: January 10, 2016
    Date of Patent: April 16, 2019
    Assignee: Veeco Instruments Inc.
    Inventors: Joshua Mangum, William E. Quinn
  • Patent number: 10259124
    Abstract: A suction apparatus for an end effector has a main body, which has a through-channel and a contact surface, and a sealing lip. The contact surface has an edge and recesses, wherein the through-channel issues into the recesses and the recesses terminate in front of the edge. The main body has a base portion and a fastening portion, which adjoins the base portion. In the fastening portion connection channels are provided which are in fluid communication with the through-channel and extend from the edge of the fastening portion. An end effector and a method of producing an end effector are also shown.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: April 16, 2019
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventor: Bernhard Bogner
  • Patent number: 10244038
    Abstract: The present application details exemplary methods and systems for providing current state information to multiple active datacenters within a network-based communication system. For example, a datacenter can detect an event that occurs within the network-based communication system. Upon detecting the event, the datacenter can update a state table on the datacenter based on state information associated with the event. In addition, the datacenter can send a state information message to other datacenters in the network-based communication system. The state information message can include state information associated with the event. The other datacenters in the network-based communication system can update their respective state tables using the state information in the state information message without needing to individually process the event.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: March 26, 2019
    Assignee: JIVE COMMUNICATIONS, INC.
    Inventor: Theo Peter Zourzouvillys
  • Patent number: 10204816
    Abstract: A substrate retaining carrier, a method for retaining and separating the substrate, and a method for evaporation are provided. The substrate retaining carrier includes a substrate stage and a movable substrate retaining support device, the substrate retaining support device comprises multiple probes and a probe holder, wherein a first end of each of the probes is provided with a substrate retaining member, and a second end of each of the probes is secured onto the probe holder; the substrate stage is provided with through holes for passage of the probes therein.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: February 12, 2019
    Assignees: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
    Inventors: Xuequan Jin, Chia Hao Chang
  • Patent number: 10199255
    Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologioes AG
    Inventors: Ingo Muri, Alexander Binter, Bernhard Goller, Christian Grindling
  • Patent number: 10196272
    Abstract: Disclosed is an apparatus and method of manufacturing a graphene film, wherein the apparatus includes a wrinkle flattening device configured to flatten wrinkles in a lamination structure including a base substrate and a graphene film laminated on the base substrate; and a first lamination apparatus configured to laminate a first substrate on the graphene film, wherein the wrinkle flattening device applies a vacuum to the base substrate when the wrinkle flattening device is in contact with the base substrate.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: February 5, 2019
    Assignee: Graphene Square, Inc.
    Inventors: Wan Soo Kim, Jung Hee Han, Byung Hee Hong
  • Patent number: 10173392
    Abstract: The present invention pertains to a process for producing an article from a layered hard coat object including a hard coat layer and a transparent-resin film layer in this order from the outermost layer side, the process comprising: a step (A) in which a pressure-sensitive adhesive layer of a support having the pressure-sensitive adhesive layer on at least one surface thereof is temporarily applied to at least one surface of the layered hard coat object to obtain a temporarily support-bearing layered hard coat object; a step (B) in which at least one processing method selected from the group consisting of router processing, water-jet processing, laser processing, and punching is applied to the temporarily support-bearing layered hard coat object to cut the temporarily support-bearing layered hard coat object into a given shape, thereby obtaining a temporarily support-bearing cut article; and a step (C) in which at least one kind of energy selected from the group consisting of heat and actinic rays is applied
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: January 8, 2019
    Assignee: RIKEN TECHNOS CORPORATION
    Inventors: Hiroyuki Tomomatsu, Taketo Hashimoto
  • Patent number: 10157760
    Abstract: A semiconductor manufacturing apparatus comprises a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips, a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator, a pickup unit connected to a movement control unit simultaneously picking up the plurality of semiconductor chips, and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit, the control unit is connected to the movement control unit. The pickup unit converts an interval of the plurality of semiconductor chips to a predetermined pitch and holds the pitch. The pickup unit moves the plurality of semiconductor chips from the stage to mounting positions of a supporting substrate and simultaneously adheres the plurality of semiconductor chips at the mounting positions by the control unit.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: December 18, 2018
    Assignee: J-DEVICES CORPORATION
    Inventor: Minoru Kai
  • Patent number: 10158766
    Abstract: Provided is a scanner having: multiple sensor chips; an optical unit that focuses an image of an A4 document on eighteen or more sensor chips; and a generator that synthesizes images of the A4 document read by the sensor chips, and generates image data.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: December 18, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Takahiro Netsu, Toshifumi Sakai
  • Patent number: 10130971
    Abstract: A device for lacquering or coating a substrate is disclosed. The device includes a substrate plate configured to accommodate said substrate, and one or more suction points connected to, and extending upwardly from, the substrate plate. The one or more suction points may be configured to provide a vacuum to said substrate.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: November 20, 2018
    Assignee: solar-semi GmbH
    Inventor: Pirmin Muffler
  • Patent number: 10128974
    Abstract: An optical receiver module that receives wavelength multiplexed light and a process to assemble the optical receiver module are disclosed. The optical receiver module provides a coupling unit to collimate the wavelength multiplexed light and a device unit that installs an optical de-multiplexer and photodiode elements within housing. The front wall of the housing through which the wavelength multiplexed light passes is polished in a right angle with respect to the bottom of the housing.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: November 13, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masanobu Kawamura, Fumihiro Nakajima, Hiroshi Hara, Michio Suzuki, Yasushi Fujimura, Kazushige Oki
  • Patent number: 10099327
    Abstract: A device for press-fitting an oil seal S that includes a fixing section F in which a hard ring S is embedded and a lip section L into a structure A. The device includes an air hammer AH that includes a hammer head 1. The hammer head 1 includes a pressing section 6 configured to abut the fixing section F and a holding section 7 configured to abut the lip section L, and a negative pressure space 8 is formed between the hammer head AH and the oil seal S between the pressing section 6 and the holding section 7. The hammer head 1 is provided with an air suction path 11 that is open to the negative pressure space 8 at one end and is connected to an air suctioning means 10 at the other end. Accordingly, the device holds by suction the oil seal S having a complicated shape without deforming it, and adequately press-fits it into a structure A.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: October 16, 2018
    Assignee: NISSAN MOTOR CO., LTD.
    Inventor: Tetsunori Iwashita
  • Patent number: 10081108
    Abstract: A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 25, 2018
    Assignee: NIKON CORPORATION
    Inventor: Hideaki Hara
  • Patent number: 10058981
    Abstract: A holding device for holding an element in sheet form 10 during its phase of insertion into a work station 300 of a converting machine 1. The holding device 310 includes a suction member 320 able to partially hold each sheet 10 by its rear portion during insertion of the sheet 10 into the work station 300. The holding device also includes a blower 330 able to flatten the rear portion of each sheet 10 against the suction member 320 during the phase of insertion.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: August 28, 2018
    Assignee: BOBST MEX SA
    Inventors: Paulo Ferreira, Pascal Ramoni
  • Patent number: 10052770
    Abstract: In one aspect, a vacuum alignment tool for holding and aligning a first fastener with a second fastener is provided. The vacuum alignment tool includes a main body including an end wall having an aperture disposed therein configured to receive at least a portion of the first fastener. The vacuum alignment tool also includes a vacuum receiving portion coupled to the main body. The vacuum receiving portion including a vacuum bore disposed therein, wherein a vacuum channel extends within the main body and within the vacuum receiving portion between the aperture and the vacuum bore.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: August 21, 2018
    Assignee: The Boeing Company
    Inventors: John Richard Porter, Daniel Thomas Long, Raymond C. Eng, Bruce J. Hanninen, Kevin Michael Bell
  • Patent number: 10049901
    Abstract: A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: August 14, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee
  • Patent number: 10046471
    Abstract: A vacuum table for securing a sheet of material. The vacuum table includes a top plate that is porous, a perimeter vacuum chamber disposed beneath a perimeter of the top plate, and interior vacuum chambers bound by the perimeter vacuum chamber and disposed beneath a target area of the top plate that is inside the perimeter of the top plate.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: August 14, 2018
    Assignee: The Boeing Company
    Inventors: Daniel David Bloch, Camille Doristine Carter, Nicole Renee Williams, Samuel J. Easley, Eric E. Moyes
  • Patent number: 10035230
    Abstract: A system for machining semi-rigid curved panels includes a fixturing device within an enclosure cell, the cell having a sealable entrance and a sealable exit. A holding table, moveable through the sealable entrance between the inside and outside of the cell, is configured to receive unfinished semi-rigid curved panels. Another holding table, fixed outside of the cell, is configured to receive processed semi-rigid curved panels. A first robot inside the cell transports the semi-rigid curved panels from the first holding table and onto the fixturing device, later transporting the curved panels from the fixturing device onto the second holding table through the sealable exit. A second robot processes the semi-rigid curved panels on the fixturing device. A controller is configured to sequentially actuate first and second robots for transporting and processing the semi-rigid curved panels, and to manage a vacuum clamping system for workpiece retention on the fixturing device.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: July 31, 2018
    Assignee: The Boeing Company
    Inventors: Gary M. Buckus, Paul J. Hixson
  • Patent number: 10022987
    Abstract: In one example, a media support includes a platen and multiple suction cups in the platen. Each suction cup in the platen has a port through which air may be evacuated from the cup.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: July 17, 2018
    Assignee: HP SCITEX LTD.
    Inventors: Yaron Dvori, Yuval Dim, Alex Veis
  • Patent number: 9993960
    Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: June 12, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Daniel David Bloch, Samuel Joseph Easley, Frederick Coleman Wear, Michael Brian Gedera, Nicholas Lee Buelow, Alan Frank Tegeler, William John Keyes, Joshua Bryan Reando
  • Patent number: 9980702
    Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: May 29, 2018
    Assignee: Volcano Corporation
    Inventor: Michael Reiter
  • Patent number: 9968163
    Abstract: A system for manufacturing shoes is provided that includes two or more pieces of equipment used in the customization and manufacturing of shoes and an alignment fixture that may engage with each piece of equipment by way of an alignment mounting member. The alignment fixture may secure to it a portion of a shoe, such as an upper portion, wherein the shoe portion remains in a flat position, and in a fixed relationship to the alignment fixture, throughout the various processes performed by the pieces of equipment. These processes may include, for example, printing, laser, embroidery, forming, cutting, or the like.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 15, 2018
    Assignee: NIKE, Inc.
    Inventors: Tricia Kamakeeaina, Jeremy Petty, Eric Graham, Melody Crisp
  • Patent number: 9966293
    Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 8, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Francisco Javier Santos Rodriguez, Gerald Lackner, Josef Unterweger
  • Patent number: 9956622
    Abstract: A chucking apparatus for a workpiece with honeycomb structure includes a table that can be supplied with vacuum and a clamping plate which can be placed on the table and which accommodates the workpiece in the region of an already profiled surface determined by the face ends of the honeycombs, whose receiving surface, which corresponds to the profiled surface of the workpiece, is provided with suction openings to the table. In order to provide advantageous chucking conditions, the clamping plate has an open-cell structure.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: May 1, 2018
    Assignee: GFM—GmbH
    Inventor: Franz Heidlmayer
  • Patent number: 9951754
    Abstract: In one aspect, a method for assembling a tower section of a lattice tower structure for a wind turbine on a tower assembly fixture may generally include installing a first trolley onto a first fixture arm of the fixture and installing a second trolley onto a second fixture arm of the fixture. In addition, the method may include securing a first support leg of the tower section to the first trolley, securing a second support leg of the tower section to the second trolley and coupling at least one secondary support member between the first and seconds support legs.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 24, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Don Conrad Johnson, Cyler Barclay Beard, Todd D. Andersen, David D. Oliphant, Caroline Christine Williams, Jose Luis Virgen
  • Patent number: 9939736
    Abstract: A substrate table supports a substrate holder to which a substrate is clamped for exposure. The substrate table has a plurality of e-pins spaced apart from and distributed around the center of the substrate holder to receive, and lower, a substrate onto the substrate holder prior to exposure, and to raise a substrate off the substrate holder after exposure. Tip portions of the e-pins and the corresponding apertures in the substrate holder have a shape in plan including at least one re-entrant, e.g. a cross shape.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: April 10, 2018
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Martijn Houben, Thomas Poiesz
  • Patent number: 9936690
    Abstract: A method and apparatus for the processing of tissue and cellular material during cryopreservation and/or processing for microscopy. The method and apparatus maximizes heat transfer coefficients by using liquid-free cryopreservation protocols and maximizing glass transition characteristics through increasing pressure during cryopreservation. Cooling rates combined with megapascal pressures reduced the required concentration of cryoprotective agents (CPAs) needed for ice-free cell and tissue cryopreservation.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: April 10, 2018
    Assignee: BOARD OF TRUSTEES OF NORTHERN ILLINOIS UNIVERSITY
    Inventor: James Dale Benson
  • Patent number: 9921267
    Abstract: Provided is an apparatus for testing a semiconductor. The apparatus includes a chuck on which a wafer is disposed, a probe card disposed on the chuck to provide a test signal to the wafer, a sensor disposed in the probe card, a base unit connected to the probe card to transmit the test signal to the probe card, and a pressure device connecting the base unit to the probe card, the pressure device correcting deformation of the probe card.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: March 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangboo Kang, MinJung Kim
  • Patent number: 9917000
    Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: March 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Roland Rupp, Ronny Kern, Josef Unterweger
  • Patent number: 9896801
    Abstract: The invention relates to an apparatus and method for cutting a material web in a papermaking machine. The apparatus includes a cutting device, an upper holding device and an upper positioning device. The cutting device is fixed above the upper positioning device on the upper holding device such that it can be moved in the cross-machine direction. The apparatus additionally has an air guide box and the air guide box is fixed above the material web, likewise on the upper holding device. Furthermore, the apparatus has a cutting table fixed to a lower holding device via a first and/or a second lower positioning device. The cutting table is movable substantially vertically with respect to the material web via the first lower positioning device and/or movable in the cross-machine direction via the second lower positioning device.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 20, 2018
    Assignee: PAPRIMA INDUSTRIES INC.
    Inventor: Roman C. Caspar
  • Patent number: 9876217
    Abstract: A battery electrode manufacturing apparatus including: a front end die which cuts a strip-shaped electrode material into an electrode shape; a hand which grasps the electrode material and conveys the electrode material to the cutting position of the front end die; and a first suction conveyor which is disposed upstream of the front end die in a conveying direction and has a supporting surface for supporting the electrode material during the cutting by the front end die. The hand includes a first grasper and a second grasper, and the first suction conveyor is disposed between the first grasper and the second grasper. The hand carries the electrode material to the cutting position, at such a position that the electrode material does not contact the front end die and the first suction conveyor.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: January 23, 2018
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Masashi Watanabe, Hiroshi Yuhara, Manabu Yamashita