Vacuum-type Holding Means Patents (Class 269/21)
  • Patent number: 9751172
    Abstract: The workpiece fastening device of the present invention comprises a table on which a workpiece is placed, an arm which can move so as to press a workpiece on the table against the table, and a drive part which drives the arm. The arm of the workpiece fastening device comprises a connection member which is connected to the drive part, and a rotary member which is attached to the connection member to be able to rotate about a rotation axis which extends in a direction intersecting with a movement direction of the arm. The rotary member of the arm has first and second pressing parts which are arranged at the opposite sides of the rotation axis and presses a workpiece on the table against the table by the first and second pressing parts.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: September 5, 2017
    Assignee: FANUC CORPORATION
    Inventors: Yoshiaki Dohi, Naoki Akagawa
  • Patent number: 9741593
    Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: August 22, 2017
    Assignee: Applied Materials, Inc.
    Inventors: David Benjaminson, Dmitry Lubomirsky
  • Patent number: 9741599
    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: August 22, 2017
    Assignee: Cascade Microtech, Inc.
    Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
  • Patent number: 9724806
    Abstract: A device for clamping a workpiece (P) to a workbench (T) includes a body (1) containing a vacuum-generating element. The body (1) has a lower cavity (2) open at the bottom and positioned in the vicinity of a face for securing to the workbench (T). The lower cavity (2) forms a vacuum reserve, this vacuum reserve being connected by a substantially straight duct (6) to an upper face for securing a workpiece (P).
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: August 8, 2017
    Assignee: THIBAUT SAS
    Inventors: Jacques Thibaut, Christophe Thibaut
  • Patent number: 9713918
    Abstract: An evaporation device includes a carrier stage, a base and a light source. The carrier stage is placed on the base; the base provides with a vacuum pin; the vacuum pin can move with respect to the base; the carrier stage provides with a pin hole; the vacuum pin can pass through the pin hole to absorb a substrate. A side of the carrier stage away from the base is coated with a photosensitive adhesive, the light source is used to irradiate the photosensitive adhesive between carrier stage and the substrate in order to decrease the adhesiveness of the photosensitive adhesive so that the substrate and the carrier stage can be separated smoothly in order to achieve a small deformation and improve the product yield rate. The evaporation method can achieve a small deformation and improve the product yield rate when separating the substrate and the spacing pad.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: July 25, 2017
    Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd
    Inventor: Junying Mu
  • Patent number: 9701872
    Abstract: A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: July 11, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Paul F. Fortier, Stephane Harel, Simon LaFlamme, Roch Thivierge
  • Patent number: 9694572
    Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: July 4, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shintaro Sugihara, Hajime Furuya, Goro Furutani, Yasunobu Iwamoto
  • Patent number: 9594312
    Abstract: A processing apparatus that performs processing to a wafer is provided, the processing apparatus comprising a wafer chuck disposed on a stage and that holds the wafer; three pins that attract the wafer and move the wafer from the wafer chuck; and a control unit that is configured to stop or decrease the attraction of the three pins based on information about a through hole of the wafer when the wafer is moved from the wafer chuck by the three pins.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: March 14, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shinichi Hirano
  • Patent number: 9580199
    Abstract: There is disclosed a container processing machine comprising a material handling surface for handling a sheet-like material through suction and a vacuum source in fluid connection with said material handling surface, the machine including means for detecting and transmitting a value of pressure of the gas being suctioned; a controllably operable flow valve; a control unit operatively connected with said detection and transmission means and with said flow valve; said detection and transmission means and said flow valve being arranged between said vacuum source and said material handling surface; said control unit being programmed to adjust the degree of opening of said flow valve in response to a signal which is a function of at least said value of pressure.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: February 28, 2017
    Assignee: SIDEL S.p.A. con Socio Unico
    Inventors: Alessandro Gorbi, Luca Venturini, James Carmichael
  • Patent number: 9568682
    Abstract: A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: February 14, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski, Stephan L. Martel, Jean-Francois Morissette
  • Patent number: 9555913
    Abstract: An apparatus and method for automatically modulating vacuum applied to a vacuum cup are described herein. More particularly an automated labeling apparatus and method for applying labels onto containers using a vacuum based transport mechanism is described herein.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: January 31, 2017
    Assignee: NuLabel Technologies, Inc.
    Inventors: Randy Peckham, Benjamin David Lux
  • Patent number: 9551169
    Abstract: A vacuum based apparatus that will, when activated, inhibit relocation of a computing device. The apparatus includes a first surface of a main body. A suction cup is attached to the main body. The suction cup faces outward from and protrudes from the first surface. The suction cup is connected to a vacuum pump and activation of the vacuum pump generates adhesion between the suction cup and another surface that is in contact with the suction cup. A spacer is attached to and protrudes outward from the first surface. The spacer surrounds at least a part of the suction cup that is protruding from the first surface. A control logic that controls the activation of the vacuum pump.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: January 24, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Giuseppe Longobardi, Scot MacLellan
  • Patent number: 9539801
    Abstract: A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: January 10, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
  • Patent number: 9533484
    Abstract: A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: January 3, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Steve Canale, David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong Yong Lee
  • Patent number: 9464362
    Abstract: A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center surrounded by a support, the cover plate comprising an electrical conductor surrounding the open center and with at least one of the overlapping cavities of the wafer plating jig base.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: October 11, 2016
    Assignee: DECA Technologies Inc.
    Inventors: Christopher M. Scanlan, Ferdinand Aldas, Kenneth C. Blaisdell, Cheryl R. Abanes
  • Patent number: 9457478
    Abstract: A surface area vacuum gripper for sucking and handling workpieces, comprising a housing, in which a negative pressure vacuum chamber is provided that can be subjected to negative pressure and wherein the housing includes suction openings on the suction side, facing the workpiece. An insertion element is provided in the housing, which reduces the free inner space of the housing and includes vacuum channels fed by a vacuum generator. The insertion element can be equipped with a plurality of optional functions.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: October 4, 2016
    Assignee: J. Schmalz GmbH
    Inventors: Leonhard Harter, Ken Steyerl
  • Patent number: 9421638
    Abstract: A laser processing apparatus is provided in which its XY table is composed of plural divided blocks vertically movable, at least one divided block is stopped while it is moving down, and a through hole is formed by irradiating a workpiece in an area corresponding to a position directly above the divided block with a laser beam.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: August 23, 2016
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yoshinori Nakagawa, Mitsuo Hara
  • Patent number: 9401283
    Abstract: A substrate treatment method includes the steps of: supporting a substrate with a support member; arranging an extension surface such that the extension surface laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate supported by the support member; rotating the substrate supported by the support member; and etching the substrate by supplying an etching liquid onto the major surface of the substrate supported by the support member, wherein the extension surface has higher affinity for the etching liquid than the major surface of the substrate supported by the support member.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: July 26, 2016
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kenichiro Arai, Kazunari Nada
  • Patent number: 9385017
    Abstract: Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate having an outer perimeter, an opening inside of the outer perimeter, and a gap extending between the opening and the outer perimeter. The lift plate includes annular rims of different inner diameters and that are configured to respectively support the first and second workpieces.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: July 5, 2016
    Assignee: Nordson Corporation
    Inventors: James P. Fazio, David K. Foote, James D. Getty
  • Patent number: 9373451
    Abstract: An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: June 21, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Katsunori Ogata, Miyuki Mizukami
  • Patent number: 9352432
    Abstract: A tool for machining a curved profile along an axis of rotation X, said curved profile comprising at least one first section along a plane perpendicular to the axis of rotation X and at least one second section parallel to the axis of rotation X. The tool includes blocks, each having a clamping surface against which the profile can take support. The blocks include positioning elements against which the first section and the second section of the profile can take support, and an apparatus arranged to immobilize the profile which is adapted to occupy a first activated state, wherein it immobilizes the profile, and a second deactivated state, wherein it does not immobilize the profile. The tool includes manual presses for maintaining the profile flattened against the positioning elements until the profile immobilizing apparatus is in the activated state.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 31, 2016
    Assignee: Airbus Operations SAS
    Inventor: Denis De Mattia
  • Patent number: 9347771
    Abstract: A partial spherical shape of each measurement area of a sphere to be measured, which is established so as to have an area overlapping with another measurement area adjacent to each other, is measured at each rotation position, and the surface shape is measured by joining the partial spherical shapes of the measurement areas by a stitching operation based on the shape of the overlapping area. The position at which the sphere is measured is changed and re-held. A positional displacement between half parts of the sphere before and after re-holding, which is caused by an effect of an error owing to the re-holding, is separated into three rotational components. Magnitudes of the three rotational components are quantified by image correlation and the positional displacement corrected. Then, the stitching operation is performed to measure the entire part of the sphere surface.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: May 24, 2016
    Assignee: MITUTOYO CORPORATION
    Inventors: Takeshi Hagino, Yuichiro Yokoyama
  • Patent number: 9347989
    Abstract: A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: May 24, 2016
    Assignee: CHROMA ATE INC.
    Inventors: Chien-Ming Chen, Meng-Kung Lu
  • Patent number: 9347761
    Abstract: A two way roundness device can be configured as a device in which a tool, such as an indicator rotates or as a device in which the part to be measured or cut rotates. This ability to alternate between these two configurations is enabled by a combination of a rotating spindle assembly and a two-axis stage that can be oriented, in use, with the two-axis stage under the spindle assembly or with the two-axis stage on top of the spindle assembly.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: May 24, 2016
    Assignee: Cedarflat Precision Inc.
    Inventor: Darcy Thomas Montgomery
  • Patent number: 9327466
    Abstract: Tool for transporting and shaping flexible laminar parts, which comprises a chamber 1 having a flexible and impermeable wall, with a bottom 3 provided with though holes 6. The chamber 1 houses a flexible and impermeable plate, a rigid plate 4, which reproduces the final three-dimensional shape that the flexible laminar part 5 has to adopt, and a suction tube 8.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: May 3, 2016
    Assignee: SIMPLICITY WORKS EUROPE, S.L.
    Inventor: Adrian Hernandez Hernandez
  • Patent number: 9330954
    Abstract: Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: May 3, 2016
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Ilyas Mohammed
  • Patent number: 9316876
    Abstract: The present invention relates an aligning voltage applying device and a method for applying an aligning voltage. The aligning voltage applying device includes a base, probe pins, and a pressing plate module. The pressing plate module includes a pressing plate and a driving unit. The aligning voltage applying device and the method for applying the aligning voltage of the present invention can make the probe pins contact pads effectively without damage to the probe pins and an LCD substrate.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: April 19, 2016
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Shengpeng Mo
  • Patent number: 9267732
    Abstract: Embodiments relates to a refrigerator that makes it possible to improve water supply performance by disposing an air exhaust unit in a water supply channel connected to the output side of a pump supplying water from a water tank to an ice maker or a dispenser, and effectively return water remaining when the use of dispenser is finished, by using an opening/closing member in the water supply channel, and a water tank for a refrigerator.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: February 23, 2016
    Assignee: LG ELECTRONICS INC.
    Inventor: Sung Kyoung Kim
  • Patent number: 9261553
    Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: February 16, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Eiichi Shinohara, Munetoshi Nagasaka, Isamu Inomata, Kazuya Yano, Yoshiyasu Kato
  • Patent number: 9242187
    Abstract: A new and useful improvement in starting blocks and starting block anchoring devices for use at the line of start of a track either indoors or outdoors. The inventive starting block anchor is comprised of a vacuum suction device operatively and releasably attaches to an interface that also operatively and releasably attaches to a track and field starting block of various configurations.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: January 26, 2016
    Inventor: Michael C. Ford
  • Patent number: 9233452
    Abstract: Hard-material, flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached with vacuum to the flexible elastomeric membrane of a wafer carrier that allows one surface of the workpiece to be in conformal abrading contact with a moving flat-surfaced abrasive. The elastomeric membrane external wafer attachment surface has a pattern of recessed vacuum grooves and vacuum is supplied to the grooves to firmly attach the rigid-material silicon wafer in flat-surfaced contact with the membrane. The attached wafer seals the vacuum grooves and also provides lateral stiffness to the center portion of the membrane. An outer annular extension of the flexible elastomer membrane maintains the wafer at its original membrane-centered location when abrading forces are applied to the rotating wafer. The rotating wafer peripheral edge does not contact a rigid retaining ring during a wafer polishing procedure.
    Type: Grant
    Filed: August 31, 2014
    Date of Patent: January 12, 2016
    Inventors: Wayne O. Duescher, Cameron M. Duescher
  • Patent number: 9214373
    Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: December 15, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Hao Hsu, Kipling Yeh, Chia-Ching Huang
  • Patent number: 9214591
    Abstract: The invention relates to a device for securing solar cells to glass surfaces, the securing device comprising a film of encapsulation material containing a plurality of holes and troughs in the film surface. Solar cells disposed on the film can be secured to a glass surface as a result of a vacuum being generated in the troughs and holes. The invention also relates to a method for securing solar cells in solar module production.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: December 15, 2015
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Harry Wirth
  • Patent number: 9194822
    Abstract: An adjustable fixture structure for a 3D X-ray CT device is disclosed. Only the detected article is fixed on the fixture element of the adjustable fixture structure, may the adjustable connecting element slide with respect to the adjustable sliding trough and the fixture element slide with respect to the fixture sliding trough, so that the detected article is adjusted into within the detection range of the 3D X-ray CT device by using the adjustable connecting element and the fixture element. As such, the issues which a detected article is difficult to be oriented and positioned, a detection efficacy and result is poor, and the detected article might thus be damaged, may be well overcome.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: November 24, 2015
    Assignee: YUAN ZE UNIVERSITY
    Inventors: Cheng-En Ho, Cheng-Hsien Yang, Ling-Huang Hsu
  • Patent number: 9149882
    Abstract: A method and system for a preheating step of a wave soldering process. A bottom side preheater is positioned underneath a PCB and a thermal carrier is positioned adjacent the PCB. A top side heater may also be used. The PCB includes one or more through holes, and an electronic component having one or more pins is mounted on the PCB so that each pin is positioned in a corresponding through hole. The bottom side preheater directs heat to the bottom surface of the PCB, thereby heating the bottom surface via heat convection. The thermal carrier directs heated air laterally across the top surface of the PCB to increase a heat transfer at the top surface without increasing the temperature of the electronic component, thereby reducing a temperature differential between the top and bottom surfaces.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: October 6, 2015
    Assignee: Flextronics AP, LLC
    Inventors: Omar Garcia Lopez, Enrique Avelar Secada, Dason Cheung, Murad Kurwa
  • Patent number: 9085980
    Abstract: A method is provided for repairing a turbine component with a distressed portion. The method includes machining the turbine component into a first intermediate turbine article such that the distressed portion is removed; and rebuilding the first intermediate turbine article into the turbine component with an additive manufacturing process.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: July 21, 2015
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Don Mittendorf, Daniel Ryan, Donald G. Godfrey, Mark C. Morris, Harry Kington
  • Patent number: 9067365
    Abstract: The invention relates to a positioning device (203) for a manual welding machine (300), particularly for a plastic welding machine, comprising at least one contact shield (16) associated with the manual welding machine (300) and a positioning ring (3) associated with the material to be welded. In order to perform precise welding and to prevent the subsequent slipping of the manual welding machine (300), according to the invention, the positioning ring (3) can be fixed to the material to be welded and a contact shield (16) that can be inserted in the positioning ring (3) transfers a pressure distributed evenly over the circumference to the materials to be welded, in order to allow secure welding over a large area.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: June 30, 2015
    Assignee: Plasticon Germany GmbH
    Inventor: Hermann Van Laak
  • Publication number: 20150145547
    Abstract: A probe apparatus includes a card clamp unit detachably supporting a probe card; and a wafer mounting table adsorbing the semiconductor wafer and bringing electrodes on the semiconductor wafer into contact with the probes. In order to mount the semiconductor wafer including an annular portion protruding from a rear surface of an outer peripheral portion and a thin portion having a thickness smaller than the annular portion, the wafer mounting table includes a planar portion on which the thin portion is mounted; and a step-shaped portion which is formed at an edge of the planar portion and mounts the annular portion thereon. Multiple circular vacuum chuck grooves are concentrically formed in the planar portion, and at least some of the vacuum chuck grooves are connected to multiple vacuum paths through which vacuum evacuation is performed at multiple positions separated from each other by 90° or more along a circumferential direction.
    Type: Application
    Filed: April 25, 2013
    Publication date: May 28, 2015
    Inventors: Kazuya Yano, Eiji Hayashi, Munetoshi Nagasaka
  • Patent number: 9038264
    Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: May 26, 2015
    Assignees: SanDisk Semiconductor (Shanghai) Co., Ltd., SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Pradeep Kumar Rai, Kim Lee Bock, Li Wang, JinXiang Huang, EnYong Tai, JianHua Wang, King Hoo Ong
  • Patent number: 9016342
    Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 28, 2015
    Assignee: Apic Yamada Corporation
    Inventor: Kazuhiko Kobayashi
  • Patent number: 9016675
    Abstract: An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: April 28, 2015
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Chi Wah Cheng, Lap Kei Chow, Chi Hang Leung
  • Patent number: 9004479
    Abstract: A ski tip hold down assembly for holding the tip end of the ski. The ski tip hold down assembly having a base attached to a work bench and an upright stand affixed to the base. The upright stand having a ski rest on a top surface thereof and a ski tip hold down bar secured to the upright stand in spaced apart relation to the ski rest defining an opening adapted to receive a ski tip, with the ski oriented in a base-up configuration, with the ski tip extending underneath the ski tip hold down bar. The apparatus further including a tail rest assembly having a base adapted to be used on the work bench in spaced apart relation to the ski tip hold down assembly and further including an upright stand affixed to the base with a ski rest provided on a top surface thereof.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: April 14, 2015
    Inventor: Aldrich C. Fisher
  • Publication number: 20150091230
    Abstract: In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 2, 2015
    Inventors: Mahadevan GanapathiSubramanian, Mario Johannes Meissl, Avinash Panga, Byung-Jin Choi
  • Publication number: 20150089791
    Abstract: The described embodiments relate to adjustable fixtures. A number of adjustable length cylindrical pins can be utilized to form a conformal support structure in accordance with a workpiece having any number of variations. At least three fixed length pins having heights lower than the adjustable length pins, can be interspersed with the adjustable length cylindrical pins to define an orientation at which the workpiece is held. Because the adjustable length pins have an uncompressed height greater than the fixed length pins, each of the adjustable length pins can be compressed in accordance with a bottom surface of the workpiece when the workpiece is pressed against the fixed length pin. In this way a conformal support structure can be formed that supports the workpiece during a machining operation.
    Type: Application
    Filed: March 24, 2014
    Publication date: April 2, 2015
    Applicant: Apple Inc.
    Inventors: Charles H. Werner, JR., Erik J. Gjøvik, Alexander H. Slocum
  • Patent number: 8979046
    Abstract: A vacuum suction device of the present invention comprises: a cover which is rotatably mounted on the upper portion so as to couple to a flat surface by means of vacuum suction; an suction plate, which is coupled to the lower portion of the cover, for vacuum suction to the flat surface; and a height adjustment member, which is arranged between the cover and the suction plate, for moving the suction plate back and forth according to the rotation of the cover; wherein a plurality of fixing pieces are formed on the upper surface of the inside of the cover, a plurality of elastic stoppers are coupled to the inside of the height adjustment member, so as to be movable by sliding when each of the fixing pieces is in contact, and for fixing the cover by each of the fixing pieces being hooked to the end portion of the cover so as to prevent reverse rotation.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: March 17, 2015
    Inventor: Chul Seok Woo
  • Publication number: 20150068372
    Abstract: A plate configured to contact a web includes a first region having a first characteristic and a second region having a second characteristic different than the first characteristic. The plate has a substantially arcuate wall with an inner surface and an outer surface. A plurality of vacuum holes extends between the inner and outer surfaces and are configured to be in fluid communication with a vacuum source. A vacuum region is adapted to contact the first region of the web and a reduced-vacuum region is adapted to receive the second region of the web. The plurality of vacuum holes are configured such that, when attached to the vacuum source, a vacuum pressure at the vacuum region is greater than a pressure at the reduced-vacuum region so that the first region of the web is held against the plate with a greater force than the second region.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 12, 2015
    Inventors: Patrick Dean Abney, Paul Douglas Beuther, Kevin Dolan, David John Enz
  • Patent number: 8976336
    Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: March 10, 2015
    Assignee: ASML Holding N.V.
    Inventors: Samir A. Nayfeh, Mark Edd Williams, Justin Matthew Verdirame
  • Patent number: 8967608
    Abstract: A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: March 3, 2015
    Assignee: Asahi Glass Company, Limited
    Inventors: Takahiro Mitsumori, Takeru Kinoshita, Hirotoshi Ise
  • Publication number: 20150053350
    Abstract: A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.
    Type: Application
    Filed: April 25, 2014
    Publication date: February 26, 2015
    Inventors: ILYOUNG HAN, KYOUNGRAN KIM, DONGGIL SHIM, YOUNGJOO LEE, BYUNGGON KIM, BYEONGKAP CHOI
  • Patent number: 8960686
    Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: February 24, 2015
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Robert A. Ferguson