Abstract: Disclosed is a vacuum fixture. The vacuum fixture may include a base plate assembly, a middle frame assembly, and a top plate assembly. The base plate assembly may have a first hinged edge. The middle frame assembly may be connected to the base plate proximate the first hinged edge and may define a void. The top plate assembly may have a second hinged edge connected to the first hinged edge, such that when the top plate assembly is in a closed position the middle frame assembly is located in between and contacts a first surface of the base plate assembly and a first surface of the top plate assembly, thereby forming a cavity in between the base plate assembly and the top plate assembly.

Abstract: An object detection system utilizes a teach cycle performed with a low-pressure blow-off (i.e. positive pressure) instead of vacuum (negative pressure). During the teach operation, the positive pressure is enabled and the nozzle is lowered to the object. An air sensor detects pressure or flow at the nozzle tip. A rise in pressure or drop in flow is detected as the nozzle makes contact with the object (i.e. just before or just after actual physical contact is made). The height of the object is stored as the taught height to be used subsequently in repetitive operations by the machine. This teaching method is particularly useful for very small objects because the positive pressure does not lift the object.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.

Abstract: A substrate suction stage including a substrate support unit having a top surface, a cavity formed therein, an ejection hole formed therein and extending from the cavity to the top surface, and a suction hole formed therein for connecting the ejection hole and the top surface, and a gas supply unit for supplying gas into the cavity, wherein the ejection hole surrounds the suction hole in plan view, and when gas is supplied into the cavity, gas in the suction hole is discharged to the outside via the ejection hole.

Abstract: A robotic system includes an end effector with one or more fin grippers that have one or more vacuum ports. The fin grippers are made of elastic material. The fin grippers each include contact and exterior flanges joined together with a series of crossbeams. The crossbeams each define a tube opening to form a tube guide channel between the contact and exterior flanges. In one form, the vacuum ports are located at fingertip ends of the fin grippers, and the vacuum ports include vacuum cups.

Abstract: A splitting apparatus for an LCD panel and a splitting method thereof are described. The LCD panel has a first substrate and a second substrate. The splitting apparatus includes a first splitting device and a second splitting device disposed correspondingly to the first splitting device, and the second splitting device includes protrusion adjustment devices. The protrusion adjustment device extrudes the second substrate for forming a protrusion corresponding to a split line to separate a split plate from the first substrate by a deformation portion of the protrusion and to remove the split plate by the first splitting device. The splitting apparatus makes a rapid separation of the split plate.

Abstract: A combined chuck table mechanism includes a chuck table, an electrostatic attraction section, and a vacuum suction section. The chuck table has a holding surface for holding a plate-shaped workpiece. The electrostatic attraction section has electrodes provided in the chuck table for charging an upper surface, a holding surface, through supply of power and electrostatically attracting the workpiece. The vacuum suction section has a porous portion that is formed to be flush with the upper surface, that communicates with a suction source, and that has fine holes, suction ports. The combined chuck table mechanism further includes a control unit adapted to achieve holding of the workpiece through a combined force by supplying power to the electrodes and a negative pressure to the suction ports.

Abstract: A fingerprint identification module packing method is provided. Firstly, plural fingerprint identification modules are attached on a supporting plate. Then, plural covering plates are attached on fingerprint sensing chips of the fingerprint identification modules. Then, the fingerprint identification modules are transferred to vacuum adsorption holes of a vacuum adsorption fixture. Then, the fingerprint sensing chips, the corresponding covering plates and corresponding metal terminals are welded by a laser welding process. Afterwards, the vacuum adsorption fixture is disabled. Consequently, the plural fingerprint identification modules are transferred to the packing plate.

Abstract: In one example, a media support includes a sheet of elongated suction cups. In another example, a media support includes an arrangement of elongated and/or circular suction cups in which the density of the suction cups varies between different parts of the support.

Abstract: There is provided a carrier plate removing method of removing a carrier plate from a workpiece disposed on a front surface of the carrier plate with a provisional bond layer interposed between the carrier plate and the workpiece. The carrier plate removing method includes a first holding step of holding the carrier plate and exposing the workpiece, a stepped portion forming step of forming a stepped portion in which an back surface side projects outward of a front surface side at an outer peripheral edge of the carrier plate, a second holding step of holding the workpiece and exposing the carrier plate, and a carrier plate removing step of removing the carrier plate from the workpiece by applying a force to the stepped portion and moving the carrier plate in a direction of being separated from the workpiece by a removing unit.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.

Abstract: A specialized vacuum chuck system of the present invention is capable of securing an object to a specialized welding tool in order to ensure that the object remains in a proper positional relationship with the welding tool. The system may also use springs and load stops to ensure that a proper load in maintained so the chuck base is not pulled off the object.

Abstract: A vacuum adsorbing workbench and a vacuum adsorbing device are provided. The vacuum adsorbing workbench includes a workbench body, a first suction tube and an occluder. The workbench body is provided with multiple suction holes. Each suction hole is in communication with the first suction tube. The occluder is able to be connected with the first suction tube cooperatively to cut off communication between each suction hole and the first suction tube.

Abstract: A substrate delivery method includes receiving a substrate by protruding a plurality of pins, detecting a position of a predetermined portion of the substrate in a state where the substrate is supported by the plurality of pins, estimating a deviation amount and a deviation direction of a positional deviation between a center position of the substrate and a predetermined reference position using a detected result, tilting the substrate, and bringing the substrate into partial contact with the placing table by lowering the plurality of pins at a same speed in a state where the substrate is tilted, and disposing the substrate on the placing table while moving the center position of the substrate by the deviation amount in a direction opposite to the deviation direction by using rotation of the substrate in a vertical direction due to contact with the placing table by continuously lowering the plurality of pins.

Abstract: A method is provided for the preparation of a semifinished product made of fiber material with an upper side and with an underside prior to a wet-pressing process. The method includes following steps: arrangement of a semifinished product made of fiber material with the underside on a preparation area with a large number of suction apertures, application of a reduced pressure to the underside of the semifinished product by way of the suction apertures, and introduction of a flowable matrix material by way of the upper side of the semifinished product.

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably coupled to one another so that the wafer support ring can be uncoupled from the wafer without causing damage to the wafer or the wafer support ring.

Abstract: Tape feeder holding device includes slide section on which a tape feeder can be slid, the tape feeder supplying electronic components by feeding tape housing the electronic components in a tape feeding direction; and sliding device configured to slide the tape feeder held in the slide section in the tape feeding direction, the sliding device being capable of sliding the tape feeder to a supply position at which the electronic components can be supplied from the tape feeder. That is, with the tape feeder holding device, a tape feeder is automatically attached to the tape feeder holding device.

Abstract: A chuck according to an embodiment of the present invention includes first and second support portions 10 each of which has a repetition structure of a convex portion 11 and a concave portion 13 on a base. A substrate is held by bringing each convex portion 11 into contact with the substrate and exhausting gas in each concave portion 13 such that the concave portion 13 has a negative pressure with respect to a space between the first support portion 10 and the second support portion 10. At least one support portion of the first support portion 10 and the second support portion 10 includes at least four convex portions 11 and three concave portions 13.

Abstract: A method for supporting a structure includes coupling an index pin to the structure, moving an index head relative to the structure to receive the index pin within a bore extending through the index head, and actuating a pin lock of the index head to retain the index pin within the bore.

Abstract: A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.

Abstract: According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.

Abstract: A remote optical control surface indication system comprising mechanisms configured to engage heads of respective fasteners that attach an alignment indexing plate to a vehicular structure having a control surface coupled thereto. The system further comprises: a camera having a field of view that encompasses a portion of an end face of the control surface when the mechanisms are engaged with the fasteners and when the control surface is in a neutral position; a source of light that is activatable to project light that illuminates the end face of the control surface; a display screen comprising an array of pixels; and a computing system configured to process image data captured by the camera to determine a current position of a centerline of the end face of the control surface relative to a baseline position and control the display screen to display symbology indicating the current position relative to the baseline position.

Abstract: A pellicle includes a frame. The frame includes a check valve, wherein the check valve is configured to permit gas flow from an interior of the pellicle to an exterior of the pellicle. The frame further includes a recess in a bottom surface of the frame. The pellicle further includes a membrane extending across the frame. The pellicle further includes a gasket configured to fit within the recess.

Abstract: An apparatus has a frame and a plurality of clamps connected to the frame. At least one of the clamps is movable to releasably clamp a sheet of material on the apparatus. The plurality of clamps are configured and located on the frame to be limited to clamp on the sheet of material at least two edges of the sheet of material.

Abstract: A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.

Abstract: A robot main body having a robotic arm, a remote control device which includes a robotic arm operational instruction input part installed outside of a working area and by which an operational instruction for the robotic arm is inputted, and a contactless action detecting part configured to detect a contactless action including at least one given operating condition parameter change instructing action by an operator, a control device communicably connected to the remote control device and configured to control operation of the robot main body.

Abstract: An end of arm tool includes concentric rings of suction cup assemblies. Each suction cup assembly includes a tube for supplying vacuum and a distal suction cup. The suction cup assembly can be longitudinally moveable (that is, in a retraction direction) upon engaging an item. Each ring has a vacuum control. Each ring can have its own action or compliance.

Abstract: A method of milling a piece of raw steel stock comprising: arranging a minimum of four solid pole extensions on top surface segments of a magnetic chuck such that the solid pole extensions are relatively evenly distributed under a piece of raw steel stock and within 2 inches of a perimeter of the piece of raw steel stock; arranging multiple mobile pole extensions beneath the piece of raw steel stock and on every other top surface segment of the magnetic chuck under the piece of raw steel stock that is not occupied by the solid pole extensions but beneath the piece of raw steel stock, each of the multiple mobile pole extensions having a biased top portion that contacts the piece of raw steel stock; milling the piece of raw steel stock with a face mill that generates steel chip as swarf; and recycling the steel chip.

Abstract: A substrate holder (WT) for use in a lithographic apparatus and configured to support a substrate, the substrate holder comprising: a main body (20) having a main body surface; and a plurality of burls (21) projecting from the main body surface; wherein each burl has a distal end configured to engage with the substrate; the distal ends of the burls substantially conform to a support plane whereby a substrate can be supported in a substantially flat state on the burls; and a flow control feature (22, 22c, 22d) configured to form a gas cushion adjacent the periphery of the substrate holder when a substrate is being lowered onto the substrate holder.

Abstract: A stage assembly (10) that moves a device (15) includes a stage (14) that retains the device (15), a base (12), a stage mover assembly (16), and a supply system (20A). The supply system (20A) is secured to and positioned on the stage (14). The supply system (20A) includes a circulation system (24) that circulates a circulation fluid (22) through a circulation conduit (14D) in the stage (14) to control the temperature of the stage (14) and the device (15).

Abstract: Apparatuses, systems and methods associated with a nest device design are disclosed herein. In embodiments, a nest device may include a main body and one or more air bearings that extend from the main body. A placement mechanism may be positioned on ends of the one or more air bearings, wherein the placement mechanism includes the part. The one or more air bearings may blow air out of the ends of the air bearings against the placement mechanism when the air bearings are in a first state, and draw air in through the ends when the air bearings are in a second state. The nest device may further include one or more air jets that extend from the main body and are directed toward the placement mechanism, air blown by the one or more air jets causes the placement mechanism to be translated. Other embodiments may be described and/or claimed.

Abstract: An apparatus for picking up and positioning an item includes a vacuum assembly capable of applying a suction force to the item. The apparatus further includes an item engaging plate positioned adjacent the vacuum assembly. The apparatus still further has a blocking member positioned adjacent the vacuum assembly. The blocking member is capable of interrupting the suction force. The blocking member is positionable in a first position allowing the item to be picked up and in a second position interrupting the suction force to assist disengagement of the item.

Abstract: A support table, a method of loading a substrate, a lithographic apparatus and a method of manufacturing a device using a lithographic apparatus are disclosed. In one arrangement, a support table is configured to support a substrate. The support table has a base surface. The base surface faces a bottom surface of the substrate when the substrate is supported by the support table. One or more gas cushion members are provided above the base surface. Each of the gas cushion members includes a recess. The recess is shaped and configured such that a lowering of the substrate into a position on the support table at which the substrate is supported by the support table causes a localized build-up of pressure within the recess. The localized build-up of pressure provides a localized gas cushioning effect during the lowering of the substrate.

Abstract: A universal object holding mechanism for holding three-dimensional objects for printing thereon uses multiple conformable balls mounted within a pattern of holes in a two part back plate. The multiple conformable balls are pressed into an object which in turn is pressed against a datum surface that represents desired spacing away from print heads. Vacuum is applied to the multiple conformable balls which grip the object. The multiple conformable balls are filled with particulates that cause the multiple conformable balls to become rigid when the vacuum is applied. This contributes to keeping the object from moving when it is being moved past a print head.

Abstract: A pick-and-place device for picking a work-piece from a first location to a second location and having force measurement is disclosed. The pick-and-place device comprises: (a) a positive pressure chamber formed among a pick-and-place holder, a force measuring membrane and a cover, wherein a positive pressure is supplied to the positive pressure chamber via a pressure supply inlet provided on the pick-and-place holder, and thus the force measuring membrane is being preloaded; (b) a vacuum chamber formed among the pick-and-place holder, the force measuring membrane and a pick-up membrane, wherein a negative pressure is provided via a vacuum supply inlet provided on the pick-and-place holder, wherein the pick-and-place device provides a pressure difference between the work-piece and the pick-and-place device, enabling a pick-and-place capability.

Abstract: An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.

Abstract: Embodiments of substrate carriers and method of making the same are provided herein. In some embodiments, a substrate carrier includes a substantially planar body; and a plurality of holding elements arranged on a surface of the substantially planar body, wherein the plurality of holding elements are configured to hold a plurality of substrates on the surface of the substantially planar body, and wherein the plurality of holding elements includes at least three holding elements disposed around a corresponding position of each of the plurality of substrates.

Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

Abstract: A numeric-control work center can be used for carrying out cutting operations or grinding and/or milling operations on plates of stone, marble, or, in general, natural or synthetic stone material, or ceramic material. The work center comprises at least one working head movable along at least two mutually orthogonal horizontal axes on a work surface. The work surface includes a rigid supporting board, which defines a first planar supporting surface, and a series of sacrificial elements rigidly connected to the rigid supporting board. The sacrificial elements are arranged in positions spaced apart from each other and define a second supporting surface located at a higher level than the first planar supporting surface, so that a cutting tool coupled to the working head engraves the sacrificial elements, without interfering with the supporting board during a cutting operation on a plate resting on the sacrificial elements, whichever is the path followed by the cutting tool.

Abstract: A method and apparatus for supporting a structure. The apparatus may comprise a support, a load-balancing structure associated with the support, and a set of connection devices associated with the load-balancing structure. The set of connection devices may be configured to connect to the structure to form a set of control points. Each of the set of connection devices may be configured to independently control a location of a corresponding control point in the set of control points.

Abstract: A system and method for orienting a workpiece on an assembly line to prepare the workpiece for an operation is provided. The method includes positioning a flexible fixture on the assembly line. The flexible fixture has a base and at least one adjustable component. The workpiece is positioned on the flexible fixture. A first orientation of the workpiece relative to the flexible fixture is detected with a detection device and transmitted to a calibrator. The calibrator determines a difference between the detected first orientation of the workpiece and a predetermined fixture orientation and transmits instructions from the calibrator to the flexible fixture to move the workpiece from the detected first orientation to the predetermined fixture orientation. The workpiece is moved with the at least one adjustable component into the predetermined fixture orientation and is fixedly held with the adjustable component.

Abstract: A carrier system and method carries a plate-like object to an object mounting member provided with an object mounting section. The system includes an adjustment device that changes a shape of the plate-like object into a predetermined shape before the plate-like object is mounted onto the object mounting section. The plate-like object whose shape is changed into the predetermined shape is mounted onto the object mounting section.

Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.

Abstract: A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool for processing and cutting materials, incorporates suckers able to cause the device to adhere to and be fixed to the materials being machined. Further, a cutting head having a protection device with incorporated suckers, a cutting spindle having a protection device with incorporated suckers and a machine for machining the materials, having a cutting spindle incorporating suckers.

Abstract: Provided is an imprint apparatus for contacting a resin applied to a substrate with a mold to perform patterning on the substrate. The imprint apparatus includes a substrate holding unit for holding the substrate, wherein the substrate holding unit comprises a plurality of holding areas arranged in a predetermined direction, the plurality of holding areas has different width dimension in the direction respectively based on positions in the direction, a surface ratio between two holding areas of the plurality of holding areas with different width dimension respectively is within a range of 0.8 to 1.2.

Abstract: Disclosed is a vacuum laminating device and a method of using such a vacuum laminating device to laminate a first object and a second object together.

Abstract: A roundness measuring device including: an angle detector detecting a current rotation angle of a table relative to an X axis direction; a joystick (external operator) issuing an instruction for an operation amount of a rotation axis line of the table; a centering controller calculating a CX axis displacement amount and a CY axis displacement amount from the operation amount and the rotation angle, and displacing a CX axis displacement mechanism and CY axis displacement mechanism based on the calculated CX axis displacement amount and CY axis displacement amount; and a centering controller calculating an LX axis tilt amount and an LY axis tilt amount from the operation amount and the rotation angle, and displacing an LX axis tilt mechanism and LY axis tilt mechanism based on the calculated LX axis tilt amount and LY axis tilt amount.

Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.