Abstract: A robot main body having a robotic arm, a remote control device which includes a robotic arm operational instruction input part installed outside of a working area and by which an operational instruction for the robotic arm is inputted, and a contactless action detecting part configured to detect a contactless action including at least one given operating condition parameter change instructing action by an operator, a control device communicably connected to the remote control device and configured to control operation of the robot main body.

Abstract: An end of arm tool includes concentric rings of suction cup assemblies. Each suction cup assembly includes a tube for supplying vacuum and a distal suction cup. The suction cup assembly can be longitudinally moveable (that is, in a retraction direction) upon engaging an item. Each ring has a vacuum control. Each ring can have its own action or compliance.

Abstract: A method of milling a piece of raw steel stock comprising: arranging a minimum of four solid pole extensions on top surface segments of a magnetic chuck such that the solid pole extensions are relatively evenly distributed under a piece of raw steel stock and within 2 inches of a perimeter of the piece of raw steel stock; arranging multiple mobile pole extensions beneath the piece of raw steel stock and on every other top surface segment of the magnetic chuck under the piece of raw steel stock that is not occupied by the solid pole extensions but beneath the piece of raw steel stock, each of the multiple mobile pole extensions having a biased top portion that contacts the piece of raw steel stock; milling the piece of raw steel stock with a face mill that generates steel chip as swarf; and recycling the steel chip.

Abstract: A substrate holder (WT) for use in a lithographic apparatus and configured to support a substrate, the substrate holder comprising: a main body (20) having a main body surface; and a plurality of burls (21) projecting from the main body surface; wherein each burl has a distal end configured to engage with the substrate; the distal ends of the burls substantially conform to a support plane whereby a substrate can be supported in a substantially flat state on the burls; and a flow control feature (22, 22c, 22d) configured to form a gas cushion adjacent the periphery of the substrate holder when a substrate is being lowered onto the substrate holder.

Abstract: A stage assembly (10) that moves a device (15) includes a stage (14) that retains the device (15), a base (12), a stage mover assembly (16), and a supply system (20A). The supply system (20A) is secured to and positioned on the stage (14). The supply system (20A) includes a circulation system (24) that circulates a circulation fluid (22) through a circulation conduit (14D) in the stage (14) to control the temperature of the stage (14) and the device (15).

Abstract: Apparatuses, systems and methods associated with a nest device design are disclosed herein. In embodiments, a nest device may include a main body and one or more air bearings that extend from the main body. A placement mechanism may be positioned on ends of the one or more air bearings, wherein the placement mechanism includes the part. The one or more air bearings may blow air out of the ends of the air bearings against the placement mechanism when the air bearings are in a first state, and draw air in through the ends when the air bearings are in a second state. The nest device may further include one or more air jets that extend from the main body and are directed toward the placement mechanism, air blown by the one or more air jets causes the placement mechanism to be translated. Other embodiments may be described and/or claimed.

Abstract: An apparatus for picking up and positioning an item includes a vacuum assembly capable of applying a suction force to the item. The apparatus further includes an item engaging plate positioned adjacent the vacuum assembly. The apparatus still further has a blocking member positioned adjacent the vacuum assembly. The blocking member is capable of interrupting the suction force. The blocking member is positionable in a first position allowing the item to be picked up and in a second position interrupting the suction force to assist disengagement of the item.

Abstract: A support table, a method of loading a substrate, a lithographic apparatus and a method of manufacturing a device using a lithographic apparatus are disclosed. In one arrangement, a support table is configured to support a substrate. The support table has a base surface. The base surface faces a bottom surface of the substrate when the substrate is supported by the support table. One or more gas cushion members are provided above the base surface. Each of the gas cushion members includes a recess. The recess is shaped and configured such that a lowering of the substrate into a position on the support table at which the substrate is supported by the support table causes a localized build-up of pressure within the recess. The localized build-up of pressure provides a localized gas cushioning effect during the lowering of the substrate.

Abstract: A universal object holding mechanism for holding three-dimensional objects for printing thereon uses multiple conformable balls mounted within a pattern of holes in a two part back plate. The multiple conformable balls are pressed into an object which in turn is pressed against a datum surface that represents desired spacing away from print heads. Vacuum is applied to the multiple conformable balls which grip the object. The multiple conformable balls are filled with particulates that cause the multiple conformable balls to become rigid when the vacuum is applied. This contributes to keeping the object from moving when it is being moved past a print head.

Abstract: A pick-and-place device for picking a work-piece from a first location to a second location and having force measurement is disclosed. The pick-and-place device comprises: (a) a positive pressure chamber formed among a pick-and-place holder, a force measuring membrane and a cover, wherein a positive pressure is supplied to the positive pressure chamber via a pressure supply inlet provided on the pick-and-place holder, and thus the force measuring membrane is being preloaded; (b) a vacuum chamber formed among the pick-and-place holder, the force measuring membrane and a pick-up membrane, wherein a negative pressure is provided via a vacuum supply inlet provided on the pick-and-place holder, wherein the pick-and-place device provides a pressure difference between the work-piece and the pick-and-place device, enabling a pick-and-place capability.

Abstract: An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.

Abstract: Embodiments of substrate carriers and method of making the same are provided herein. In some embodiments, a substrate carrier includes a substantially planar body; and a plurality of holding elements arranged on a surface of the substantially planar body, wherein the plurality of holding elements are configured to hold a plurality of substrates on the surface of the substantially planar body, and wherein the plurality of holding elements includes at least three holding elements disposed around a corresponding position of each of the plurality of substrates.

Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

Abstract: A numeric-control work center can be used for carrying out cutting operations or grinding and/or milling operations on plates of stone, marble, or, in general, natural or synthetic stone material, or ceramic material. The work center comprises at least one working head movable along at least two mutually orthogonal horizontal axes on a work surface. The work surface includes a rigid supporting board, which defines a first planar supporting surface, and a series of sacrificial elements rigidly connected to the rigid supporting board. The sacrificial elements are arranged in positions spaced apart from each other and define a second supporting surface located at a higher level than the first planar supporting surface, so that a cutting tool coupled to the working head engraves the sacrificial elements, without interfering with the supporting board during a cutting operation on a plate resting on the sacrificial elements, whichever is the path followed by the cutting tool.

Abstract: A method and apparatus for supporting a structure. The apparatus may comprise a support, a load-balancing structure associated with the support, and a set of connection devices associated with the load-balancing structure. The set of connection devices may be configured to connect to the structure to form a set of control points. Each of the set of connection devices may be configured to independently control a location of a corresponding control point in the set of control points.

Abstract: A system and method for orienting a workpiece on an assembly line to prepare the workpiece for an operation is provided. The method includes positioning a flexible fixture on the assembly line. The flexible fixture has a base and at least one adjustable component. The workpiece is positioned on the flexible fixture. A first orientation of the workpiece relative to the flexible fixture is detected with a detection device and transmitted to a calibrator. The calibrator determines a difference between the detected first orientation of the workpiece and a predetermined fixture orientation and transmits instructions from the calibrator to the flexible fixture to move the workpiece from the detected first orientation to the predetermined fixture orientation. The workpiece is moved with the at least one adjustable component into the predetermined fixture orientation and is fixedly held with the adjustable component.

Abstract: A carrier system and method carries a plate-like object to an object mounting member provided with an object mounting section. The system includes an adjustment device that changes a shape of the plate-like object into a predetermined shape before the plate-like object is mounted onto the object mounting section. The plate-like object whose shape is changed into the predetermined shape is mounted onto the object mounting section.

Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.

Abstract: A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool for processing and cutting materials, incorporates suckers able to cause the device to adhere to and be fixed to the materials being machined. Further, a cutting head having a protection device with incorporated suckers, a cutting spindle having a protection device with incorporated suckers and a machine for machining the materials, having a cutting spindle incorporating suckers.

Abstract: Provided is an imprint apparatus for contacting a resin applied to a substrate with a mold to perform patterning on the substrate. The imprint apparatus includes a substrate holding unit for holding the substrate, wherein the substrate holding unit comprises a plurality of holding areas arranged in a predetermined direction, the plurality of holding areas has different width dimension in the direction respectively based on positions in the direction, a surface ratio between two holding areas of the plurality of holding areas with different width dimension respectively is within a range of 0.8 to 1.2.

Abstract: Disclosed is a vacuum laminating device and a method of using such a vacuum laminating device to laminate a first object and a second object together.

Abstract: A roundness measuring device including: an angle detector detecting a current rotation angle of a table relative to an X axis direction; a joystick (external operator) issuing an instruction for an operation amount of a rotation axis line of the table; a centering controller calculating a CX axis displacement amount and a CY axis displacement amount from the operation amount and the rotation angle, and displacing a CX axis displacement mechanism and CY axis displacement mechanism based on the calculated CX axis displacement amount and CY axis displacement amount; and a centering controller calculating an LX axis tilt amount and an LY axis tilt amount from the operation amount and the rotation angle, and displacing an LX axis tilt mechanism and LY axis tilt mechanism based on the calculated LX axis tilt amount and LY axis tilt amount.

Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.

Abstract: A universal object holding mechanism for holding three-dimensional objects for printing thereon uses an array of suction cups reciprocally connected to a vacuum box to acquire objects from a staging platen while in a horizontal position and then pivot into a vertical position for movement of the objects past print heads. A plenum connected to the vacuum box is valve controlled to allow a low flow rate to the vacuum box to acquire objects and then a high flow rate pulse to close off all un-sealed suction cups with ball valves.

Abstract: A method of modifying a substrate carrier to improve process performance includes depositing material or fabricating devices on a substrate supported by a substrate carrier. A parameter of layers deposited on the substrate is then measured as a function of their corresponding positions on the substrate carrier. The measured parameter of at least some devices fabricated on the substrate or a property of the deposited layers is related to a physical characteristic of substrate carrier to obtain a plurality of physical characteristics of the substrate carrier corresponding to a plurality of positions on the substrate carrier. The physical characteristic of the substrate carrier is then modified at one or more of the plurality of corresponding positions on the substrate carrier to obtain desired parameters of the deposited layers or fabricated devices as a function of position on the substrate carrier.

Abstract: A clamp for selectively inhibiting movement of a first object relative to a second object includes (i) a first clamp component coupled to the first object; (ii) a second clamp component coupled to the second object; and (iii) a fluid source that directs a fluid to the second clamp component to create a fluid bearing between the first clamp component and the second clamp component that allows for movement of the first clamp component relative to the second clamp component, and wherein the fluid source directs less fluid to the second clamp component to inhibit relative movement.

Abstract: A suction apparatus for an end effector has a main body, which has a through-channel and a contact surface, and a sealing lip. The contact surface has an edge and recesses, wherein the through-channel issues into the recesses and the recesses terminate in front of the edge. The main body has a base portion and a fastening portion, which adjoins the base portion. In the fastening portion connection channels are provided which are in fluid communication with the through-channel and extend from the edge of the fastening portion. An end effector and a method of producing an end effector are also shown.

Abstract: The present application details exemplary methods and systems for providing current state information to multiple active datacenters within a network-based communication system. For example, a datacenter can detect an event that occurs within the network-based communication system. Upon detecting the event, the datacenter can update a state table on the datacenter based on state information associated with the event. In addition, the datacenter can send a state information message to other datacenters in the network-based communication system. The state information message can include state information associated with the event. The other datacenters in the network-based communication system can update their respective state tables using the state information in the state information message without needing to individually process the event.

Abstract: A substrate retaining carrier, a method for retaining and separating the substrate, and a method for evaporation are provided. The substrate retaining carrier includes a substrate stage and a movable substrate retaining support device, the substrate retaining support device comprises multiple probes and a probe holder, wherein a first end of each of the probes is provided with a substrate retaining member, and a second end of each of the probes is secured onto the probe holder; the substrate stage is provided with through holes for passage of the probes therein.

Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.

Abstract: Disclosed is an apparatus and method of manufacturing a graphene film, wherein the apparatus includes a wrinkle flattening device configured to flatten wrinkles in a lamination structure including a base substrate and a graphene film laminated on the base substrate; and a first lamination apparatus configured to laminate a first substrate on the graphene film, wherein the wrinkle flattening device applies a vacuum to the base substrate when the wrinkle flattening device is in contact with the base substrate.

Abstract: The present invention pertains to a process for producing an article from a layered hard coat object including a hard coat layer and a transparent-resin film layer in this order from the outermost layer side, the process comprising: a step (A) in which a pressure-sensitive adhesive layer of a support having the pressure-sensitive adhesive layer on at least one surface thereof is temporarily applied to at least one surface of the layered hard coat object to obtain a temporarily support-bearing layered hard coat object; a step (B) in which at least one processing method selected from the group consisting of router processing, water-jet processing, laser processing, and punching is applied to the temporarily support-bearing layered hard coat object to cut the temporarily support-bearing layered hard coat object into a given shape, thereby obtaining a temporarily support-bearing cut article; and a step (C) in which at least one kind of energy selected from the group consisting of heat and actinic rays is applied

Abstract: A semiconductor manufacturing apparatus comprises a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips, a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator, a pickup unit connected to a movement control unit simultaneously picking up the plurality of semiconductor chips, and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit, the control unit is connected to the movement control unit. The pickup unit converts an interval of the plurality of semiconductor chips to a predetermined pitch and holds the pitch. The pickup unit moves the plurality of semiconductor chips from the stage to mounting positions of a supporting substrate and simultaneously adheres the plurality of semiconductor chips at the mounting positions by the control unit.

Abstract: Provided is a scanner having: multiple sensor chips; an optical unit that focuses an image of an A4 document on eighteen or more sensor chips; and a generator that synthesizes images of the A4 document read by the sensor chips, and generates image data.

Abstract: A device for lacquering or coating a substrate is disclosed. The device includes a substrate plate configured to accommodate said substrate, and one or more suction points connected to, and extending upwardly from, the substrate plate. The one or more suction points may be configured to provide a vacuum to said substrate.

Abstract: An optical receiver module that receives wavelength multiplexed light and a process to assemble the optical receiver module are disclosed. The optical receiver module provides a coupling unit to collimate the wavelength multiplexed light and a device unit that installs an optical de-multiplexer and photodiode elements within housing. The front wall of the housing through which the wavelength multiplexed light passes is polished in a right angle with respect to the bottom of the housing.

Abstract: A device for press-fitting an oil seal S that includes a fixing section F in which a hard ring S is embedded and a lip section L into a structure A. The device includes an air hammer AH that includes a hammer head 1. The hammer head 1 includes a pressing section 6 configured to abut the fixing section F and a holding section 7 configured to abut the lip section L, and a negative pressure space 8 is formed between the hammer head AH and the oil seal S between the pressing section 6 and the holding section 7. The hammer head 1 is provided with an air suction path 11 that is open to the negative pressure space 8 at one end and is connected to an air suctioning means 10 at the other end. Accordingly, the device holds by suction the oil seal S having a complicated shape without deforming it, and adequately press-fits it into a structure A.

Abstract: A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.

Abstract: A holding device for holding an element in sheet form 10 during its phase of insertion into a work station 300 of a converting machine 1. The holding device 310 includes a suction member 320 able to partially hold each sheet 10 by its rear portion during insertion of the sheet 10 into the work station 300. The holding device also includes a blower 330 able to flatten the rear portion of each sheet 10 against the suction member 320 during the phase of insertion.

Abstract: In one aspect, a vacuum alignment tool for holding and aligning a first fastener with a second fastener is provided. The vacuum alignment tool includes a main body including an end wall having an aperture disposed therein configured to receive at least a portion of the first fastener. The vacuum alignment tool also includes a vacuum receiving portion coupled to the main body. The vacuum receiving portion including a vacuum bore disposed therein, wherein a vacuum channel extends within the main body and within the vacuum receiving portion between the aperture and the vacuum bore.

Abstract: A vacuum table for securing a sheet of material. The vacuum table includes a top plate that is porous, a perimeter vacuum chamber disposed beneath a perimeter of the top plate, and interior vacuum chambers bound by the perimeter vacuum chamber and disposed beneath a target area of the top plate that is inside the perimeter of the top plate.

Abstract: A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.

Abstract: A system for machining semi-rigid curved panels includes a fixturing device within an enclosure cell, the cell having a sealable entrance and a sealable exit. A holding table, moveable through the sealable entrance between the inside and outside of the cell, is configured to receive unfinished semi-rigid curved panels. Another holding table, fixed outside of the cell, is configured to receive processed semi-rigid curved panels. A first robot inside the cell transports the semi-rigid curved panels from the first holding table and onto the fixturing device, later transporting the curved panels from the fixturing device onto the second holding table through the sealable exit. A second robot processes the semi-rigid curved panels on the fixturing device. A controller is configured to sequentially actuate first and second robots for transporting and processing the semi-rigid curved panels, and to manage a vacuum clamping system for workpiece retention on the fixturing device.

Abstract: In one example, a media support includes a platen and multiple suction cups in the platen. Each suction cup in the platen has a port through which air may be evacuated from the cup.

Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.

Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

Abstract: A system for manufacturing shoes is provided that includes two or more pieces of equipment used in the customization and manufacturing of shoes and an alignment fixture that may engage with each piece of equipment by way of an alignment mounting member. The alignment fixture may secure to it a portion of a shoe, such as an upper portion, wherein the shoe portion remains in a flat position, and in a fixed relationship to the alignment fixture, throughout the various processes performed by the pieces of equipment. These processes may include, for example, printing, laser, embroidery, forming, cutting, or the like.

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.

Abstract: A chucking apparatus for a workpiece with honeycomb structure includes a table that can be supplied with vacuum and a clamping plate which can be placed on the table and which accommodates the workpiece in the region of an already profiled surface determined by the face ends of the honeycombs, whose receiving surface, which corresponds to the profiled surface of the workpiece, is provided with suction openings to the table. In order to provide advantageous chucking conditions, the clamping plate has an open-cell structure.

Abstract: In one aspect, a method for assembling a tower section of a lattice tower structure for a wind turbine on a tower assembly fixture may generally include installing a first trolley onto a first fixture arm of the fixture and installing a second trolley onto a second fixture arm of the fixture. In addition, the method may include securing a first support leg of the tower section to the first trolley, securing a second support leg of the tower section to the second trolley and coupling at least one secondary support member between the first and seconds support legs.